ICS552R-01BILFT [IDT]

Low Skew Clock Driver, 552 Series, 4 True Output(s), 0 Inverted Output(s), CMOS, PDSO20, 0.150 INCH, SSOP-20;
ICS552R-01BILFT
型号: ICS552R-01BILFT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Low Skew Clock Driver, 552 Series, 4 True Output(s), 0 Inverted Output(s), CMOS, PDSO20, 0.150 INCH, SSOP-20

驱动 光电二极管 逻辑集成电路
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ICS552-01B  
Dual 1 to 4 High-Speed Clock Buffer  
Description  
Features  
The ICS552-01B is a low cost, high-speed clock buffer  
which includes two identical single input to four output  
buffers. By combining the two buffers on one monolithic  
device, the propagation delays are matched through  
the device, maintaining any skew relationship present  
on the inputs. It is also possible to connect the inputs  
together, creating a one-to-eight buffer. See the  
ICS551M for a single 1 to 4 buffer in an 8-pin SOIC. For  
more than eight outputs, see the MK74CBxxx Buffalo™  
series of clock drivers.  
Packaged as 20-pin (150 mil) SSOP (QSOP)  
Pb-free packaging available  
Up to 200 MHz clock input/output at 3.3 V  
Low skew of 250 ps maximum for any bank of four  
Inputs can be connected together for a 1 to 8 buffer  
with 250 ps skew between any outputs  
3.0 V to 5.5 V operating voltage  
Non-inverting  
Ideal for networking clocks  
Output Enable mode tri-states outputs  
ICS also makes many PLL-based low-skew output  
devices, as well as Zero Delay Buffers to synchronize  
clocks. Contact ICS for all of your clocking needs.  
Full CMOS output swing with 25 mA output drive  
capability at TTL levels  
Advanced, low power, sub-micron CMOS process  
Industrial temperature version available  
Block Diagram  
INA  
QA1  
QA2  
QA3  
QA4  
QB1  
QB2  
QB3  
QB4  
S1  
Control  
Logic  
S0  
INB  
MDS 552-01B E  
1
Revision 012904  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS552-01B  
Dual 1 to 4 High-Speed Clock Buffer  
Clock Output Select Table  
Pin Assignment  
S1 S0  
Mode  
INA  
DC  
DC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
S0  
0
0
1
1
0
1
0
1
QA1:4 and QB1:4 running  
Test mode  
INB  
QB4  
QB3  
VDD  
OE. All outputs in high impedance  
QA1:4 only. QB1:4 stopped low  
VDD  
VDD  
GND  
QA1  
QA2  
QA3  
QA4  
VDD  
GND  
QB2  
QB1  
S1  
20-pin (150 mil) SSOP (QSOP)  
Pin Descriptions  
Pin  
Pin  
Pin  
Type  
Pin Description  
Number Name  
1
2
INA  
DC  
CI  
Input to buffer A. Outputs QA1:4 will be the same frequency. Internal pull-up resistor.  
Do not connect.  
3
DC  
Do not connect.  
4
VDD  
VDD  
GND  
QA1  
QA2  
QA3  
QA4  
Power  
Power  
Power  
Connect to +3.3 V or 5.0 V. Must be same as other VDDs.  
Connect to +3.3 V or 5.0 V. Must be same as other VDDs.  
5
6
Connect to ground.  
7
Output Output 1 from buffer A.  
Output Output 2 from buffer A.  
Output Output 3 from buffer A.  
Output Output 4 from buffer A.  
8
9
10  
Mode Select pin 1. Selects mode for outputs. Must be at GND for all clocks on. Internal  
pull-up resistor.  
11  
S1  
I
12  
13  
14  
15  
16  
17  
18  
19  
QB1  
QB2  
GND  
VDD  
VDD  
QB3  
QB4  
INB  
Output Output 1 from buffer B.  
Output Output 2 from buffer B.  
Power  
Power  
Power  
Connect to ground.  
Connect to +3.3 V or 5.0 V. Must be same as other VDDs.  
Connect to +3.3 V or 5.0 V. Must be same as other VDDs.  
Output Output 3 from buffer B.  
Output Output 4 from buffer B.  
Input to buffer B. Outputs QA1:4 will be the same frequency. Internal pull-up resistor.  
CI  
Mode Select pin 0. Selects mode for outputs. Must be at GND for all clocks on. Internal  
pull-up resistor.  
20  
S0  
I
KEY: CI = clock input with pull-up resistor; I = input with internal pull-up resistor  
MDS 552-01B E  
2
Revision 012904  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS552-01B  
Dual 1 to 4 High-Speed Clock Buffer  
PCB Layout Recommendations  
External Components  
For optimum device performance and lowest output  
phase noise, the following guidelines should be  
observed.  
Series Termination Resistor  
Clock output traces over one inch should use series  
termination. To series terminate a 50trace (a  
commonly used trace impedance), place a 33resistor  
in series with the clock line, as close to the clock output  
pin as possible. The nominal impedance of the clock  
output is 20.  
1) Each 0.01µF decoupling capacitor should be  
mounted on the component side of the board as close  
to the VDD pin as possible. No vias should be used  
between decoupling capacitor and VDD pin. The PCB  
trace to VDD pin should be kept as short as possible,  
as should the PCB trace to the ground via.  
Decoupling Capacitors  
2) The external crystal should be mounted just next to  
the device with short traces. The X1 and X2 traces  
should not be routed next to each other with minimum  
spaces, instead they should be separated and away  
from other traces.  
As with any high-performance mixed-signal IC, the  
ICS552-01B must be isolated from system power  
supply noise to perform optimally.  
Decoupling capacitors of 0.01µF must be connected  
between each VDD and GND on pins 4 and 6, and 16  
and 14. Other VDDs and GNDs can be connected to  
these pins or directly to their respective ground planes.  
3) To minimize EMI, the 33series termination resistor  
(if needed) should be placed close to the clock output.  
4) An optimum layout is one with all components on the  
same side of the board, minimizing vias through other  
signal layers.  
MDS 552-01B E  
3
Revision 012904  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS552-01B  
Dual 1 to 4 High-Speed Clock Buffer  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICS552-01B. These ratings,  
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of  
the device at these or any other conditions above those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can  
affect product reliability. Electrical parameters are guaranteed only over the recommended operating  
temperature range.  
Parameter  
Condition  
Min.  
Typ.  
Max.  
7
Units  
V
Supply Voltage, VDD  
Inputs  
Referenced to GND  
Referenced to GND  
Referenced to GND  
-0.5  
-0.5  
-65  
VDD+0.5  
VDD+0.5  
150  
V
Clock Outputs  
V
Storage Temperature  
Soldering Temperature  
Junction Temperature  
°C  
°C  
°C  
Max 10 seconds  
260  
125  
Recommended Operation Conditions  
Parameter  
Min.  
0
Typ.  
Max.  
+70  
Units  
°C  
Ambient Operating Temperature (ICS552R-01B)  
Ambient Operating Temperature (ICS552R-01BI)  
-40  
+85  
°C  
DC Electrical Characteristics  
Unless stated otherwise, VDD = 5 V, Ambient Temperature -40 to +85°C  
Parameter  
Operating Voltage  
Input High Voltage  
Input Low Voltage  
Input High Voltage  
Input Low Voltage  
Output High Voltage  
Symbol  
Conditions  
Min.  
Typ.  
Max. Units  
VDD  
3.0  
5.5  
V
V
V
V
V
V
V
INA and INB  
VDD/2+1 VDD/2  
IH  
V
X1 pin only  
S1 and S0  
S1 and S0  
VDD = 5 V,  
VDD/2 VDD/2-1  
0.8  
IL  
V
2
IH  
V
IL  
V
2.4  
OH  
I
= -25 mA  
OH  
Output Low Voltage  
Output High Voltage  
Short Circuit Current  
V
VDD = 5 V,  
= 25 mA  
0.4  
V
V
OL  
OH  
OS  
I
OL  
V
CMOS level,  
= -8 mA  
VDD-0.4  
I
OH  
I
VDD = 3.3 V, each  
output  
50  
mA  
MDS 552-01B E  
4
Revision 012904  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS552-01B  
Dual 1 to 4 High-Speed Clock Buffer  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max. Units  
Operating Supply Current  
I
at 3.3 V, no load, all 135  
MHz  
35  
mA  
DD  
Input Capacitance  
All inputs  
All inputs  
4
pF  
Internal Pull-up resistor  
R
55  
kΩ  
PU  
AC Electrical Characteristics  
Unless stated otherwise, VDD = 5 V, Ambient Temperature -40 to +85° C  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max. Units  
Input Frequency  
F
0
200  
200  
180  
135  
1.5  
MHz  
MHz  
MHz  
MHz  
ns  
IN  
Output Frequency  
F
OUT  
3.3 V, 10 pF load, note 3.  
3.3 V, 15 pF load, note 3.  
5 V, 15 pF load, note 3.  
0.8 to 2.0 V  
Output Rise Time  
Output Fall Time  
Propagation Delay  
t
OR  
t
2.0 to 0.8 V  
1.5  
ns  
OF  
at 3.3 V  
4
3
ns  
at 5 V  
ns  
Output-to-Output Skew  
within bank of four  
Rising edges at VDD/2  
250  
250  
ps  
Output-to-Output Skew  
between banks  
Note 1  
ps  
Notes:  
1. When INA is connected to INB, all eight outputs are within 250 ps skew.  
2. Duty cycle on outputs will match incoming clock duty cycle. Consult ICS for tight duty cycle clock  
generators.  
3. With external series resistor of 33positioned close to each output pin.  
Thermal Characteristics  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
θ
θ
Still air  
135  
93  
°C/W  
°C/W  
°C/W  
°C/W  
JA  
JA  
JA  
JC  
1 m/s air flow  
3 m/s air flow  
78  
Thermal Resistance Junction to Case  
θ
60  
MDS 552-01B E  
5
Revision 012904  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  
ICS552-01B  
Dual 1 to 4 High-Speed Clock Buffer  
Package Outline and Package Dimensions (20-pin SSOP, 150 Mil. Wide Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches  
20  
Symbol  
Min  
Max  
1.75  
0.25  
1.50  
0.30  
0.25  
8.75  
6.20  
4.00  
Min  
Max  
A
A1  
A2  
b
1.35  
0.10  
--  
0.20  
0.18  
8.55  
5.80  
3.80  
0.053  
0.004  
--  
0.008  
0.007  
0.337  
0.228  
0.150  
0.069  
0.010  
0.059  
0.012  
0.010  
0.344  
0.244  
0.157  
E1  
E
INDEX  
AREA  
c
D
E
E1  
e
1
2
.635 Basic  
.025 Basic  
D
L
0.40  
0°  
1.27  
8°  
0.016  
0°  
0.050  
8°  
α
aaa  
--  
0.10  
--  
0.004  
A
A2  
A1  
c
- C -  
e
SEATING  
PLANE  
b
L
aaa C  
Ordering Information  
Part / Order Number  
Marking  
Shipping  
packaging  
Package  
Temperature  
ICS552R-01B  
ICS552R-01BT  
ICS552R-01BLF  
ICS552R-01BLFT  
ICS552R-01BI  
ICS552-01B  
ICS552-01B  
Tubes  
20-pin SSOP  
20-pin SSOP  
20-pin SSOP  
20-pin SSOP  
20-pin SSOP  
20-pin SSOP  
0 to +70°C  
0 to +70°C  
0 to +70°C  
0 to +70°C  
-40 to +85°C  
-40 to +85°C  
Tape and Reel  
Tubes  
ICS552-01BLF  
ICS552-01BLF  
ICS552-01BI  
ICS552-01BI  
Tape and Reel  
Tubes  
ICS552R-01BIT  
Tape and Reel  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)  
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would  
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial  
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary  
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any  
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or  
critical medical instruments.  
MDS 552-01B E  
6
Revision 012904  
Integrated Circuit Systems, Inc. 525 Race Street, San Jose, CA 95126 tel (408) 297-1201 www.icst.com  

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