IDT7134LA70L48BG [IDT]

Dual-Port SRAM, 4KX8, 70ns, CQCC48, LCC-48;
IDT7134LA70L48BG
型号: IDT7134LA70L48BG
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Dual-Port SRAM, 4KX8, 70ns, CQCC48, LCC-48

静态存储器
文件: 总12页 (文件大小:120K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HIGH-SPEED  
IDT7134SA/LA  
4K x 8 DUAL-PORT  
STATIC SRAM  
Š
Features  
Fully asynchronous operation from either port  
High-speed access  
Battery backup operation—2V data retention (LA only)  
TTL-compatible; single 5V (±10%) power supply  
Available in 48-pin DIP, LCC, Flatpack and 52-pin PLCC  
Military product compliant to MIL-PRF-38535 QML  
Industrial temperature range (–40°C to +85°C) is available for  
selected speeds  
– Military:35/45/55/70ns(max.)  
– Industrial: 25/55ns(max.)  
– Commercial: 20/25/35/45/55/70ns (max.)  
Low-power operation  
– IDT7134SA  
Active: 700mW (typ.)  
Standby: 5mW (typ.)  
– IDT7134LA  
Green parts available, see ordering information  
Active: 700mW (typ.)  
Standby: 1mW (typ.)  
Functional Block Diagram  
R/W  
L
R/W  
R
R
CE  
CEL  
OEL  
OER  
I/O  
CONTROL  
I/O  
CONTROL  
I/O0L- I/O7L  
I/O0R- I/O7R  
ADDRESS  
DECODER  
ADDRESS  
DECODER  
MEMORY  
ARRAY  
A0L- A11L  
A0R- A11R  
2720 drw 01  
FEBRUARY 2013  
1
©2012IntegratedDeviceTechnology,Inc.  
DSC-2720/14  
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Description  
The IDT7134 is a high-speed 4K x 8 Dual-Port Static RAM controlledbyCE,permitstheon-chipcircuitryofeachporttoenteravery  
designedtobeusedinsystemswhereon-chiphardwareportarbitration low standby power mode.  
is not needed. This part lends itself to those systems which cannot  
FabricatedusingCMOShigh-performancetechnology,theseDual-  
tolerate wait states or are designed to be able to externally arbitrate or Ports typically operate on only 700mW of power. Low-power (LA)  
withstand contention when both sides simultaneously access the versions offer battery backup data retention capability, with each port  
same Dual-Port RAM location.  
typically consuming 200µW from a 2V battery.  
TheIDT7134providestwoindependentportswithseparatecontrol,  
The IDT7134 is packaged on either a sidebraze or plastic 48-pin  
address, and I/O pins that permit independent, asynchronous access DIP, 48-pin LCC, 52-pin PLCC and 48-pin Flatpack. Military grade  
forreadsorwritestoanylocationinmemory.Itistheuser’sresponsibility product is manufactured in compliance with MIL-PRF-38535 QML,  
to ensure data integrity when simultaneously accessing the same makingitideallysuitedtomilitarytemperatureapplicationsdemandingthe  
memory location from both ports. An automatic power down feature, highestlevelofperformanceandreliability.  
Pin Configurations(1,2,3)  
INDEX  
CE  
L
L
CC  
V
1
2
3
4
5
6
7
8
9
10  
48  
47  
7
6
5
4
3
2
52 51 50 49 48 47  
CE  
R
R
R/W  
1
8
46  
A
1L  
OER  
46 R/W  
A
A1110LL  
45  
44  
43  
42  
A
11R  
9
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
A
A
2L  
3L  
A
A
A
A
A
A
A
A
A
A
0R  
OE  
L
A10R  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
1R  
2R  
3R  
4R  
5R  
6R  
7R  
8R  
9R  
A
0L  
OER  
A
4L  
5L  
A
1L  
A
0R  
1R  
2R  
3R  
4R  
5R  
6R  
7R  
8R  
9R  
A
2L  
3L  
IDT7134P or C 41  
A
A
(4)  
A
P48-1  
&
40  
39  
38  
37  
36  
35  
34  
33  
A
IDT7134J  
J52-1(4)  
A6L  
A7L  
A8L  
A9L  
A
4L  
A
(4)  
C48-2  
A
5L 11  
A
52-Pin PLCC  
Top View(5)  
A
6L  
7L  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
A
48-Pin  
Top  
A
A
(5)  
View  
A8L  
A
I/O0L  
I/O1L  
I/O2L  
I/O3L  
A
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
9L  
0L  
1L  
2L  
3L  
4L  
5L  
6L  
7L  
A
A
32 I/O7R  
31 I/O6R  
30 I/O5R  
29 I/O4R  
28 I/O3R  
27 I/O2R  
26 I/O1R  
25 I/O0R  
N/C  
I/O7R  
21 22 23 24 25 26 27 28 29 30 31 32 33  
2720 drw 03  
GND 24  
,
2720 drw 02  
INDEX  
6
5
4
3
2
48 47 46 45 44 43  
1
42  
A
1L  
7
8
9
A
A
A
A
A
A
A
A
A
A
0R  
1R  
2R  
3R  
4R  
5R  
6R  
7R  
8R  
9R  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
A
2L  
3L  
A
A4L  
10  
IDT7134L48 or F  
L48-1(4)  
&
A
5L  
11  
12  
13  
14  
15  
16  
17  
18  
A
6L  
7L  
F48-1(4)  
A
48-Pin LCC/Flatpack  
Top View(5)  
A
A
8L  
9L  
NOTES:  
1. All VCC pins must be connected to the power supply.  
2. All GND pins must be connected to the ground supply.  
I/O0L  
I/O1L  
I/O2L  
,
I/O7R  
I/O6R  
3. P48-1 package body is approximately .55 in x 2.43 in x .18 in.  
C48-2 package body is approximately .62 in x 2.43 in x .15 in.  
J52-1 package body is approximately .75 in x .75 in x .17 in.  
L48-1 package body is approximately .57 in x .57 in x .68 in.  
F48-1 package body is approxiamtely .75 in x .75 in x .11 in.  
4. This package code is used to reference the package diagram.  
5. This text does not indicate orientation of actual part-marking.  
19 20 21 22 23 24 25 26 27 28 29 30  
2720 drw 04  
2
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Absolute Maximum Ratings(1)  
Recommended Operating  
TemperatureandSupplyVoltage(1,2)  
Symbol  
Rating  
Commercial  
& Industrial  
Military  
Unit  
Grade  
Ambient  
Temperature  
GND  
Vcc  
(2)  
V
TE RM  
Terminal Voltage  
with Respect  
to GND  
-0.5 to +7.0  
-0.5 to +7.0  
V
Military  
-55OC to +125OC  
0OC to +70OC  
0V  
0V  
0V  
5.0V  
+
+
+
10%  
T
BIAS  
Temperature  
Under Bias  
-55 to +125  
-65 to +150  
1.5  
-65 to +135  
-65 to +150  
1.5  
oC  
oC  
W
Commercial  
Industrial  
5.0V  
5.0V  
10%  
-40OC to +85OC  
10%  
TSTG  
Storage  
Temperature  
2720 tbl 03  
NOTES:  
(3)  
1. This is the parameter TA. This is the "instant on" case temperature.  
P
T
Power  
Dissipation  
DC Output  
Current  
50  
50  
mA  
IOUT  
2720 tbl 01  
NOTES:  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may  
cause permanent damage to the device. This is a stress rating only and functional  
operation of the device at these or any other conditions above those indicated in the  
operational sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect reliability.  
2. VTERM must not exceed Vcc + 10% for more than 25%of the cycle time or 10 ns  
maximum, and is limited to < 20mA for the period of VTERM > Vcc +10%.  
3. VTERM = 5.5V.  
Recommended DC Operating  
Conditions  
Symbol  
Parameter  
Min.  
Typ.  
Max. Unit  
V
CC  
Supply Voltage  
4.5  
5.0  
5.5  
0
V
V
V
GND  
Ground  
0
0
____  
V
IH  
IL  
Input High Voltage  
Input Low Voltage  
2.2  
6.0(2)  
0.8  
____  
V
-0.5(1)  
V
Capacitance(1) (TA = +25°C, f = 1.0MHz)  
2720 tbl 04  
NOTES:  
Symbol  
Parameter  
Input Capacitance  
Output Capacitance  
Conditions(2 )  
IN = 3dV  
OUT = 3dV  
Max. Unit  
1. VIL (min.) > -1.5V for pulse width less than 10ns.  
2. VTERM must not exceed Vcc + 10%.  
CIN  
V
11  
11  
pF  
COUT  
V
pF  
2720 tbl 02  
NOTES:  
1. This parameter is determined by device characterization but is not production  
tested.  
2. 3dV references the interpolated capacitance when the input and output signals  
switch from 0V to 3V and from 3V to 0V.  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range (VCC = 5V ± 10%)  
7134SA  
7134LA  
Symbol  
Parameter  
Input Leakage Current(1)  
Output Leakage Current  
Output Low Voltage  
Test Conditions  
Min.  
Max.  
10  
Min.  
Max.  
Unit  
µA  
µA  
V
___  
___  
|ILI|  
V
CC = 5.5V, VIN = 0V to VCC  
5
5
___  
___  
___  
___  
___  
___  
|ILO  
|
10  
CE - VIH, VOUT = 0V to VCC  
OL = 6mA  
OL = 8mA  
OH = -4mA  
I
0.4  
0.4  
V
OL  
I
0.5  
0.5  
V
___  
___  
V
OH  
Output High Voltage  
I
2.4  
2.4  
V
2720 tbl 05  
NOTES:  
1. At Vcc < 2.0V input leakages are undefined.  
3
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
DC Electrical Characteristics Over the Operating  
Temperature and Supply Voltage Range(1,2) (VCC = 5.0V ± 10%)  
7134X20  
7134X25  
Com'l & Ind  
7134X35  
Com'l  
& Military  
Com'l Only  
Symbol  
Parameter  
Test Condition  
Version  
COM'L  
Typ.  
Max.  
Typ.  
Max.  
Typ.  
Max.  
Unit  
ICC  
Dynamic Operating  
Current  
(Both Ports Active)  
SA  
LA  
170  
170  
280  
240  
160  
160  
280  
220  
150  
150  
260  
210  
mA  
CE = VIL  
Outputs Disabled  
(3)  
f = fMAX  
____  
____  
____  
____  
MIL &  
IND  
SA  
LA  
160  
160  
310  
260  
150  
150  
300  
250  
I
SB1  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
COM'L  
SA  
LA  
25  
25  
100  
80  
25  
25  
80  
50  
25  
25  
75  
45  
mA  
mA  
mA  
mA  
CE  
L
and CER = VIH  
(3)  
f = fMAX  
____  
____  
____  
____  
MIL &  
IND  
SA  
LA  
25  
25  
100  
80  
25  
25  
75  
55  
ISB2  
Standby Current  
(One Port - TTL  
Level Inputs)  
COM'L  
SA  
LA  
105  
105  
180  
150  
95  
95  
180  
140  
85  
85  
170  
130  
CE"A" = VIL and CE"B" = VIH  
Active Port Outputs Disabled,  
(3)  
f=fMAX  
____  
____  
____  
____  
MIL &  
IND  
SA  
LA  
95  
95  
210  
170  
85  
85  
200  
160  
ISB3  
Full Standby Current  
(Both Ports -  
CMOS Level Inputs)  
Both Ports CE  
L and  
> VCC - 0.2V  
COM'L  
SA  
LA  
1.0  
0.2  
15  
4.5  
1.0  
0.2  
15  
4.0  
1.0  
0.2  
15  
4.0  
CE  
R
V
V
IN > VCC - 0.2V or  
IN < 0.2V, f = 0(3)  
MIL &  
IND  
SA  
LA  
1.0  
0.2  
30  
10  
1.0  
0.2  
30  
10  
____  
____  
____  
____  
ISB4  
Full Standby Current  
(One Port -  
CMOS Level Inputs)  
One Port CE"A" or  
CE"B" > VCC - 0.2V  
COM'L  
SA  
LA  
105  
105  
170  
130  
95  
95  
170  
120  
85  
85  
160  
110  
VIN > VCC - 0.2V or VIN < 0.2V  
____  
____  
____  
____  
MIL &  
IND  
SA  
LA  
95  
95  
210  
150  
85  
85  
190  
130  
Active Port Outputs Disabled,  
(3)  
f = fMAX  
2720 tbl 06a  
7134X45  
Com'l &  
Military  
7134X55  
Com'l, Ind  
& Military  
7134X70  
Com'l &  
Military  
Symbol  
Parameter  
Test Condition  
Version  
Typ.  
Max.  
Typ.  
Max.  
Typ.  
Max.  
Unit  
ICC  
Dynamic Operating  
Current  
(Both Ports Active)  
COM'L  
SA  
LA  
140  
140  
240  
200  
140  
140  
240  
200  
140  
140  
240  
200  
mA  
CE = VIL  
Outputs Disabled  
(3)  
f = fMAX  
MIL &  
IND  
SA  
LA  
140  
140  
280  
240  
140  
140  
270  
220  
140  
140  
270  
220  
I
SB1  
Standby Current  
(Both Ports - TTL  
Level Inputs)  
COM'L  
SA  
LA  
25  
25  
70  
40  
25  
25  
70  
40  
25  
25  
70  
40  
mA  
mA  
mA  
mA  
CE  
L
and CER = VIH  
(3)  
f = fMAX  
MIL &  
IND  
SA  
LA  
25  
25  
70  
50  
25  
25  
70  
50  
25  
25  
70  
50  
ISB2  
Standby Current  
(One Port - TTL  
Level Inputs)  
COM'L  
SA  
LA  
75  
75  
160  
130  
75  
75  
160  
130  
75  
75  
160  
130  
CE"A" = VIL and CE"B" = VIH  
Active Port Outputs Disabled,  
(3)  
f=fMAX  
MIL &  
IND  
SA  
LA  
75  
75  
190  
150  
75  
75  
180  
150  
75  
75  
180  
150  
ISB3  
Full Standby Current  
(Both Ports -  
CMOS Level Inputs)  
Both Ports CE  
> VCC - 0.2V  
IN > VCC - 0.2V or  
IN < 0.2V, f = 0(3)  
L and  
COM'L  
SA  
LA  
1.0  
0.2  
15  
4.0  
1.0  
0.2  
15  
4.0  
1.0  
0.2  
15  
4.0  
CE  
R
V
V
MIL &  
IND  
SA  
LA  
1.0  
0.2  
30  
10  
1.0  
0.2  
30  
10  
1.0  
0.2  
30  
10  
ISB4  
Full Standby Current  
(One Port -  
CMOS Level Inputs)  
One Port CE"A" or  
CE"B" > VCC - 0.2V  
COM'L  
SA  
LA  
75  
75  
150  
100  
75  
75  
150  
100  
75  
75  
150  
100  
VIN > VCC - 0.2V or VIN < 0.2V  
MIL &  
IND  
SA  
LA  
75  
75  
180  
120  
75  
75  
170  
120  
75  
75  
170  
120  
Active Port Outputs Disabled,  
(3)  
f = fMAX  
2720 tbl 06b  
NOTES:  
1. 'X' in part number indicates power rating (SA or LA).  
2. VCC = 5V, TA = +25°C for typical, and parameters are not production tested.  
3. fMAX = 1/tRC = All inputs cycling at f = 1/tRC (except Output Enable). f = 0 means no address or control lines change. Applies only to inputs at CMOS level standby ISB3.  
4
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Data Retention Characteristics Over All Temperature Ranges  
(LA Version Only) VLC = 0.2V, VHC = VCC - 0.2V  
Symbol  
Parameter  
CC for Data Retention  
Test Condition  
Min.  
Typ.(1)  
Max.  
Unit  
V
___  
___  
V
DR  
V
V
CC = 2V  
2.0  
___  
ICCDR  
Data Retention Current  
µA  
CE > VHC  
IN > VHC or < VLC  
MIL. & IND.  
100  
4000  
___  
V
COM'L.  
100  
1500  
(3)  
___  
___  
t
CDR  
Chip Deselect to Data Retention Time  
Operation Recovery Time  
0
ns  
(3)  
(2)  
___  
___  
tR  
t
RC  
ns  
2720 tbl 07  
NOTES:  
1. VCC = 2V, TA = +25°C, and are not production tested.  
2. tRC = Read Cycle Time.  
3. This parameter is guaranteed by device characterization, but not production tested.  
Data Retention Waveform  
DATA RETENTION MODE  
VCC  
4.5V  
4.5V  
VDR 2V  
tCDR  
tR  
VDR  
CE  
VIH  
VIH  
2720 drw 05  
AC Test Conditions  
Input Pulse Levels  
GND to 3.0V  
5ns  
Input Rise/Fall Times  
Input Timing Reference Levels  
Output Reference Levels  
Output Load  
1.5V  
1.5V  
Figures 1 and 2  
2720 tbl 08  
+5V  
+5V  
1250  
1250  
DATAOUT  
DATAOUT  
30pF  
775Ω  
775Ω  
5pF *  
,
,
2720 drw 06  
2720 drw 07  
Figure 1. AC Output Test Load  
Figure 2. Output Test Load  
(for tLZ, tHZ, tWZ, tOW)  
*Including scope and jig  
5
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
OperatingTemperatureandSupplyVoltage(3)  
7134X20  
Com'l Only  
7134X25  
Com'l & Ind  
7134X35  
Com'l  
& Military  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
READ CYCLE  
____  
____  
____  
t
RC  
AA  
ACE  
AOE  
OH  
LZ  
HZ  
PU  
PD  
Read Cycle Time  
20  
25  
35  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
t
Address Access Time  
20  
20  
25  
25  
35  
35  
____  
____  
____  
____  
____  
____  
t
Chip Enable Access Time  
t
Output Enable Access Time  
Output Hold from Address Change  
Output Low-Z Time (1,2)  
15  
15  
20  
____  
____  
____  
t
0
0
0
____  
____  
____  
t
0
0
0
Output High-Z Time(1,2)  
15  
15  
20  
____  
____  
____  
t
t
Chip Enable to Power Up Time(2)  
Chip Disable to Power Down Time(2)  
0
0
0
____  
____  
____  
____  
____  
____  
t
20  
25  
35  
ns  
2720 tbl 09a  
7134X45  
Com'l &  
Military  
7134X55  
Com'l, Ind  
& Military  
7134X70  
Com'l &  
Military  
Symbol  
READ CYCLE  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
____  
____  
____  
t
RC  
AA  
ACE  
AOE  
OH  
LZ  
HZ  
PU  
PD  
Read Cycle Time  
45  
55  
70  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
____  
____  
____  
t
Address Access Time  
45  
45  
55  
55  
70  
70  
____  
____  
____  
____  
____  
____  
t
Chip Enable Access Time  
Output Enable Access Time  
Output Hold from Address Change  
Output Low-Z Time(1,2)  
t
25  
30  
40  
____  
____  
____  
t
0
0
0
____  
____  
____  
t
5
5
5
Output High-Z Time(1,2)  
20  
25  
30  
____  
____  
____  
t
t
Chip Enable to Power Up Time (2)  
Chip Disable to Power Down Time(2)  
0
0
0
____  
____  
____  
____  
____  
____  
t
45  
50  
50  
ns  
2720 tbl 09b  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).  
2. This parameter is guaranteed by device characterization, but is not production tested.  
3. 'X' in part number indicates power rating (SA or LA).  
6
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Timing Waveform of Read Cycle No. 1, Either Side(1,2,4)  
tRC  
ADDRESS  
(5)  
tAA  
tOH  
tOH  
PREVIOUS DATA VALID  
DATA VALID  
DATAOUT  
2720 drw 08  
Timing Waveform of Read Cycle No. 2, Either Side(1,3)  
t
ACE  
CE  
(2)  
HZ  
(4)  
AOE  
t
t
OE  
(2)  
(1)  
LZ  
t
HZ  
t
VALID DATA(4)  
DATAOUT  
(1)  
LZ  
t
tPU  
tPD  
I
CC  
CURRENT  
50%  
50%  
I
SB  
2720 drw 09  
NOTES:  
1. Timing depends on which signal is asserted last, OE or CE.  
2. Timing depends on which signal is de-asserted first, OE or CE.  
3. R/W = VIH.  
4. Start of valid data depends on which timing becomes effective, tAOE, tACE or tAA  
5. tAA for RAM Address Access and tSAA for Semaphore Address Access.  
7
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
AC Electrical Characteristics Over the  
OperatingTemperatureandSupplyVoltage(5)  
7134X20  
7134X25  
Com'l & Ind  
7134X35  
Com'l  
& Military  
Com'l Only  
Symbol  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
WRITE CYCLE  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
EW  
AW  
AS  
WP  
WR  
DW  
HZ  
DH  
WZ  
OW  
WDD  
DDD  
Write Cycle Time  
20  
15  
15  
0
25  
20  
20  
0
35  
30  
30  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Enable to End-of-Write  
Address Valid to End-of-Write  
Address Set-up Time  
t
t
t
Write Pulse Width  
15  
0
20  
0
25  
0
t
Write Recovery Time  
t
Data Valid to End-of-Write  
Output High-Z Time(1,2)  
15  
15  
20  
____  
____  
____  
t
15  
15  
20  
t
Data Hold Time(3)  
0
0
3
____  
____  
____  
Write Enable to Output in High-Z(1,2)  
Output Active from End-of-Write(1,2,3)  
Write Pulse to Data Delay(4)  
Write Data Valid to Read Data Delay(4)  
15  
15  
20  
____  
____  
____  
t
____  
____  
____  
t
3
3
3
____  
____  
____  
t
40  
30  
50  
30  
60  
35  
____  
____  
____  
t
ns  
2720 tbl 10a  
7134X45  
Com'l &  
Military  
7134X55  
Com'l, Ind  
& Military  
7134X70  
Com'l &  
Military  
Symbol  
WRITE CYCLE  
Parameter  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
____  
t
WC  
EW  
AW  
AS  
WP  
WR  
DW  
HZ  
DH  
WZ  
OW  
WDD  
DDD  
Write Cycle Time  
45  
40  
40  
0
55  
50  
50  
0
70  
60  
60  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
t
Chip Enable to End-of-Write  
Address Valid to End-of-Write  
Address Set-up Time  
t
t
t
Write Pulse Width  
40  
0
50  
0
60  
0
t
Write Recovery Time  
t
Data Valid to End-of-Write  
Output High-Z Time(1,2)  
20  
25  
30  
____  
____  
____  
t
20  
25  
30  
t
Data Hold Time(3)  
3
3
3
____  
____  
____  
Write Enable to Output in High-Z(1,2)  
Output Active from End-of-Write(1,2,3)  
Write Pulse to Data Delay(4)  
Write Data Valid to Read Data Delay(4)  
20  
25  
30  
____  
____  
____  
t
____  
____  
____  
t
3
3
3
____  
____  
____  
t
70  
45  
80  
55  
90  
70  
____  
____  
____  
t
ns  
2720 tbl 10b  
NOTES:  
1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2).  
2. This parameter is guaranteed by device characterization, but is not production tested.  
3. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over voltage and  
temperature, the actual tDH will always be smaller than the actual tOW.  
4. Port-to-port delay through RAM cells from writing port to reading port, refer to “Timing Waveform of Write with Port-to-Port Read”.  
5. 'X' in part number indicates power rating (SA or LA).  
8
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Timing Waveform of Write with Port-to-Port Read(1,2,3)  
tWC  
ADDR "A"  
R/W "A"  
MATCH  
tWP  
tAW  
(1)  
tDW  
DATAIN "A"  
ADDR "B"  
VALID  
MATCH  
tWDD  
VALID  
DATAOUT "B"  
tDDD  
2720 drw 10  
NOTES:  
1. Write cycle parameters should be adhered to, in order to ensure proper writing.  
2. CEL = CER = VIL. OE"B" = VIL.  
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".  
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)  
tWC  
ADDRESS  
OE  
(6)  
tAS  
(3)  
t
WR  
tAW  
CE  
(7)  
(2)  
tHZ  
tWP  
R/W  
(7)  
(7)  
tWZ  
tHZ  
(7)  
t
LZ  
tOW  
(4)  
(4)  
DATAOUT  
tDH  
tDW  
DATAIN  
2720 drw 11  
NOTES:  
1. R/W or CE must be HIGH during all address transitions.  
2. A write occurs during the overlap (tEW or tWP) of a CE =VIL and R/W = VIL.  
3. tWR is measured from the earlier of CE or R/W going to VIH to the end-of-write cycle.  
4. During this period, the I/O pins are in the output state, and input signals must not be applied.  
5. If the CE = VIL transition occurs simultaneously with or after the R/W = VIL transition, the outputs remain in the High-impedance state.  
6. Timing depends on which enable signal (CE or R/W) is asserted last.  
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load  
(Figure 2).  
8. If OE = VIL during a R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off data to be placed on the bus  
for the required tDW. If OE = VIH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP.  
9
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,4)  
tWC  
ADDRESS  
CE  
tAW  
(5)  
(2)  
EW  
(3)  
tAS  
t
tWR  
R/W  
tDW  
tDH  
DATAIN  
2720 drw 12  
NOTES:  
1. R/W or CE must be HIGH during all address transitions.  
2. A write occurs during the overlap (tEW or tWP) of a CE =VIL and R/W = VIL.  
3. tWR is measured from the earlier of CE or R/W going HIGH to the end-of-write cycle.  
4. If the CE LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state.  
5. Timing depends on which enable signal (CE or R/W) is asserted last.  
Truth Table I – Read/Write Control  
Functional Description  
Left or Right Port(1)  
The IDT7134 provides two ports with separate control, address,  
and I/O pins that permit independent access for reads or writes to any  
location in memory. These devices have an automatic power down  
featurecontrolledbyCE.TheCEcontrolson-chippowerdowncircuitry  
that permits the respective port to go into standby mode when not  
selected (CE HIGH). When a port is enabled, access to the entire  
memory array is permitted. Each port has its own Output Enable  
control(OE).Inthereadmode,theport’s OEturnsontheoutputdrivers  
whensetLOW.Non-contentionREAD/WRITEconditionsareillustrated  
inTruth Table I.  
R/W  
D0-7  
Function  
CE  
OE  
X
H
X
Z
Z
Port Deselected and in Power-Down  
Mode, ISB2 or ISB4  
X
H
X
CE  
R
= CEL = H, Power Down  
Mode ISB1 or ISB3  
L
H
X
L
L
X
L
DATAIN  
Data on port written into memory  
DATAOUT Data in memory output on port  
High impedance outputs  
X
H
Z
2720 tbl 11  
NOTE:  
1. A0L - A11L A0R - A11R  
"H" = VIH, "L" = VIL, "X" = Don’t Care, and "Z" = High Impedance  
10  
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Ordering Information  
A
XXXX  
A
999  
A
A
A
Device  
Type  
Power Speed Package  
Process/  
Temperature  
Range  
Tube or Tray  
Tape and Reel  
Blank  
8
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
Military (-55°C to +125°C)  
Blank  
I(1)  
B
Compliant to MIL-PRF-38535 QML  
(2)  
G
Green  
P(3)  
C
48-pin Plastic DIP (P48-1)  
48-pin Ceramic DIP (C48-2)  
52-pin PLCC (J52-1)  
J
L48  
F
48-pin LCC (L48-1)  
48-pin Ceramic Flatpack (F48-1)  
Commercial Only  
20  
25  
35  
45  
55  
70  
Commercial & Industrial  
Commercial & Military  
Speed in nanoseconds  
Commercial & Military  
Commercial, Industrial & Military  
Commercial & Military  
LA  
SA  
Low Power  
Standard Power  
32K (4K x 8-Bit) Dual-Port RAM  
7134  
2720 drw 13  
NOTES:  
1. Contact your local sales office for industrial temp. range for other speeds, packages and powers.  
2. Green parts available. For specific speeds, packages and powers contact your local sales office.  
3. For "P", plastic DIP, when ordering green package the suffix is "PDG".  
DatasheetDocumentHistory  
03/25/99:  
Initiateddatasheetdocumenthistory  
Convertedtonewformat  
Cosmeticandtypographicalcorrections  
Addedadditionalnotestopinconfigurations  
Changeddrawingformat  
AddedIndustrialTemperatureRangesandremovedcorrespondingnotes  
Replaced IDT logo  
Madecorrectionstodrawing  
Correctedblockdiagramandpinconfigurations  
Changed±500mVto0mV  
Pages 2  
Page 1  
060/9/99:  
10/01/99:  
11/10/99:  
12/22/99:  
03/03/00:  
01/12/00:  
Pages 1 2  
Page 1  
Moved "Description to page 2 and adjusted page layout  
Added "LA only)" to paragraph  
Page 2  
FixedP48-1packagedescription  
Page 3  
Increasedstoragetemperatureparameters  
ClarifiedTA parameter  
Page 4  
Page 10  
Page 1  
DCElectricalparameters–changedwordingfrom"open"to"disabled"  
FixedTruthTablespecificationin"FunctionalDescription"paragraph  
Addedgreenavailabilitytofeatures  
01/17/06:  
08/12/08:  
Page 11  
Page 1 & 11  
Page 11  
Addedgreenindicatortoorderinginformation  
Replaced old IDTTM with new IDTTM logo  
Correctedtypointheorderinginformation  
11  
IDT7134SA/LA  
High-Speed 4K x 8 Dual-Port Static SRAM  
Military, Industrial and Commercial Temperature Ranges  
Datasheet Document History (con't.)  
08/12/08:  
10/21/08:  
02/04/13:  
Page 11  
Page 11  
Correctedtypointheorderinginformation  
Removed "IDT" from orderable part number  
Page 1, 4, 6 & 8 Removed Military 25ns & Industrial 35ns speed grades from Features and corrected  
the headers of the DC Chars and AC Chars tables to indicate this change  
Page 11  
Added T& R indicator to and removed Military 25ns & Industrial 35ns speed grades from the  
ordering information  
Typo/correction  
Page 2  
CORPORATE HEADQUARTERS  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
for SALES:  
for Tech Support:  
408-284-2794  
DualPortHelp@idt.com  
800-345-7015 or 408-284-8200  
fax: 408-284-2775  
www.idt.com  
Š
The IDT logo is a registered trademark of Integrated Device Technology, Inc.  
12  

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