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IDT7008S/L
64K x 8 DUAL-PORT
STATIC RAM
Features
◆
◆
IDT7008 easily expands data bus width to 16 bits or
more using the Master/Slave select when cascading more
than one device
M/S = VIH for BUSY output flag on Master,
M/S = VIL for BUSY input on Slave
Interrupt Flag
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
◆
◆
– Military:25/35/55ns(max.)
– Industrial:55ns (max.)
– Commercial:20/25/35/55ns(max.)
Low-power operation
◆
◆
◆
◆
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
– IDT7008S
Active:750mW(typ.)
Standby: 5mW (typ.)
– IDT7008L
Active:750mW(typ.)
Standby: 1mW (typ.)
Dual chip enables allow for depth expansion without
external logic
◆
◆
◆
◆
Fully asynchronous operation from either port
TTL-compatible, single 5V (±10%) power supply
Available in 84-pin PGA, 84-pin PLCC, and a 100-pin TQFP
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
◆
FunctionalBlockDiagram
R/WL
CE0L
CE1L
R/WR
CE0R
CE1R
OEL
OER
I/O
Control
I/O
Control
I/O0-7L
I/O0-7R
(1,2)
BUSYL
(1,2)
BUSYR
64Kx8
MEMORY
ARRAY
7008
A15L
A15R
Address
Decoder
Address
Decoder
A0R
A0L
16
16
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE0L
CE0R
1L
CE
1R
CE
OEL
OER
L
R/
W
R
R/W
SEML
INTL
SEMR
INTR
(2)
(2)
M/S(1)
3198 drw 01
NOTES:
1. BUSY is an input as a Slave (M/S = VIL) and an output when it is a Master (M/S = VIH).
2. BUSY and INT are non-tri-state totem-pole outputs (push-pull).
MAY 2000
1
DSC 3198/6
©2000IntegratedDeviceTechnology,Inc.
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Description
The IDT7008 is a high-speed 64K x 8 Dual-Port Static RAM. The reads or writes to any location in memory. An automatic power down
IDT7008isdesignedtobeusedasastand-alone512K-bitDual-PortRAM featurecontrolledbythe chipenables(CE0andCE1)permittheon-chip
orasacombinationMASTER/SLAVEDual-PortRAMfor16-bit-or-more circuitry of each port to enter a very low standby power mode.
wordsystems.UsingtheIDTMASTER/SLAVEDual-PortRAMapproach
FabricatedusingIDT’sCMOShigh-performancetechnology,these
in16-bitorwidermemorysystemapplicationsresultsinfull-speed,error- devices typicallyoperate ononly750mWofpower.
freeoperationwithouttheneedforadditionaldiscretelogic.
TheIDT7008ispackagedina84-pinCeramicPinGridArray(PGA),
This device provides two independent ports with separate control, a84-pinPlasticLeadlessChipCarrier(PLCC)anda100-pinThinQuad
address,andI/Opinsthatpermitindependent,asynchronousaccessfor Flatpack(TQFP).
PinConfigurations(1,2,3)
INDEX
11 10 9
8
7
6
5
4
3
2
1 84 83 82 81 80 79 78 77 76 75
74
A6R
A5R
A4R
A3R
A2R
A1R
A0R
NC
12
13
14
15
16
17
I/O7R
I/O6R
I/O5R
I/O4R
I/O3R
Vcc
73
72
71
70
69
68
67
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
R
R
S
INT
I/O2R
I/O1R
I/O0R
GND
Vcc
IDT7008J
J84-1
BUSY
(4)
66
65
64
63
62
61
M/
84-Pin PLCC
GND
BUSYL
INTL
NC
(5)
Top View
I/O0L
I/O1L
GND
I/O2L
I/O3L
I/O4L
I/O5L
I/O6L
I/O7L
A0L
60
59
58
57
56
55
54
A1L
A2L
A3L
A4L
A5L
A6L
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
,
3198 drw 02
NOTES:
1. This text does not indicate orientation of the actual part marking.
2. All Vcc pins must be connected to power supply.
3. Package body is approximately 1.15 in x 1.15 in x .17 in.
4. This package code is used to reference the package diagram.
5. All GND pins must be connected to ground supply.
2
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3) (con't.)
Index
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
NC
NC
A7L
A8L
A9L
A10L
A11L
A12L
A13L
A14L
A15L
NC
75
NC
NC
A7R
A8R
2
74
73
72
71
70
69
68
67
66
65
64
63
3
4
5
A9R
6
A10R
A11R
A12R
A13R
A14R
A15R
NC
GND
NC
NC
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
IDT7008PF
PN100-1
(
4)
100-Pin TQFP
Vcc
NC
NC
NC
(5)
Top View
62
61
60
59
58
57
56
55
54
53
52
51
NC
NC
NC
CE0L
CE1L
SEML
CE0R
CE1R
SEMR
R/WR
OER
GND
GND
NC
WL
R/
OEL
GND
NC
NC
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
,
3198 drw 03
NOTES:
1. This text does not indicate orientation of the actual part marking.
2. All Vcc pins must be connected to power supply.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. All GND pins must be connected to ground supply.
3
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations(1,2,3) (con't)
63
66
67
61
64
65
68
71
60
58
55
54
49
51
50
48
46
45
42
40
GND
11
10
09
08
A7R
A4R
A3R
A1R
A9R
A6R
A5R
A2R
A10R
A12R
A15R
SEMR OER
NC
NC
NC
62
59
56
47
44
43
A8R
A11R
A14R
CE0R R/WR
GND
NC
I/O6R
CE1R
57
53
52
41
39
A13R
GND
NC
I/O7R I/O5R
69
72
38
37
I/O4R I/O3R
73
74
33
35
34
BUSYR
M/S
INTR
I/O0R
I/O2R I/O1R
07
06
IDT7008G
G84-3
75
70
32
31
36
30
(4)
GND
GND
BUSY
A0R
Vcc
Vcc
L
84-Pin PGA
Top View
(5)
76
77
78
28
29
INTL
A
0L
NC
I/O1L
I/O0L
GND
05
04
79
80
26
27
A1L
A2L
A5L
A7L
I/O3L I/O2L
81
83
1
7
8
9
11
10
15
12
23
25
03
02
01
NC
A3L
A13L
A14L
Vcc
NC
I/O6L I/O4L
82
2
4
5
6
14
17
20
22
24
A4L
A8L
A11L
CE0L R/WL
GND I/O7L I/O5L
84
3
13
16
18
19
21
A6L
A9L
B
A10L
C
A12L
D
A15L
E
NC
G
SEML
OEL
GND
NC
L
CE
1L
,
A
F
H
J
K
3198 drw 04
INDEX
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. Package body is approximately 1.12 in x 1.12 in x .16 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part marking.
PinNames
Left Port
Right Port
Names
Chip Enables
Read/Write Enable
Output Enable
Address
CE0L
1L
CE0R
1R
, CE
, CE
WL
R/
WR
R/
OEL
A0L - A15L
OER
A0R - A15R
0L
7L
0R
7R
I/O - I/O
I/O - I/O
Data Input/Output
Semaphore Enable
Interrupt Flag
Busy Flag
SEML
INTL
SEMR
INTR
BUSYR
S
BUSYL
M/
Master or Slave Select
Power
CC
V
GND
Ground
3198 tbl 01
4
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Truth Table I: Chip Enable(1)
1
CE
CE
CE0
Mode
VIL
VIH
Port Selected (TTL Active)
L
< 0.2V
VIH
>VCC -0.2V
X
Port Selected (CMOS Active)
Port Deselected (TTL Inactive)
Port Deselected (TTL Inactive)
Port Deselected (CMOS Inactive)
Port Deselected (CMOS Inactive)
X
VIL
H
>VCC -0.2V
X
X
<0.2V
3198 tbl 02
NOTES:
1. Chip Enable references are shown above with the actual CE0 and CE1 levels, CE is a reference only.
Truth Table II: Non-Contention Read/Write Control
Inputs(1)
Outputs
CE(2)
H
OE
SEM
H
R/W
X
I/O0-7
Mode
X
X
L
High-Z
DATAIN
Deselected: Power-Down
Write to memory
L
L
H
L
H
H
DATAOUT Read memory
High-Z Outputs Disabled
X
X
H
X
3198 tbl 03
NOTES:
1. A0L – A15L ≠ A0R – A15R.
2. Refer to Chip Enable Truth Table.
Truth Table III: Semaphore Read/Write Control(1)
Inputs
Outputs
(2)
R/W
I/O0-7
Mode
CE
OE
SEM
H
H
L
L
DATAOUT Read Semaphore Flag Data Out
H
L
↑
X
X
L
L
DATAIN
Write I/O0 into Semaphore Flag
Not Allowed
______
X
3198 tbl 04
NOTES:
1. There are eight semaphore flags written to via I/O0 and read from all the I/Os (I/O0-I/O7). These eight semaphore flags are addressed by A0-A2.
2. Refer to Chip Enable Truth Table.
5
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AbsoluteMaximumRatings(1)
RecommendedDCOperating
Conditions
Symbol
Rating
Commercial
& Industrial
Military
Unit
Symbol
Parameter
Min.
4.5
0
Typ.
Max. Unit
(2)
VTERM
Terminal Voltage
with Respect
to GND
-0.5 to +7.0
-0.5 to +7.0
V
VCC
Supply Voltage
5.0
5.5
0
V
V
V
GND Ground
0
TBIAS
TSTG
Temperature
Under Bias
-55 to +125
-65 to +150
50
-65 to +135
-65 to +150
50
oC
oC
(2)
____
VIH
VIL
Input High Voltage
Input Low Voltage
2.2
6.0
Storage
Temperature
(1)
____
-0.5
0.8
V
3198 tbl 07
IOUT
DC Output Current
mA
NOTES:
1. VIL > -1.5V for pulse width less than 10ns.
2. VTERM must not exceed Vcc + 10%.
3198 tbl 05
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect
reliability.
Capacitance
(TA = +25°C, f = 1.0mhz) (TQFP Only)
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.
Symbol
Parameter(1)
Input Capacitance
Output Capacitance
Conditions(2)
IN = 3dV
OUT = 3dV
Max. Unit
CIN
V
9
pF
COUT
V
10
pF
MaximumOperatingTemperature
andSupplyVoltage(1,2)
Ambient
3198 tbl 08
NOTES:
1. This parameter is determined by device characterization but is not production
tested.
2. 3dV represents the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
Grade
Temperature
-55OC to+125OC
0OC to +70OC
-40OC to +85OC
GND
Vcc
Military
0V
5.0V + 10%
5.0V + 10%
5.0V + 10%
Commercial
Industrial
0V
0V
3198 tbl 06
NOTES:
1. This is the parameter TA. This is the "instant on" case tempreature.
2. Industrial Temperature: for other speeds, packages and powers contact your
sales office.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(2) (VCC = 5.0V ± 10%)
7008S
7008L
Symbol
Parameter
Input Leakage Current(1)
Output Leakage Current
Output Low Voltage
Test Conditions
VCC = 5.5V, VIN = 0V to VCC
Min.
Max.
10
Min.
Max.
Unit
µA
µA
V
___
___
|ILI|
5
5
___
___
___
___
|ILO
|
10
CE = VIH, VOUT = 0V to VCC
IOL = 4mA
VOL
VOH
0.4
0.4
___
___
Output High Voltage
IOH = -4mA
2.4
2.4
V
3198 tbl 09
NOTES:
1. At Vcc < 2.0V, input leakages are undefined.
2. Refer to Chip Enable Truth Table.
6
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1,6,7) (VCC = 5.0V ± 10%)
7008X20
Com'l Only
7008X25
Com'l &
Military
Symbol
Parameter
Dynamic Operating
Current
(Both Ports Active)
Test Condition
Version
COM'L
Typ.(2)
Max.
Typ.(2)
Max.
Unit
CC
I
S
L
190
180
325
285
180
170
305
265
mA
IL
CE = V , Outputs Disabled
IH
SEM = V
(3)
MAX
f = f
___
___
___
___
MIL &
IND
S
L
170
170
345
305
SB1
I
Standby Current
(Both Ports - TTL Level
Inputs)
COM'L
S
L
50
50
90
70
40
40
85
60
mA
mA
mA
mA
L
R
IH
CE = CE = V
R
L
IH
SEM = SEM = V
(3)
MAX
f = f
___
___
___
___
MIL &
IND
S
L
40
40
100
80
(5)
IH
SB2
I
Standby Current
(One Port - TTL Level
Inputs)
"A"
IL
"B"
COM'L
S
L
115
115
215
185
105
105
200
170
CE = V and CE = V
Active Port Outputs Disabled,
(3)
MAX
f=f
___
___
___
___
R
L
IH
MIL &
IND
S
L
105
105
230
200
SEM = SEM = V
SB3
I
L
Full Standby Current
(Both Ports - All CMOS
Level Inputs)
Both Ports CE and
COM'L
S
L
1.0
0.2
15
5
1.0
0.2
15
5
R
CC
CC
CE > V - 0.2V
IN
IN
V
> V - 0.2V or
< 0.2V, f = 0
___
___
___
___
(4)
MIL &
IND
S
L
1.0
0.2
30
10
V
R
L
CC
SEM = SEM > V - 0.2V
SB4
I
Full Standby Current
(One Port - All CMOS
Level Inputs)
COM'L
S
L
110
110
190
160
100
100
170
145
"A"
CE < 0.2V and
(5)
"B"
CC
CE > V - 0.2V
R
L
CC
SEM = SEM > V - 0.2V
___
___
___
___
MIL &
IND
S
L
100
100
200
175
IN
CC
IN
V
> V - 0.2V or V < 0.2V
Active Port Outputs Disabled
f = f
(3)
MAX
3198 tbl 10a
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Symbol
Parameter
Test Condition
Version
Typ.(2)
Max.
Typ.(2)
Max.
Unit
CC
I
Dynamic Operating Current
(Both Ports Active)
COM'L
S
L
160
160
295
255
150
150
270
230
mA
IL
CE = V , Outputs Disabled
IH
SEM = V
(3)
MAX
f = f
MIL &
IND
S
L
160
160
335
295
150
150
310
270
SB1
I
Standby Current
(Both Ports - TTL Level
Inputs)
COM'L
S
L
30
30
85
60
20
20
85
60
mA
mA
L
R
IH
CE = CE = V
R
L
IH
SEM = SEM = V
MIL &
IND
S
L
20
20
100
80
13
13
100
80
(5)
IH
SB2
I
Standby Current
(One Port - TTL Level
Inputs)
COM'L
S
L
95
95
185
155
85
85
165
135
"A"
IL
"B"
CE = V and CE = V
Active Port Outputs Disabled,
(3)
MAX
f=f
MIL &
IND
S
L
95
95
215
185
85
85
195
165
R
L
IH
SEM = SEM = V
SB3
L
I
Full Standby Current
(Both Ports - All CMOS
Level Inputs)
Both Ports CE and
mA
mA
COM'L
S
L
1.0
0.2
15
5
1.0
0.2
15
5
R
CC
CE > V - 0.2V
IN
IN
V
CC
V
> V - 0.2V or
(4)
MIL &
IND
S
L
1.0
0.2
30
10
1.0
0.2
30
10
< 0.2V, f = 0
R
L
CC
SEM = SEM > V - 0.2V
SB4
I
Full Standby Current
(One Port - All CMOS
Level Inputs)
"A"
"B"
COM'L
S
L
90
90
160
135
80
80
135
110
CE < 0.2V and
(5)
CC
CE > V - 0.2V
R
L
CC
SEM = SEM > V - 0.2V
IN
V
CC
IN
MIL &
IND
S
L
90
90
190
165
80
80
175
150
> V - 0.2V or V < 0.2V
Active Port Outputs Disabled
(3)
MAX
f = f
3198 tbl 10b
NOTES:
1. 'X' in part numbers indicates power rating (S or L)
2. VCC = 5V, TA = +25°C, and are not production tested. ICCDC = 120mA (Typ.)
3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/ tRC, and using “AC Test Conditions” of input
levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
6. Refer to Chip Enable Truth Table.
7. Industrial Temperature: for other speeds, packages and powers contact your sales office.
7
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
5V
5V
AC Test Conditions
Input Pulse Levels
GND to 3.0V
5ns Max.
1.5V
893Ω
Ω
893
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
DATAOUT
BUSY
INT
DATAOUT
1.5V
30pF
5pF*
347Ω
347
Ω
Figures 1 and 2
3198 tbl 11
3198 drw 05
3198 drw 06
Figure 2. Output Test Load
(for tLZ, tHZ, tWZ, tOW)
Figure 1. AC Output Test Load
* Including scope and jig.
Waveform of Read Cycles(5)
tRC
ADDR
(4)
tAA
(4)
tACE
CE(6)
(4)
tAOE
OE
R/W
(1)
tOH
tLZ
VALID DATA(4)
DATAOUT
(2)
tHZ
BUSYOUT
(3,4)
3198 drw 07
tBDD
Timing of Power-Up Power-Down
CE(6)
PU
t
PD
t
I
CC
I
SB
,
3198 drw 08
NOTES:
1. Timing depends on which signal is asserted last, OE or CE.
2. Timing depends on which signal is de-asserted first CE or OE.
3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY
has no relation to valid output data.
4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD.
5. SEM = VIH.
6. Refer to Chip Enable Truth Table.
8
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(6,7)
7008X20
Com'l Only
7008X25 Com'l 7008X35 Com'l
& Military & Military
7008X55
Com'l, Ind
& Military
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
READ CYCLE
____
____
____
____
tRC
Read Cycle Time
20
25
35
55
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
____
____
____
____
tAA
Address Access Time
20
20
25
25
35
35
55
55
Chip Enable Access Time(4)
Output Enable Access Time
____
____
____
____
____
____
____
____
tACE
tAOE
tOH
tLZ
12
13
20
30
____
____
____
____
Output Hold from Address Change
Output Low-Z Time(1,2)
3
3
3
3
____
____
____
____
3
3
3
3
Output High-Z Time(1,2)
12
15
15
25
____
____
____
____
tHZ
tPU
tPD
tSOP
tSAA
Chip Enab le to Power Up Time(2)
Chip Disable to Power Down Time(2)
Semaphore Flag Update Pulse (OE or SEM)
Semaphore Address Access Time
0
0
0
0
____
____
____
____
____
____
____
____
20
25
35
50
____
____
____
____
10
12
15
15
____
____
____
____
20
25
35
55
ns
3198 tbl 12
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltage(6,7)
7008X20
Com'l Only
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
WRITE CYCLE
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
tWC
tEW
tAW
tAS
Write Cycle Time
20
15
15
0
25
20
20
0
35
30
30
0
55
45
45
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Chip Enable to End-of-Write(3)
Address Valid to End-of-Write
Address Set-up Time(3)
Write Pulse Width
tWP
15
0
20
0
25
0
40
0
tWR
tDW
tHZ
Write Recovery Time
Data Valid to End-of-Write
Output High-Z Time(1,2)
Data Hold Time(5)
15
15
15
30
____
____
____
____
12
15
15
25
____
____
____
____
tDH
0
0
0
0
(1,2)
____
____
____
____
tWZ
tOW
tSWRD
tSPS
Write Enable to Output in High-Z
Output Active from End-of-Write(1, 2,5 )
SEM Flag Write to Read Time
SEM Flag Contention Window
12
15
15
25
____
____
____
____
0
5
5
0
5
5
0
5
5
0
5
5
____
____
____
____
____
____
____
____
ns
3198 tbl 13
NOTES:
1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2).
2. This parameter is guaranted by device characterization, but is not production tested.
3. To access RAM, CE= VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time.
4. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE= VIH and SEM = VIL.
5. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over voltage
and temperature, the actual tDH will always be smaller than the actual tOW.
6. 'X' in part numbers indicates power rating (s or L).
7. Industrial Temperature: for other speeds, packages and powers contact your sales office.
9
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)
tWC
ADDRESS
(7)
tHZ
OE
tAW
CE or SEM(9,10)
(3)
(2)
(6)
tWP
tWR
tAS
R/W
DATAOUT
DATAIN
(7)
tWZ
tOW
(4)
(4)
tDW
tDH
3198 drw 09
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5)
tWC
ADDRESS
tAW
(9,10)
or
CE SEM
(3)
WR
(6)
(2)
t
t
EW
tAS
R/
W
t
DW
t
DH
DATAIN
3198 drw 10
NOTES:
1. R/W or CE must be HIGH during all address transitions.
2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle.
3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state.
6. Timing depends on which enable signal is asserted last, CE or R/W.
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure
2).
8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be
placed on the bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as
the specified tWP.
9. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition.
10. Refer to Chip Enable Truth Table.
10
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Timing Waveform of Semaphore Read after Write Timing, Either Side(1)
tSAA
tOH
A0-A2
VALID ADDRESS
VALID ADDRESS
tACE
tAW
tWR
tEW
SEM
tDW
DATAIN VALID
tSOP
DATAOUT
VALID(2)
DATA0
tAS
tWP
tDH
R/W
tSWRD
tAOE
OE
tSOP
Write Cycle
Read Cycle
3198 drw 11
NOTES:
1. CE = VIH for the duration of the above timing (both write and read cycle) (Refer to Chip Enable Truth Table).
2. "DATAOUT VALID" represents all I/O's (I/O0 - I/O15) equal to the semaphore value.
Timing Waveform of Semaphore Write Contention(1,3,4)
A0"A"-A2"A"
MATCH
SIDE(2) "A"
R/W"A"
SEM"A"
SPS
t
A0"B"-A2"B"
MATCH
SIDE(2)
"B"
R/W
"B"
SEM"B"
3198 drw 12
NOTES:
1. DOR = DOL = VIL, CEL = CER = VIH (Refer to Chip Enable Truth Table).
2. All timing is the same for left and right ports. Port "A" may be either left or right port. "B" is the opposite from port "A".
3. This parameter is measured from R/W"A" or SEM"A" going HIGH to R/W"B" or SEM"B" going HIGH.
4. If tSPS is not satisfied, the semaphore will fall positively to one side or the other, but there is no guarantee which side will obtain the flag.
11
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(6,7)
7008X20
Com'l Only
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind &
Military
Symbol
BUSY TIMING (M/S=V )
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max. Unit
IH
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
____
tBAA
tBDA
tBAC
tBDC
tAPS
tBDD
tWH
20
20
20
20
20
20
20
20
20
45
40
40
ns
ns
ns
ns
ns
ns
ns
BUSY Access Time from Address Match
BUSY Disable Time from Address Not Matched
BUSY Access Time from Chip Enable Low
BUSY Access Time from Chip Enable High
Arbitration Priority Set-up Time(2)
17
17
20
35
____
____
____
____
5
5
5
5
____
____
____
____
BUSY Disable to Valid Data(3)
20
25
35
55
Write Hold After BUSY(5)
15
17
25
25
____
____
____
____
BUSY TIMING (M/S=V )
IL
BUSY Input to Write(4)
Write Hold After BUSY(5)
PORT-TO-PORT DELAY TIMING
tWDD
Write Pulse to Data Delay(1)
tDDD
Write Data Valid to Read Data Delay(1)
____
____
____
____
____
____
____
____
tWB
0
0
0
0
ns
ns
tWH
15
17
25
25
____
____
____
____
____
____
____
____
45
30
50
35
60
45
80
65
ns
ns
3198 tbl 14
NOTES:
1. Port-to-port delay through RAM cells from writing port to reading port, refer to "Timing Waveform of Write with Port-to-Port Read and BUSY (M/S = VIH)".
2. To ensure that the earlier of the two ports wins.
3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual).
4. To ensure that the write cycle is inhibited on port "B" during contention on port "A".
5. To ensure that a write cycle is completed on port "B" after contention on port "A".
6. 'X' in part numbers indicates power rating (S or L).
7. Industrial Temperature: for other speeds, packages and powers contact your sales office.
12
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
TimingWaveformof WritewithPort-to-PortReadandBUSY(2,5)(M/S = VIH)(4)
tWC
ADDR"A"
MATCH
tWP
R/
W"A"
tDH
tDW
DATAIN "A"
VALID
(1)
tAPS
ADDR"B"
MATCH
tBDA
tBDD
BUSY"B"
tWDD
DATAOUT "B"
VALID
(3)
tDDD
NOTES:
3198 drw 13
1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S = VIL (SLAVE).
2. CEL = CER = VIL, refer to Chip Enable Truth Table.
3. OE = VIL for the reading port.
4. If M/S = VIL (SLAVE), then BUSY is an input (BUSY"A" = VIH and BUSY"B" = "don't care", for this example).
5. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from port "A".
Timing Waveform of Write with BUSY (M/S = VIL)
tWP
R/W"A"
(3)
tWB
BUSY"B"
(1)
tWH
R/W"B"
(2)
3198 drw 14
NOTES:
1. tWH must be met for both BUSY input (SLAVE) and output (MASTER).
2. BUSY is asserted on port "B" blocking R/W"B", until BUSY"B" goes HIGH.
3. tWB is only for the 'Slave' version.
13
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of BUSY Arbitration Controlled by CE Timing(1,3) (M/S = VIH)
ADDR"A"
ADDRESSES MATCH
and "B"
CE"A"
(2)
t
APS
CE"B"
t
BAC
t
BDC
BUSY"B"
3198 drw 15
Waveform of BUSY Arbitration Cycle Controlled by Address Match
Timing(1) (M/S = VIH)
"A"
ADDR
ADDRESS "N"
(2)
t
APS
ADDR"B"
MATCHING ADDRESS "N"
t
BAA
t
BDA
BUSY"B"
3198 drw 16
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.
2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or another but there is no guarantee on which side BUSY will be asserted.
3. Refer to Chip Enable Truth Table.
AC Electrical Characteristics Over the
OperatingTemperatureandSupplyVoltageRange(1,2)
7008X20
Com'l Only
7008X25
Com'l &
Military
7008X35
Com'l &
Military
7008X55
Com'l, Ind
& Military
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
INTERRUPT TIMING
____
____
____
____
____
____
____
____
tAS
Address Set-up Time
Write Recovery Time
0
0
0
0
ns
ns
ns
tWR
tINS
tINR
0
0
0
0
____
____
____
____
Interrupt Set Time
20
20
20
20
25
25
40
40
____
____
____
____
Interrupt Reset Time
ns
3198 tbl 15
NOTES:
1. 'X' in part numbers indicates power rating (S or L).
2. Industrial Temperature: for other speeds, packages and powers contact your sales office.
14
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Waveform of Interrupt Timing(1,5)
t
WC
INTERRUPT SET ADDRESS(2)
ADDR"A"
(3)
(4)
t
AS
t
WR
CE"A"
R/W"A"
INT"B"
(3)
t
INS
3198 drw 17
t
RC
INTERRUPT CLEAR ADDRESS(2)
ADDR"B"
t
AS(3)
CE"B"
"B"
OE
t
INR(3)
INT"B"
3198 drw 18
NOTES:
1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”.
2. See Interrupt Truth Table.
3. Timing depends on which enable signal (CE or R/W) is asserted last.
4. Timing depends on which enable signal (CE or R/W) is de-asserted first.
5. Refer to Chip Enable Truth Table.
Truth Table IV Interrupt Flag(1,4,5)
Left Port
Right Port
WL
R/
WR
R/
A15L-A0L
FFFF
X
A15R-A0R
X
Function
CE
L
OEL
X
INTL
X
CE
X
L
OER
X
INT
R
(2)
L
X
X
X
X
X
L
L
Set Right INT Flag
R
(3
)
X
X
L
X
X
L
FFFF
FFFE
X
H
Reset Right INT Flag
R
(3)
X
X
L
L
X
X
X
Set Left INT Flag
L
(2)
L
FFFE
H
X
X
X
Reset Left INT Flag
L
3198 tbl 16
NOTES:
1. Assumes BUSYL = BUSYR =VIH.
2. If BUSYL = VIL, then no change.
3. If BUSYR = VIL, then no change.
4. INTL and INTR must be initialized at power-up.
5. Refer to Chip Enable Truth Table.
15
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
Truth Table V Address BUSY
Arbitration(4)
Inputs
Outputs
AOL-A15L
AOR-A15R
(1)
(1)
Function
Normal
Normal
Normal
Write
CEL
X
CER
X
BUSYL
BUSYR
NO MATCH
MATCH
H
H
H
H
H
H
H
X
X
H
MATCH
L
L
MATCH
(2)
(2)
(3)
Inhibit
3198 tbl 17
NOTES:
1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSY outputs on the IDT7008 are
push-pull, not open drain outputs. On slaves the BUSY input internally inhibits writes.
2. "L" if the inputs to the opposite port were stable prior to the address and enable inputs of this port. "H" if the inputs to the opposite port became stable after the address
and enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs can not be LOW simultaneously.
3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored
when BUSYR outputs are driving LOW regardless of actual logic level on the pin.
4. Refer to Chip Enable Truth Table.
Truth Table VI Example of Semaphore Procurement Sequence(1,2,3)
Functions
D0 - D7 Left
D0 - D7 Right
Status
No Action
1
0
0
1
1
0
1
1
1
0
1
1
1
1
0
0
1
1
0
1
1
1
Semaphore free
Left Port Writes "0" to Semaphore
Right Port Writes "0" to Semaphore
Left Port Writes "1" to Semaphore
Left Port Writes "0" to Semaphore
Right Port Writes "1" to Semaphore
Left Port Writes "1" to Semaphore
Right Port Writes "0" to Semaphore
Right Port Writes "1" to Semaphore
Left Port Writes "0" to Semaphore
Left Port Writes "1" to Semaphore
Left port has semaphore token
No change. Right side has no write access to semaphore
Right port obtains semaphore token
No change. Left port has no write access to semaphore
Left port obtains semaphore token
Semaphore free
Right port has semaphore token
Semaphore free
Left port has semaphore token
Semaphore free
3198 tbl 18
NOTES:
1. This table denotes a sequence of events for only one of the eight semaphores on the IDT7008.
2. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0-I/O7). These eight semaphores are addressed by A0-A2.
3. CE = VIH, SEM = VIL to access the semaphores. Refer to the Semaphore Read/Write Control Truth Table.
FunctionalDescription
TheIDT7008providestwoportswithseparatecontrol,addressand (INTL) is asserted when the right port writes to memory location FFFE
I/Opinsthatpermitindependentaccessforreadsorwritestoanylocation (HEX),whereawriteisdefinedasCER=R/WR=VILpertheTruthTable.
inmemory.TheIDT7008hasanautomaticpowerdownfeaturecontrolled TheleftportclearstheinterruptthroughaccessofaddresslocationFFFE
byCE. TheCE0and CE1 control the on-chip power down circuitry that when CEL = OEL = VIL, R/W is a "don't care". Likewise, the right port
permitstherespectiveporttogointoastandbymodewhennotselected interruptflag(INTR)isassertedwhentheleftportwritestomemorylocation
(CEHIGH).Whenaportis enabled,access totheentirememoryarray FFFF(HEX)andtocleartheinterruptflag(INTR),therightportmustread
ispermitted.
thememorylocationFFFF. Themessage(8bits)atFFFEorFFFFisuser-
definedsinceitisanaddressableSRAMlocation.Iftheinterruptfunction
isnotused,addresslocationsFFFEandFFFFarenotusedasmailboxes,
butaspartoftherandomaccessmemory.RefertoTableIVfortheinterrupt
operation.
Interrupts
Iftheuserchoosestheinterruptfunction,amemorylocation(mailbox
ormessagecenter)is assignedtoeachport. Theleftportinterruptflag
16
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
resultina glitchedinternalwrite inhibitsignalandcorrupteddata inthe
slave.
BusyLogic
BusyLogicprovidesahardwareindicationthatbothportsoftheRAM
haveaccessedthesamelocationatthesametime.Italsoallowsoneofthe
twoaccessestoproceedandsignalstheothersidethattheRAMis“busy”.
TheBUSYpincanthenbeusedtostalltheaccessuntiltheoperationon
theothersideiscompleted.Ifawriteoperationhasbeenattemptedfrom
thesidethatreceivesaBUSYindication,thewritesignalisgatedinternally
topreventthewritefromproceeding.
TheuseofBUSYlogicisnotrequiredordesirableforallapplications.
InsomecasesitmaybeusefultologicallyORtheBUSYoutputstogether
anduse anyBUSYindicationas aninterruptsource toflagthe eventof
anillegalorillogicaloperation.IfthewriteinhibitfunctionofBUSYlogicis
notdesirable,theBUSYlogiccanbedisabledbyplacingthepartinslave
modewiththeM/Spin.OnceinslavemodetheBUSYpinoperatessolely
asawriteinhibitinputpin.Normaloperationcanbeprogrammedbytying
the BUSY pins HIGH. If desired, unintended write operations can be
prevented to a port by tying the BUSY pin for that port LOW.
TheBUSYoutputsontheIDT7008RAMinmastermode,arepush-
pulltypeoutputsanddonotrequirepullupresistorstooperate.Ifthese
RAMs are being expanded in depth, then the BUSY indication for the
resulting array requires the use of an external AND gate.
Semaphores
TheIDT7008isanextremelyfastDual-Port64Kx8CMOSStaticRAM
withanadditional8addresslocationsdedicatedtobinarysemaphoreflags.
TheseflagsalloweitherprocessorontheleftorrightsideoftheDual-Port
RAMtoclaimaprivilegeovertheotherprocessorforfunctionsdefinedby
thesystemdesigner’ssoftware.Asanexample,thesemaphorecanbe
usedbyoneprocessortoinhibittheotherfromaccessingaportionofthe
Dual-Port RAM or any other shared resource.
The Dual-PortRAMfeatures a fastaccess time, andbothports are
completelyindependentofeachother.Thismeansthattheactivityonthe
leftportinnowayslows theaccess timeoftherightport.Bothports are
identicalinfunctiontostandardCMOSStaticRAMandcanbereadfrom,
orwrittento,atthesametimewiththeonlypossibleconflictarisingfromthe
simultaneous writing of, or a simultaneous READ/WRITE of, a non-
semaphorelocation.Semaphoresareprotectedagainstsuchambiguous
situationsandmaybeusedbythesystemprogramtoavoidanyconflicts
inthenon-semaphoreportionoftheDual-PortRAM.Thesedeviceshave
anautomaticpower-downfeaturecontrolledbyCE,theDual-PortRAM
enable,andSEM,thesemaphoreenable.TheCEandSEMpinscontrol
on-chippowerdowncircuitrythatpermits the respective porttogointo
standbymodewhennotselected. Thisistheconditionwhichisshownin
Truth Table II where CE and SEM are both HIGH.
A16
CE0
CE0
MASTER
Dual Port RAM
SLAVE
Dual Port RAM
BUSY (L) BUSY (R)
BUSY (L) BUSY (R)
SystemswhichcanbestusetheIDT7008containmultipleprocessors
or controllers and are typically very high-speed systems which are
softwarecontrolledorsoftwareintensive.Thesesystemscanbenefitfrom
a per-formance increase offered by the IDT7008s hardware sema-
phores,whichprovidealockoutmechanismwithoutrequiringcomplex
programming.
CE1
CE1
MASTER
Dual Port RAM
SLAVE
Dual Port RAM
BUSY (L) BUSY (R)
BUSY (L) BUSY (R)
,
3198 drw 19
Softwarehandshakingbetweenprocessors offers themaximumin
systemflexibilitybypermittingsharedresourcestobeallocatedinvarying
configurations.TheIDT7008doesnotuseitssemaphoreflagstocontrol
anyresourcesthroughhardware,thusallowingthesystemdesignertotal
flexibilityinsystemarchitecture.
An advantage of using semaphores rather than the more common
methodsofhardwarearbitrationisthatwaitstatesareneverincurredin
either processor. This can prove to be a major advantage in very high-
speedsystems.
Figure 3. Busy and chip enable routing for both width and depth
expansion with IDT7008 RAMs.
WidthExpansionBusyLogic
Master/SlaveArrays
WhenexpandinganIDT7008RAMarrayinwidthwhileusingBUSY
logic,onemasterpartisusedtodecidewhichsideoftheRAMsarraywill
receivea BUSYindication,andtooutputthatindication.Anynumberof
slaves to be addressed in the same address range as the master, use
the BUSYsignalasawriteinhibitsignal.ThusontheIDT7008RAMthe
How the Semaphore Flags Work
Thesemaphorelogicisasetofeightlatcheswhichareindependent
BUSYpinisanoutputifthepartisusedasamaster(M/Spin=VIH),and oftheDual-PortRAM.Theselatchescanbeusedtopassaflag,ortoken,
theBUSYpinisaninputifthepartusedasaslave(M/Spin=VIL)as shown fromoneporttotheothertoindicatethatasharedresourceisinuse.The
in Figure 3.
semaphores provide a hardware assist for a use assignment method
Iftwoormoremasterpartswereusedwhenexpandinginwidth,asplit called“TokenPassingAllocation.”Inthismethod,thestateofasemaphore
decisioncouldresultwithonemasterindicatingBUSYononesideofthe latchisusedasatokenindicatingthatsharedresourceisinuse.Iftheleft
arrayandanothermasterindicatingBUSYononeothersideofthearray. processorwantstousethisresource,itrequeststhetokenbysettingthe
Thiswouldinhibitthewriteoperationsfromoneportforpartofawordand latch.Thisprocessorthenverifiesitssuccessinsettingthelatchbyreading
inhibitthewriteoperationsfromtheotherportfortheotherpartoftheword. it. If it was successful, it proceeds to assume control over the shared
TheBUSYarbitration,onamaster,is basedonthechipenableand resource.Ifitwasnotsuccessfulinsettingthelatch,itdeterminesthatthe
address signals only. Itignores whetheranaccess is a readorwrite. In rightsideprocessorhassetthelatchfirst, hasthetokenandisusingthe
a master/slave array, both address and chip enable must be valid long sharedresource. Theleftprocessorcantheneitherrepeatedlyrequest
enoughforaBUSYflagtobeoutputfromthemasterbeforetheactualwrite thatsemaphore’sstatusorremoveitsrequestforthatsemaphoretoperform
pulsecanbeinitiatedwiththeR/Wsignal.Failuretoobservethistimingcan anothertaskandoccasionallyattemptagaintogaincontrolofthetokenvia
17
6.42
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
thesetandtestsequence.Oncetherightsidehasrelinquishedthetoken, side during subsequent read. Had a sequence of READ/WRITE been
theleftsideshouldsucceedingainingcontrol. usedinstead,systemcontentionproblemscouldhaveoccurredduringthe
ThesemaphoreflagsareactiveLOW.Atokenisrequestedbywriting gap between the read and write cycles.
azerointoasemaphorelatchandisreleasedwhenthesamesidewrites
aonetothatlatch.
Itisimportanttonotethatafailedsemaphorerequestmustbefollowed
byeitherrepeatedreadsorbywritingaoneintothesamelocation.The
The eightsemaphore flags reside withinthe IDT7008ina separate reasonforthisiseasilyunderstoodbylookingatthesimplelogicdiagram
memoryspacefromtheDual-PortRAM.This addressspaceisaccessed ofthesemaphoreflaginFigure4.Twosemaphorerequestlatchesfeed
byplacingaLOWinputontheSEMpin(whichactsasachipselectforthe into a semaphore flag. Whichever latch is first to present a zero to the
semaphore flags) and using the other control pins (Address, CE, and semaphoreflagwillforceitssideofthesemaphoreflagLOWandtheother
R/W)as theywouldbeusedinaccessingastandardStaticRAM.Each sideHIGH.Thisconditionwillcontinueuntilaoneiswrittentothesame
oftheflagshasauniqueaddresswhichcanbeaccessedbyeitherside semaphorerequestlatch.Shouldtheotherside’ssemaphorerequestlatch
throughaddresspinsA0–A2.Whenaccessingthesemaphores,noneof havebeenwrittentoazerointhemeantime,thesemaphoreflagwillflip
theotheraddresspinshasanyeffect.
Whenwritingtoasemaphore,onlydatapinD0isused.IfaLOWlevel
L PORT
R PORT
iswrittenintoanunusedsemaphorelocation,thatflagwillbesettoazero
onthatsideandaoneontheotherside(seeTableVI).Thatsemaphore
can now only be modified by the side showing the zero. When a one is
writtenintothesamelocationfromthesameside,theflagwillbesettoa
one for both sides (unless a semaphore request from the other side is
pending)andthencanbewrittentobybothsides.Thefactthattheside
whichisabletowriteazerointoasemaphoresubsequentlylocksoutwrites
fromtheothersideiswhatmakessemaphoreflagsusefulininterprocessor
communications.(Athoroughdiscussionontheuseofthisfeaturefollows
shortly.)Azerowrittenintothesamelocationfromtheothersidewillbe
storedinthesemaphorerequestlatchforthatsideuntilthesemaphoreis
freedbythefirstside.
Whenasemaphoreflagisread,itsvalueisspreadintoalldatabitsso
thataflagthatisaonereadsasaoneinalldatabitsandaflagcontaining
azeroreadsasallzeros.Thereadvalueislatchedintooneside’soutput
registerwhenthatside'ssemaphoreselect(SEM)andoutputenable(OE)
signalsgoactive.Thisservestodisallowthesemaphorefromchanging
stateinthemiddleofareadcycleduetoawritecyclefromtheotherside.
Becauseofthislatch,arepeatedreadofasemaphoreinatestloopmust
cause either signal (SEM or OE) to go inactive or the output will never
change.
AsequenceWRITE/READmustbeusedbythesemaphoreinorder
to guarantee that no system level contention will occur. A processor
requestsaccesstosharedresourcesbyattemptingtowriteazerointoa
semaphorelocation.Ifthesemaphoreisalreadyinuse,thesemaphore
requestlatchwillcontainazero,yetthesemaphoreflagwillappearasone,
afactwhichtheprocessorwillverifybythesubsequentread(seeTable
VI). As anexample, assume a processorwrites a zerotothe leftportat
afreesemaphorelocation.Onasubsequentread,theprocessorwillverify
thatithaswrittensuccessfullytothatlocationandwillassumecontrolover
the resource in question. Meanwhile, if a processor on the right side
attempts towriteazerotothesamesemaphoreflagitwillfail,as willbe
verifiedbythefactthataonewillbereadfromthatsemaphoreontheright
SEMAPHORE
REQUEST FLIP FLOP
SEMAPHORE
REQUEST FLIP FLOP
D0
D0
D
D
Q
Q
WRITE
WRITE
SEMAPHORE
READ
SEMAPHORE
,
READ
3198 drw 20
Figure 4. IDT7008 Semaphore Logic
overtotheothersideassoonasaoneiswrittenintothefirstside’srequest
latch.Thesecondside’sflagwillnowstayLOWuntilitssemaphorerequest
latchiswrittentoaone.Fromthisitiseasytounderstandthat,ifasemaphore
is requestedandthe processorwhichrequesteditnolongerneeds the
resource, the entire system can hang up until a one is written into that
semaphorerequestlatch.
The criticalcase ofsemaphore timingis whenbothsides requesta
single token by attempting to write a zero into it at the same time. The
semaphorelogicisspeciallydesignedtoresolvethisproblem.Ifsimulta-
neousrequestsaremade,thelogicguaranteesthatonlyonesidereceives
thetoken.Ifonesideisearlierthantheotherinmakingtherequest,thefirst
sidetomaketherequestwillreceivethetoken.Ifbothrequestsarriveat
thesametime,theassignmentwillbearbitrarilymadetooneportorthe
other.
One caution that should be noted when using semaphores is that
semaphoresalonedonotguaranteethataccesstoaresourceissecure.
Aswithanypowerfulprogrammingtechnique,ifsemaphoresaremisused
ormisinterpreted, a software errorcaneasilyhappen.
Initializationofthesemaphoresisnotautomaticandmustbehandled
viatheinitializationprogramatpower-up.Sinceanysemaphorerequest
flagwhichcontainsazeromustberesettoaone,allsemaphoresonboth
sidesshouldhaveaonewrittenintothematinitializationfrombothsides
to assure that they will be free when needed.
18
IDT7008S/L
High-Speed 64K x 8 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
OrderingInformation
IDT XXXXX
A
999
A
A
Device
Type
Power
Speed
Package
Process/
Temperature
Range
Blank
I(1)
B
Commercial (0°C to +70°C)
Industrial (-40°C to + 85°C)
Military (-55°C to +125°C)
Compliant to MIL-PRF-38535 QML
PF
G
J
100-pin TQFP (PN100-1)
108-pin PGA (G108-1)
84-pin PLCC (J84-1)
Commercial Only
Commercial & Military
Commercial & Military
Commercial, Industrial
& Military
20
25
35
55
Speed in
nanoseconds
,
Standard Power
Low Power
S
L
512K (64K x 8) Dual-Port RAM
7008
3198 drw 21
NOTE:
1. IndustrialtemperaturerangeisavailableonselectedTQFPpackagesinstandardpower.
Forotherspeeds,packagesandpowerscontactyoursalesoffice.
DatasheetDocumentHistory
1/6/99:
Initiateddatasheetdocumenthistory
Convertedtonewformat
Cosmeticandtypographicalcorrections
Pages2and3Addedadditionalnotestopinconfigurations
Changeddrawingformat
6/3/99:
11/10/99:
5/8/99:
Replaced IDT logo
Page 6 Increasedstoragetemperatureparameter
ClarifiedTAparameter
Page 7 DCElectricalparamters–changedwordingfrom"open"to"disabled"
Changed±200mVto0mVinnotes
CORPORATE HEADQUARTERS
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Santa Clara, CA 95054
for SALES:
for Tech Support:
831-754-4613
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800-345-7015 or 408-727-5166
fax: 408-492-8674
www.idt.com
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
19
6.42
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