P9122-00NBGI [IDT]

Dual Channel Synchronous Step- Down Switcher with Integrated FET;
P9122-00NBGI
型号: P9122-00NBGI
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Dual Channel Synchronous Step- Down Switcher with Integrated FET

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Dual Channel Synchronous Step-  
Down Switcher with Integrated FET  
Advanced Datasheet  
IDTP9122  
Features  
. Input Voltage Range: 2.7V to 5.5V  
Description  
IDTP9122 is a fully integrated power management IC  
. Two step-down converters with integrated FETs  
designed to provide 2 factory programmable voltage rails  
from a single 5V or 3.3V input rail with high efficiency and  
low quiescent currents in sleep mode or no-load condition.  
.
Buck1: 2A  
Buck2: 3A  
.
. Buck 2 to operate in Buck or Switch mode  
. Factory Programmable Output Voltage: 0.8 - 3.4V  
. Automatic PFM/PWM or forced PWM mode  
. Switching frequency 2MHz  
. Optional Programmable Sequence Mode  
. Power Good and/or Power On Reset Output  
. -40°C to +85°C operating temperature range  
. Package: QFN 24-ld 4 x 4mm x 0.8mm  
The device offers selectable direct buck enable inputs or a  
factory programmable sequencing with power good and  
power on reset generation.  
To support low power standby operation, the IDTP9122  
supports a configurable sleep mode.  
The IDTP9122 is available in a 4mm x 4mm, 24-ld, QFN  
package and guaranteed to operate over the ambient  
temperature range -40°C to +85°C.  
Applications  
Point of Load Regulation in a variety of low power  
applications:  
. Solid State Disk Drive (SSD) Power Management  
. Low Power USB powered applications  
. Set Top Box / TV Power Supply  
. Portable Gaming  
Simplified Application Diagram  
INPUT VOLTAGE  
INPUT VOLTAGE  
VIN  
FB1  
VIN  
FB1  
LX1  
PVIN1  
PVIN2  
LX1  
VOUT1  
PVIN1  
PVIN2  
VOUT1  
PGND1  
PGND1  
VINSEL  
VREF(optional)  
VREF(optional)  
VGND  
VGND  
VINSEL  
DEVSLPIN  
GPI3  
DEVSLPIN  
GPI3  
FB2  
LX2  
FB2  
LX2  
GPIO14  
GPIO15  
GPO16  
GPIO17  
GPIO14  
GPIO15  
GPO16  
GPIO17  
VOUT2  
VOUT2  
PGND2  
PGND2  
IDTP9122 with VINSEL (pin 4) in Buck Configuration for VOUT2  
IDTP9122 with VINSEL (pin 4) in Switch Configuration for VOUT2  
March 12, 2014  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
ORDERING GUIDE  
Table 1 Ordering Summary  
AMBIENT TEMP.  
RANGE  
PART NUMBER MARKING  
PACKAGE  
SHIPPING CARRIER QUANTITY  
P9122-00NBGI  
P9122-xxNBGI  
P9122-xxNBGI8  
P9122-00NBGI  
P9122-xxNBGI  
P9122-xxNBGI  
QFN-24 4x4x0.75mm 24-ld  
QFN-24 4x4x0.75mm 24-ld  
QFN-24 4x4x0.75mm 24-ld  
-40°C to +85°C  
-40°C to +85°C  
-40°C to +85°C  
Tape or Canister  
Tape or Canister  
Tape and Reel  
490  
490  
4000  
IDT P 91 22 xx NBG I 8  
T&R option:  
8=T&R, Blank=no  
Temperature Grade:  
I=-40C to +85C  
Package Code  
Configuration ID  
Device ID  
PMIC Code  
Power Prefix  
Additional Ordering Information:  
The IDTP9122 will be sampled in “-00” configuration, with all user configurable OTP registers at default state (0). Once a final  
customer configuration has been defined, a configuration specific “-xx” ID will be assigned and used for order and marking.  
ABSOLUTE MAXIMUM RATINGS  
Stresses above the ratings listed below can cause permanent damage to the IDTP9122. These ratings are stress ratings only. Functional  
operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.  
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed  
only over the recommended operating temperature range.  
Table 2 Absolute Maximum Ratings  
SYMBOL  
PARAMETER  
MIN  
MAX  
UNIT  
PVIN1, PVIN2 to PGND  
Regulator input voltage  
Supply for device  
Regulator Switch Nodes  
Regulator Feedback pins  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
6.0  
6.0  
6.0  
3.6  
6.0  
125  
150  
260  
2.5  
V
V
V
V
V
°C  
°C  
°C  
W
VIN to GND  
LX1, LX2  
FB1, FB2  
All other pins  
TJ  
TS  
TSOLDER  
PD  
Operating Junction Temperature  
Storage Temperature  
Soldering Temperature (10 seconds)  
Power Dissipation (TA = 25°C)  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
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IDTP9122  
Advanced Datasheet  
Table 3- Package Thermal Resistivity  
SYMBOL  
DESCRIPTION  
CONDITIONS  
Junction to Ambient  
Junction to Board  
Value  
Units  
Thermal Resistance (QFN-24)  
JA  
ΨJB  
PD  
40  
23  
1
C/W  
C/W  
W
Thermal Characterization Parameter (QFN-24)  
Maximum Package Power Dissipation  
(HBM) Human Body Model (all pins except 20, 21)  
(HBM) Human Body Model (only pins 20, 21)  
(CDM) Charged Device Model (all pins)  
2000V  
500V  
500V  
ESD Rating  
Per JEDEC spec, the QFN-24 package is rated at MSL3. This thermal rating was calculated based on a JEDEC standard 4-layer board with dimensions 3in x 4.5in in still air  
conditions. Actual thermal resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow, altitude, and other unlisted variables. For  
the QFN-24 package, the 2.8mm X 2.8mm EP is connected to ground plane with a matrix of 3x3 PCB thermal VIAs plated through from Top to Bottom layers. Actual thermal  
resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow, altitude, and other unlisted variables.  
ELECTRICAL CHARACTERISTICS  
Table 4 General Electrical Characteristics  
Typical values at 25°C, unless noted. VPVIN1 = VPVIN2 = Vin= 5V. CO(BUCK1) = 10uF, CO(BUCK2) = 20μF, L1 = L2 = 1.0μH.  
Symbol  
Parameter  
Conditions  
Min  
2.7  
Typ  
Max  
5.5  
Unit  
V
Input voltage range  
2.95  
2.65  
4.35  
3.95  
3
2.7  
4.4  
4.0  
<1  
3.05  
2.75  
4.45  
4.05  
V
UVLO threshold, VIN rising  
UVLO threshold, VIN falling  
UVLO threshold, VIN rising  
UVLO threshold, VIN falling  
VINSEL>1V, Buck2 in Switch  
(3.3V) Mode  
VVIN  
V
V
VINSEL=0V, Buck2 in Buck (5V) Mode  
V
Device in sleep mode  
μA  
μA  
V
IQ(VIN)  
VIN quiescent current  
Device in active mode, all Bucks = OFF  
All inputs  
100  
0.85  
1.25  
1
VIL  
0.65  
5
Low Level Input Voltage  
High Level Input Voltage  
Pull Down Current  
VIH  
IPD  
All inputs  
1.45  
10  
V
GPIO14,15,17, and GPI3  
DEVSLPIN @ VIN=5V  
Optional for GPIO14,15,16,17 and GPI3  
μA  
μA  
kΩ  
°C  
IPU  
8
Pull Up Current  
RPU  
TSD  
50  
Selectable Pull Up Resistor  
Thermal Shutdown  
135  
% of selected output voltage in Buck  
Mode, % of VPVIN2 in Switch mode  
VPG  
PG Detection Threshold  
10  
%
In push-pull configuration, VOL=0.4V,  
VFBx ≥ 1.8V  
4
mA  
mA  
V
IOD  
Max Drive Output  
In open drain configuration, VOL=0.4V  
12  
Reference Voltage Output  
Voltage  
VREF  
CVREF  
IVREF  
VFB(BUCK1)/2  
0.1  
μF  
mA  
Output Capacitor VREF  
Reference Voltage Output  
Current  
1.0  
March 12, 2014  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
ELECTRICAL CHARACTERISTICS  
Table 5 Buck1 Electrical Characteristics  
VO(BUCK1) = 1.8V.  
Typical values at 25°C, unless noted. VPVIN1 = VPVIN2 = Vin= 5V. CO(BUCK1) = 10uF, CO(BUCK2) = 20μF, L1 = L2 = 1.0μH.  
Symbol  
VPVIN1  
Parameter  
Input voltage range  
Output voltage range  
Regulation voltage accuracy  
Line Regulation  
Conditions  
Min  
2.7  
0.8  
-2  
Typ  
Max  
5.5  
3.4  
2
Unit  
V
V
%
VPVIN1 = 3.0V to 5V  
0.01  
15  
0.04  
0.5  
%/V  
mV/A  
VO(BUCK1)  
Load Regulation  
IOUT1 = 0.2A to 2A, PWM mode  
Offset voltage in PFM mode  
VO(PFM) = VO(PWM) + Voffset  
PFM mode  
mV  
ISHDN(BUCK1)  
IQ(BUCK1)  
IOP(BUCK1)  
Shutdown current  
Quiescent Current  
GBD  
1
μA  
μA  
No load, PFM mode  
25  
Continuous operating DC  
current  
TJ < 115°C  
1.8  
A
A
ILIM(BUCK1)  
Current Limitation  
2
2.5  
High side switch  
110  
56  
650  
2
153  
78  
mΩ  
mΩ  
Ω
R(on)  
Low side switch  
RDIS(BUCK1)  
fSW(BUCK1)  
Tssr(BUCK1)  
IFB1  
Output discharge resistance  
Switching frequency  
Soft-start ramp rate  
FB1 input bias current  
Output Capacitor  
500  
1.89  
4
900  
2.1  
12  
PWM mode  
MHz  
mV/μs  
μA  
8
6
8
CO(BUCK1)  
LO(BUCK1)  
10  
1
μF  
Output Inductor  
μH  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
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IDTP9122  
Advanced Datasheet  
ELECTRICAL CHARACTERISTICS  
Table 6Buck2 Electrical Characteristics  
VO(BUCK2) = 3.3V  
Typical values at 25°C, unless noted. VPVIN1 = VPVIN2 = Vin= 5V. CO(BUCK1) = 10uF, CO(BUCK2) = 20μF, L1 = L2 = 1.0μH.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
In Buck Mode (VINSEL=LOW)  
VPVIN2  
2.7  
0.8  
-2  
5.5  
3.4  
2
V
V
Input voltage range  
Output voltage range  
Regulation voltage accuracy  
Line Regulation  
%
VPVIN2 = 3.6V to 5V  
0.01  
0.4  
0.15  
0.5  
%/V  
mV/A  
VO(BUCK2)  
Load Regulation  
IOUT2 = 0.2A to 2.4A, PWM mode  
PFM mode  
Offset voltage in PFM mode  
VO(PFM) = VO(PWM) + Voffset  
15  
mV  
ISHDN(BUCK2)  
IQ(BUCK2)  
Shutdown current  
Quiescent Current  
1
μA  
μA  
No load, PFM mode  
TJ < 115°C  
28  
Continuous operating DC  
current  
IOP(BUCK2)  
ILIM(BUCK2)  
2.3  
A
A
Peak Inductor Current  
2.6  
3
High side switch  
64  
45  
650  
2
93  
61  
mΩ  
mΩ  
Ω
R(on)  
Low side switch  
RDIS(BUCK2)  
fSW(BUCK2)  
Tssr(BUCK2)  
IFB2  
Output discharge resistance  
Switching frequency  
Soft-start ramp rate  
FB2 input bias current  
Output Capacitor  
500  
900  
2.1  
12  
PWM mode  
1.89  
MHz  
mV/μs  
μA  
8
9
11  
CO(BUCK2)  
LO(BUCK2)  
20  
1
μF  
Output Inductor  
μH  
In Switch Mode (VINSEL=HIGH), CO(BUCK2) = 10μF, VPVIN2 = 3.3V  
VPVIN2  
2.7  
3.6  
2.4  
V
Input voltage range  
ISHDN(BUCK2)  
IQ(BUCK2)  
Shutdown current  
Quiescent Current  
1
μA  
μA  
No load  
10  
Continuous operating DC  
current  
IOP(BUCK2)  
TJ < 115°C  
A
ILIM(BUCK2)  
R(on)  
Current Limitation  
2.8  
3
A
mΩ  
Ω
High side switch  
64  
93  
RDIS(BUCK2)  
Tssr(BUCK2)  
CO(BUCK2)  
Output discharge resistance  
Soft-start ramp rate  
Output Capacitor  
300  
800  
16  
2
mV/μs  
μF  
March 12, 2014  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
PIN CONFIGURATION AND DESCRIPTION  
Table 7 Pin Functions by Pin Number  
#
Label  
Type  
Description  
1
2
3
4
5
VGND  
VREF  
GPI3  
VINSEL  
DEVSLPIN  
FB1  
GND Device ground connection  
A
DI  
DI  
DI  
A
Reference output [VREF=VOUT(Buck 1)/2]  
General Purpose Input (see Modes of Operation, page 7, Master Enable Pin when configured.)  
Logic input to select function of Buck 2. Logic Low = Buck operation, High = Switch operation.  
Logic input to activate sleep mode. Logic Low = Normal onoperation, High = Sleep operation.  
Feedback connection for Buck 1  
6
7
LX1  
A
Inductor connection for Buck 1  
8
9
PGND1  
PVIN1  
VIN  
GND Power ground for Buck 1  
PWR Power supply input for Buck 1  
PWR Device supply input  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
EP  
VGND  
N/C  
VGND Device ground connection  
N/C Pin must be left floating/open  
VGND Device ground connection  
VGND  
GPIO14  
GPIO15  
GPO16  
GPIO17  
FB2  
PGND2  
LX2  
LX2  
DIO  
DIO  
DO  
DIO  
A
General Purpose Input / Output (see Modes of Operation, page 7).  
General Purpose Input / Output (see Modes of Operation, page 7).  
General Purpose Output (see Modes of Operation, page 7).  
General Purpose Input / Output (see Modes of Operation, page 7).  
Feedback connection for Buck 2 (Buck Mode) or Output (Switch Mode)  
GND Power ground Buck 2  
A
Inductor connection Buck 2 (Buck Mode) or Output (Switch Mode)  
A
PVIN2  
PVIN2  
VIN  
PWR  
PWR  
Power supply input for Buck 2  
PWR Device supply input  
GND Exposed pad, connect to heat sink ground plane  
EP  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
6
IDTP9122  
Advanced Datasheet  
FUNCTIONAL DESCRIPTION:  
Overview  
The IDTP9122 support several modes to control the 2 Buck regulators and to generate status information like PG (power good)  
or POR (power on reset).  
Various device features can be configured during production using one time programmable fuse memory (OTP). During  
evaluation, the options can be evaluated using the IDTP9122 Evaluation Kit (IDTP9122-EVAL).  
The IDTP9122 OTP memory is organized into four fuse banks with 34 bits each. Bank0 and 1 are used for IDT internal  
trimming and calibration. Bank2 and 3 are used for customer specific device configuration.  
Modes of Operation  
Device Power States  
Device operates in three basic power states controlled by the DEVSLPIN pin and one optional state (standby) when in Mode 3.  
DEVSLPIN (pin5)=HIGH  
SLEEP  
VIN>VUVLO  
NO  
POWER  
DEVSLPIN (pin5)=LOW  
ON  
STANDBY (GPIO14 pin14) =HIGH  
STANDBY  
VIN<VUVLO  
STANDBY (GPIO14 pin 14) =LOW  
Mode 3 only  
Figure 1. Device Power States  
Regulator Control Options (Mode 0..3)  
The IDTP9122 supports four different control options for the Buck regulator. The functionality of GPI3, GPIO14,15,16, and 17,  
and is different for each of the options. (MODE[1:0] = OTP Bank3[1:0])  
Table 8 Buck Control Options  
MODE[1:0]  
DESCRIPTION  
GPI3  
GPIO14  
GPIO15  
GPO16  
GPIO17  
0
Buck regulators controlled by  
individual enable pins (EN1, EN2)  
NC  
EN1  
GND  
PORB  
EN2  
(Default)  
1
2
Do not use - reserved  
Buck regulators controlled by master MEN  
enable pin (MEN) w/ sequence  
PORB  
PG1  
PG1  
NC  
NC  
PG2  
3
Buck regulators controlled by master MEN  
enable pin (MEN) w/ sequence and  
standby mode support  
STANDBY  
PG2/PORB  
March 12, 2014  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
Mode0 Individual Buck control  
With IDTP9122 configured for mode0, both regulators are individually controlled via ENx input pin. The PORB output can be  
configured to indicate various power up conditions.  
Mode1 Do not use - reserved  
Mode2 Master Enable pin (MEN) with sequence  
With IDTP9122 configured for mode2, a configurable state machine will ramp up/down both regulators controlled by the MEN  
pin. The PORB output can be configured to indicate various power up conditions. Individual Power Good output pins indicate  
the regulator output being established.  
Mode3 Master Enable pin (MEN) with sequence and Standby Mode  
With IDTP9122 configured for mode3, a configurable state machine will ramp up/down both regulators controlled by the MEN  
pin. The PORB output can be configured to indicate various power up conditions. Individual Power Good output pins indicate  
the regulator output being established.  
In addition to mode2, mode3 supports the STANDBY mode entered by asserting the STANDBY pin. During standby, Buck1  
and/or  
2
will be turned off without sequencing. The configuration is configurable via OTP.  
Pin Description  
DEVSLPIN  
This pin allows the IC to enter and exit SLEEP mode. Sleep mode is the lowest power state of the device and is activated when  
DEVSLPIN is logic HIGH. The device will be on “normal operation” when DEVSLPIN is logic LOW. See figure 2 Device Power States.  
VINSEL  
This pin allows the function of Buck 2 to be changed to a Switch function. Logic LOW on this pin puts the channel into Buck configuration,  
and a Logic HIGH on this pin puts the channel into Switch configuration.  
PVIN1, PVIN2  
PVINx is each buck convertersrespective power supply input. They provide power to the internal MOSFETs for the switch mode regulator.  
Their operating range is 2.7V to 5.5V, and a 10uF capacitor is be placed as close as possible to each of the respective pins. An second  
10uF capacitor should be used with PVIN2 because of the greater current sourcing capability of this channel. Because capacitance  
derates with voltage, a 10V rated X7R ceramic capacitors be used. X7R is preferred over X5R because the derating with X7R is less. For  
best performance, each of these power supply inputs are to be connected together on a dedicated circuit board power plane, and that the  
trace going from these pins to the dedicated power plane be made as short as possible. Y5V capacitors are not recommended because of  
their general low performance with respect to temperature, voltage derating, and higher resistance at high frequency’s minimizing their  
ability to filter out high frequency noise.  
VIN  
VIN is the power supply input for the rest of the integrated circuit. It too has an operating range of 2.7V to 5.5V, and a 2.2uF 10V rated  
X7R capacitor should be placed as close as possible to its’ pin. VIN should also be tied to the same power plane that the PVINx pins are  
tied to with as short a trace as possible. Y5V capacitors are highly not recommended.  
PGND1, PGND2  
These are the dedicated ground pins for each of the respective power supply’s. The traces from these pins, to a dedicated ground plane,  
should be made as short as possible.  
VGND  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
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IDTP9122  
Advanced Datasheet  
VGND is the ground pin for the rest of the integrated circuit. The trace from this pin, to a dedicated ground plane, should be made as short  
as possible.  
EP  
This is the exposed pad on the bottom side of the IC. It needs to be connected to a circuit board ground plane to maximize the heat  
dissipation performance of the IC.  
VREF  
The Vref pin is an internal voltage reference of the IC. It tracks the output voltage of Buck 1, at half its’ value. This voltage could be used  
to interface to the negative input of a comparator as in Li-Ion low battery indicator applications, when the positive input of the comparator is  
a voltage divided level from the battery’s positive node. At the moment of low battery indication, the comparator’s output changes state  
from high to low, thereby, indicating a low battery state, and in turn, for example, then allows an electronic system to begin power down  
operations. A 2.2uF 6.3V rated X7R capacitor is recommended at this pin.  
FB1, FB2  
FB1 and FB2 are the respective feedback pins of the output voltage for each buck converter. It is the control input for programming the  
output voltage of each buck converter. Because of the IDTP9122’s output voltage programmability, the classical resistor divider network is  
no longer needed, thereby saving six resistor components. The granularity of programmability of the outputs for each channel is 25mV all  
the way from 0.8000V to 3.3375V. During layout, the feedback traces should be kept as short as possible and should never run parallel to  
the inductors and the inductor trace leading to the inductor switching pin. Feedback traces should always cross inductor’s and inductor  
traces on separate planes and at right angles.  
LX1, LX2  
LX1, LX2 are the switching pins of the respective buck converters. Small footprint chip inductors of 1uH in value have been optimized for  
use with the IDTP9122, and connect to the switching pings. The inductors should be placed as close as possible to the LX pins  
themselves.  
GPIO14, GPIO15, GPIO17  
These three pins have multiple function, but in the default state they serve as enable pins for each of the three buck converters accordingly:  
GPIO14 enables Buck 1. Logic High enables Buck 1. Logic Low disables Buck 1. See Table 9 for alternate mode function.  
GPIO15 See Table 9 for alternate mode function.  
GPIO16 enables Buck 2. Logic High enables Buck 2. Logic Low disables Buck 2. See Table 9 for alternate mode function.  
GPI3  
This pin serves no function in default configuration, but when in Mode 2 or Mode 3 configuration, it serves as a master enable pin. I.e., this  
pin alone will enable all bucks by the change in logic state on its’ pin. Logic High enables all the bucks with sequencing of all the bucks,  
and Logic Low disables all the Bucks with sequencing of all the bucks. See Table 9 for details of GPIO14, GPIO15, GPO16, GOIO17  
functionality when the GPI3 pin is configured.  
GPO16  
This pin serves as a Power on Reset pin or as a Buck 2 Power Good pin depending up whether the device is in Mode 0 or Mode 2 and  
mode 3 respectively. See Table 9 for alternate mode function.  
Component Selection  
The IDTP9122 is a high performance dual DC-DC step down convertor that minimizes the solution size demands of miniature portable  
electronic devices. It supports 2 outputs with currents up to 3A inside a 4mm x 4mm QFN package, and only requires 3 external  
components per channel (Cin, Cout, L). Because it is designed to automatically switch to a pulse frequency modulation scheme at light  
loads, the IDTP9122 is able to maintain high efficiency across the entire load range while providing ultra-fast load transient response.  
Input Capacitor  
A 10uF ceramic capacitor or greater should be placed close to each PVIN pin for each channel for bypassing. Its’ voltage rating should be  
10V to accommodate any high frequency noise coming from 5V power supply source. The Kemet 0805C106K8RACTU is ideal based  
March 12, 2014  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
upon performance, cost, and size. For the VIN pin, a 2.2uF 10V capacitor is sufficient because the VIN pin is powering the low power  
internal circuitry of the IC.  
Output Capacitor  
A 10uF or greater ceramic capacitor should be placed close to each output inductor. Increasing the output capacitance will lower output  
ripple and improve load transient response but could also increase solution size or cost. The voltage rating of the output capacitor should  
be 6.3V and the C1206C106K9RACTU is recommended, but for more demanding space constrained designs, the Samsung  
CL10B106MQ8NRNC is a good alternative.  
Inductor Selection  
The IDTP9122 has been designed for use with a 1.0uH inductor. A larger inductor will produce lower output voltage ripple, but a slightly  
smaller inductor will produce faster transient response. The best compromise is a 1.0uH inductor. Selection of the inductor needs to  
ensure maximum operating current not just the DC current, and can be rated for a 40°C temperature rise. This maximum operating  
current or peak current for a buck converter can be calculated using equation 1  
Ipeak = Iout [1 + r/2]  
eq (1); where r is the inductor current ripple ratio and equal to  
r = [ Vout (1 Vout/Vin) ] / [ Iout * L * f ] eq (2); where L and f are the inductor and switching frequency. Simplifying gives equation 3:  
Ipeak = Iout + Vout [ (1-Vout/Vin) / 2Lf) ] eq (3).  
Equation 3 shows that the peak inductor current is inversely related to the switching frequency and inductance. In other words, the lower  
the switching frequency or inductance, the higher the peak current. Peak current also increases as input voltage increases. The size of  
the inductor depends on the application, and the recommended inductor is the Toko 1239AS-H-1R0M for best performance, size, and cost.  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
10  
IDTP9122  
Advanced Datasheet  
OTP Register Mapping (Bank T2)  
The following table lists all configurable OTP registers available in the IDTP9122. Bank0 and Bank1 are IDT internal use only  
trimming and calibration registers and not listed.  
The registers can be programmed for evaluation purpose using the IDTP9122 Evaluation Kit (IDTP9122-EVAL) with the  
included GUI software. The final production configuration will be programmed by IDT during final test.  
Trim Bits  
Parametric Trim  
T2[0]  
Buck1 Transconductance Selection: Relevant for all modes  
0 : Nominal  
1 : 3x transconductance  
T2[1]  
T2[2]  
Buck1 Bandwidth Selection: Relevant for all modes  
0 : Nominal  
1 : 2x bandwidth  
Buck1 Forced PWM Mode: Relevant for all modes  
0 : Auto-switching between PWM & PFM modes  
1 : Forced PWM mode  
T2[5:3]  
T2[6]  
reserved  
Buck2 Transconductance Selection:  
0 : Nominal  
1 : 3x transconductance  
T2[7]  
T2[8]  
Buck2 Bandwidth Selection:  
0 : Nominal  
1 : 2x bandwidth  
Buck2 Forced PWM Mode:  
0 : Auto-switching between PWM & PFM modes  
1 : Forced PWM mode  
T2[10:9]  
Power-Off Sequencer Delay 1: Relevant only when mode[1:0]≠’00’  
00 : 0.5ms  
01 : 1ms  
10 : 2ms  
11 : 4ms  
T2[12:11]  
Power-Off Sequencer Delay 2: Relevant only when mode[1:0]≠’00’  
00 : 0.5ms  
01 : 1ms  
10 : 2ms  
11 : 4ms  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
Trim Bits  
Parametric Trim  
T2[15:13]  
Buck Power-Off Sequence Selection: Relevant only when mode[1:0]≠’00’  
000 : wait Buck2 Buck1  
001 : wait Buck1 Buck2  
010 : Buck1 wait Buck2  
011 : Buck1 Buck2 wait  
100 : Buck2 Buck1 wait  
101 : Buck2 wait Buck1  
110 : Buck1 Buck2  
111 : wait Buck1 & Buck2  
T2[18:16]  
PORB Output Boolean Operator Selection: PG=Power Good  
000 : reserved  
001 : PG1  
010 : reserved  
011 : PG2  
100 : reserved  
101 : PG1 & PG2  
110 : reserved  
111 : reserved  
T2[19]  
GPI3 Internal Pull-up Enable:  
0 : Disable (1A pull-down to VGND)  
1 : Enable (100kΩ pull-up to VIN)  
T2[20]  
T2[21]  
Unused  
GPIO14 Internal Pull-up Enable:  
0 : Disable (1A pull-down to VGND when pin configured as input)  
1 : Enable (50kΩ pull-up to supply voltage selected by gpio14_vio)  
T2[22]  
GPIO14 Open-Drain Output Select:  
Relevant only when pin configured as output.  
0 : Push-pull output  
1 : Open-drain output  
T2[23]  
T2[24]  
T2[25]  
GPIO14 I/O Voltage Select: For both input buffer and push-pull output driver.  
0 : VOUT2 (FB2)  
1 : VOUT1 (FB1)  
GPIO15 Internal Pull-up Enable:  
0 : Disable (1A pull-down to VGND when pin configured as input)  
1 : Enable (50kΩ pull-up to supply voltage selected by gpio15_vio)  
GPIO15 Open-Drain Output Select:  
Relevant only when pin configured as output.  
0 : Push-pull output  
1 : Open-drain output  
T2[26]  
T2[27]  
GPIO15 I/O Voltage Select: For both input buffer and push-pull output driver.  
0 : VOUT2 (FB2)  
1 : VOUT1 (FB1)  
GPO16 Internal Pull-up Enable:  
0 : Disable  
1 : Enable (50kΩ pull-up to supply voltage selected by gpo16_vo)  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
12  
IDTP9122  
Advanced Datasheet  
T2[28]  
T2[29]  
T2[30]  
T2[31]  
GPO16 Open-Drain Output Select:  
0 : Push-pull output  
1 : Open-drain output  
GPO16 Output Voltage Select: For push-pull output driver.  
0 : VOUT2 (FB2)  
1 : VOUT1 (FB1)  
GPIO17 Internal Pull-up Enable:  
0 : Disable (1A pull-down to VGND when pin configured as input)  
1 : Enable (50kΩ pull-up to supply voltage selected by gpio17_vio)  
GPIO17 Open-Drain Output Select:  
Relevant only when pin configured as output.  
0 : Push-pull output  
1 : Open-drain output  
T2[32]  
T2[33]  
GPIO17 I/O Voltage Select: For both input buffer and push-pull output driver.  
0 : VOUT2 (FB2)  
1 : VOUT1 (FB1)  
VREF Output Disable:  
0 : VREF = 0.5 x VOUT1(FB1)  
1 : VREF output disabled  
OTP Register Mapping (Bank T3)  
Trim  
Bits  
Parametric Trim  
T3[1:0]  
Device I/O Configuration and Control:  
00 : Individual regulator enable via pins  
01 : reserved  
10 : Master enable control with programmable sequencing  
11 : Master enable control with programmable sequencing  
+ SLEEP mode support  
T3[2]  
TSD & UVLO Fault Disable:  
Used for device characterization and burn-in only.  
0 : Fault event shuts down all Buck regulators (programmed sequence)  
1 : Fault ignored  
T3[5:3]  
Buck Power-On Sequence Selection: Relevant only when mode[1:0]≠’00’  
000 : wait Buck2 Buck1  
001 : Buck2 Buck1 wait  
010 : Buck2 wait Buck1  
011 : Buck1 Buck2 wait  
100 : wait Buck1 Buck2  
101 : Buck1 wait Buck2  
110 : Buck2 Buck1  
111 : Buck1 & Buck2 wait  
T3[6]  
Buck1 SLEEP Mode Support: Relevant only when mode[1:0]=‘11’  
0 : Buck1 not affected by SLEEP mode  
1 : Buck1 supports SLEEP mode control  
March 12, 2014  
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© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
T3[7]  
T3[8]  
reserved  
Buck2 SLEEP Mode Support: Relevant only when mode[1:0]=‘11’  
0 : Buck2 not affected by SLEEP mode  
1 : Buck2 supports SLEEP mode control  
Trim  
Bits  
Parametric Trim  
T3[10:9]  
Power-On Sequencer Delay 1: Relevant only when mode[1:0]≠’00’  
00 : 0.5ms  
01 : 1ms  
10 : 2ms  
11 : 4ms  
T3[12:11]  
Power-On Sequencer Delay 2: Relevant only when mode[1:0]≠’00’  
00 : 0.5ms  
01 : 1ms  
10 : 2ms  
11 : 4ms  
T3[19:13]  
T3[26:20]  
T3[33:27]  
Vout1  
000d : 1.800V(vout1) / 3.300V(vout2)  
001d : 0.800V  
002d : 0.825V  
reserved  
Vout2  
003d : 0.850V  
:
:
:
:
100d : 3.275V  
101d : 3.300V  
102d : 3.325V  
≥103d : 3.3375V  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
14  
IDTP9122  
Advanced Datasheet  
APPLICATION INFORMATION  
Figure 7. Minimum component schematic of IDTP9122.  
Package Information  
Please refer to the documents located under http://www.idt.com/package/nbg24 for detailed package outline, recommended  
footprint, carrier and RoHS information. IDTP9120 is using the P1-NBG24 package option (EP size: 2.8mm)  
March 12, 2014  
15  
© 2014 Integrated Device Technology, Inc.  
IDTP9122  
Advanced Datasheet  
www.IDT.com  
6024 Silver Creek Valley Road  
San Jose, California 95138  
Tel: 800-345-7015  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All  
information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the  
described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided  
without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of  
merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT  
or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly  
affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks u20141os and designs, are the property of IDT or their respective third  
party owners.  
© Copyright 2014. All rights reserved.  
March 12, 2014  
© 2014 Integrated Device Technology, Inc.  
16  

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