IDT709389L12PF9 [IDT]

Dual-Port SRAM, 64KX18, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100;
IDT709389L12PF9
型号: IDT709389L12PF9
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Dual-Port SRAM, 64KX18, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

静态存储器 内存集成电路
文件: 总15页 (文件大小:171K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HIGH-SPEED 64K x 18  
IDT709389L  
SYNCHRONOUS PIPELINED  
DUAL-PORT STATIC RAM  
Features  
True Dual-Ported memory cells which allow simultaneous  
access of the same memory location  
High-speed clock to data access  
– Commercial:7.5/9/12ns (max.)  
Industrial:9ns (max.)  
Full synchronous operation on both ports  
– 4ns setup to clock and 0ns hold on all control, data, and  
address inputs  
Data input, address, and control registers  
– Fast 7.5ns clock to data out in the Pipelined output mode  
– Self-timed write allows fast cycle time  
Low-power operation  
IDT709389L  
– 12ns cycle time, 83MHz operation in Pipelined output mode  
Separate upper-byte and lower-byte controls for  
multiplexed bus and bus matching compatibility  
TTL- compatible, single 5V (±10%) power supply  
Industrial temperature range (–40°C to +85°C) is  
available for selected speeds  
Active: 1.2W (typ.)  
Standby: 2.5mW (typ.)  
Flow-Through or Pipelined output mode on either Port via  
the FT/PIPE pins  
Counter enable and reset features  
Dual chip enables allow for depth expansion without  
additional logic  
Available in a 100-pin Thin Quad Flatpack (TQFP) package  
Functional Block Diagram  
R/  
W
L
L
R/  
W
R
R
UB  
UB  
CE0L  
CE1L  
CE0R  
CE1R  
1
0
1
0
0/1  
0/1  
LB  
OE  
L
L
LB  
OE  
R
R
1b 0b  
0a 1a  
1a 0a  
a
0b 1b  
b
FT/PIPE  
L
0/1  
0/1  
b
a
FT/PIPE  
R
I/O9L-I/O17L  
I/O0L-I/O8L  
I/O9R-I/O17R  
I/O0R-I/O8R  
I/O  
Control  
I/O  
Control  
A
15R  
A
15L  
Counter/  
Address  
Reg.  
Counter/  
Address  
Reg.  
MEMORY  
ARRAY  
A
C0LRK  
R
R
A
0L  
L
L
L
CLK  
ADS  
CNTEN  
CNTRST  
ADS  
CNTEN  
R
L
CNTRST  
R
4844 drw 01  
NOVEMBER 2001  
1
DSC-4844/4  
©2001IntegratedDeviceTechnology,Inc.  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Description  
With an input data register, the IDT709389 has been optimized for  
applications having unidirectional or bidirectional data flow in bursts.  
Anautomaticpowerdownfeature, controlledbyCE0andCE1, permits  
the on-chip circuitry of each port to enter a very low standby power  
mode. Fabricated using IDTs CMOS high-performance technology,  
these devices typically operate on only 1.2W of power.  
The IDT709389 is a high-speed 64K x 18 bit synchronous Dual-  
Port RAM. The memory array utilizes Dual-Port memory cells to allow  
simultaneous access of any address from both ports. Registers on  
control, data, and address inputs provide minimal setup and hold  
times. The timing latitude provided by this approach allows systems  
to be designed with very short cycle times.  
Pin Configurations(1,2,3)  
INDEX  
11/07/01  
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76  
1
A
9L  
A
A
8R  
9R  
75  
74  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
2
A10L  
A11L  
A12L  
A13L  
A14L  
A
A
A
A
A
A15R  
LB  
UB  
CE0R  
10R  
11R  
12R  
13R  
14R  
3
4
5
6
7
A15L  
8
LB  
UB  
CE0L  
CE1L  
L
L
9
R
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
R
709389PF  
PN100-1(4)  
CNTRST  
R/W  
OE  
Vcc  
L
CE1R  
CNTRST  
R/W  
GND  
OE  
FT/PIPE  
I/O17R  
GND  
I/O16R  
I/O15R  
I/O14R  
I/O13R  
I/O12R  
I/O11R  
R
L
R
L
100-Pin TQFP  
Top View(5)  
FT/PIPE  
L
R
I/O17L  
I/O16L  
GND  
I/O15L  
I/O14L  
I/O13L  
I/O12L  
I/O11L  
I/O10L  
R
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50  
4844 drw 02  
NOTES:  
1. All VCC pins must be connected to power supply.  
2. All GND pins must be connected to ground.  
3. Package body is approximately 14mm x 14mm x 1.4mm  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of the actual part-marking.  
2
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Pin Names  
Left Port  
Right Port  
Names  
Chip Enables  
CE0L, CE1L  
CE0R, CE1R  
R/WL  
R/WR  
Read/Write Enable  
Output Enable  
Address  
OEL  
OER  
A0L - A15L  
I/O0L - I/O17L  
CLKL  
A0R - A15R  
I/O0R - I/O17R  
CLKR  
Data Input/Output  
Clock  
Upper Byte Select  
Lower Byte Select  
Address Strobe  
Counter Enable  
Counter Reset  
Flow-Through/Pipeline  
Power  
UBL  
UBR  
LBL  
LBR  
ADSL  
ADSR  
CNTENL  
CNTRSTL  
FT/PIPEL  
CNTENR  
CNTRSTR  
FT/PIPER  
VCC  
GND  
Ground  
4844 tbl 01  
Truth Table I—Read/Write and Enable Control(1,2,3)  
Upper Byte  
I/O9-17  
Lower Byte  
I/O0-8  
CLK  
CE  
1
R/W  
X
X
X
L
Mode  
OE  
X
X
X
X
X
X
L
CE  
0
UB  
X
X
H
L
LB  
X
X
H
H
L
H
X
L
L
L
L
L
L
L
L
X
L
High-Z  
High-Z  
High-Z  
DATAIN  
High-Z  
DATAIN  
DATAOUT  
High-Z  
DATAOUT  
High-Z  
High-Z  
High-Z  
High-Z  
High-Z  
DATAIN  
DATAIN  
High-Z  
DATAOUT  
DATAOUT  
High-Z  
DeselectedPower Down  
DeselectedPower Down  
Both Bytes Deselected  
Write to Upper Byte Only  
Write to Lower Byte Only  
Write to Both Bytes  
H
H
H
H
H
H
H
H
H
L
L
L
L
L
H
L
H
H
H
X
Read Upper Byte Only  
Read Lower Byte Only  
Read Both Bytes  
L
H
L
L
L
H
X
L
L
Outputs Disabled  
4844 tbl 02  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Don't Care.  
2. ADS, CNTEN, CNTRST = X.  
3. OE is an asynchronous input signal.  
6.342  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Truth Table II—Address Counter Control(1,2,6)  
Previous  
Address  
Addr  
Used  
Mode  
(3)  
Address  
CLK  
I/O  
ADS  
CNTEN CNTRST  
X
An  
An  
X
X
X
0
An  
X
X
X
H
L
H
H
H
D
I/O(0)  
I/O(n)  
I/O(p)  
I/O(p+1)  
Counter Reset to Address 0  
(4)  
L
D
External Address Utilized  
Ap  
Ap  
Ap  
H
H
D
External Address BlockedCounter Disabled (Ap reused)  
(5)  
Ap + 1  
L
D
Counter EnableInternal Address Generation  
4844 tbl 03  
NOTES:  
1. "H" = VIH, "L" = VIL, "X" = Don't Care.  
2. CE0, LB, UB, and OE = VIL; CE1 and R/W = VIH.  
3. Outputs configured in Flow-Through Output mode: if outputs are in Pipelined mode the data out will be delayed by one cycle.  
4. ADS is independent of all other signals including CE0, CE1, UB and LB.  
5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0, CE1, UB and LB.  
6. While an external address is being loaded (ADS = VIL), R/W = VIH is recommended to ensure data is not written arbitrarily.  
Recommended Operating  
Recommended DC Operating  
Temperature and Supply Voltage Conditions  
Symbol  
Parameter  
Supply Voltage  
GND Ground  
Min.  
4.5  
Typ. Max. Unit  
Grade  
Ambient  
GND  
Vcc  
Temperature(2)  
VCC  
5.0  
5.5  
0
V
V
V
Commercial  
0OC to +70OC  
0V  
0V  
5.0V  
5.0V  
+
+
10%  
0
0
Industrial  
-40OC to +85OC  
10%  
____  
V
IH  
Input High Voltage  
Input Low Voltage  
2.2  
6.0(1)  
0.8  
4844 tbl 04  
NOTES:  
____  
VIL  
-0.5(2)  
V
1. This is the parameter TA. This is the "instant on" case temperature.  
4844 tbl 05  
NOTES:  
1. VTERM must not exceed Vcc + 10%.  
2. VIL > -1.5V for pulse width less than 10ns.  
Absolute Maximum Ratings(1)  
Capacitance(1)  
(TA = +25°C, f = 1.0MHz)  
Symbol  
Rating  
Commercial  
& Industrial  
Unit  
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions(2)  
IN = 3dV  
OUT = 3dV  
Max. Unit  
(2)  
V
TERM  
Terminal Voltage  
with Respect  
to GND  
-0.5 to +7.0  
V
CIN  
V
9
pF  
(3)  
OUT  
C
V
10  
pF  
4844 tbl 07  
Temperature  
Under Bias  
-55 to +125  
-65 to +150  
50  
oC  
oC  
T
BIAS  
NOTES:  
1. These parameters are determined by device characterization, but are not  
production tested.  
2. 3dV references the interpolated capacitance when the input and output switch from  
0V to 3V or from 3V to 0V.  
Storage  
Temperature  
TSTG  
3. COUT also references CI/O.  
DC Output  
Current  
mA  
IOUT  
4844 tbl 06  
NOTES:  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operationofthe device atthese oranyotherconditions above those indicatedinthe  
operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
2. VTERM must not exceed Vcc + 10% for more than 25% of the cycle time or 10ns  
maximum, and is limited to < 20mA for the period of VTERM > Vcc + 10%.  
4
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature Supply Voltage Range (VCC = 5.0V ± 10%)  
709389L  
Symbol  
|ILI  
|ILO  
Parameter  
Test Conditions  
VCC = 5.5V, VIN = 0V to VCC  
Min.  
Max.  
5
Unit  
µA  
µA  
V
(1)  
___  
___  
___  
|
Input Leakage Current  
|
Output Leakage Current  
Output Low Voltage  
Output High Voltage  
5
CE  
OL = +4mA  
OH = -4mA  
0
= VIH or CE  
1
= VIL, VOUT = 0V to VCC  
VOL  
I
0.4  
___  
VOH  
I
2.4  
V
4844 tbl 08  
NOTE:  
1. At Vcc < 2.0V input leakages are undefined.  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(3) (VCC = 5V ± 10%)  
709389L7  
709389L9  
709389L12  
Com'l Only  
Com'l Only  
Com'l  
& Ind  
Symbol  
Parameter  
Test Condition  
= VIL  
Version  
COM'L  
Typ.(4)  
Max.  
Typ.(4)  
Max.  
400  
430  
135  
160  
275  
295  
Typ.(4)  
Max.  
Unit  
mA  
ICC  
Dynamic Operating  
Current  
(Both Ports Active)  
L
L
L
L
L
L
275  
465  
250  
300  
80  
230  
355  
CE  
L
and CE  
R
Outputs Disabled  
(1)  
____  
____  
____  
____  
IND  
f = fMAX  
mA  
mA  
ISB1  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
COM'L  
IND  
95  
150  
70  
110  
CEL  
= CER = VIH  
(1)  
f = fMAX  
____  
____  
____  
____  
95  
ISB2  
Standby Current  
(One Port - TTL  
Level Inputs)  
COM'L  
IND  
200  
295  
175  
195  
150  
240  
CE"A" = VIL and  
(3)  
CE"B" = VIH  
____  
____  
____  
____  
Active Port Outputs  
Disabled, f=fMAX  
(1)  
mA  
mA  
I
SB3  
Full Standby Current  
(Both Ports -  
Both Ports CE  
CE > VCC - 0.2V  
IN > VCC - 0.2V or  
IN < 0.2V, f = 0(2)  
R and  
COM'L  
IND  
L
L
0.5  
3.0  
0.5  
0.5  
3.0  
6.0  
0.5  
3.0  
L
____  
____  
____  
____  
CMOS Level Inputs)  
V
V
ISB4  
Full Standby Current  
(One Port -  
CMOS Level Inputs)  
COM'L  
IND  
L
L
190  
290  
170  
190  
270  
290  
140  
225  
CE"A" < 0.2V and  
(5)  
CE"B" > VCC - 0.2V  
IN > VCC - 0.2V or  
IN < 0.2V, Active Port  
Outputs Disabled, f = fMAX  
____  
____  
____  
____  
V
V
(1)  
4844 tbl 09  
NOTES:  
1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of  
GND to 3V.  
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.  
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".  
4. Vcc = 5V, TA = 25°C for Typ, and are not production tested. ICC DC(f=0) = 150mA (Typ).  
5. CEX = VIL means CE0X = VIL and CE1X = VIH  
CEX = VIH means CE0X = VIH or CE1X = VIL  
CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V  
CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X < 0.2V  
"X" represents "L" for left port or "R" for right port.  
6.542  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
3ns Max.  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
1.5V  
1.5V  
Figures 1,2 and 3  
4844 tbl 10  
5V  
5V  
893  
893Ω  
DATAOUT  
DATAOUT  
30pF  
347Ω  
5pF*  
347Ω  
4844 drw 04  
4844 drw 05  
Figure 1. AC Output Test load.  
Figure 2. Output Test Load  
(For tCKLZ, tCKHZ, tOLZ, and tOHZ).  
*Including scope and jig.  
8
7
6
5
- 10pF is the I/O capacitance  
of this device, and 30pF is the  
AC Test Load Capacitance  
tCD  
tCD  
(Typical, ns)  
1
,
4
3
2
1
2
0
20 40 60 80 100 120 140 160 180 200  
Capacitance (pF)  
-1  
4844 drw 06  
Figure 3. Typical Output Derating (Lumped Capacitive Load).  
6
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the Operating Temperature Range  
(Read and Write Cycle Timing)(3) (VCC = 5V ± 10%, TA = 0°C to +70°C)  
709389L7  
709389L9  
Com'l  
709389L12  
Com'l Only  
Com'l Only  
& Ind  
Symbol  
Parameter  
Min.  
Max.  
Min.  
25  
15  
12  
12  
6
Max.  
Min.  
Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
(2)  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
CYC1  
CYC2  
CH1  
CL1  
CH2  
CL2  
Clock Cycle Time (Flow-Through)  
Clock Cycle Time (Pipelined)(2)  
22  
12  
7.5  
7.5  
5
30  
20  
12  
12  
8
t
(2)  
t
Clock High Time (Flow-Through)  
(2)  
t
Clock Low Time (Flow-Through)  
Clock High Time (Pipelined)(2)  
t
(2)  
t
Clock Low Time (Pipelined)  
5
6
8
____  
____  
____  
tR  
Clock Rise Time  
3
3
3
____  
____  
____  
tF  
Clock Fall Time  
3
3
3
____  
____  
____  
t
SA  
HA  
SC  
HC  
SB  
HB  
SW  
HW  
SD  
HD  
SAD  
HAD  
SCN  
HCN  
SRST  
HRST  
OE  
OLZ  
OHZ  
CD1  
CD2  
DC  
CKHZ  
CKLZ  
Address Setup Time  
Address Hold Time  
Chip Enable Setup Time  
Chip Enable Hold Time  
Byte Enable Setup Time  
Byte Enable Hold Time  
R/W Setup Time  
4
0
4
0
4
0
4
0
4
0
4
0
4
0
4
4
1
4
1
4
1
4
1
4
1
4
1
4
1
4
4
1
4
1
4
1
4
1
4
1
4
1
4
1
4
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
t
t
t
t
t
t
R/W Hold Time  
t
Input Data Setup Time  
Input Data Hold Time  
t
t
ADS Setup Time  
t
ADS Hold Time  
t
CNTEN Setup Time  
CNTEN Hold Time  
CNTRST Setup Time  
CNTRST Hold Time  
Output Enable to Data Valid  
t
t
t
0
1
1
____  
____  
____  
t
9
12  
12  
(1)  
____  
____  
____  
t
Output Enable to Output Low-Z  
2
2
2
(1)  
t
Output Enable to Output High-Z  
1
7
1
7
1
7
(2)  
____  
____  
____  
t
Clock to Data Valid (Flow-Through)  
18  
20  
25  
(2)  
____  
____  
____  
t
Clock to Data Valid (Pipelined)  
7.5  
9
12  
____  
____  
____  
t
Data Output Hold After Clock High  
2
2
2
2
2
2
2
2
2
(1)  
t
Clock High to Output High-Z  
9
9
9
(1)  
____  
____  
____  
t
Clock High to Output Low-Z  
Port-to-Port Delay  
Write Port Clock High to Read Data Delay  
Clock-to-Clock Setup Time  
____  
____  
____  
____  
____  
____  
t
CWDD  
28  
10  
35  
15  
40  
15  
ns  
tCCS  
ns  
4844 tbl 11  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characteriza-  
tion, but is not production tested.  
2. The Pipelined output parameters (tCYC2, tCD2) to either the Left or Right ports when FT/PIPE = VIH. Flow-Through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for  
that port.  
3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE), FT/PIPER and FT/PIPEL.  
6.742  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Read Cycle for  
Flow-Through Output (FT/PIPE"X" = VIL)(3,7)  
t
CYC1  
tCH1  
tCL1  
CLK  
CE  
0
tSC  
tHC  
tSC  
tHC  
(4)  
CE1  
t
SB  
tHB  
UB, LB  
R/W  
tHB  
tSB  
t
HW  
HA  
t
SW  
t
SA  
t
ADDRESS(5)  
DATAOUT  
An  
An + 1  
An + 2  
An + 3  
(1)  
tDC  
tCD1  
tCKHZ  
Qn  
Qn + 1  
Qn + 2  
(1)  
(1)  
t
CKLZ  
tDC  
(1)  
tOHZ  
t
OLZ  
OE(2)  
t
OE  
4844 drw 07  
Timing Waveform of Read Cycle for Pipelined Operation  
(FT/PIPE"X" = VIH)(3,7)  
t
CYC2  
tCH2  
tCL2  
CLK  
CE  
0
t
SC  
tHC  
t
SC  
t
HC  
HB  
(4)  
CE1  
t
SB  
tHB  
t
t
SB  
(6)  
UB, LB  
R/W  
tHW  
tSW  
tSA  
tHA  
ADDRESS(5)  
DATAOUT  
An  
An + 1  
An + 2  
Qn  
An + 3  
(1 Latency)  
tDC  
tCD2  
Qn + 1  
Qn + 2 (6)  
(1)  
tCKLZ  
(1)  
(1)  
t
OHZ  
tOLZ  
OE(2)  
tOE  
4844 drw 08  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge.  
3. ADS = VIL, CNTEN and CNTRST = VIH.  
4. The output is disabled (High-Impedance state) by CE0 = VIH, CE1 = VIL, UB = VIH, or LB = VIH following the next rising edge of the clock. Refer to Truth Table 1.  
5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers  
are for reference use only.  
6. If UB or LB was HIGH, then the Upper Byte and/or Lower Byte of DATAOUT for Qn + 2 would be disabled (High-Impedance state).  
7. "X" here denotes Left or Right port. The diagram is with respect to that port.  
8
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of a Bank Select Pipelined Read(1,2)  
t
CYC2  
tCH2  
tCL2  
CLK  
ADDRESS(B1)  
CE0(B1)  
t
SA  
tHA  
A6  
A5  
A4  
A3  
A
2
A
0
A1  
tSC  
tHC  
t
SC  
tHC  
(3)  
CKHZ  
tCD2  
tCD2  
t
tCD2  
Q
0
Q3  
Q
1
DATAOUT(B1)  
ADDRESS(B2)  
(3)  
(3)  
tDC  
tCKLZ  
t
DC  
t
CKHZ  
tSA  
tHA  
A6  
A5  
A4  
A3  
A2  
A
0
A1  
t
SC  
tHC  
CE0(B2)  
tSC  
tHC  
(3)  
t
CD2  
tCKHZ  
t
CD2  
(3)  
DATAOUT(B2)  
Q4  
Q2  
(3)  
t
CKLZ  
tCKLZ  
4844 drw 09  
Timing Waveform of Write with Port-to-Port Flow-Through Read(4,5,7)  
CLK "A"  
tSW  
tHW  
R/W "A"  
ADDRESS "A"  
DATAIN "A"  
CLK "B"  
t
SA  
MATCH  
SD HD  
VALID  
tHA  
NO  
MATCH  
t
t
(6)  
tCCS  
t
CD1  
R/W "B"  
tHW  
t
SW  
t
HA  
t
SA  
NO  
MATCH  
ADDRESS "B"  
DATAOUT "B"  
MATCH  
(6)  
t
CD1  
tCWDD  
VALID  
VALID  
tDC  
t
DC  
4844 drw 10  
NOTES:  
1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT709389 for this waveform, and are setup for depth expansion in this example.  
ADDRESS(B1) = ADDRESS(B2) in this situation.  
2. UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and CNTRST = VIH.  
3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
4. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH.  
5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.  
6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD.  
If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case.  
7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite from Port "A".  
6.942  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3)  
tCYC2  
tCH2  
tCL2  
CLK  
CE0  
tSC  
tHC  
CE1  
tSB  
tHB  
UB, LB  
R/W  
tSW tHW  
tSW tHW  
(4)  
An + 3  
An + 4  
An  
An +1  
An + 2  
An + 2  
ADDRESS  
tSA  
tHA  
t
SD  
t
HD  
DATAIN  
Dn + 2  
(1)  
(1)  
tCKLZ  
t
CD2  
tCD2  
(2)  
tCKHZ  
Qn + 3  
Qn  
DATAOUT  
READ  
NOP(5)  
WRITE  
READ  
.
4844 drw 11  
Timing Waveforn of Pipelined Read-to-Write-to-Read (OE Controlled)(3)  
tCYC2  
tCH2  
tCL2  
CLK  
CE0  
tSC  
tHC  
CE1  
t
SB  
tHB  
UB, LB  
R/W  
tSW tHW  
tSW tHW  
(4)  
An + 4  
An  
An +1  
An + 2  
An + 3  
Dn + 3  
An + 5  
ADDRESS  
t
SA  
tHA  
t
SD  
t
HD  
DATAIN  
Dn + 2  
(1)  
CKLZ  
t
CD2  
t
CD2  
t
(2)  
Qn  
Qn + 4  
DATAOUT  
(1)  
t
OHZ  
OE  
.
READ  
WRITE  
READ  
4844 drw 12  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
3. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation".  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.  
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.  
10  
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(3)  
t
CYC1  
tCH1  
tCL1  
CLK  
CE0  
tSC  
tHC  
CE1  
tSB  
tHB  
UB, LB  
R/W  
tSW tHW  
tSW tHW  
ADDRESS(4)  
An + 4  
An  
An + 3  
An +1  
An + 2  
Qn + 1  
An + 2  
tSA  
tHA  
t
SD tHD  
DATAIN  
Dn + 2  
tCD1  
tCD1  
tCD1  
t
CD1  
(2)  
Qn + 3  
Qn  
READ  
DATAOUT  
(1)  
CKLZ  
(1)  
t
DC  
tDC  
t
t
CKHZ  
NOP(5)  
READ  
WRITE  
4844 drw 13  
TimingWaveformofFlow-ThroughRead-to-Write-to-Read(OEControlled)(3)  
tCYC1  
tCH1  
tCL1  
CLK  
CE0  
tSC  
tHC  
CE1  
t
SB  
tHB  
UB, LB  
R/W  
t
SW tHW  
t
SW tHW  
(4)  
An + 5  
An  
tHA  
An +1  
An + 2  
An + 3  
Dn + 3  
An + 4  
ADDRESS  
tSA  
t
SD tHD  
DATAIN  
Dn + 2  
t
OE  
CD1  
tDC  
tCD1  
tCD1  
t
(2)  
Qn + 4  
Qn  
DATAOUT  
(1)  
CKLZ  
(1)  
t
tOHZ  
tDC  
OE  
READ  
WRITE  
READ  
4844 drw 14  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. Output state (High, Low, or High-impedance is determined by the previous cycle control signals.  
3. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and CNTRST = VIH. "NOP" is "No Operation".  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.  
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.  
61.412  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Pipelined Read with Address Counter Advance(1)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA  
tHA  
An  
ADDRESS  
tSAD tHAD  
ADS  
tSAD tHAD  
CNTEN  
tSCN tHCN  
tCD2  
Qn + 2(2)  
Qx - 1(2)  
Qx  
Qn + 3  
Qn + 1  
Qn  
DATAOUT  
tDC  
READ  
EXTERNAL  
ADDRESS  
READ  
WITH  
COUNTER  
COUNTER  
HOLD  
READ WITH COUNTER  
4844 drw 15  
TimingWaveformof Flow-ThroughReadwithAddressCounterAdvance(1)  
t
CYC1  
tCH1  
tCL1  
CLK  
tSA  
tHA  
An  
ADDRESS  
t
SAD tHAD  
ADS  
t
SAD  
tHAD  
tSCN  
tHCN  
CNTEN  
t
CD1  
Qn + 3(2)  
Qx(2)  
Qn + 4  
Qn + 1  
Qn + 2  
Qn  
DATAOUT  
t
DC  
READ  
READ  
EXTERNAL  
ADDRESS  
READ WITH COUNTER  
COUNTER  
HOLD  
WITH  
COUNTER  
4844 drw 16  
NOTES:  
1. CE0, OE, UB, and LB = VIL; CE1, R/W, and CNTRST = VIH.  
2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output  
remains constant for subsequent clocks.  
12  
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Timing Waveform of Write with Address Counter Advance  
(Flow-Through or Pipelined Outputs)(1)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA  
tHA  
An  
ADDRESS  
INTERNAL(3)  
ADDRESS  
An(7)  
An + 4  
An + 2  
An + 1  
An + 3  
t
SAD tHAD  
ADS  
CNTEN  
tSD tHD  
Dn + 4  
Dn + 1  
Dn + 3  
Dn  
Dn + 1  
Dn + 2  
DATAIN  
WRITE  
EXTERNAL  
ADDRESS  
WRITE  
WITH COUNTER  
WRITE  
COUNTER HOLD  
WRITE WITH COUNTER  
4844 drw 17  
Timing Waveform of Counter Reset (Pipelined Outputs)(2)  
t
CYC2  
tCH2  
tCL2  
CLK  
tSA tHA  
ADDRESS(4)  
An + 2  
An  
An + 1  
INTERNAL(3)  
ADDRESS  
Ax(6)  
0
An + 1  
1
An  
tSW tHW  
R/W  
ADS  
CNTEN  
tSRST  
tHRST  
CNTRST  
t
SD  
tHD  
D0  
DATAIN  
(5)  
Qn  
Q1  
Q0  
DATAOUT  
.
COUNTER(6)  
RESET  
WRITE  
READ  
READ  
READ  
READ  
ADDRESS 0  
ADDRESS 0  
ADDRESS n ADDRESS n+1  
ADDRESS 1  
4844 drw 18  
NOTES:  
1. CE0, UB, LB, and R/W = VIL; CE1 and CNTRST = VIH.  
CE0, UB, LB = VIL; CE1 = VIH.  
2.  
3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH.  
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.  
5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.  
6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle.  
7. CNTEN = VIL advances Internal Address from An’ to An +1. The transition shown indicates the time required for the counter to advance. The An +1Address is written  
to during this cycle.  
61.432  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Depth and Width Expansion  
A Functional Description  
The IDT709389 features dual chip enables (refer to Truth Table I)  
in order to facilitate rapid and simple depth expansion with no  
requirements for external logic. Figure 4 illustrates how to control the  
various chip enables in order to expand two devices in depth.  
The 709389 can also be used in applications requiring expanded  
width, as indicated in Figure 4. Since the banks are allocated at the  
discretion of the user, the external controller can be set up to drive the  
input signals for the various devices as required to allow for 36-bit  
or wider applications.  
The IDT709389 provides a true synchronous Dual-Port Static  
RAM interface. Registered inputs provide minimal set-up and hold  
times on address, data, and all critical control inputs. All internal  
registers are clocked on the rising edge of the clock signal, however,  
the self-timed internal write pulse is independent of the LOW to HIGH  
transition of the clock signal.  
An asynchronous output enable is provided to ease asynchronous  
bus interfacing. Counter enable inputs are also provided to stall the  
operation of the address counters for fast interleaved memory appli-  
cations.  
CE0 = VIH or CE1 = VIL for one clock cycle will power down the  
internal circuitry to reduce static power consumption. Multiple chip  
enables allow easier banking of multiple IDT709389's for depth  
expansion configurations. When the Pipelined output mode is en-  
abled, two cycles are required with CE0 = VIL and CE1 = VIH to re-  
activate the outputs.  
A16  
IDT709389  
IDT709389  
CE0  
CE0  
CE1  
CE1  
VCC  
VCC  
Control Inputs  
Control Inputs  
IDT709389  
IDT709389  
CE1  
CE1  
CE0  
CE0  
CNTRST  
CLK  
Control Inputs  
Control Inputs  
ADS  
CNTEN  
R/W  
4844 drw 19  
UB, LB  
OE  
Figure 4. Depth and Width Expansion with IDT709389  
14  
6.42  
IDT709389L  
High-Speed 64K x 18 Synchronous Pipelined Dual-Port Static RAM  
Industrial and Commercial Temperature Ranges  
Ordering Information  
IDT XXXXX  
A
99  
A
A
Device  
Type  
Power Speed  
Package  
Process/  
Temperature  
Range  
Blank  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
(1)  
I
PF  
100-pin TQFP (PN100-1)  
7
9
Commercial Only  
Commercial & Industrial  
Commercial Only  
Speed in nanoseconds  
12  
L
Low Power  
709389 1152K (64K x 18-Bit) Synchronous Dual-Port RAM  
4844 drw 20  
NOTE:  
1. Industrial temperature range is available.  
For specific speeds, packages and powers contact your sales office.  
DatasheetDocumentHistory  
9/30/99:  
11/10/99:  
12/22/99:  
1/10/01:  
InitialPublicRelease  
Replaced IDT logo  
Page 1 Addedmissingdiamond  
Page 4 ChangedinformationinTruthTableII  
Increasedstoragetemperatureparameter  
ClarifiedTAparameter  
Page 5 DCElectricalparameters–changedwordingfrom"open"to"disabled"  
Changed±200mVto0mVinnotes  
RemovedPreliminarystatus  
10/18/01:  
Page 2 Addeddate revisionforpinconfiguration  
Page 5& 7 AddedIndustrialtemptocolumnheadingandvalues for9ns speedtoDC&ACElectricalCharacteristics  
Page 15 AddedIndustrialtempofferingto9nsorderinginformation  
Page4,5& 7 RemovedIndustrialtempfootnotefromalltables  
Page 1 & 15 Replace TM logo with ® logo  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-284-2794  
DualPortHelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
61.452  

相关型号:

IDT709389L7PF

x18 Dual-Port SRAM
ETC

IDT709389L7PF9

Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
IDT

IDT709389L7PFG

Dual-Port SRAM, 64KX18, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
IDT

IDT709389L9PF

x18 Dual-Port SRAM
ETC

IDT709389L9PF8

Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
IDT

IDT709389L9PF9

Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
IDT

IDT709389L9PFG

Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
IDT

IDT709389L9PFGI

Dual-Port SRAM, 64KX18, 20ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
IDT

IDT7099S

HIGH-SPEED 4K x 9 SYNCHRONOUS DUAL-PORT RAM
IDT

IDT7099S15G

HIGH-SPEED 4K x 9 SYNCHRONOUS DUAL-PORT RAM
IDT

IDT7099S15GB

HIGH-SPEED 4K x 9 SYNCHRONOUS DUAL-PORT RAM
IDT

IDT7099S15J

HIGH-SPEED 4K x 9 SYNCHRONOUS DUAL-PORT RAM
IDT