IDT7007S20GGI8 [IDT]
Multi-Port SRAM, 32KX8, 20ns, CMOS, CPGA68;型号: | IDT7007S20GGI8 |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Multi-Port SRAM, 32KX8, 20ns, CMOS, CPGA68 静态存储器 内存集成电路 |
文件: | 总21页 (文件大小:164K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HIGH-SPEED
IDT7007S/L
32K x 8 DUAL-PORT
STATIC RAM
Features
◆
using the Master/Slave select when cascading more than
one device
M/S = H for BUSY output flag on Master,
M/S = L for BUSY input on Slave
Interrupt Flag
On-chip port arbitration logic
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
◆
◆
– Military:25/35/55ns(max.)
◆
◆
◆
– Industrial:20/25/35/55ns(max.)
– Commercial:15/20/25/35/55ns(max.)
Low-power operation
◆
Full on-chip hardware support of semaphore signaling
between ports
– IDT7007S
◆
◆
◆
◆
Fully asynchronous operation from either port
TTL-compatible, single 5V (±10%) power supply
Available in 68-pin PGA and PLCC and a 80-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Active:850mW(typ.)
Standby: 5mW (typ.)
– IDT7007L
Active:850mW(typ.)
Standby: 1mW (typ.)
IDT7007 easily expands data bus width to 16 bits or more
◆
◆
Green parts available, see ordering information
FunctionalBlockDiagram
OER
OEL
CEL
CER
R/WR
R/W
L
I/O0L- I/O7L
I/O0R-I/O7R
I/O
I/O
Control
Control
(1,2)
BUSY (1,2)
L
BUSY
R
A
14R
0R
A
14L
Address
Decoder
MEMORY
ARRAY
Address
Decoder
A
0L
A
15
15
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
L
L
CE
OE
R/W
R
OE
R
R
R/W
L
SEM
R
SEM
L
M/S
(2)
(2)
INT
R
INTL
2940 drw 01
NOTES:
1. (MASTER): BUSY is output; (SLAVE): BUSY is input.
2. BUSY and INT outputs are non-tri-stated push-pull.
JANUARY 2006
1
©2006IntegratedDeviceTechnology,Inc.
DSC 2940/12
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Description
The IDT7007 is a high-speed 32K x 8 Dual-Port Static RAM. The featurecontrolledbyCEpermitstheon-chipcircuitryofeachporttoenter
IDT7007isdesignedtobeusedasastand-alone256K-bitDual-PortRAM a very LOW standby power mode.
orasacombinationMASTER/SLAVEDual-PortRAMfor16-bit-or-more FabricatedusingIDT’sCMOShigh-performancetechnology,these
wordsystems.UsingtheIDTMASTER/SLAVEDual-PortRAMapproach devices typicallyoperate ononly850mWofpower.
in16-bitorwidermemorysystemapplicationsresultsinfull-speed,error-
freeoperationwithouttheneedforadditionaldiscretelogic.
The IDT7007 is packaged in a 68-pin pin PGA, a 68-pin PLCC,
and an 80-pin thin quad flatpack, TQFP. Military grade product is
This device provides two independent ports with separate control, manufacturedincompliancewiththelatestrevisionofMIL-PRF-38535
address,andI/Opinsthatpermitindependent,asynchronousaccessfor QML,ClassB,makingitideallysuitedtomilitarytemperatureapplications
reads or writes to any location in memory. An automatic power down demandingthehighestlevelofperformanceandreliability.
PinConfigurations(1,2,3)
11/06/01
INDEX
9
8
7
6
5
4
3
2
1 68 67 66 65 64 63 62 61
60
I/O2L
I/O3L
I/O4L
I/O5L
GND
I/O6L
I/O7L
A
A
A
A
A
A
5L
4L
3L
2L
1L
0L
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
59
58
57
56
55
IDT7007J
J68-1
54
53
52
51
50
49
48
47
46
45
44
INT
BUSY
L
(4)
L
VCC
GND
I/O0R
I/O1R
I/O2R
GND
M/S
BUSY
68-Pin PLCC
(5)
Top View
R
INT
R
VCC
A
A
A
A
A
0R
I/O3R
I/O4R
I/O5R
I/O6R
1R
2R
3R
4R
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
2940 drw 02
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground.
3. Package body is approximately .95 in x .95 in x .17 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
2
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3) (con't.)
11/06/01
INDEX
1
2
N/C
N/C
I/O2L
I/O3L
I/O4L
I/O5L
GND
I/O6L
I/O7L
60
A
A
A
A
A
A
5L
4L
3L
2L
1L
0L
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
3
4
5
6
7
7007PF
8
INT
L
PN80-1(4)
9
BUSY
GND
M/S
L
VCC
10
11
12
13
14
15
16
17
18
19
20
N/C
GND
I/O0R
I/O1R
I/O2R
80-Pin TQFP
Top View(5)
BUSY
R
,
INT
R
A
A
A
A
A
0R
1R
2R
3R
4R
VCC
I/O3R
I/O4R
I/O5R
I/O6R
N/C
N/C
N/C
2940 drw 03
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
3
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3) (con't.)
51
50
48
A
46
A
44
BUSY
42
M/S
40
INT
38
36
11/06/01
11
10
09
08
07
A4L
2L
0L
A1R
A3R
L
R
A
5L
53
52
49
47
45
INT
43
GND
41
BUSYR
39
37
35
34
L
A4R
A
7L
A3L
A
1L
A0R
A2R
A
5R
6R
8R
A
6L
55
54
32
33
A
A7R
A
9L
A
8L
57
A
56
A
30
31
A
A9R
11L
10L
12L
13L
59
58
A
28
29
A
A11R
10R
12R
13R
IDT7007G
G68-1
V
CC
(4)
61
60
A
26
GND
27
A
06
05
04
03
02
01
A14L
68-Pin PGA
Top View
63
62
24
25
A
(5)
SEM
L
A14R
CE
L
65
64
22
SEM
23
R
CER
OE
L
R/W
L
67
I/O0L
66
20
OE
21
R/WR
,
R
N/C
1
3
5
GND
7
9
68
11
13
V
15
18
I/O7R
19
N/C
GND
I/O7L
CC
I/O1L
I/O4L
I/O2L
I/O1R
I/O4R
2
4
6
8
10
12
14
16
17
I/O5L
I/O0R I/O2R I/O3R I/O5R I/O6R
V
CC
I/O6L
I/O3L
K
A
B
C
D
E
F
G
H
J
L
INDEX
2940 drw 04
NOTES:
1. All Vcc pins must be connected to power supply
2. All GND pins must be connected to ground.
3. Package body is approximately 1.8 in x 1.8 in x .16 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
PinNames
Left Port
Right Port
Names
Chip Enables
Read/Write Enable
Output Enable
Address
CE
R/W
OE
L
CE
R/W
OE
R
L
R
L
R
A0L - A14L
A0R - A14R
I/O0L - I/O7L
I/O0R - I/O7R
Data Input/Output
Semaphore Enable
Interrupt Flag
Busy Flag
SEM
INT
BUSY
L
SEM
INT
BUSY
M/S
R
L
R
L
R
Master or Slave Select
Power
V
CC
GND
Ground
2940 tbl 01
4
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Truth Table I: Non-Contention Read/Write Control
Inputs(1)
R/W
Outputs
I/O0-7
Mode
CE
H
L
OE
X
X
L
SEM
H
X
L
High-Z
DATAIN
Deselected: Power-Down
Write to Memory
H
L
H
X
H
DATAOUT Read Memory
High-Z Outputs Disabled
X
H
X
2940 tbl 02
NOTE:
1. A0L — A14L ≠ A0R — A14R
Truth Table II: Semaphore Read/Write Control(1)
Inputs
Outputs
R/W
I/O0-7
Mode
-I/O
CE
OE
SEM
H
H
L
L
DATAOUT Read Semaphore Flag Data Out (I/O
0
7)
H
L
↑
X
X
L
L
DATAIN
Write I/O
0 into Semaphore Flag
______
X
Not Allowed
2940 tbl 03
NOTE:
1. There are eight semaphore flags written to via I/O0 and read from all I/O's. These eight semaphores are addressed by A0 - A2.
AbsoluteMaximumRatings(1)
MaximumOperatingTemperature
andSupplyVoltage(1)
Symbol
Rating
Commercial
& Industrial
Military
Unit
Ambient
(2)
Grade
Temperature
-55OC to+125OC
0OC to +70OC
-40OC to +85OC
GND
0V
Vcc
V
TERM
Terminal Voltage
with Respect
to GND
-0.5 to +7.0
-0.5 to +7.0
V
Military
5.0V
+
+
+
10%
10%
Te mp e rature
Under Bias
-55 to +125
-65 to +150
50
-65 to +135
-65 to +150
50
oC
oC
Commercial
Industrial
0V
5.0V
5.0V
T
BIAS
0V
10%
Storage
Te mp e rature
TSTG
2940 tbl 05
NOTES:
1. This is the parameter TA. This is the "instant on" case temperature.
IOUT
DC Output
Current
mA
2940 tbl 04
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS
RecommendedDCOperating
Conditions
may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sec-tions of this specification is not implied. Exposure
to absolute maxi-mum rating conditions for extended periods may affect
reliability.
Symbol
Parameter
Supply Voltage
GND Ground
Min.
Typ.
Max. Unit
VCC
4.5
5.0
5.5
0
V
V
V
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.
0
0
(2)
____
V
IH
Input High Voltage
Input Low Voltage
2.2
6.0
Capacitance(TA = +25°C, f = 1.0Mhz)
VIL
-0.5(1)
0.8
V
____
Symbol
Parameter(1)
Input Capacitance
Output Capacitance
Conditions(2)
Max.
Unit
2940 tbl 06
NOTES:
CIN
VIN = 3dV
9
pF
1. VIL > -1.5V for pulse width less than 10ns.
2. VTERM must not exceed Vcc + 10%.
COUT
VOUT = 3dV
10
pF
2940 tbl 07
NOTES:
1. This parameter is determined by device characterization but is not production
tested. TQFP package only.
2. 3dV represents the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
5
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (VCC = 5.0V ± 10%)
7007S
7007L
Symbol
|ILI
|ILO
Parameter
Test Conditions
Min.
Max.
10
Min.
Max.
5
Unit
µA
µA
V
(1)
___
___
|
Input Leakage Current
Output Leakage Current
Output Low Voltage
V
CC = 5.5V, VIN = 0V to VCC
___
___
___
___
|
10
5
CE = VIH, VOUT = 0V to VCC
VOL
I
OL = 4mA
0.4
0.4
___
___
VOH
Output High Voltage
IOH = -4mA
2.4
2.4
V
2940 tbl 08
NOTE:
1. At Vcc < 2.0V, input leakages are undefined.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1) (VCC = 5.0V ± 10%)
7007X15
7007X20
Com'l & Ind
7007X25
Com'l, Ind
& Military
Com'l Only
Symbol
Parameter
Test Condition
Version
COM'L
Typ.(2)
Max.
Typ.(2)
Max.
Typ.(2)
Max.
Unit
ICC
Dynamic Operating
Current
(Both Ports Active)
S
L
190
190
325
285
180
180
315
275
170
170
305
265
mA
CE = VIL, Outputs Disabled
SEM = VIH
(3)
f = fMAX
___
___
___
___
___
___
MIL &
IND
S
L
170
170
345
305
180
315
I
SB1
Standby Current
(Both Ports - TTL Level
Inputs)
COM'L
S
L
35
35
85
60
30
30
85
60
25
25
85
60
mA
mA
CE
SEM
f = fMAX
L
= CE
R
= VIH
= VIH
R
= SEM
L
(3)
___
___
___
___
___
___
MIL &
IND
S
L
25
25
100
80
30
80
(5)
ISB2
Standby Current
(One Port - TTL Level
Inputs)
COM'L
S
L
125
125
220
190
115
115
210
180
105
105
200
170
CE"A" = VIL and CE"B" = VIH
Active Port Outputs Disabled,
(3)
f=fMAX
___
___
___
___
___
___
MIL &
IND
S
L
105
105
230
200
SEMR = SEML = VIH
115
210
I
SB3
Full Standby Current
(Both Ports - All CMOS
Level Inputs)
Both Ports CE
CE > VCC - 0.2V
IN > VCC - 0.2V or
VIN < 0.2V, f = 0(4)
SEM = SEM > VCC - 0.2V
L
and
COM'L
S
L
1.0
0.2
15
5
1.0
0.2
15
5
1.0
0.2
15
5
mA
mA
R
V
___
___
___
___
___
___
MIL &
IND
S
L
1.0
0.2
30
10
0.2
10
R
L
ISB4
Full Standby Current
(One Port - All CMOS
Level Inputs)
COM'L
S
L
120
120
190
160
110
110
185
160
100
100
175
160
CE"A" < 0.2V and
(5)
CE"B" > VCC - 0.2V
SEM = SEM > VCC - 0.2V
IN > VCC - 0.2V or VIN < 0.2V
R
L
___
___
___
___
___
___
MIL &
IND
S
L
100
100
200
175
V
110
185
Active Port Outputs Disabled
(3)
f = fMAX
2940 tbl 09
NOTES:
1. 'X' in part numbers indicates power rating (S or L)
2. VCC = 5V, TA = +25°C, and are not production tested. ICCDC = 120mA (Typ.)
3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, and using “AC Test Conditions” of input
levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
6
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1) (con't.) (VCC = 5.0V ± 10%)
7007X35
Com'l, Ind
& Military
7007X55
Com'l, Ind
& Military
Symbol
Parameter
Test Condition
Version
COM'L
Typ.(2)
Max.
Typ.(2)
Max.
Unit
ICC
Dynamic Operating Current
(Both Ports Active)
S
L
160
160
295
255
150
150
270
230
mA
CE = VIL, Outputs Disabled
SEM = VIH
(3)
f = fMAX
MIL &
IND
S
L
160
160
335
295
150
150
310
270
I
SB1
Standby Current
(Both Ports - TTL Level
Inputs)
COM'L
S
L
20
20
85
60
20
20
85
60
mA
mA
CE
SEM
f = fMAX
L
= CE
R
= VIH
= VIH
R
= SEM
L
(3)
MIL &
IND
S
L
20
20
100
80
13
13
100
80
(5)
ISB2
Standby Current
(One Port - TTL Level Inputs)
COM'L
S
L
95
95
185
155
85
85
165
135
CE"A" = VIL and CE"B" = VIH
Active Port Outputs Disabled,
(3)
f=fMAX
MIL &
IND
S
L
95
95
215
185
85
85
195
165
SEM
R
= SEML = VIH
I
SB3
Full Standby Current (Both
Ports - All CMOS Level
Inputs)
Both Ports CE
CE > VCC - 0.2V
IN > VCC - 0.2V or
VIN < 0.2V, f = 0(4)
SEM = SEM > VCC - 0.2V
L
and
COM'L
S
L
1.0
0.2
15
5
1.0
0.2
15
5
mA
mA
R
V
MIL &
IND
S
L
1.0
0.2
30
10
1.0
0.2
30
10
R
L
ISB4
Full Standby Current
(One Port - All CMOS Level
Inputs)
COM'L
S
L
90
90
160
135
80
80
135
110
CE"A" < 0.2V and
(5)
CE"B" > VCC - 0.2V
SEM = SEM > VCC - 0.2V
IN > VCC - 0.2V or VIN < 0.2V
R
L
MIL &
IND
S
L
90
90
190
165
80
80
165
140
V
Active Port Outputs Disabled
(3)
f = fMAX
2940 tbl 10
NOTES:
1. 'X' in part numbers indicates power rating (S or L)
2. VCC = 5V, TA = +25°C, and are not production tested. ICCDC = 120mA (Typ.)
3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, and using
“AC Test Conditions” of input levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
7
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
5V
5V
AC Test Conditions
Input Pulse Levels
GND to 3.0V
5ns Max.
1.5V
893Ω
893Ω
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
DATAOUT
BUSY
INT
DATAOUT
30pF
5pF*
347Ω
347Ω
1.5V
Figures 1 and 2
2940 tbl 11
2940 drw 05
2940 drw 06
Figure 1. AC Output Test Load
Figure 2. Output Test Load
(for tLZ, tHZ, tWZ, tOW)
* Including scope and jig.
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(4)
7007X15
7007X20
Com'l & Ind
7007X25
Com'l, Ind
& Military
Com'l Only
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
READ CYCLE
____
____
____
t
RC
AA
ACE
AOE
OH
LZ
HZ
PU
PD
SOP
SAA
Read Cycle Time
15
20
25
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
____
____
____
t
Address Access Time
15
15
20
20
25
25
Chip Enable Access Time(3)
Output Enable Access Time
Output Hold from Address Change
Output Low-Z Time(1,2)
____
____
____
____
____
____
t
t
10
12
13
____
____
____
t
3
3
3
____
____
____
t
3
3
3
Output High-Z Time(1,2)
10
12
15
____
____
____
t
t
Chip Enable to Power Up Time(2)
Chip Disable to Power Down Time(2)
0
0
0
____
____
____
____
____
____
t
15
20
25
____
____
____
t
Semaphore Flag Update Pulse (OE or SEM)
10
10
12
____
____
____
t
Semaphore Address Access Time
15
20
25
ns
2940 tbl 12a
7007X35
Com'l, Ind
& Military
7007X55
Com'l, Ind
& Military
Symbol
READ CYCLE
Parameter
Min.
Max.
Min.
Max.
Unit
____
____
t
RC
AA
ACE
AOE
OH
LZ
HZ
PU
PD
SOP
SAA
Read Cycle Time
35
55
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
____
____
t
Address Access Time
35
35
55
55
Chip Enable Access Time(3)
Output Enable Access Time
Output Hold from Address Change
Output Low-Z Time(1,2)
____
____
____
____
t
t
20
30
____
____
t
3
3
____
____
t
3
3
Output High-Z Time(1,2)
15
25
____
____
t
t
Chip Enable to Power Up Time(2)
Chip Disable to Power Down Time(2)
Semaphore Flag Update Pulse (OE or SEM)
Semaphore Address Access Time
0
0
____
____
____
____
t
35
50
____
____
t
15
15
____
____
t
35
55
ns
2940 tbl 12b
NOTES:
1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL.
4. 'X' in part numbers indicates power rating (S or L).
8
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of Read Cycles(5)
tRC
ADDR
(4)
t
t
AA
(4)
ACE
CE
OE
(4)
tAOE
R/W
(1)
tOH
tLZ
VALID DATA(4)
DATAOUT
(2)
tHZ
BUSYOUT
(3,4)
2940 drw 07
tBDD
NOTES:
1. Timing depends on which signal is asserted last, OE or CE.
2. Timing depends on which signal is de-asserted first CE or OE.
3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY
has no relation to valid output data.
4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD.
5. SEM = VIH.
Timing of Power-Up Power-Down
CE
tPU
tPD
I
CC
50%
50%
I
SB
,
2940 drw 08
9
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltage(5)
7007X15
7007X20
Com'l & Ind
7007X25
Com'l, Ind
& Military
Com'l Only
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
WRITE CYCLE
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
t
WC
EW
AW
AS
WP
WR
DW
HZ
DH
WZ
OW
SWRD
SPS
Write Cycle Time
15
12
12
0
20
15
15
0
25
20
20
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
Chip Enable to End-of-Write(3)
Address Valid to End-of-Write
Address Set-up Time(3)
Write Pulse Width
t
t
t
12
0
15
0
20
0
t
Write Recovery Time
Data Valid to End-of-Write
Output High-Z Time(1,2)
Data Hold Time(4)
t
10
15
15
____
____
____
t
10
12
15
____
____
____
t
0
0
0
(1,2)
____
____
____
t
Write Enable to Output in High-Z
Output Active from End-of-Write(1, 2,4)
SEM Flag Write to Read Time
SEM Flag Contention Window
10
12
15
____
____
____
t
0
5
5
0
5
5
0
5
5
____
____
____
____
____
____
t
t
ns
2940 tbl 13a
7007X35
Com'l, Ind
& Military
7007X55
Com'l, Ind
& Military
Symbol
WRITE CYCLE
Parameter
Min.
Max.
Min.
Max.
Unit
____
____
____
____
____
____
____
____
____
____
____
____
____
____
t
WC
EW
AW
AS
WP
WR
DW
HZ
DH
WZ
OW
SWRD
SPS
Write Cycle Time
35
30
30
0
55
45
45
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
Chip Enable to End-of-Write(3)
Address Valid to End-of-Write
Address Set-up Time(3)
Write Pulse Width
t
t
t
25
0
40
0
t
Write Recovery Time
Data Valid to End-of-Write
Output High-Z Time(1,2)
Data Hold Time(4)
t
15
30
____
____
t
12
25
____
____
t
0
0
(1,2)
____
____
t
Write Enable to Output in High-Z
Output Active from End-of-Write(1,2,4)
SEM Flag Write to Read Time
SEM Flag Contention Window
12
25
____
____
t
0
5
5
0
5
5
____
____
____
____
t
t
ns
2940 tbl 13b
NOTES:
1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time.
4. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over voltage
and temperature, the actual tDH will always be smaller than the actual tOW.
5. 'X' in part numbers indicates power rating (S or L).
10
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)
tWC
ADDRESS
(7)
t
HZ
OE
tAW
CE or SEM(9)
(3)
(2)
(6)
t
WP
t
WR
tAS
R/W
DATAOUT
DATAIN
(7)
t
WZ
tOW
(4)
(4)
t
DW
tDH
2940 drw 09
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5)
t
WC
ADDRESS
t
AW
CE or SEM(9)
(6)
AS
(3)
(2)
t
WR
t
tEW
R/W
t
DW
tDH
DATAIN
2940 drw 10
NOTES:
1. R/W or CE must be HIGH during all address transitions.
2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle.
3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last, CE or R/W.
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure
2).
8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be
placed on the bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as
the specified tWP.
9. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition.
11
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Semaphore Read after Write Timing, Either Side(1)
tSAA
tOH
A0-A2
VALID ADDRESS
VALID ADDRESS
tAW
tWR
tACE
t
t
EW
SEM
tSOP
tDW
DATAOUT
DATAIN VALID
DATA
0
VALID(2)
t
AS
WP
tDH
R/W
tSWRD
tAOE
OE
tSOP
Write Cycle
Read Cycle
2940 drw 11
NOTE:
1. CE = VIH for the duration of the above timing (both write and read cycle).
Timing Waveform of Semaphore Write Contention(1,3,4)
A0"A"-A2"A"
MATCH
SIDE(2) "A"
R/W"A"
SEM"A"
tSPS
A0"B"-A2"B"
MATCH
SIDE(2)
"B"
R/W"B"
SEM"B"
2940 drw 12
NOTES:
1. DOR = DOL = VIL, CER = CEL = VIH.
2. All timing is the same for left and right ports. Port "A" may be either left or right port. "B" is the opposite from port "A".
3. This parameter is measured from R/WA or SEMA going HIGH to R/WB or SEMB going HIGH.
4. If tSPS is not satisfied, the semaphore will fall positively to one side or the other, but there is no guarantee which side will obtain the flag.
12
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(6)
7007X15
7007X20
Com'l & Ind
7007X25
Com'l, Ind
& Military
Com'l Only
Symbol
BUSY TIMING (M/S=VIH
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
)
____
____
____
____
____
____
____
____
____
____
____
____
t
BAA
BDA
BAC
BDC
APS
BDD
WH
15
15
15
20
20
20
20
20
20
ns
ns
ns
ns
ns
ns
ns
BUSY Access Time from Address Match
t
BUSY Disable Time from Address Not Matched
BUSY Access Time from Chip Enable Low
BUSY Access Time from Chip Enable High
Arbitration Priority Set-up Time(2)
t
t
15
17
17
____
____
____
t
5
5
5
____
____
____
BUSY Disable to Valid Data(3)
Write Hold After BUSY(5)
t
18
30
30
____
____
____
t
12
15
17
BUSY TIMING (M/S=VIL
)
____
____
____
____
____
____
BUSY Input to Write(4)
Write Hold After BUSY(5)
t
WB
0
0
0
ns
ns
tWH
12
15
17
PORT-TO-PORT DELAY TIMING
____
____
____
____
____
____
t
WDD
Write Pulse to Data Delay(1)
30
25
45
30
50
35
ns
tDDD
Write Data Valid to Read Data Delay(1)
ns
2940 tbl 14a
7007X35
Com'l, Ind
& Military
7007X55
Com'l, Ind
& Military
Symbol
Parameter
Min.
Max.
Min.
Max.
Unit
BUSY TIMING (M/S=VIH
)
____
____
____
____
____
____
____
____
t
BAA
BDA
BAC
BDC
APS
BDD
WH
20
20
20
45
40
40
ns
ns
ns
ns
ns
ns
ns
BUSY Access Time from Address Match
t
BUSY Disable Time from Address Not Matched
BUSY Access Time from Chip Enable Low
BUSY Access Time from Chip Enable High
Arbitration Priority Set-up Time(2)
t
t
20
35
____
____
t
5
5
____
____
BUSY Disable to Valid Data(3)
Write Hold After BUSY(5)
t
35
40
____
____
t
25
25
BUSY TIMING (M/S=VIL
)
____
____
____
____
BUSY Input to Write(4)
Write Hold After BUSY(5)
t
WB
0
0
ns
ns
tWH
25
25
PORT-TO-PORT DELAY TIMING
____
____
____
____
t
WDD
Write Pulse to Data Delay(1)
60
45
80
65
ns
tDDD
Write Data Valid to Read Data Delay(1)
ns
2940 tbl 14b
NOTES:
1. Port-to-port delay through RAM cells from writing port to reading port, refer to "Timing Waveform of Write with Port-to-Port Read and BUSY (M/S = VIH)".
2. To ensure that the earlier of the two ports wins.
3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual).
4. To ensure that the write cycle is inhibited on port "B" during contention on port "A".
5. To ensure that a write cycle is completed on port "B" after contention on port "A".
6. 'X' in part numbers indicates power rating (S or L).
13
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Write with Port-to-Port Read and BUSY(2,5)
(M/S = VIH)(4)
tWC
MATCH
ADDR"A"
t
WP
R/W"A"
t
DW
t
DH
VALID
DATAIN "A"
(1)
tAPS
MATCH
ADDR"B"
tBDA
tBDD
BUSY"B"
t
WDD
VALID
DATAOUT "B"
(3)
tDDD
2940 drw 13
NOTES:
1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S = VIL (SLAVE).
2. CEL = CER = VIL
3. OE = VIL for the reading port.
4. If M/S = VIL (SLAVE), then BUSY is an input (BUSY"A" = VIH and BUSY"B" = "don't care", for this example).
5. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from port "A".
Timing Waveform of Write with BUSY (M/S = VIL)
tWP
R/W"A"
t
WB
BUSY"B"
(1)
t
WH
R/W"B"
(2)
,
2940 drw 14
NOTES:
1. tWH must be met for both BUSY input (SLAVE) and output (MASTER).
2. BUSY is asserted on port "B" blocking R/W"B", until BUSY"B" goes HIGH.
14
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of BUSY Arbitration Controlled by CE Timing(1) (M/S = VIH)
ADDR"A"
ADDRESSES MATCH
and "B"
CE"A"
(2)
tAPS
CE"B"
tBAC
tBDC
BUSY"B"
2940 drw 15
Waveform of BUSY Arbitration Cycle Controlled by Address Match
Timing(1) (M/S = VIH)
ADDR"A"
ADDR"B"
BUSY"B"
ADDRESS "N"
(2)
tAPS
MATCHING ADDRESS "N"
t
BAA
tBDA
2940 drw 16
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.
2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or another but there is no guarantee on which side BUSY will be asserted.
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(1,2)
7007X15
7007X20
7007X25
Com'l, Ind
& Military
Com'l Only
Com'l & Ind
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Unit
INTERRUPT TIMING
____
____
____
____
____
____
t
AS
WR
INS
INR
Address Set-up Time
Write Recovery Time
Interrupt Set Time
0
0
0
ns
ns
ns
t
0
0
0
____
____
____
t
15
15
20
20
20
20
____
____
____
t
Interrupt Reset Time
ns
2940 tbl 15a
7007X35
Com'l, Ind
& Military
7007X55
Com'l, Ind
& Military
Symbol
INTERRUPT TIMING
Parameter
Min.
Max.
Min.
Max.
Unit
____
____
____
____
t
AS
WR
INS
INR
Address Set-up Time
Write Recovery Time
Interrupt Set Time
0
0
ns
ns
ns
t
0
0
____
____
t
25
25
40
40
____
____
t
Interrupt Reset Time
ns
2940 tbl 15b
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
15
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of Interrupt Timing(1)
tWC
INTERRUPT SET ADDRESS (2)
ADDR"A"
CE"A"
(4)
(3)
tAS
tWR
R/W"A"
INT"B"
(3)
tINS
2940 drw 17
tRC
ADDR"B"
CE"B"
INTERRUPT CLEAR ADDRESS (2)
(3)
tAS
OE"B"
(3)
tINR
INT"B"
2940 drw 18
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.
2. See Interrupt Truth Table III.
3. Timing depends on which enable signal (CE or R/W) is asserted last.
4. Timing depends on which enable signal (CE or R/W) is de-asserted first.
Truth Table III — Interrupt Flag(1)
Left Port
Right Port
R/W
L
A
14L-A0L
R/W
R
A
14R-A0R
Function
Set Right INT Flag
Reset Right INT Flag
Set Left INT Flag
Reset Left INT Flag
CE
L
OE
L
INT
L
CE
R
OE
R
INT
R
(2)
L
X
X
X
L
X
X
L
X
X
X
L
7FFF
X
X
X
X
L
X
L
L
X
X
L
X
7FFF
7FFE
X
L
R
(3)
X
H
R
(3)
X
L
X
X
X
L
(2)
7FFE
H
X
X
L
2940 tbl 16
NOTES:
1. Assumes BUSYL = BUSYR =VIH.
2. If BUSYL = VIL, then no change.
3. If BUSYR = VIL, then no change.
16
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Truth Table IV — Address BUSY
Arbitration
Inputs
Outputs
A
OL-A14L
(1)
(1)
A
OR-A14R
Function
Normal
Normal
Normal
CE
L
CE
R
BUSY
L
BUSY
R
X
H
X
L
X
X
H
L
NO MATCH
MATCH
H
H
H
H
H
MATCH
H
(3)
MATCH
(2)
(2)
Write Inhibit
2940 tbl 17
NOTES:
1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSY outputs on the IDT7007 are
push-pull, not open drain outputs. On slaves the BUSY input internally inhibits writes.
2. "L" if the inputs to the opposite port were stable prior to the address and enable inputs of this port. "H" if the inputs to the opposite port became stable after the address
and enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs can not be LOW simultaneously.
3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored
when BUSYR outputs are driving LOW regardless of actual logic level on the pin.
Truth Table V — Example of Semaphore Procurement Sequence(1,2,3)
Functions
D0
- D7
Left
D0
- D7
Right
Status
No Action
1
0
0
1
1
0
1
1
1
0
1
1
1
1
0
0
1
1
0
1
1
1
Semaphore free
Left Port Writes "0" to Semaphore
Right Port Writes "0" to Semaphore
Left Port Writes "1" to Semaphore
Left Port Writes "0" to Semaphore
Right Port Writes "1" to Semaphore
Left Port Writes "1" to Semaphore
Right Port Writes "0" to Semaphore
Right Port Writes "1" to Semaphore
Left Port Writes "0" to Semaphore
Left Port Writes "1" to Semaphore
Left port has semaphore token
No change. Right side has no write access to semaphore
Right port obtains semaphore token
No change. Left port has no write access to semaphore
Left port obtains semaphore token
Semaphore free
Right port has semaphore token
Semaphore free
Left port has semaphore token
Semaphore free
2940 tbl 18
NOTES:
1. This table denotes a sequence of events for only one of the eight semaphores on the IDT7007.
2. There are eight semaphore flags written to via I/O5(I/O0 - I/O7) and read from all I/O0. These eight semaphores are addressed by A0 - A2.
3. CE = VIH, SEM = VIL to access the semaphores. Refer to the Semaphore Read/Write Control Truth Table.
FunctionalDescription
when CER = OER = VIL, R/W is a "don't care". Likewise, the right port
interruptflag(INTR)isassertedwhentheleftportwritestomemorylocation
7FFF(HEX)andtocleartheinterruptflag(INTR),therightportmustread
thememorylocation7FFF. Themessage(8bits)at7FFEor7FFFisuser-
definedsinceitisanaddressableSRAMlocation.Iftheinterruptfunction
isnotused,addresslocations7FFEand7FFFarenotusedasmailboxes,
butaspartoftherandomaccessmemory.RefertoTableIIIfortheinterrupt
operation.
TheIDT7007providestwoportswithseparatecontrol,addressand
I/Opinsthatpermitindependentaccessforreadsorwritestoanylocation
inmemory.TheIDT7007hasanautomaticpowerdownfeaturecontrolled
by CE. The CE controls on-chip power down circuitry that permits the
respectiveporttogointoastandbymodewhennotselected(CEHIGH).
Whenaportisenabled,accesstotheentirememoryarrayispermitted.
INTERRUPTS
Iftheuserchoosestheinterruptfunction,amemorylocation(mailbox
ormessagecenter)is assignedtoeachport. Theleftportinterruptflag
(INTL) is asserted when the right port writes to memory location 7FFE
(HEX), where a write is defined as CE = R/W=VIL per the Truth Table.
Theleftportclearstheinterruptthroughaccessofaddresslocation7FFE
BusyLogic
BusyLogicprovidesahardwareindicationthatbothportsoftheRAM
haveaccessedthesamelocationatthesametime. Italsoallowsoneof
thetwoaccesses toproceedandsignals theothersidethattheRAMis
17
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
“busy”. The BUSY pin can then be used to stall the access until the
operationon the otherside is completed. Ifa write operationhas been
attemptedfromthesidethatreceivesaBUSYindication,thewritesignal
isgatedinternallytopreventthewritefromproceeding.
Semaphores
TheIDT7007isanextremelyfastDual-Port 16Kx8CMOSStaticRAM
withanadditional8addresslocationsdedicatedtobinarysemaphoreflags.
TheseflagsalloweitherprocessorontheleftorrightsideoftheDual-Port
RAMtoclaimaprivilegeovertheotherprocessorforfunctionsdefinedby
thesystemdesigner’ssoftware.Asanexample,thesemaphorecanbe
usedbyoneprocessortoinhibittheotherfromaccessingaportionofthe
Dual-Port RAM or any other shared resource.
TheuseofBUSYlogicisnotrequiredordesirableforallapplications.
InsomecasesitmaybeusefultologicallyORtheBUSYoutputstogether
anduse anyBUSYindicationas aninterruptsource toflagthe eventof
anillegalorillogicaloperation.IfthewriteinhibitfunctionofBUSYlogicis
notdesirable,theBUSYlogiccanbedisabledbyplacingthepartinslave
modewiththeM/Spin.OnceinslavemodetheBUSYpinoperatessolely
asawriteinhibitinputpin.Normaloperationcanbeprogrammedbytying
the BUSY pins HIGH. If desired, unintended write operations
can be prevented to a port by tying the BUSY pin for that port LOW.
TheBUSYoutputsontheIDT7007RAMinmastermode,arepush-
pulltypeoutputsanddonotrequirepullupresistorstooperate.Ifthese
RAMs are being expanded in depth, then the BUSY indication for the
resulting array requires the use of an external AND gate.
The Dual-PortRAMfeatures a fastaccess time, andbothports are
completelyindependentofeachother.Thismeansthattheactivityonthe
leftportinnowayslows theaccess timeoftherightport.Bothports are
identicalinfunctiontostandardCMOSStaticRAMandcanbereadfrom,
orwrittento,atthesametimewiththeonlypossibleconflictarisingfromthe
simultaneous writing of, or a simultaneous READ/WRITE of, a non-
semaphorelocation.Semaphoresareprotectedagainstsuchambiguous
situationsandmaybeusedbythesystemprogramtoavoidanyconflicts
inthenon-semaphoreportionoftheDual-PortRAM.Thesedeviceshave
anautomaticpower-downfeaturecontrolledbyCE,theDual-PortRAM
enable,andSEM,thesemaphoreenable.TheCEandSEMpinscontrol
on-chippowerdowncircuitrythatpermits the respective porttogointo
standbymodewhennotselected. Thisistheconditionwhichisshownin
Truth Table I where CE and SEM are both HIGH.
Width Expansion with Busy Logic
Master/SlaveArrays
Systems which can best use the IDT7007 contain multiple proces-
sors or controllers and are typically very high-speed systems which
are software controlled or software intensive. These systems can
benefitfromaperformanceincreaseofferedbytheIDT7007hardware
semaphores, which provide a lockout mechanism without requiring
complexprogramming.
Softwarehandshakingbetweenprocessors offers themaximumin
systemflexibilitybypermittingsharedresourcestobeallocatedinvarying
configurations.TheIDT7007doesnotuseitssemaphoreflagstocontrol
anyresourcesthroughhardware,thusallowingthesystemdesignertotal
flexibilityinsystemarchitecture.
CE
CE
MASTER
Dual Port
RAM
SLAVE
Dual Port
RAM
BUSY (L) BUSY (R)
BUSY (R)
BUSY (L)
MASTER
Dual Port
RAM
SLAVE
Dual Port
RAM
CE
CE
BUSY (R)
BUSY (L) BUSY (R)
BUSY (L) BUSY (R)
BUSY (L)
2940 drw 19
An advantage of using semaphores rather than the more common
methodsofhardwarearbitrationisthatwaitstatesareneverincurredin
either processor. This can prove to be a major advantage in very high-
speedsystems.
Figure 3. Busy and chip enable routing for both width and depth
expansion with IDT7007 RAMs.
WhenexpandinganIDT7007RAMarrayinwidthwhileusingBUSY
logic,onemasterpartisusedtodecidewhichsideoftheRAMsarraywill
receiveaBUSYindication,andtooutputthatindication.Anynumberof
slavestobeaddressedinthesameaddressrangeasthemaster,usethe
How the Semaphore Flags Work
Thesemaphorelogicisasetofeightlatcheswhichareindependent
BUSYsignalasawriteinhibitsignal.ThusontheIDT7007RAMtheBUSY oftheDual-PortRAM.Theselatchescanbeusedtopassaflag,ortoken,
pinisanoutputifthepartisusedasamaster(M/Spin=H),andtheBUSY fromoneporttotheothertoindicatethatasharedresourceisinuse.The
pin is an input if the part used as a slave (M/S pin = L) as shown in semaphores provide a hardware assist for a use assignment method
Figure 3.
Iftwoormoremasterpartswereusedwhenexpandinginwidth,asplit
called“TokenPassingAllocation.”Inthismethod,thestateofasemaphore
latchisusedasatokenindicatingthatsharedresourceisinuse.Iftheleft
processorwantstousethisresource,itrequeststhetokenbysettingthe
latch.Thisprocessorthenverifiesitssuccessinsettingthelatchbyreading
it. If it was successful, it proceeds to assume control over the shared
resource.Ifitwasnotsuccessfulinsettingthelatch,itdeterminesthatthe
rightsideprocessorhassetthelatchfirst,hasthetokenandisusingthe
sharedresource.Theleftprocessorcantheneitherrepeatedlyrequest
thatsemaphore’sstatusorremoveitsrequestforthatsemaphoretoperform
anothertaskandoccasionallyattemptagaintogaincontrolofthetokenvia
thesetandtestsequence.Oncetherightsidehasrelinquishedthetoken,
theleftsideshouldsucceedingainingcontrol.
decisioncouldresultwithonemasterindicatingBUSYononesideofthe
arrayandanothermasterindicatingBUSYononeothersideofthearray.
Thiswouldinhibitthewriteoperationsfromoneportforpartofawordand
inhibitthewriteoperationsfromtheotherportfortheotherpartoftheword.
TheBUSYarbitration,onamaster,isbasedonthechipenableand
address signals only. Itignores whetheranaccess is a readorwrite. In
a master/slave array, bothaddress andchipenable mustbe validlong
enoughforaBUSYflagtobeoutputfromthemasterbeforetheactualwrite
pulsecanbeinitiatedwiththeR/Wsignal.Failuretoobservethistimingcan
resultina glitchedinternalwrite inhibitsignalandcorrupteddata inthe
slave.
ThesemaphoreflagsareactiveLOW.Atokenisrequestedbywriting
18
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
azerointoasemaphorelatchandisreleasedwhenthesamesidewrites overtotheothersideassoonasaoneiswrittenintothefirstside’srequest
aonetothatlatch. latch.Thesecondside’sflagwillnowstaylowuntilitssemaphorerequest
The eightsemaphore flags reside withinthe IDT7007ina separate latchiswrittentoaone.Fromthisitiseasytounderstandthat,ifasemaphore
memoryspacefromtheDual-PortRAM.This addressspaceisaccessed is requestedandthe processorwhichrequesteditnolongerneeds the
byplacingaLOWinputontheSEMpin(whichactsasachipselectforthe resource, the entire system can hang up until a one is written into that
semaphore flags) and using the other control pins (Address, OE, and semaphorerequestlatch.
R/W)as theywouldbeusedinaccessingastandardStaticRAM.Each
The criticalcase ofsemaphore timingis whenbothsides requesta
oftheflagshasauniqueaddresswhichcanbeaccessedbyeitherside single token by attempting to write a zero into it at the same time. The
throughaddresspinsA0–A2.Whenaccessingthesemaphores,noneof semaphorelogicisspeciallydesignedtoresolvethisproblem.Ifsimulta-
theotheraddresspinshasanyeffect.
neousrequestsaremade,thelogicguaranteesthatonlyonesidereceives
Whenwritingtoasemaphore,onlydatapinD0isused.IfaLOWlevel thetoken.Ifonesideis earlierthantheotherinmakingtherequest,the
iswrittenintoanunusedsemaphorelocation,thatflagwillbesettoazero firstsidetomaketherequestwillreceivethetoken.Ifbothrequestsarrive
on that side and a one on the other side (see Truth Table V). That at the same time, the assignment will be arbitrarily made to one port or
semaphorecannowonlybemodifiedbythesideshowingthezero.When
aoneiswrittenintothesamelocationfromthesameside,theflagwillbe
L PORT
R PORT
settoaoneforbothsides(unlessasemaphorerequestfromtheotherside
ispending)andthencanbewrittentobybothsides.Thefactthattheside
whichisabletowriteazerointoasemaphoresubsequentlylocksoutwrites
fromtheothersideiswhatmakessemaphoreflagsusefulininterprocessor
communications.(Athoroughdiscussionontheuseofthisfeaturefollows
shortly.)Azerowrittenintothesamelocationfromtheothersidewillbe
storedinthesemaphorerequestlatchforthatsideuntilthesemaphoreis
freedbythefirstside.
SEMAPHORE
REQUEST FLIP FLOP
SEMAPHORE
REQUEST FLIP FLOP
0
0
D
D
D
D
Q
Q
WRITE
WRITE
SEMAPHORE
READ
SEMAPHORE
READ
2940 drw 20
Whenasemaphoreflagisread,itsvalueisspreadintoalldatabitsso
thataflagthatisaonereadsasaoneinalldatabitsandaflagcontaining
azeroreadsasallzeros.Thereadvalueislatchedintooneside’soutput
registerwhenthatside'ssemaphoreselect(SEM)andoutputenable(OE)
signalsgoactive.Thisservestodisallowthesemaphorefromchanging
stateinthemiddleofareadcycleduetoawritecyclefromtheotherside.
Becauseofthislatch,arepeatedreadofasemaphoreinatestloopmust
cause either signal (SEM or OE) to go inactive or the output will never
change.
AsequenceWRITE/READmustbeusedbythesemaphoreinorder
to guarantee that no system level contention will occur. A processor
requestsaccesstosharedresourcesbyattemptingtowriteazerointoa
semaphorelocation.Ifthesemaphoreisalreadyinuse,thesemaphore
requestlatchwillcontainazero,yetthesemaphoreflagwillappearasone,
afactwhichtheprocessorwillverifybythesubsequentread(seeTruth
TableV).Asanexample,assumeaprocessorwritesazerototheleftport
atafreesemaphorelocation.Onasubsequentread,theprocessorwill
verifythatithaswrittensuccessfullytothatlocationandwillassumecontrol
overtheresourceinquestion.Meanwhile,ifaprocessorontherightside
attempts towriteazerotothesamesemaphoreflagitwillfail,as willbe
verifiedbythefactthataonewillbereadfromthatsemaphoreontheright
side during subsequent read. Had a sequence of READ/WRITE been
usedinstead,systemcontentionproblemscouldhaveoccurredduringthe
gap between the read and write cycles.
Figure 4. IDT7007 Semaphore Logic
theother.
One caution that should be noted when using semaphores is that
semaphoresalonedonotguaranteethataccesstoaresourceissecure.
Aswithanypowerfulprogrammingtechnique,ifsemaphoresaremisused
ormisinterpreted, a software errorcaneasilyhappen.
Initializationofthesemaphoresisnotautomaticandmustbehandled
viatheinitializationprogramatpower-up.Sinceanysemaphorerequest
flagwhichcontainsazeromustberesettoaone,allsemaphoresonboth
sidesshouldhaveaonewrittenintothematinitializationfrombothsides
to assure that they will be free when needed.
Using Semaphores—Some Examples
Perhapsthesimplestapplicationofsemaphoresistheirapplicationas
resourcemarkersfortheIDT7007’sDual-PortRAM. Saythe32Kx8RAM
was tobedividedintotwo16Kx8blocks whichweretobededicatedat
anyonetimetoservicingeithertheleftorrightport.Semaphore0could
be used to indicate the side which would control the lower section of
memory,andSemaphore1couldbedefinedastheindicatorfortheupper
sectionofmemory.
Totakearesource,inthisexamplethelower16KofDual-PortRAM,
the processor on the left port could write and then read a zero in to
Semaphore0.Ifthistaskweresuccessfullycompleted(azerowasread
backratherthana one), the leftprocessorwouldassume controlofthe
lower16K.Meanwhiletherightprocessorwasattemptingtogaincontrol
ofthe resourceaftertheleftprocessor,itwouldreadbackaoneinresponse
tothezeroithadattemptedtowriteintoSemaphore0.Atthis point,the
softwarecouldchoosetotryandgaincontrolofthesecond16Ksection
bywriting,thenreadingazerointoSemaphore1.Ifitsucceededingaining
control,itwouldlockouttheleftside.
Itisimportanttonotethatafailedsemaphorerequestmustbefollowed
byeitherrepeatedreadsorbywritingaoneintothesamelocation.The
reasonforthisiseasilyunderstoodbylookingatthesimplelogicdiagram
ofthesemaphoreflaginFigure4.Twosemaphorerequestlatchesfeed
into a semaphore flag. Whichever latch is first to present a zero to the
semaphoreflagwillforceitssideofthesemaphoreflagLOWandtheother
sideHIGH.Thisconditionwillcontinueuntilaoneiswrittentothesame
semaphorerequestlatch.Shouldtheotherside’ssemaphorerequestlatch
havebeenwrittentoazerointhemeantime,thesemaphoreflagwillflip
19
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Once the left side was finished with its task, it would write a one to was“off-limits”totheCPU,boththeCPUandtheI/Odevicescouldaccess
Semaphore 0 and may then try to gain access to Semaphore 1. If theirassignedportionsofmemorycontinuouslywithoutanywaitstates.
Semaphore1wasstilloccupiedbytherightside,theleftsidecouldundo
Semaphoresarealsousefulinapplicationswherenomemory“WAIT”
itssemaphorerequestandperformothertasksuntilitwasabletowrite,then stateisavailableononeorbothsides.Onceasemaphorehandshakehas
readazerointoSemaphore1.Iftherightprocessorperformsasimilartask been performed, both processors can access their assigned RAM
withSemaphore0,thisprotocolwouldallowthetwoprocessorstoswap segmentsatfullspeed.
16Kblocks ofDual-PortRAMwitheachother.
Anotherapplicationisintheareaofcomplexdatastructures.Inthis
The blocks do not have to be any particular size and can even be case,blockarbitrationisveryimportant.Forthisapplicationoneprocessor
variable, depending upon the complexity of the software using the mayberesponsibleforbuildingandupdatingadatastructure.Theother
semaphoreflags.AlleightsemaphorescouldbeusedtodividetheDual- processorthenreadsandinterpretsthatdatastructure.Iftheinterpreting
PortRAMorothersharedresources intoeightparts. Semaphores can processorreadsanincompletedatastructure,amajorerrorconditionmay
evenbeassigneddifferentmeaningsondifferentsidesratherthanbeing exist.Therefore,somesortofarbitrationmustbeusedbetweenthetwo
given a common meaning as was shown in the example above.
differentprocessors.Thebuildingprocessorarbitratesfortheblock,locks
Semaphores are a useful form of arbitration in systems like disk itandthenisabletogoinandupdatethedatastructure.Whentheupdate
interfaceswheretheCPUmustbelockedoutofasectionofmemoryduring is completed, the data structure block is released. This allows the
atransferandtheI/Odevicecannottolerateanywaitstates.Withtheuse interpretingprocessortocomebackandreadthecompletedatastructure,
ofsemaphores,oncethetwodeviceshasdeterminedwhichmemoryarea therebyguaranteeingaconsistentdatastructure.
20
IDT7007S/L
High-Speed 32K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
OrderingInformation
IDT XXXXX
A
999
A
A
A
Device
Type
Power Speed Package
Process/
Temperature
Range
Blank
I (1)
B
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Military (-55°C to +125°C)
Compliant to MIL-PRF-38535 QML
G(2)
Green
PF
G
J
80-pin TQFP (PN80-1)
68-pin PGA (G68-1)
68-pin PLCC (J68-1)
,
Commercial Only
Commercial & Industrial
Commercial, Industrial & Military
Commercial, Industrial & Military
Commercial, Industrial & Military
15
20
25
35
55
Speed in nanoseconds
S
L
Standard Power
Low Power
256K (32K x 8) Dual-Port RAM
7007
2940 drw 21
NOTES:
1. Contact your local sales office for industrial temp. range for other speeds, packages and powers.
2. Green parts available. For specific speeds, packages and powers contact your local sales office.
DatasheetDocumentHistory
01/05/99:
Initiateddatasheetdocumenthistory
Convertedtonewformat
Cosmeticandtypographicalcorrections
Addedadditionalnotestopinconfigurations
Changeddrawingformat
AddedIndustrialTemperatureRangesandremovedrelatednotes
Replaced IDT logo
Pages 2, 3, 4
06/03/99:
03/24/00:
Changed±200mVto0mVinnotes
Addedcopyrightinfo
FixedAbsoluteMaximumRatingschart,correctedtypos
Updateddrawings
Correctedwaveformdrawing
Increasedstoragetemperatureparameter
ClarifiedTAparameter
05/08/00:
Page 1
Page 5
Page 9
Page 12
Page 5
Pages 6, 7
Page 2 - 4
Page 6
DCElectricalparameters–changedworkingfromopentodisabled
Addeddaterevisionforpinconfigurations
RemovedstandardpowerofferingforIndustrialtempfor20nsfromDCElectricalCharacteristics
Addedgreenavailabilitytofeatures
09/11/01:
01/31/06:
Page 1
Page 21
Addedgreenindicatortoorderinginformation
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fax: 408-284-2775
www.idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
21
相关型号:
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Dual-Port SRAM, 32KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68
IDT
IDT7007S20JGI
Dual-Port SRAM, 32KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68
IDT
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