ICS95V850AGT [IDT]

PLL Based Clock Driver, 10 True Output(s), 0 Inverted Output(s), PDSO48, 0.240 INCH, MO-153, TSSOP-48;
ICS95V850AGT
型号: ICS95V850AGT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

PLL Based Clock Driver, 10 True Output(s), 0 Inverted Output(s), PDSO48, 0.240 INCH, MO-153, TSSOP-48

驱动 光电二极管 逻辑集成电路
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ICS95V850  
Integrated  
Circuit  
Systems, Inc.  
DDR Phase Lock Loop Clock Driver (60MHz - 210MHz)  
RecommendedApplication:  
DDR Clock Driver  
Pin Configuration  
GND  
CLKC0  
CLKT0  
VDD  
CLKT1  
CLKC1  
GND  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
GND  
ProductDescription/Features:  
CLKC5  
CLKT5  
VDD  
CLKT6  
CLKC6  
GND  
Low skew, low jitter PLL clock driver  
Feedback pins for input to output synchronization  
Spread Spectrum tolerant inputs  
With bypass mode mux  
GND  
GND  
CLKC2  
CLKT2  
VDD  
CLKC7  
CLKT7  
VDD  
Operating frequency 60 to 210 MHz  
AC Coupled (Universal) CLK inputs:  
- 400 mV switching amplitude  
- (LVTTL, LVPELL, LVDS, LVCMOS) standards  
translation to SSTL2  
NC  
NC  
CLK_INT  
CLK_INC  
NC  
AVDD  
AGND  
GND  
CLKC3  
CLKT3  
VDD  
CLKT4  
CLKC4  
GND  
FB_INC  
FB_INT  
VDD  
FB_OUTT  
FB_OUTC  
GND  
CLKC8  
CLKT8  
VDD  
CLKT9  
CLKC9  
GND  
SwitchingCharacteristics:  
CYCLE - CYCLE jitter: <60ps  
OUTPUT - OUTPUT skew: <60ps  
Period jitter:±30ps  
DUTY CYCLE: 49.5% - 50.5%  
48-Pin TSSOP  
6.10mm Body, 0.5mm Pitch  
Block Diagram  
Functionality  
INPUTS  
OUTPUTS  
PLL State  
AVDD CLK_INT CLK_INC CLKT CLKC FB_OUTT FB_OUTC  
FB_OUTT  
FB_OUTC  
GND  
GND  
L
H
L
L
H
L
L
H
L
Bypassed/Off  
Bypassed/Off  
H
H
H
CLKT0  
CLKC0  
2.5V  
(nom)  
L
H
L
L
H
L
L
H
L
On  
On  
CLKT1  
CLKC1  
2.5V  
(nom)  
H
H
H
CLKT2  
CLKC2  
CLKT3  
CLKC3  
CLKT4  
CLKC4  
FB_INT  
FB_INC  
CLKT5  
CLKC5  
PLL  
CLK_INC  
CLK_INT  
CLKT6  
CLKC6  
CLKT7  
CLKC7  
CLKT8  
CLKC8  
AVDD  
CLKT9  
CLKC9  
0458G—11/21/08  
ICS95V850  
Pin Descriptions  
PIN NUMBER  
PIN NAME  
TYPE  
DESCRIPTION  
1, 7, 8, 18, 24, 25,  
31, 41, 42, 48  
GND  
PWR Ground  
26, 30, 40, 43, 47,  
23, 19, 9, 6, 2  
CLK[9:0]  
CLK[9:0]  
VDD  
OUT  
OUT  
"Complementary" clocks of differential pair outputs  
"True" Clock of differential pair outputs  
27, 29, 39, 44, 46,  
22, 20, 10, 5, 3  
4, 11, 21, 28,  
34, 38, 45,  
PWR Power supply, 2.5V  
13  
14  
16  
17  
CLK_INT  
CLK_INC  
AVDD  
IN  
IN  
"True" reference clock input  
"Complementary" reference clock input  
PWR Analog power supply, 2.5V  
AGND  
PWR Analog ground  
"Complementary" Feedback output, dedicated for external feedback. It  
32  
FB_OUTC  
OUT  
OUT  
switches at the same frequency as the CLK. This output must be wired  
to FB_INC  
"True" " Feedback output, dedicated for external feedback. It switches  
at the same frequency as the CLK. This output must be wired to  
FB_INT  
33  
35  
FB_OUTT  
FB_INT  
"True" Feedback input, provides feedback signal to the internal PLL for  
synchronization with CLK_INT to eliminate phase error  
IN  
IN  
"Complementary" Feedback input, provides signal to the internal PLL  
for synchronization with CLK_INC to eliminate phase error  
36  
FB_INC  
NC  
12, 15, 37  
No Connects  
0458G—11/21/08  
2
ICS95V850  
Absolute Maximum Ratings  
Supply Voltage: (VDD & AVDD) . . . . . . . . . . . . . . . . -0.5V to 3.6V  
Input clamp current: IIK (VI < 0 or VI > VDD). . . . . . +/- 50mA  
Output clamp current: IOK (VO < 0 or VO > VDD) . . +/- 50mA  
Continuous output current: IO (VO = 0 to VDD) . . . . +/- 50mA  
Package thermal impedance, theta JA: DGG package +89°C/Ω  
StorageTemperature . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device.These  
ratingsarestressspecificationsonlyandfunctionaloperationofthedeviceattheseoranyotherconditionsabovethose  
listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions  
for extended periods may affect product reliability.  
Electrical Characteristics - Input/Supply/Common Output Parameters  
TA = 0 - 85°C; Supply Voltage AVDD, VDD = 2.5 V +/- 0.2V (unless otherwise stated)  
PARAMETER  
Input High Current  
Input Low Current  
SYMBOL  
CONDITIONS  
VI = VDD or GND  
VI = VDD or GND  
MIN  
5
TYP  
MAX  
UNITS  
µA  
IIH  
IIL  
5
µA  
Operating Supply  
Current  
IDD2.5 CL = 0pf @ 200MHz  
IDDPD CL = 0pf  
148  
100  
mA  
µA  
High Impedance  
Output Current  
VDD = 2.7V, Vout = VDD or  
IOZ  
±10  
-1.2  
mA  
GND  
Input Clamp Voltage  
VIK  
VDD = 2.3V Iin = -18mA  
V
V
High-level output  
voltage  
IOH = -1 mA  
IOH = -12 mA  
IOL =1 mA  
VDD - 0.1  
1.7V  
VOH  
V
0.1  
0.6  
3.5  
V
Low-level output voltage  
Input Capacitance1  
1Guaranteed by design at 233MHz, not 100% tested in production.  
VOL  
CIN  
IOH =12 mA  
V
VI = GND or VDD  
2.5  
pF  
0458G—11/21/08  
3
ICS95V850  
Recommended Operating Condition  
(see note1)  
TA = 0 - 85°C; Supply Voltage AVDD, VDD = 2.5 V +/- 0.2V (unless otherwise stated)  
PARAMETER  
Supply Voltage  
SYMBOL  
DD, AVDD  
CONDITIONS  
MIN  
2.3  
TYP  
2.5  
MAX  
2.7  
UNITS  
V
V
V
CLK_INT, CLK_INC, FB_INC  
0.4  
V
DD/2 - 0.18  
Low level input voltage  
VIL  
CLK_INT, CLK_INC (Universal Input)  
-0.3  
VDD - 0.4  
V
CLK_INT, CLK_INC, FB_INC  
VDD/2 + 0.18  
0.4  
2.1  
V
V
High level input voltage  
VIH  
VIN  
CLK_INT, CLK_INC (Universal Input)  
VDD + 0.3  
VDD + 0.3  
DC input signal voltage  
(note 2)  
-0.3  
0.36  
0.4  
V
V
V
DC - CLK_INT, FB_INT  
V
V
DD + 0.6  
DD + 0.6  
Differential input signal  
voltage (note 3)  
VID  
AC - CLK_INT, FB_INT (Universal Input)  
Output differential cross-  
voltage (note 4)  
Input differential cross-  
voltage (note 4)  
High level output  
current  
VOX  
VIX  
IOH  
IOL  
TA  
VDD/2 - 0.15  
VDD/2 + 0.15  
V
(Universal Input)  
0.45(VIH - VIL)  
0.55(VIH - VIL)  
V
-6.4  
5.5  
85  
mA  
mA  
°C  
Low level output current  
Operating free-air  
temperature  
0
Notes:  
1. Unused inputs must be held high or low to prevent them from floating.  
2. DC input signal voltage specifies the allowable DC execution of differential input.  
3. Differential inputs signal voltages specifies the differential voltage [VTR-VCP]  
required for switching, where VT is the true input level and VCP is the  
complementary input level.  
4. Differential cross-point voltage is expected to track variations of VDD and is the  
voltage at which the differential signal must be crossing.  
Timing Requirements  
TA = 0 - 85°C; Supply Voltage AVDD, VDD = 2.5 V +/- 0.2V (unless otherwise stated)  
CONDITIONS  
PARAMETER  
Operating clock frequency  
Input clock duty cycle  
SYMBOL  
freqop  
dtin  
MIN  
66  
TYP  
MAX UNITS  
210  
60  
MHz  
%
40  
CLK stabilization  
TSTAB  
15  
µs  
0458G—11/21/08  
4
ICS95V850  
Switching Characteristics (see note 3)  
PARAMETER  
Low-to high level  
propagation delay time  
High-to low level propagation  
delay time  
SYMBOL  
CONDITION  
MIN  
TYP  
MAX UNITS  
ns  
1
CLK_IN to any output  
5.5  
5.5  
tPLH  
1
CLK_IN to any output  
ns  
tPLL  
Period jitter  
Tjit (per)  
t(jit_hper)  
tsl(i)  
100MHz to 200MHz  
100MHz to 200MHz  
-30  
-75  
1
30  
30  
4
ps  
ps  
Half-period jitter  
Input clock slew rate  
V/ns  
V/ns  
ps  
Output clock slew rate  
Cycle to Cycle Jitter1  
Phase error  
tsl(o)  
1
2.5  
60  
50  
60  
Tcyc-Tcyc  
100MHz to 200MHz  
4
-50  
0
ps  
t(phase error)  
Tskew  
Output to Output Skew  
ps  
Notes:  
1. Refers to transition on noninverting output in PLL bypass mode.  
2. While the pulse skew is almost constant over frequency, the duty cycle error  
increases at higher frequencies.This is due to the formula:duty cycle=twH/tc, where  
the cycle (tc) decreases as the frequency goes up.  
3. Switching characteristics guaranteed for application frequency range.  
4. Static phase offset shifted by design.  
0458G—11/21/08  
5
ICS95V850  
Parameter Measurement Information  
V
DD  
V
(CLKC)  
R = 60Ω  
V
/2  
R = 60Ω  
DD  
V
(CLKC)  
ICS95V850  
GND  
Figure 1. IBIS Model Output Load  
V
DD/2  
C = 14 pF  
ICS95V850  
-V  
DD/2  
SCOPE  
R = 10Z = 50Ω  
Z = 60Ω  
Z = 60Ω  
R = 50Ω  
(TT)  
V
R = 10Ω  
Z = 50Ω  
R = 50Ω  
C = 14 pF  
DD/2  
V
(TT)  
-V  
-V  
DD/2  
NOTE: V  
(TT) = GND  
Figure 2. Output Load Test Circuit  
YX, FB_OUTC  
YX, FB_OUTT  
t
t
c(n+1)  
c(n)  
t
= t  
± t  
jit(cc) c(n) c(n+1)  
Figure 3. Cycle-to-Cycle Jitter  
0458G—11/21/08  
6
ICS95V850  
Parameter Measurement Information  
CLK_INC  
CLK_INT  
FB_INC  
FB_INT  
t
t
( ) n  
( ) n+1  
n = N  
t
1
( ) n  
t
=
( )  
N
(N is a large number of samples)  
Figure 4. Static Phase Offset  
YX  
#
YX  
YX, FB_OUTC  
YX, FB_OUTT  
t(SK_O)  
Figure 5. Output Skew  
YX, FB_OUTC  
YX, FB_OUTT  
YX, FB_OUTC  
YX, FB_OUTT  
1
fO  
1
t(jit_per)  
tC(n)  
=
-
fO  
Figure 6. Period Jitter  
0458G—11/21/08  
7
ICS95V850  
Parameter Measurement Information  
YX, FB_OUTC  
YX, FB_OUTT  
t
t
(hper_n+1)  
(hper_n)  
1
f
o
t(jit_Hper) t(jit_Hper_n)  
1
2xfO  
=
-
Figure 7. Half-Period Jitter  
80%  
80%  
V
, V  
ID OD  
20%  
20%  
Clock Inputs  
and Outputs  
Rise t  
Fall t  
sl  
sl  
Figure 8. Input and Output Slew Rates  
0458G—11/21/08  
8
ICS95V850  
Recommended Layout for the ICS95V850  
General Layout Precautions:  
Use copper flooded ground on the top signal layer under the  
clock buffer The area under U1 on the right is an example.  
Flood over the ground vias.  
1) Use power vias for power and ground. Vias 20 mil or  
larger in diameter have lower high frequency impedance.  
Vias for signals may be minimum drill size.  
2) Make all power and ground traces are as wide as the via  
pad for lower inductance.  
3) VAA for pin 16 has a low pass RC filter to decouple the  
digital and analog supplies. The 4.7uF capacitors may be  
replaced with a single low ESR device with the same  
total capacitance. VAA is routed on a outside signal  
layer. Do not cut a power or ground plane and route in it.  
4) Notice that ground vias are never shared.  
5) When ever possible, VCC (net V2P5 in the schematic)  
pins have a decoupling capacitor. Power is always routed  
from the plane connection via to the capacitor pad to the  
VCC pin on the clock buffer. Moats or plane cuts are not  
used to isolate power.  
6) Differential mode clock output traces are routed:  
a. With a ground trace between the pairs. Trace is  
grounded on both ends.  
b. Without a ground trace, clock pairs are routed with a  
separation of at least 5 times the thickness of the  
dielectric. If the dielectric thickness is 4.5 mil, the  
trace separation is at least 18 mils.  
7) Terminate differential CLK_IN and FB_IN traces after  
routing to buffer pads.  
Component Values:  
Ref Desg. Value  
Description  
CERAMIC MLC  
Package  
0603  
C1,C4,C5,  
C7,C11,C12  
C2,C3,C8,  
C9  
.01uF  
4.7uF  
.22uF  
CERAMIC MLC  
1206  
C10  
CERAMIC MLC  
0603  
0603  
0603  
C6  
2200pF CERAMIC MLC  
R9,R12  
120 Ω  
R9  
U1  
0603  
4.7 Ω  
ICS95V850  
TSSOP48  
0458G—11/21/08  
9
ICS95V850  
c
N
In Millimeters  
In Inches  
SYMBOL  
COMMON DIMENSIONS COMMON DIMENSIONS  
L
MIN  
--  
0.05  
0.80  
0.17  
0.09  
MAX  
1.20  
0.15  
1.05  
0.27  
0.20  
MIN  
--  
.002  
.032  
.007  
.0035  
MAX  
.047  
.006  
.041  
.011  
.008  
A
A1  
A2  
b
E1  
E
INDEX  
AREA  
c
1
22  
D
E
SEE VARIATIONS  
8.10 BASIC  
SEE VARIATIONS  
0.319 BASIC  
a
D
E1  
e
6.00  
6.20  
.236  
0.020 BASIC  
.244  
0.50 BASIC  
L
0.45  
0.75  
.018  
.030  
A
N
SEE VARIATIONS  
SEE VARIATIONS  
A2  
0°  
--  
8°  
0.10  
0°  
--  
8°  
.004  
α
aaa  
A1  
- CC --  
VARIATIONS  
e
SEATING  
PLANE  
b
D mm.  
D (inch)  
N
aaa  
C
MIN  
MAX  
12.60  
MIN  
.488  
MAX  
.496  
48  
12.40  
Reference Doc.: JEDEC Publication 95, M O-153  
6.10 mm. Body, 0.50 mm. pitch TSSOP  
(0.020 mil)  
10 - 0 0 3 9  
(240 mil)  
Ordering Information  
95V850yLFGT  
Example:  
XXXX y G (LF) - T  
Designation for tape and reel packaging  
Lead Free (Optional)  
Package Type  
G = TSSOP  
Revision Designator (will not correlate with datasheet revision)  
Device Type  
0458G—11/21/08  
10  

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