9ZXL1231EKILF/W [IDT]
12-Output DB1200ZL for PCIe Gen1â4 and UPI;型号: | 9ZXL1231EKILF/W |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | 12-Output DB1200ZL for PCIe Gen1â4 and UPI PC |
文件: | 总21页 (文件大小:267K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
12-Output DB1200ZL for PCIe
Gen1–4 and UPI
9ZXL1231E / 9ZXL1251E
Datasheet
Description
Features
▪ LP-HCSL outputs; eliminate 24 resistors, save 41mm2 of area
The 9ZXL1231E / 9ZXL1251E are second-generation, enhanced
performance DB1200ZL differential buffers. The parts are
pin-compatible upgrades to the 9ZXL1231A and 9ZXL1251A,
while offering much improved phase jitter performance and
increased system security features. A fixed external feedback
maintains low drift for critical QPI/UPI applications.
(1231E)
▪ LP-HCSL outputs with 85Ω Zout; eliminate 48 resistors, save
82mm2 of area (1251E)
▪ 12 OE# pins; hardware control of each output
▪ 9 selectable SMBus addresses; multiple devices can share the
same SMBus segment
PCIe Clocking Architectures
Supported
▪ Selectable PLL BW; minimizes jitter peaking in cascaded PLL
topologies
▪ Hardware/SMBus control of PLL bandwidth and bypass;
▪ Common Clocked (CC)
change mode without power cycle
▪ Independent Reference (IR) with and without spread spectrum
▪ Spread spectrum compatible; tracks spreading input clock for
EMI reduction
Typical Applications
▪ 100MHz & 133.33MHz PLL Mode; UPI and legacy QPI support
▪ 9 x 9 mm 64-VFQFPN package; small board footprint
▪ Servers
▪ Storage
▪ Networking
▪ SSDs
Key Specifications
▪ Cycle-to-cycle jitter < 50ps
▪ Output-to-output skew < 50ps
Output Features
▪ Input-to-output delay: fixed at 0ps
▪ Input-to-output delay variation < 50ps
▪ PCIe Gen4 phase jitter: < 0.5ps rms
▪ Phase jitter: QPI/UPI > = 9.6GB/s < 0.2ps rms
▪ Phase jitter: IF-UPI < 1.0ps rms
▪ 12 Low-Power (LP) HCSL output pairs (1231E)
▪ 12 Low-Power (LP) HCSL output pairs with 85Ω Zout (1251E)
Block Diagram
VDDR
VDDA
VDD x3
VDDIO x4
FBOUT_NC#
FBOUT_NC
PLL
DIF_IN#
DIF_IN
DIF11#
DIF11
^100M_133M#
vSADR[1:0]_tri
SMBCLK
12
outputs
SMBus
Engine Configuration
Factory
SMBDAT
DIF0#
DIF0
^vHIBW_BYPM-LOBW#
^CKPWRGD_PD#
vOE[11:0]#
Control Logic
Resistors are integrated on 9ZXL125x devices and
external on 9ZXL123x devices
GNDA
GND x7
©2018 Integrated Device Technology, Inc
1
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
PCIe Clocking Architectures Supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Output Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Clock Periods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Functionality at Power-Up (PLL Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PLL Operating Mode Readback. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PLL Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SMBus Addressing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Test Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Alternate Terminations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
General SMBus Serial Interface Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
How to Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
How to Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Package Outline Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Marking Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
©2018 Integrated Device Technology, Inc
2
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Pin Assignments
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
VDDA 1
GNDA 2
48 GND
47 DIF7#
46 DIF7
45 vOE7#
44 vOE6#
43 DIF6#
42 DIF6
41 GND
40 VDD
NC 3
^100M_133M# 4
^HIBW_BYPM_LOBW# 5
^CKPWRGD_PD# 6
GND 7
9ZXL1231
9ZXL1251
VDDR 8
DIF_IN 9
connect EPAD to ground
DIF_IN# 10
39 DIF5#
38 DIF5
37 vOE5#
36 vOE4#
35 DIF4#
34 DIF4
33 GND
vSADR0_tri 11
SMBDAT 12
SMBCLK 13
vSADR1_tri 14
FBOUT_NC# 15
FBOUT_NC 16
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
9 x 9 mm 64-VFQFPN, 0.5mm pad pitch
Note: Pins with ^ prefix have internal 120kOhm pull-up
Pins with v prefix have internal 120kOhm pull-down
Pin Descriptions
Table 1. Pin Descriptions
Number
Name
Type
Power Power supply for PLL core.
Description
1
2
3
V
DDA
GNDA
NC
GND
—
Ground pin for the PLL core.
No connection.
Latched 3.3V input to select operating frequency. This pin has an internal 120kΩ pull-up resistor.
In See Functionality at Power-Up table for definition.
4
5
^100M_133M#
Latched Tri-level input to select High BW, Bypass or Low BW Mode. Has an internal 120kΩ pull-up
^HIBW_BYPM_LOBW#
In
resistor. See PLL Operating Mode table for details.
Input notifies device to sample latched inputs and start up on first high assertion. Low
enters Power Down Mode, subsequent high assertions exit Power Down Mode. This pin
has internal 120kΩ pull-up resistor.
6
^CKPWRGD_PD#
GND
Input
7
8
GND
Ground pin.
Power supply for differential input clock (receiver). This V should be treated as an analog
DD
V
Power
DDR
power rail and filtered appropriately. Nominally 3.3V.
9
DIF_IN
Input
Input
HCSL true input.
10
DIF_IN#
HCSL complementary input.
©2018 Integrated Device Technology, Inc
3
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 1. Pin Descriptions (Cont.)
Number
Name
Type
Description
SMBus address bit. This is a tri-level input that works in conjunction with other SADR pins,
if present, to decode SMBus addresses. It has an internal 120kΩ pull-down resistor. See
the SMBus Addressing table.
11
vSADR0_tri
Input
12
13
SMBDAT
SMBCLK
I/O
Data pin of SMBUS circuitry.
Clock pin of SMBUS circuitry.
Input
SMBus address bit. This is a tri-level input that works in conjunction with other SADR pins,
if present, to decode SMBus Addresses. It has an internal 120kΩ pull-down resistor. See
the SMBus Addressing table.
14
vSADR1_tri
Input
Complementary half of differential feedback output. This pin should NOT be connected to
15
16
FBOUT_NC#
FBOUT_NC
Output anything outside the chip. It exists to provide delay path matching to get 0 propagation
delay.
True half of differential feedback output. This pin should NOT be connected to anything
Output
outside the chip. It exists to provide delay path matching to get 0 propagation delay.
17
18
DIF0
Output Differential true clock output.
DIF0#
Output Differential complementary clock output.
Active low input for enabling output 0. This pin has an internal 120kΩ pull-down.
19
20
vOE0#
vOE1#
Input
1 = disable outputs, 0 = enable outputs.
Active low input for enabling output 1. This pin has an internal 120kΩ pull-down.
Input
1 = disable outputs, 0 = enable outputs.
21
22
23
24
25
26
27
DIF1
DIF1#
GND
Output Differential true clock output.
Output Differential complementary clock output.
GND
Ground pin.
V
Power Power supply, nominally 3.3V.
Power Power supply for differential outputs.
Output Differential true clock output.
DD
V
DDIO
DIF2
DIF2#
Output Differential complementary clock output.
Active low input for enabling output 2. This pin has an internal 120kΩ pull-down.
28
29
vOE2#
vOE3#
Input
1 = disable outputs, 0 = enable outputs.
Active low input for enabling output 3. This pin has an internal 120kΩ pull-down.
Input
1 = disable outputs, 0 = enable outputs.
30
31
32
33
34
35
DIF3
Output Differential true clock output.
DIF3#
Output Differential complementary clock output.
Power Power supply for differential outputs.
V
DDIO
GND
DIF4
GND
Ground pin.
Output Differential true clock output.
DIF4#
Output Differential complementary clock output.
Active low input for enabling output 4. This pin has an internal 120kΩ pull-down.
36
vOE4#
Input
1 = disable outputs, 0 = enable outputs.
©2018 Integrated Device Technology, Inc
4
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 1. Pin Descriptions (Cont.)
Number
Name
Type
Description
Active low input for enabling output 5. This pin has an internal 120kΩ pull-down.
37
vOE5#
Input
1 = disable outputs, 0 = enable outputs.
38
39
40
41
42
43
DIF5
Output Differential true clock output.
DIF5#
Output Differential complementary clock output.
Power Power supply, nominally 3.3V.
V
DD
GND
DIF6
GND
Ground pin.
Output Differential true clock output.
DIF6#
Output Differential complementary clock output.
Active low input for enabling output 6. This pin has an internal 120kΩ pull-down.
44
45
vOE6#
vOE7#
Input
1 = disable outputs, 0 = enable outputs.
Active low input for enabling output 7. This pin has an internal 120kΩ pull-down.
Input
1 = disable outputs, 0 = enable outputs.
46
47
48
49
50
51
DIF7
DIF7#
GND
Output Differential true clock output.
Output Differential complementary clock output.
GND
PWR
Ground pin.
V
Power supply for differential outputs.
DDIO
DIF8
Output Differential true clock output.
DIF8#
Output Differential complementary clock output.
Active low input for enabling output 8. This pin has an internal 120kΩ pull-down.
52
53
vOE8#
vOE9#
Input
1 = disable outputs, 0 = enable outputs.
Active low input for enabling output 9. This pin has an internal 120kΩ pull-down.
Input
1 = disable outputs, 0 = enable outputs.
54
55
56
57
58
59
60
DIF9
DIF9#
VDDIO
Output Differential true clock output.
Output Differential complementary clock output.
Power Power supply for differential outputs.
Power Power supply, nominally 3.3V.
V
DD
GND
DIF10
DIF10#
GND
Ground pin.
Output Differential true clock output.
Output Differential complementary clock output.
Active low input for enabling output 10. This pin has an internal 120kΩ pull-down.
61
62
vOE10#
vOE11#
Input
1 = disable outputs, 0 = enable outputs.
Active low input for enabling output 11. This pin has an internal 120kΩ pull-down.
Input
1 = disable outputs, 0 = enable outputs.
63
64
65
DIF11
DIF11#
EPAD
Output Differential true clock output.
Output Differential complementary clock output.
GND
Connect epad to ground.
©2018 Integrated Device Technology, Inc
5
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the 9ZXL1231E / 9ZXL1251E. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other
conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Table 2. Absolute Maximum Ratings
Parameter
Symbol
Conditions
Minimum
Typical
Maximum Units Notes
Supply Voltage
Input Voltage
VDDx
3.9
+0.5
V
V
1,2
1,3
1
V
-0.5
-65
V
IN
DD
Input High Voltage, SMBus
Storage Temperature
Junction Temperature
Input ESD Protection
V
SMBus clock and data pins.
3.9
150
125
V
IHSMB
Ts
°C
°C
V
1
Tj
1
ESD prot Human Body Model.
2500
1
1 Guaranteed by design and characterization, not 100% tested in production.
2 Operation under these conditions is neither implied nor guaranteed.
3 Not to exceed 3.9V.
Electrical Characteristics
T = T . Supply voltages per normal operation conditions; see Test Loads for loading conditions.
A
AMB
Table 3. SMBus Parameters
Parameter
Symbol
Conditions
Minimum Typical
Maximum Units Notes
SMBus Input Low Voltage
SMBus Input High Voltage
SMBus Output Low Voltage
SMBus Sink Current
V
0.8
V
V
ILSMB
V
2.1
V
DDSMB
IHSMB
V
At I
0.4
V
OLSMB
PULLUP
PULLUP.
I
At V
4
mA
V
OL.
Nominal Bus Voltage
V
2.7
3.6
1000
300
1
1
1
5
DDSMB
SCLK/SDATA Rise Time
SCLK/SDATA Fall Time
SMBus Operating Frequency
t
(Max V - 0.15V) to (Min V + 0.15V).
ns
ns
kHz
RSMB
IL
IH
t
(Min V + 0.15V) to (Max V - 0.15V).
IH IL
FSMB
f
SMBus operating frequency.
400
SMB
1 Guaranteed by design and characterization, not 100% tested in production.
2 Control input must be monotonic from 20% to 80% of input swing.
3 Time from deassertion until outputs are > 200mV.
4 DIF_IN input.
5 The differential input clock must be running for the SMBus to be active.
©2018 Integrated Device Technology, Inc
6
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 4. DIF_IN Clock Input Parameters
Parameter
Symbol
Conditions
Cross over voltage.
Minimum Typical Maximum Units Notes
Input Crossover Voltage – DIF_IN
Input Swing – DIF_IN
V
150
300
0.4
-5
900
mV
mV
V/ns
μA
1
1
CROSS
V
Differential value.
SWING
Input Slew Rate – DIF_IN
Input Leakage Current
Input Duty Cycle
dv/dt
Measured differentially.
8
5
1,2
I
V
= V
V = GND.
DD , IN
IN
IN
d
Measurement from differential waveform.
Differential measurement.
45
0
55
125
%
1
1
tin
Input Jitter – Cycle to Cycle
J
ps
DIFIn
1 Guaranteed by design and characterization, not 100% tested in production.
2 Slew rate measured through ±75mV window centered around differential zero.
Table 5. Input/Supply/Common Parameters
T
= over the specified operating range. Supply voltages per normal operation conditions; see Test Loads for loading conditions.
AMB
Parameter
Supply Voltage
Symbol
Conditions
Minimum
Typical
Maximum Units Notes
V
x
Supply voltage for core and analog.
3.135
0.95
0
3.3
3.465
3.465
70
V
V
DD
Output Supply Voltage
V
Supply voltage for DIF outputs, if present.
1.05
DDIO
Commercial range (T
).
°C
°C
COM
Ambient Operating
Temperature
T
AMB
Industrial range (T ).
-40
25
85
IND
Single-ended inputs, except SMBus, tri-level
inputs.
Input High Voltage
Input Low Voltage
V
2
V
V
+ 0.3
DD
V
V
IH
Single-ended inputs, except SMBus, tri-level
inputs.
V
GND - 0.3
0.8
+ 0.3
IL
Input High Voltage
Input Mid Voltage
Input Low Voltage
V
Tri-level inputs.
Tri-level inputs.
Tri-level inputs.
2.2
1.2
V
V
IH
DD
V
V
V
/2
DD
1.8
IL
IL
GND - 0.3
-5
0.8
5
V
I
Single-ended inputs, V = GND, V = V
DD.
μA
IN
IN
IN
Single-ended inputs.
Input Current
V
= 0 V; inputs with internal pull-up resistors.
IN
I
-50
50
μA
INP
V
= V ; inputs with internal pull-down
IN
DD
resistors.
F
V
V
V
= 3.3V, Bypass Mode.
1
400
102.5
135
7
MHz
MHz
MHz
nH
ibyp
DD
DD
DD
Input Frequency
Pin Inductance
Capacitance
F
= 3.3V, 100MHz PLL Mode.
= 3.3V, 133.33MHz PLL Mode.
98.5
132
100.00
133.33
ipll
ipll
pin
F
L
1
1
C
Logic inputs, except DIF_IN.
DIF_IN differential clock inputs.
Output pin capacitance.
1.5
1.5
5
pF
IN
INDIF_IN
C
2.7
6
pF
1,4
1
C
pF
OUT
©2018 Integrated Device Technology, Inc
7
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 5. Input/Supply/Common Parameters (Cont.)
T
= over the specified operating range. Supply voltages per normal operation conditions; see Test Loads for loading conditions.
AMB
Parameter
Symbol
Conditions
Minimum
Typical
Maximum Units Notes
From V power-up and after input clock
stabilization or deassertion of PD# to 1st clock.
DD
Clk Stabilization
T
1
1.8
33
10
ms
1,2
STAB
Input SS Modulation
Frequency PCIe
Allowable frequency for PCIe applications
(Triangular modulation).
f
30
4
kHz
MODINPCIe
DIF start after OE# assertion.
DIF stop after OE# deassertion.
OE# Latency
t
5
clocks 1,2,3
LATOE#
Tdrive_PD#
Tfall
t
DIF output enable after PD# deassertion.
Fall time of control inputs.
49
300
5
μs
ns
ns
1,3
2
DRVPD
t
F
Trise
t
Rise time of control inputs.
5
2
R
1 Guaranteed by design and characterization, not 100% tested in production.
2 Control input must be monotonic from 20% to 80% of input swing.
3 Time from deassertion until outputs are > 200mV.
4 DIF_IN input.
Table 6. Current Consumption
Parameter
Symbol
Conditions
Minimum
Typical
Maximum Units Notes
I
V
, PLL Mode at 100MHz.
DDA
38
25
46
34
107
4
mA
mA
mA
mA
mA
1
DDA
Operating Supply
Current
I
All other V pins.
DD
DD
I
V
V
for LP-HCSL outputs, if applicable.
DDIO
83
DDOIO
I
, CKPWRGD_PD# = 0.
DDA
3.3
1.3
1
DDAPD
Power Down
Current
I
All other V pins, CKPWRGD_PD# = 0.
2
DDPD
DD
1 Includes VDDR if applicable.
Table 7. Skew and Differential Jitter Parameters
T
= over the specified operating range. Supply voltages per normal operation conditions; see Test Loads for loading conditions.
AMB
Parameter
Symbol
Conditions
Minimum Typical Maximum Units Notes
Input-to-output skew in PLL Mode at 100MHz, nominal
temperature and voltage.
1,2,4,5,
CLK_IN, DIF[x:0]
CLK_IN, DIF[x:0]
CLK_IN, DIF[x:0]
t
-100
2.5
-21.3
2.6
100
4.5
50
ps
ns
ps
SPO_PLL
8
Input-to-output skew in Bypass Mode at 100MHz,
nominal temperature and voltage.
1,2,3,5,
8
t
PD_BYP
Input-to-output skew variation in PLL Mode at 100MHz,
across voltage and temperature.
1,2,3,5,
8
t
-50
0.0
DSPO_PLL
©2018 Integrated Device Technology, Inc
8
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 7. Skew and Differential Jitter Parameters (Cont.)
T
= over the specified operating range. Supply voltages per normal operation conditions; see Test Loads for loading conditions.
AMB
Parameter
Symbol
Conditions
Minimum Typical Maximum Units Notes
Input-to-output skew variation in Bypass Mode at
100MHz, across voltage and temperature,
1,2,3,5,
-250
-350
250
350
ps
ps
8
T
= 0 to 70°C.
AMB
CLK_IN, DIF[x:0]
t
DSPO_BYP
Input-to-output skew variation in Bypass Mode at
100MHz, across voltage and temperature,
1,2,3,5,
8
T
= -40 to +85°C.
AMB
ps
Random differential tracking error between two 9ZX
devices in High BW Mode.
1,2,3,5,
8
CLK_IN, DIF[x:0]
CLK_IN, DIF[x:0]
DIF[x:0]
t
3
5
DTE
(rms)
Random differential spread spectrum tracking error
between two 9ZX devices in High BW Mode.
1,2,3,5,
8
t
23
50
50
ps
ps
DSSTE
Output-to-output skew across all outputs, common to
PLL and Bypass Mode, at 100MHz.
t
1,2,3,8
SKEW_ALL
PLL Jitter Peaking
PLL Jitter Peaking
PLL Bandwidth
PLL Bandwidth
Duty Cycle
j
j
LOBW#_BYPASS_HIBW = 1.
LOBW#_BYPASS_HIBW = 0.
LOBW#_BYPASS_HIBW = 1.
LOBW#_BYPASS_HIBW = 0.
Measured differentially, PLL Mode.
0
0
1.3
1.3
2.5
2
dB
dB
7,8
7,8
8,9
8,9
1
peak-hibw
peak-lobw
pll
2
2.6
4
MHz
MHz
%
HIBW
pll
t
0.7
45
1.0
1.4
55
LOBW
t
50.3
DC
Duty Cycle
Distortion
Measured differentially, Bypass Mode at 100MHz.
-1
0
1
%
1,10
DCD
PLL Mode.
14
50
5
ps
ps
1,11
1,11
Jitter, Cycle to
Cycle
t
jcyc-cyc
Additive jitter in Bypass Mode.
0.1
1 Measured into fixed 2pF load cap. Input to output skew is measured at the first output edge following the corresponding input.
2 Measured from differential cross-point to differential cross-point. This parameter can be tuned with external feedback path, if present.
3 All Bypass Mode input-to-output specs refer to the timing between an input edge and the specific output edge created by it.
4 This parameter is deterministic for a given device.
5 Measured with scope averaging on to find mean value.
6 “t” is the period of the input clock.
7 Measured as maximum pass band gain. At frequencies within the loop BW, highest point of magnification is called PLL jitter peaking.
8 Guaranteed by design and characterization, not 100% tested in production.
9 Measured at 3db down or half power point.
10 Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in Bypass Mode.
11 Measured from differential waveform.
©2018 Integrated Device Technology, Inc
9
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 8. HCSL/LP-HCSL Outputs
T
= over the specified operating range. Supply voltages per normal operation conditions; see Test Loads for loading conditions.
AMB
Specification
Parameter
Symbol
Conditions
Minimum Typical Maximum
Limits
Units Notes
Slew Rate
dV/dt
ΔdV/dt
Vmax
Scope averaging on.
2
2.9
7.1
792
4
1–4
20
V/ns
%
1,2,3
14,7
7
Slew Rate Matching
Maximum Voltage
Single-ended measurement.
20
Measurement on single-ended
signal using absolute value
(scope averaging off).
660
-150
250
850
1150
mV
Minimum Voltage
Vmin
-35
150
-300
7
Crossing Voltage (abs) Vcross_abs
Crossing Voltage (var) Δ-Vcross
Scope averaging off.
Scope averaging off.
372
15
550
140
250–550
140
mV
mV
1,5,7
1,6,7
1 Guaranteed by design and characterization, not 100% tested in production.
2 Measured from differential waveform.
3 Slew rate is measured through the Vswing voltage range centered around differential 0 V. This results in a ±150mV window around differential 0V.
4 Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a ±75mV window centered on the average
cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use
for the edge rate calculations.
5 Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising edge (i.e. Clock
rising and Clock# falling).
6 The total variation of all Vcross measurements in any particular system. Note that this is a subset of Vcross_min/max (Vcross absolute) allowed.
The intent is to limit Vcross induced modulation by setting Δ-Vcross to be smaller than Vcross absolute.
7 At default SMBus settings.
Table 9. Filtered Phase Jitter Parameters - PCIe Common Clocked (CC) Architectures
Specification
Parameter
Symbol
Conditions
Minimum Typical Maximum
Limits
Units Notes
ps
t
t
PCIe Gen 1.
13.4
30
86
1,2,3
(p-p)
jphPCIeG1-CC
PCIe Gen 2 Low Band.
10kHz < f < 1.5MHz
ps
1,2
0.2
0.7
3
(rms)
(PLL BW of 5–16MHz or 8–16MHz,
CDR = 5MHz).
jphPCIeG2-CC
PCIe Gen 2 High Band.
ps
1,2
Phase Jitter, PLL
Mode
1.5MHz < f < Nyquist (50MHz)
1.0
1.5
3.1
(rms)
(PLL BW of 5–16MHz or 8–16MHz,
CDR = 5MHz).
PCIe Gen 3.
ps
1,2
t
t
0.2
0.2
0.4
0.4
1
(PLL BW of 2–4MHz or 2–5MHz, CDR
= 10MHz).
jphPCIeG3-CC
jphPCIeG4-CC
(rms)
PCIe Gen 4.
ps
1,2
0.5
(PLL BW of 2–4MHz or 2–5MHz, CDR
= 10MHz).
(rms)
©2018 Integrated Device Technology, Inc
10
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 9. Filtered Phase Jitter Parameters - PCIe Common Clocked (CC) Architectures (Cont.)
Specification
Limits
Parameter
Symbol
Conditions
Minimum Typical Maximum
Units Notes
ps
(p-p)
1,2,3,
4
t
t
PCIe Gen 1.
0.01
0.06
jphPCIeG1-CC
PCIe Gen 2 Low Band.
10kHz < f < 1.5MHz
ps
1,2,3,
4
0.01
0.06
(rms)
(PLL BW of 5–16MHz or 8–16MHz,
CDR = 5MHz).
jphPCIeG2-CC
PCIe Gen 2 High Band.
Additive Phase
Jitter, Bypass
Mode
ps
1.5MHz < f < Nyquist (50MHz)
1,2,3,
4
0.01
0.06
Not Applicable
(rms)
(PLL BW of 5–16MHz or 8–16MHz,
CDR = 5MHz).
PCIe Gen 3.
ps
1,2,3,
4
t
t
0.01
0.01
0.06
0.06
(PLL BW of 2–4MHz or 2–5MHz, CDR
= 10MHz).
jphPCIeG3-CC
jphPCIeG4-CC
(rms)
PCIe Gen 4.
ps
1,2,3,
4
(PLL BW of 2–4MHz or 2–5MHz, CDR
= 10MHz).
(rms)
Table 10. Filtered Phase Jitter Parameters – PCIe Independent Reference (IR) Architectures
Industry
Limits
Parameter
Symbol
Conditions
Minimum Typical Maximum
Units Notes
PCIe Gen 2.
ps
t
t
t
t
0.9
0.6
1.1
2
1,2,5
(rms)
jphPCIeG2-SRIS
(PLL BW of 16MHz, CDR = 5MHz).
Phase Jitter,
PLL Mode
PCIe Gen 3.
ps
0.65
0.05
0.05
0.7
1,2,5
(rms)
jphPCIeG3-SRIS
jphPCIeG2-SRIS
jphPCIeG3-SRIS
(PLL BW of 2–4MHz, CDR = 10MHz).
PCIe Gen 2.
ps
0.01
0.01
2,4,5
(rms)
Additive Phase
Jitter, Bypass
Mode
(PLL BW of 16MHz, CDR = 5MHz).
Not
applicable
PCIe Gen 3.
ps
2,4,5
(rms)
(PLL BW of 2–4MHz, CDR = 10MHz).
Notes for PCIe Filtered Phase Jitter tables (CC) and (IR).
1 Applies to all differential outputs, guaranteed by design and characterization.
2 Calculated from Intel-supplied clock jitter tool when driven by 9SQL495x or equivalent with spread on and off.
3 Sample size of at least 100K cycles. This figure extrapolates to 108ps pk-pk at 1M cycles for a BER of 1–12
4 For RMS values, additive jitter is calculated by solving for b [b = sqrt(c2 - a2)] where “a” is rms input jitter and “c” is rms total jitter.
.
5 IR is the new name for Separate Reference Independent Spread (SRIS) and Separate Reference no Spread (SRNS) PCIe clock architectures.
According to the PCIe Base Specification Rev4.0 version 0.7 draft, the jitter transfer functions and corresponding jitter limits are not defined for the
IR clock architecture. Widely accepted industry limits using widely accepted industry filters are used to populate this table. There are no accepted
filters or limits for IR clock architectures at PCIe Gen1 or Gen4 data rates.
©2018 Integrated Device Technology, Inc
11
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Table 11. Filtered Phase Jitter Parameters – QPI/UPI
Specification
Parameter
Symbol
Conditions
Minimum Typical Maximum
Limits
Units Notes
QPI & UPI.
0.14
0.07
0.06
0.3
0.13
0.1
0.5
1,2
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI).
QPI & UPI.
t
0.3
0.2
1
1,2
ps
jphQPI_UPI
(100MHz, 8.0Gb/s, 12UI).
Phase Jitter,
PLL Mode
(rms)
1,2
QPI & UPI.
(100MHz, > 9.6Gb/s, 12UI).
0.1
0.17
0.14
0.2
t
IF-UPI.
1,4,5
1,2,3
jphIF-UPI
QPI & UPI.
0.00
0.00
0.01
0.01
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI).
QPI & UPI.
Additive
Phase Jitter,
Bypass Mode
t
1,2,3
ps
jphQPI_UPI
(100MHz, 8.0Gb/s, 12UI).
Not applicable
(rms)
QPI & UPI.
0.00
0.06
0.01
0.07
1,2,3
1,4
(100MHz, > 9.6Gb/s, 12UI).
t
IF-UPI.
jphIF-UPI
1 Applies to all differential outputs, guaranteed by design and characterization.
2 Calculated from Intel-supplied clock jitter tool, when driven by 9SQL495x or equivalent with spread on and off.
3 For RMS values, additive jitter is calculated by solving for b [b = sqrt(c2 - a2)] where “a” is rms input jitter and “c” is rms total jitter.
4 Calculated from phase noise analyzer when driven by Wenzel Associates source with Intel-specified brick-wall filter applied.
5 Top number is when the buffer is in Low BW mode, bottom number is when the buffer is in High BW mode.
Table 12. Unfiltered Phase Jitter Parameters – 12kHz to 20MHz
Industry
Limits
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Units
Notes
fs
Phase Jitter, PLL
Mode
PLL High BW, SSC Off,
100MHz
t
171
225
1,2
jph12k-20MHi
(rms)
fs
Phase Jitter, PLL
Mode
PLL Low BW, SSC Off,
100MHz
Not
applicable
t
184
107
225
125
1,2
jph12k-20MLo
(rms)
fs
Additive Phase
Jitter, Bypass Mode
Bypass Mode, SSC Off,
100MHz
t
1,2,3
jph12k-20MByp
(rms)
1 Applies to all outputs when driven by Wenzel clock source.
2 12kHz to 20MHz brick wall filter.
3 For RMS values, additive jitter is calculated by solving for b [b = sqrt(c2 - a2)] where “a” is rms input jitter and “c” is rms total jitter.
©2018 Integrated Device Technology, Inc
12
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Clock Periods
Table 13. Clock Periods – Differential Outputs w ith Spread Spectrum Disabled
Measurement Window
1 Clock
1μs
0.1s
0.1s
0.1s
1μs
1 Clock
- S S C
- p p m
+ p p m
Long-Term
Average
+ S S C
Short-Term
Average
Center
Frequency AbsPer
-c2cjitter
Short-Term Long-Term
Average
0 ppm
Period
+c2cjitter
AbsPer
Average
SSC On
MHz
Minimum
Minimum
Minimum
Nominal
Maximum
Maximum
Maximum Units Notes
100.00
133.33
9.94900
7.44925
—
—
9.99900
7.49925
10.00000
7.50000
10.00100
7.50075
—
—
10.05100
7.55075
ns
ns
1,2,3
1,2,4
DIF
Table 14. Clock Periods – Differential Outputs w ith Spread Spectrum Enabled
Measurement Window
1 Clock
1μs
0.1s
0.1s
0.1s
1μs
1 Clock
- S S C
- p p m
+ p p m
Long-Term
Average
+ S S C
Center
Frequency AbsPer
- c 2 c jit t e r
Short-Term Long-Term
Average
Minimum
0 ppm
Period
Nominal
Short-Term +c2cjitter
Average
Maximum
Average
Minimum
AbsPer
Maximum Units Notes
SSC On
MHz
Minimum
Maximum
99.75
9.94906
7.44930
9.99906
7.49930
10.02406
7.51805
10.02506
7.51880
10.02607
7.51955
10.05107
7.53830
10.10107
7.58830
ns
ns
1,2,3
1,2,4
DIF
133.00
1 Guaranteed by design and characterization, not 100% tested in production.
2 All Long Term Accuracy specifications are guaranteed with the assumption that the input clock complies with CK420BQ accuracy requirements
(±100ppm). The buffer itself does not contribute to ppm error.
3 Driven by SRC output of main clock, 100MHz PLL Mode or Bypass Mode.
4 Driven by CPU output of main clock, 133MHz PLL Mode or Bypass Mode.
Pow er Management
CKPWRGD_PD#
DIF_IN
SMBus EN bit
OE[x]#
DIF[x]
PLL State if not in Bypass Mode
0
X
X
0
0
1
1
X
0
1
0
1
Low/Low
Low/Low
Low/Low
Running
Low/Low
Off
On
On
On
On
1
Running
©2018 Integrated Device Technology, Inc
13
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Pow er Connections
Pin Number
V
V
GND
Description
DD
DDIO
1
8
2
Analog PLL
Analog input
DIF clocks
7
24,40,57
25,32,49,56
23,33,41,48, 58,65
Functionality at Pow er-Up (PLL Mode)
100M_133M#
DIF_IN MHz
DIF[x]
1
0
100.00
133.33
DIF_IN
DIF_IN
PLL Operating Mode Readback
HIBW_BYPM_LOBW#
Byte0, bit 7
Byte 0, bit 6
Low (Low BW)
Mid (Bypass)
0
0
1
0
1
1
High (High BW)
PLL Operating Mode
HIBW_BYPM_LOBW#
Mode
Low
Mid
PLL Low BW
Bypass
High
PLL High BW
Note: PLL is OFF in Bypass Mode.
SMBus Addressing
SMB_A1_tri
SMB_A0_tri
SMBus Address
0
0
0
M
1
D8
DA
DE
C2
C4
C6
CA
CC
CE
0
M
M
M
1
0
M
1
0
1
M
1
1
©2018 Integrated Device Technology, Inc
14
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Test Loads
Low-Power HCSL Output Test Load
(standard PCIe source-terminated test load)
Rs
CL
L
Test
Points
Differential Zo
CL
Rs
Table 15. Parameters for Low -Power HCSL Output Test Load
Device
Rs (Ω)
Zo (Ω)
L (inches)
C (pF)
L
27
33
85
100
85
10
10
10
10
2
2
2
2
9ZXL123x
Internal
7.5
9ZXL125x*
100
* Contact factory for versions of this device with Zo = 100Ω.
Alternate Terminations
The LP-HCSL output can easily drive other logic families. See “AN-891 Driving LVPECL, LVDS, and CML Logic with IDT's “Universal”
Low-Power HCSL Outputs” for termination schemes for LVPECL, LVDS, CML and SSTL.
©2018 Integrated Device Technology, Inc
15
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
General SMBus Serial Interface Information
How to Write
How to Read
▪ Controller (host) sends a start bit
▪ Controller (host) will send a start bit
▪ Controller (host) sends the write address
▪ IDT clock will acknowledge
▪ Controller (host) sends the write address
▪ IDT clock will acknowledge
▪ Controller (host) sends the beginning byte location = N
▪ IDT clock will acknowledge
▪ Controller (host) sends the beginning byte location = N
▪ IDT clock will acknowledge
▪ Controller (host) sends the byte count = X
▪ IDT clock will acknowledge
▪ Controller (host) will send a separate start bit
▪ Controller (host) sends the read address
▪ IDT clock will acknowledge
▪ Controller (host) starts sending Byte N through Byte N+X-1
▪ IDT clock will acknowledge each byte one at a time
▪ Controller (host) sends a stop bit
▪ IDT clock will send the data byte count = X
▪ IDT clock sends Byte N+X-1
▪ IDT clock sends Byte 0 through Byte X (if X(H) was written to
Index Block Write Operation
Byte 8)
Controller (Host)
starT bit
Slave Address
WR WRite
IDT (Slave/Receiver)
▪ Controller (host) will need to acknowledge each byte
▪ Controller (host) will send a not acknowledge bit
▪ Controller (host) will send a stop bit
T
Index Block Read Operation
ACK
ACK
ACK
ACK
Controller (Host)
starT bit
Slave Address
WR WRite
IDT (Slave/Receiver)
Beginning Byte = N
Data Byte Count = X
Beginning Byte N
T
ACK
ACK
Beginning Byte = N
O
O
O
RT
Repeat starT
O
O
O
Slave Address
RD
ReaD
ACK
Byte N + X - 1
ACK
Data Byte Count=X
Beginning Byte N
P
stoP bit
ACK
ACK
O
O
O
O
O
O
Byte N + X - 1
N
P
Not
stoP bit
©2018 Integrated Device Technology, Inc
16
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
SMBus Table: PLL Mode and Frequency Select Register
Byte 0
Pin #
Name
Control Function
Type
0
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
5
5
PLL Mode 1
PLL Mode 0
PLL Operating Mode Rd back 1
PLL Operating Mode Rd back 0
Reserved
R
R
Latch
See PLL Operating Mode Readback
table
Latch
0
Reserved
0
—
—
—
4
PLL_SW_EN
PLL Mode 1
PLL Mode 0
100M_133M#
Enable S/W control of PLL BW
PLL Operating Mode 1
PLL Operating Mode 1
Frequency Select Readback
RW
RW
RW
R
HW Latch
SMBus Control
0
1
See PLL Operating Mode Readback
Table
1
133MHz
100MHz
Latch
Note: Setting bit 3 to '1' allows the user to override the latch value from pin 5 via use of bits 2 and 1. Use the values from the PLL
Operating Mode Readback table. Note that Bits 7 and 6 will keep the value originally latched on pin 5. If these bits are changed, a warm
reset of the system must be completed.
SMBus Table: Output Control Register
Byte 1
Pin #
Name
Control Function
Type
0
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
47/46
43/42
39/38
35/34
30/31
26/27
21/22
17/18
DIF_7_En
DIF_6_En
DIF_5_En
DIF_4_En
DIF_3_En
DIF_2_En
DIF_1_En
DIF_0_En
Output Enable
Output Enable
Output Enable
Output Enable
Output Enable
Output Enable
Output Enable
Output Enable
RW
RW
RW
RW
RW
RW
RW
RW
1
1
1
1
1
1
1
1
Low/Low
OE# Pin Control
SMBus Table: Output Control Register
Byte 2
Pin #
Name
Control Function
Type
0
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reserved
0
0
0
0
1
1
1
1
Reserved
Reserved
Reserved
64/63
59/60
54/55
50/51
DIF_11_En
DIF_10_En
DIF_9_En
DIF_8_En
Output Enable
RW
RW
RW
RW
Output Enable
Output Enable
Output Enable
Low/Low
OE# Pin Control
©2018 Integrated Device Technology, Inc
17
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
SMBus Table: Reserved Register
Byte 3
Pin #
Name
Control Function
Reserved
Type
Type
Type
0
0
0
1
1
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
0
0
0
0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SMBus Table: Reserved Register
Byte 4
Pin #
Name
Control Function
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
0
0
0
0
0
0
0
0
SMBus Table: Vendor & Revision ID Register
Byte 5
Pin #
Name
Control Function
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
—
—
—
—
—
—
—
—
RID3
RID2
RID1
RID0
VID3
VID2
VID1
VID0
R
R
R
R
R
R
R
R
0
1
0
0
0
0
0
1
REVISION ID
VENDOR ID
E rev = 0100
—
—
—
—
—
—
—
—
©2018 Integrated Device Technology, Inc
18
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
SMBus Table: Device ID
Byte 6
Pin #
Name
Control Function
Device ID 7 (MSB)
Type
0
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
—
—
—
—
—
—
—
—
R
R
R
R
R
R
R
R
1
1
1
x
x
x
x
x
Device ID 6
Device ID 5
Device ID 4
Device ID 3
Device ID 2
Device ID 1
Device ID 0
9ZXL1231E: E7h
9ZXL1251E: F7h
SMBus Table: Byte Count Register
Byte 7
Pin #
Name
Control Function
Reserved
Type
0
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
0
0
0
0
1
0
0
0
Reserved
Reserved
—
—
—
—
—
BC4
BC3
BC2
BC1
BC0
RW
RW
RW
RW
RW
Writing to this register configures
how many bytes will be read back.
Default value is 8 hex, so 9 bytes (0 to
8) will be read back by default.
SMBus Table: Reserved Register
Byte 8
Pin #
Name
Control Function
Type
0
1
Default
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
0
0
0
0
0
0
0
0
©2018 Integrated Device Technology, Inc
19
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Package Outline Draw ings
The package outline drawings are appended at the end of this document and are accessible from the link below. The package information
is the most current data available.
www.idt.com/document/psc/64-vfqfpn-package-outline-drawing-90-x-90-x-09-mm-body-05mm-pitch-epad-615-x-615-mm-nlg64p2
Ordering Information
Orderable Part Number
Package
Carrier Type
Temperature
9ZXL1231EKILF
9ZXL1231EKILFT
9 x 9 mm, 0.5 mm pitch 64-VFQFPN
9 x 9 mm, 0.5 mm pitch 64-VFQFPN
9 x 9 mm, 0.5 mm pitch 64-VFQFPN
9 x 9 mm, 0.5 mm pitch 64-VFQFPN
Trays
-40° to +85°C
-40° to +85°C
-40° to +85°C
Tape and Reel, Pin 1 Orientation: EIA-481C
Tape and Reel, Pin 1 Orientation: EIA-481D
9ZXL1231EKILF/W
9ZXL1231EKILF-1K/W
Tape and Reel, Pin 1 Orientation: EIA-481D, 1K -40° to +85°C
Reel Quantity
9ZXL1251EKILF
9ZXL1251EKILFT
9 x 9 mm, 0.5 mm pitch 64-VFQFPN
9 x 9 mm, 0.5 mm pitch 64-VFQFPN
Trays
-40° to +85°C
-40° to +85°C
Tape and Reel, Pin 1 Orientation: EIA-481C
“LF” designates PB-free configuration, RoHS compliant.
“E” is the device revision designator (will not correlate with the datasheet revision).
Table 16. Pin 1 Orientation in Tape and Reel Packaging
Part Number Suffix
Pin 1 Orientation
Illustration
8
Quadrant 1 (EIA-481-C)
/W
Quadrant 2 (EIA-481-D)
©2018 Integrated Device Technology, Inc
20
August 14, 2018
9ZXL1231E / 9ZXL1251E Datasheet
Marking Diagrams
1. “I” denotes industrial temperature range
2. “L” denotes RoHS compliant package.
ICS
9ZXL1231EIL
LOT
ICS
9ZXL1251EIL
LOT
3. “YYWW” denotes the last two digits of the year and
week the part was assembled.
COO YYWW
4. “COO” denotes country of origin.
5. “LOT” denotes the lot number.
COO YYWW
Revision History
Revision Date
Description of Change
August 14, 2018
April 17, 2018
Updated block diagram.
Updated absolute maximum supply voltage rating and VIHSMB to 3.9V.
Removed “5V tolerant” reference in pins 12 and 13 descriptions.
Updated Slew Rate Matching conditions.
Updated Byte 6 device ID.
December 1, 2017
September 29, 2017
May 4, 2017
May 2, 2017
Initial release.
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138 USA
www.IDT.com
Sales
Tech Support
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,
without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability
of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not
convey any license under intellectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be rea-
sonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property
of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Integrated Device Technology, Inc All rights reserved.
©2018 Integrated Device Technology, Inc
21
August 14, 2018
相关型号:
©2020 ICPDF网 联系我们和版权申明