P9122-00NBGI [IDT]
Dual Channel Synchronous Step- Down Switcher with Integrated FET;![P9122-00NBGI](http://pdffile.icpdf.com/pdf2/p00341/img/icpdf/P9122-00NBGI_2096838_icpdf.jpg)
型号: | P9122-00NBGI |
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描述: | Dual Channel Synchronous Step- Down Switcher with Integrated FET |
文件: | 总16页 (文件大小:631K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Dual Channel Synchronous Step-
Down Switcher with Integrated FET
Advanced Datasheet
IDTP9122
Features
. Input Voltage Range: 2.7V to 5.5V
Description
IDTP9122 is a fully integrated power management IC
. Two step-down converters with integrated FETs
designed to provide 2 factory programmable voltage rails
from a single 5V or 3.3V input rail with high efficiency and
low quiescent currents in sleep mode or no-load condition.
.
Buck1: 2A
Buck2: 3A
.
. Buck 2 to operate in Buck or Switch mode
. Factory Programmable Output Voltage: 0.8 - 3.4V
. Automatic PFM/PWM or forced PWM mode
. Switching frequency 2MHz
. Optional Programmable Sequence Mode
. Power Good and/or Power On Reset Output
. -40°C to +85°C operating temperature range
. Package: QFN 24-ld 4 x 4mm x 0.8mm
The device offers selectable direct buck enable inputs or a
factory programmable sequencing with power good and
power on reset generation.
To support low power standby operation, the IDTP9122
supports a configurable sleep mode.
The IDTP9122 is available in a 4mm x 4mm, 24-ld, QFN
package and guaranteed to operate over the ambient
temperature range -40°C to +85°C.
Applications
Point of Load Regulation in a variety of low power
applications:
. Solid State Disk Drive (SSD) Power Management
. Low Power USB powered applications
. Set Top Box / TV Power Supply
. Portable Gaming
Simplified Application Diagram
INPUT VOLTAGE
INPUT VOLTAGE
VIN
FB1
VIN
FB1
LX1
PVIN1
PVIN2
LX1
VOUT1
PVIN1
PVIN2
VOUT1
PGND1
PGND1
VINSEL
VREF(optional)
VREF(optional)
VGND
VGND
VINSEL
DEVSLPIN
GPI3
DEVSLPIN
GPI3
FB2
LX2
FB2
LX2
GPIO14
GPIO15
GPO16
GPIO17
GPIO14
GPIO15
GPO16
GPIO17
VOUT2
VOUT2
PGND2
PGND2
IDTP9122 with VINSEL (pin 4) in Buck Configuration for VOUT2
IDTP9122 with VINSEL (pin 4) in Switch Configuration for VOUT2
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© 2014 Integrated Device Technology, Inc.
IDTP9122
Advanced Datasheet
ORDERING GUIDE
Table 1 – Ordering Summary
AMBIENT TEMP.
RANGE
PART NUMBER MARKING
PACKAGE
SHIPPING CARRIER QUANTITY
P9122-00NBGI
P9122-xxNBGI
P9122-xxNBGI8
P9122-00NBGI
P9122-xxNBGI
P9122-xxNBGI
QFN-24 4x4x0.75mm 24-ld
QFN-24 4x4x0.75mm 24-ld
QFN-24 4x4x0.75mm 24-ld
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Tape or Canister
Tape or Canister
Tape and Reel
490
490
4000
IDT P 91 22 – xx NBG I 8
T&R option:
8=T&R, Blank=no
Temperature Grade:
I=-40C to +85C
Package Code
Configuration ID
Device ID
PMIC Code
Power Prefix
Additional Ordering Information:
The IDTP9122 will be sampled in “-00” configuration, with all user configurable OTP registers at default state (0). Once a final
customer configuration has been defined, a configuration specific “-xx” ID will be assigned and used for order and marking.
ABSOLUTE MAXIMUM RATINGS
Stresses above the ratings listed below can cause permanent damage to the IDTP9122. These ratings are stress ratings only. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed
only over the recommended operating temperature range.
Table 2 – Absolute Maximum Ratings
SYMBOL
PARAMETER
MIN
MAX
UNIT
PVIN1, PVIN2 to PGND
Regulator input voltage
Supply for device
Regulator Switch Nodes
Regulator Feedback pins
-0.3
-0.3
-0.3
-0.3
-0.3
6.0
6.0
6.0
3.6
6.0
125
150
260
2.5
V
V
V
V
V
°C
°C
°C
W
VIN to GND
LX1, LX2
FB1, FB2
All other pins
TJ
TS
TSOLDER
PD
Operating Junction Temperature
Storage Temperature
Soldering Temperature (10 seconds)
Power Dissipation (TA = 25°C)
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IDTP9122
Advanced Datasheet
Table 3- Package Thermal Resistivity
SYMBOL
DESCRIPTION
CONDITIONS
Junction to Ambient
Junction to Board
Value
Units
Thermal Resistance (QFN-24)
JA
ΨJB
PD
40
23
1
C/W
C/W
W
Thermal Characterization Parameter (QFN-24)
Maximum Package Power Dissipation
(HBM) Human Body Model (all pins except 20, 21)
(HBM) Human Body Model (only pins 20, 21)
(CDM) Charged Device Model (all pins)
2000V
500V
500V
ESD Rating
Per JEDEC spec, the QFN-24 package is rated at MSL3. This thermal rating was calculated based on a JEDEC standard 4-layer board with dimensions 3in x 4.5in in still air
conditions. Actual thermal resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow, altitude, and other unlisted variables. For
the QFN-24 package, the 2.8mm X 2.8mm EP is connected to ground plane with a matrix of 3x3 PCB thermal VIAs plated through from Top to Bottom layers. Actual thermal
resistance will be affected by PCB size, solder joint quality, PCB layer count, copper thickness, air flow, altitude, and other unlisted variables.
ELECTRICAL CHARACTERISTICS
Table 4 – General Electrical Characteristics
Typical values at 25°C, unless noted. VPVIN1 = VPVIN2 = Vin= 5V. CO(BUCK1) = 10uF, CO(BUCK2) = 20μF, L1 = L2 = 1.0μH.
Symbol
Parameter
Conditions
Min
2.7
Typ
Max
5.5
Unit
V
Input voltage range
2.95
2.65
4.35
3.95
3
2.7
4.4
4.0
<1
3.05
2.75
4.45
4.05
V
UVLO threshold, VIN rising
UVLO threshold, VIN falling
UVLO threshold, VIN rising
UVLO threshold, VIN falling
VINSEL>1V, Buck2 in Switch
(3.3V) Mode
VVIN
V
V
VINSEL=0V, Buck2 in Buck (5V) Mode
V
Device in sleep mode
μA
μA
V
IQ(VIN)
VIN quiescent current
Device in active mode, all Bucks = OFF
All inputs
100
0.85
1.25
1
VIL
0.65
5
Low Level Input Voltage
High Level Input Voltage
Pull Down Current
VIH
IPD
All inputs
1.45
10
V
GPIO14,15,17, and GPI3
DEVSLPIN @ VIN=5V
Optional for GPIO14,15,16,17 and GPI3
μA
μA
kΩ
°C
IPU
8
Pull Up Current
RPU
TSD
50
Selectable Pull Up Resistor
Thermal Shutdown
135
% of selected output voltage in Buck
Mode, % of VPVIN2 in Switch mode
VPG
PG Detection Threshold
10
%
In push-pull configuration, VOL=0.4V,
VFBx ≥ 1.8V
4
mA
mA
V
IOD
Max Drive Output
In open drain configuration, VOL=0.4V
12
Reference Voltage Output
Voltage
VREF
CVREF
IVREF
VFB(BUCK1)/2
0.1
μF
mA
Output Capacitor VREF
Reference Voltage Output
Current
1.0
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IDTP9122
Advanced Datasheet
ELECTRICAL CHARACTERISTICS
Table 5 – Buck1 Electrical Characteristics
VO(BUCK1) = 1.8V.
Typical values at 25°C, unless noted. VPVIN1 = VPVIN2 = Vin= 5V. CO(BUCK1) = 10uF, CO(BUCK2) = 20μF, L1 = L2 = 1.0μH.
Symbol
VPVIN1
Parameter
Input voltage range
Output voltage range
Regulation voltage accuracy
Line Regulation
Conditions
Min
2.7
0.8
-2
Typ
Max
5.5
3.4
2
Unit
V
V
%
VPVIN1 = 3.0V to 5V
0.01
15
0.04
0.5
%/V
mV/A
VO(BUCK1)
Load Regulation
IOUT1 = 0.2A to 2A, PWM mode
Offset voltage in PFM mode
VO(PFM) = VO(PWM) + Voffset
PFM mode
mV
ISHDN(BUCK1)
IQ(BUCK1)
IOP(BUCK1)
Shutdown current
Quiescent Current
GBD
1
μA
μA
No load, PFM mode
25
Continuous operating DC
current
TJ < 115°C
1.8
A
A
ILIM(BUCK1)
Current Limitation
2
2.5
High side switch
110
56
650
2
153
78
mΩ
mΩ
Ω
R(on)
Low side switch
RDIS(BUCK1)
fSW(BUCK1)
Tssr(BUCK1)
IFB1
Output discharge resistance
Switching frequency
Soft-start ramp rate
FB1 input bias current
Output Capacitor
500
1.89
4
900
2.1
12
PWM mode
MHz
mV/μs
μA
8
6
8
CO(BUCK1)
LO(BUCK1)
10
1
μF
Output Inductor
μH
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IDTP9122
Advanced Datasheet
ELECTRICAL CHARACTERISTICS
Table 6– Buck2 –Electrical Characteristics
VO(BUCK2) = 3.3V
Typical values at 25°C, unless noted. VPVIN1 = VPVIN2 = Vin= 5V. CO(BUCK1) = 10uF, CO(BUCK2) = 20μF, L1 = L2 = 1.0μH.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
In Buck Mode (VINSEL=LOW)
VPVIN2
2.7
0.8
-2
5.5
3.4
2
V
V
Input voltage range
Output voltage range
Regulation voltage accuracy
Line Regulation
%
VPVIN2 = 3.6V to 5V
0.01
0.4
0.15
0.5
%/V
mV/A
VO(BUCK2)
Load Regulation
IOUT2 = 0.2A to 2.4A, PWM mode
PFM mode
Offset voltage in PFM mode
VO(PFM) = VO(PWM) + Voffset
15
mV
ISHDN(BUCK2)
IQ(BUCK2)
Shutdown current
Quiescent Current
1
μA
μA
No load, PFM mode
TJ < 115°C
28
Continuous operating DC
current
IOP(BUCK2)
ILIM(BUCK2)
2.3
A
A
Peak Inductor Current
2.6
3
High side switch
64
45
650
2
93
61
mΩ
mΩ
Ω
R(on)
Low side switch
RDIS(BUCK2)
fSW(BUCK2)
Tssr(BUCK2)
IFB2
Output discharge resistance
Switching frequency
Soft-start ramp rate
FB2 input bias current
Output Capacitor
500
900
2.1
12
PWM mode
1.89
MHz
mV/μs
μA
8
9
11
CO(BUCK2)
LO(BUCK2)
20
1
μF
Output Inductor
μH
In Switch Mode (VINSEL=HIGH), CO(BUCK2) = 10μF, VPVIN2 = 3.3V
VPVIN2
2.7
3.6
2.4
V
Input voltage range
ISHDN(BUCK2)
IQ(BUCK2)
Shutdown current
Quiescent Current
1
μA
μA
No load
10
Continuous operating DC
current
IOP(BUCK2)
TJ < 115°C
A
ILIM(BUCK2)
R(on)
Current Limitation
2.8
3
A
mΩ
Ω
High side switch
64
93
RDIS(BUCK2)
Tssr(BUCK2)
CO(BUCK2)
Output discharge resistance
Soft-start ramp rate
Output Capacitor
300
800
16
2
mV/μs
μF
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IDTP9122
Advanced Datasheet
PIN CONFIGURATION AND DESCRIPTION
Table 7 – Pin Functions by Pin Number
#
Label
Type
Description
1
2
3
4
5
VGND
VREF
GPI3
VINSEL
DEVSLPIN
FB1
GND Device ground connection
A
DI
DI
DI
A
Reference output [VREF=VOUT(Buck 1)/2]
General Purpose Input (see Modes of Operation, page 7, Master Enable Pin when configured.)
Logic input to select function of Buck 2. Logic Low = Buck operation, High = Switch operation.
Logic input to activate sleep mode. Logic Low = Normal “on” operation, High = Sleep operation.
Feedback connection for Buck 1
6
7
LX1
A
Inductor connection for Buck 1
8
9
PGND1
PVIN1
VIN
GND Power ground for Buck 1
PWR Power supply input for Buck 1
PWR Device supply input
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
EP
VGND
N/C
VGND Device ground connection
N/C Pin must be left floating/open
VGND Device ground connection
VGND
GPIO14
GPIO15
GPO16
GPIO17
FB2
PGND2
LX2
LX2
DIO
DIO
DO
DIO
A
General Purpose Input / Output (see Modes of Operation, page 7).
General Purpose Input / Output (see Modes of Operation, page 7).
General Purpose Output (see Modes of Operation, page 7).
General Purpose Input / Output (see Modes of Operation, page 7).
Feedback connection for Buck 2 (Buck Mode) or Output (Switch Mode)
GND Power ground Buck 2
A
Inductor connection Buck 2 (Buck Mode) or Output (Switch Mode)
A
PVIN2
PVIN2
VIN
PWR
PWR
Power supply input for Buck 2
PWR Device supply input
GND Exposed pad, connect to heat sink ground plane
EP
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IDTP9122
Advanced Datasheet
FUNCTIONAL DESCRIPTION:
Overview
The IDTP9122 support several modes to control the 2 Buck regulators and to generate status information like PG (power good)
or POR (power on reset).
Various device features can be configured during production using one time programmable fuse memory (OTP). During
evaluation, the options can be evaluated using the IDTP9122 Evaluation Kit (IDTP9122-EVAL).
The IDTP9122 OTP memory is organized into four fuse banks with 34 bits each. Bank0 and 1 are used for IDT internal
trimming and calibration. Bank2 and 3 are used for customer specific device configuration.
Modes of Operation
Device Power States
Device operates in three basic power states controlled by the DEVSLPIN pin and one optional state (standby) when in Mode 3.
DEVSLPIN (pin5)=HIGH
SLEEP
VIN>VUVLO
NO
POWER
DEVSLPIN (pin5)=LOW
ON
STANDBY (GPIO14 pin14) =HIGH
STANDBY
VIN<VUVLO
STANDBY (GPIO14 pin 14) =LOW
Mode 3 only
Figure 1. Device Power States
Regulator Control Options (Mode 0..3)
The IDTP9122 supports four different control options for the Buck regulator. The functionality of GPI3, GPIO14,15,16, and 17,
and is different for each of the options. (MODE[1:0] = OTP Bank3[1:0])
Table 8 – Buck Control Options
MODE[1:0]
DESCRIPTION
GPI3
GPIO14
GPIO15
GPO16
GPIO17
0
Buck regulators controlled by
individual enable pins (EN1, EN2)
NC
EN1
GND
PORB
EN2
(Default)
1
2
Do not use - reserved
Buck regulators controlled by master MEN
enable pin (MEN) w/ sequence
PORB
PG1
PG1
NC
NC
PG2
3
Buck regulators controlled by master MEN
enable pin (MEN) w/ sequence and
standby mode support
STANDBY
PG2/PORB
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IDTP9122
Advanced Datasheet
Mode0 – Individual Buck control
With IDTP9122 configured for mode0, both regulators are individually controlled via ENx input pin. The PORB output can be
configured to indicate various power up conditions.
Mode1 – Do not use - reserved
Mode2 – Master Enable pin (MEN) with sequence
With IDTP9122 configured for mode2, a configurable state machine will ramp up/down both regulators controlled by the MEN
pin. The PORB output can be configured to indicate various power up conditions. Individual Power Good output pins indicate
the regulator output being established.
Mode3 – Master Enable pin (MEN) with sequence and Standby Mode
With IDTP9122 configured for mode3, a configurable state machine will ramp up/down both regulators controlled by the MEN
pin. The PORB output can be configured to indicate various power up conditions. Individual Power Good output pins indicate
the regulator output being established.
In addition to mode2, mode3 supports the STANDBY mode entered by asserting the STANDBY pin. During standby, Buck1
and/or
2
will be turned off without sequencing. The configuration is configurable via OTP.
Pin Description
DEVSLPIN
This pin allows the IC to enter and exit SLEEP mode. Sleep mode is the lowest power state of the device and is activated when
DEVSLPIN is logic HIGH. The device will be on “normal operation” when DEVSLPIN is logic LOW. See figure 2 – Device Power States.
VINSEL
This pin allows the function of Buck 2 to be changed to a Switch function. Logic LOW on this pin puts the channel into Buck configuration,
and a Logic HIGH on this pin puts the channel into Switch configuration.
PVIN1, PVIN2
PVINx is each buck converters’ respective power supply input. They provide power to the internal MOSFETs for the switch mode regulator.
Their operating range is 2.7V to 5.5V, and a 10uF capacitor is be placed as close as possible to each of the respective pins. An second
10uF capacitor should be used with PVIN2 because of the greater current sourcing capability of this channel. Because capacitance
derates with voltage, a 10V rated X7R ceramic capacitors be used. X7R is preferred over X5R because the derating with X7R is less. For
best performance, each of these power supply inputs are to be connected together on a dedicated circuit board power plane, and that the
trace going from these pins to the dedicated power plane be made as short as possible. Y5V capacitors are not recommended because of
their general low performance with respect to temperature, voltage derating, and higher resistance at high frequency’s minimizing their
ability to filter out high frequency noise.
VIN
VIN is the power supply input for the rest of the integrated circuit. It too has an operating range of 2.7V to 5.5V, and a 2.2uF 10V rated
X7R capacitor should be placed as close as possible to its’ pin. VIN should also be tied to the same power plane that the PVINx pins are
tied to with as short a trace as possible. Y5V capacitors are highly not recommended.
PGND1, PGND2
These are the dedicated ground pins for each of the respective power supply’s. The traces from these pins, to a dedicated ground plane,
should be made as short as possible.
VGND
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IDTP9122
Advanced Datasheet
VGND is the ground pin for the rest of the integrated circuit. The trace from this pin, to a dedicated ground plane, should be made as short
as possible.
EP
This is the exposed pad on the bottom side of the IC. It needs to be connected to a circuit board ground plane to maximize the heat
dissipation performance of the IC.
VREF
The Vref pin is an internal voltage reference of the IC. It tracks the output voltage of Buck 1, at half its’ value. This voltage could be used
to interface to the negative input of a comparator as in Li-Ion low battery indicator applications, when the positive input of the comparator is
a voltage divided level from the battery’s positive node. At the moment of low battery indication, the comparator’s output changes state
from high to low, thereby, indicating a low battery state, and in turn, for example, then allows an electronic system to begin power down
operations. A 2.2uF 6.3V rated X7R capacitor is recommended at this pin.
FB1, FB2
FB1 and FB2 are the respective feedback pins of the output voltage for each buck converter. It is the control input for programming the
output voltage of each buck converter. Because of the IDTP9122’s output voltage programmability, the classical resistor divider network is
no longer needed, thereby saving six resistor components. The granularity of programmability of the outputs for each channel is 25mV all
the way from 0.8000V to 3.3375V. During layout, the feedback traces should be kept as short as possible and should never run parallel to
the inductors and the inductor trace leading to the inductor switching pin. Feedback traces should always cross inductor’s and inductor
traces on separate planes and at right angles.
LX1, LX2
LX1, LX2 are the switching pins of the respective buck converters. Small footprint chip inductors of 1uH in value have been optimized for
use with the IDTP9122, and connect to the switching pings. The inductors should be placed as close as possible to the LX pins
themselves.
GPIO14, GPIO15, GPIO17
These three pins have multiple function, but in the default state they serve as enable pins for each of the three buck converters accordingly:
GPIO14 enables Buck 1. Logic High enables Buck 1. Logic Low disables Buck 1. See Table 9 for alternate mode function.
GPIO15 See Table 9 for alternate mode function.
GPIO16 enables Buck 2. Logic High enables Buck 2. Logic Low disables Buck 2. See Table 9 for alternate mode function.
GPI3
This pin serves no function in default configuration, but when in Mode 2 or Mode 3 configuration, it serves as a master enable pin. I.e., this
pin alone will enable all bucks by the change in logic state on its’ pin. Logic High enables all the bucks with sequencing of all the bucks,
and Logic Low disables all the Bucks with sequencing of all the bucks. See Table 9 for details of GPIO14, GPIO15, GPO16, GOIO17
functionality when the GPI3 pin is configured.
GPO16
This pin serves as a Power on Reset pin or as a Buck 2 Power Good pin depending up whether the device is in Mode 0 or Mode 2 and
mode 3 respectively. See Table 9 for alternate mode function.
Component Selection
The IDTP9122 is a high performance dual DC-DC step down convertor that minimizes the solution size demands of miniature portable
electronic devices. It supports 2 outputs with currents up to 3A inside a 4mm x 4mm QFN package, and only requires 3 external
components per channel (Cin, Cout, L). Because it is designed to automatically switch to a pulse frequency modulation scheme at light
loads, the IDTP9122 is able to maintain high efficiency across the entire load range while providing ultra-fast load transient response.
Input Capacitor
A 10uF ceramic capacitor or greater should be placed close to each PVIN pin for each channel for bypassing. Its’ voltage rating should be
10V to accommodate any high frequency noise coming from 5V power supply source. The Kemet 0805C106K8RACTU is ideal based
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© 2014 Integrated Device Technology, Inc.
IDTP9122
Advanced Datasheet
upon performance, cost, and size. For the VIN pin, a 2.2uF 10V capacitor is sufficient because the VIN pin is powering the low power
internal circuitry of the IC.
Output Capacitor
A 10uF or greater ceramic capacitor should be placed close to each output inductor. Increasing the output capacitance will lower output
ripple and improve load transient response but could also increase solution size or cost. The voltage rating of the output capacitor should
be 6.3V and the C1206C106K9RACTU is recommended, but for more demanding space constrained designs, the Samsung
CL10B106MQ8NRNC is a good alternative.
Inductor Selection
The IDTP9122 has been designed for use with a 1.0uH inductor. A larger inductor will produce lower output voltage ripple, but a slightly
smaller inductor will produce faster transient response. The best compromise is a 1.0uH inductor. Selection of the inductor needs to
ensure maximum operating current not just the DC current, and can be rated for a 40°C temperature rise. This maximum operating
current or peak current for a buck converter can be calculated using equation 1
Ipeak = Iout [1 + r/2]
eq (1); where r is the inductor current ripple ratio and equal to
r = [ Vout (1 – Vout/Vin) ] / [ Iout * L * f ] eq (2); where L and f are the inductor and switching frequency. Simplifying gives equation 3:
Ipeak = Iout + Vout [ (1-Vout/Vin) / 2Lf) ] eq (3).
Equation 3 shows that the peak inductor current is inversely related to the switching frequency and inductance. In other words, the lower
the switching frequency or inductance, the higher the peak current. Peak current also increases as input voltage increases. The size of
the inductor depends on the application, and the recommended inductor is the Toko 1239AS-H-1R0M for best performance, size, and cost.
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IDTP9122
Advanced Datasheet
OTP Register Mapping (Bank T2)
The following table lists all configurable OTP registers available in the IDTP9122. Bank0 and Bank1 are IDT internal use only
trimming and calibration registers and not listed.
The registers can be programmed for evaluation purpose using the IDTP9122 Evaluation Kit (IDTP9122-EVAL) with the
included GUI software. The final production configuration will be programmed by IDT during final test.
Trim Bits
Parametric Trim
T2[0]
Buck1 Transconductance Selection: Relevant for all modes
0 : Nominal
1 : 3x transconductance
T2[1]
T2[2]
Buck1 Bandwidth Selection: Relevant for all modes
0 : Nominal
1 : 2x bandwidth
Buck1 Forced PWM Mode: Relevant for all modes
0 : Auto-switching between PWM & PFM modes
1 : Forced PWM mode
T2[5:3]
T2[6]
reserved
Buck2 Transconductance Selection:
0 : Nominal
1 : 3x transconductance
T2[7]
T2[8]
Buck2 Bandwidth Selection:
0 : Nominal
1 : 2x bandwidth
Buck2 Forced PWM Mode:
0 : Auto-switching between PWM & PFM modes
1 : Forced PWM mode
T2[10:9]
Power-Off Sequencer Delay 1: Relevant only when mode[1:0]≠’00’
00 : 0.5ms
01 : 1ms
10 : 2ms
11 : 4ms
T2[12:11]
Power-Off Sequencer Delay 2: Relevant only when mode[1:0]≠’00’
00 : 0.5ms
01 : 1ms
10 : 2ms
11 : 4ms
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IDTP9122
Advanced Datasheet
Trim Bits
Parametric Trim
T2[15:13]
Buck Power-Off Sequence Selection: Relevant only when mode[1:0]≠’00’
000 : wait Buck2 Buck1
001 : wait Buck1 Buck2
010 : Buck1 wait Buck2
011 : Buck1 Buck2 wait
100 : Buck2 Buck1 wait
101 : Buck2 wait Buck1
110 : Buck1 Buck2
111 : wait Buck1 & Buck2
T2[18:16]
PORB Output Boolean Operator Selection: PG=Power Good
000 : reserved
001 : PG1
010 : reserved
011 : PG2
100 : reserved
101 : PG1 & PG2
110 : reserved
111 : reserved
T2[19]
GPI3 Internal Pull-up Enable:
0 : Disable (1A pull-down to VGND)
1 : Enable (100kΩ pull-up to VIN)
T2[20]
T2[21]
Unused
GPIO14 Internal Pull-up Enable:
0 : Disable (1A pull-down to VGND when pin configured as input)
1 : Enable (50kΩ pull-up to supply voltage selected by gpio14_vio)
T2[22]
GPIO14 Open-Drain Output Select:
Relevant only when pin configured as output.
0 : Push-pull output
1 : Open-drain output
T2[23]
T2[24]
T2[25]
GPIO14 I/O Voltage Select: For both input buffer and push-pull output driver.
0 : VOUT2 (FB2)
1 : VOUT1 (FB1)
GPIO15 Internal Pull-up Enable:
0 : Disable (1A pull-down to VGND when pin configured as input)
1 : Enable (50kΩ pull-up to supply voltage selected by gpio15_vio)
GPIO15 Open-Drain Output Select:
Relevant only when pin configured as output.
0 : Push-pull output
1 : Open-drain output
T2[26]
T2[27]
GPIO15 I/O Voltage Select: For both input buffer and push-pull output driver.
0 : VOUT2 (FB2)
1 : VOUT1 (FB1)
GPO16 Internal Pull-up Enable:
0 : Disable
1 : Enable (50kΩ pull-up to supply voltage selected by gpo16_vo)
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IDTP9122
Advanced Datasheet
T2[28]
T2[29]
T2[30]
T2[31]
GPO16 Open-Drain Output Select:
0 : Push-pull output
1 : Open-drain output
GPO16 Output Voltage Select: For push-pull output driver.
0 : VOUT2 (FB2)
1 : VOUT1 (FB1)
GPIO17 Internal Pull-up Enable:
0 : Disable (1A pull-down to VGND when pin configured as input)
1 : Enable (50kΩ pull-up to supply voltage selected by gpio17_vio)
GPIO17 Open-Drain Output Select:
Relevant only when pin configured as output.
0 : Push-pull output
1 : Open-drain output
T2[32]
T2[33]
GPIO17 I/O Voltage Select: For both input buffer and push-pull output driver.
0 : VOUT2 (FB2)
1 : VOUT1 (FB1)
VREF Output Disable:
0 : VREF = 0.5 x VOUT1(FB1)
1 : VREF output disabled
OTP Register Mapping (Bank T3)
Trim
Bits
Parametric Trim
T3[1:0]
Device I/O Configuration and Control:
00 : Individual regulator enable via pins
01 : reserved
10 : Master enable control with programmable sequencing
11 : Master enable control with programmable sequencing
+ SLEEP mode support
T3[2]
TSD & UVLO Fault Disable:
Used for device characterization and burn-in only.
0 : Fault event shuts down all Buck regulators (programmed sequence)
1 : Fault ignored
T3[5:3]
Buck Power-On Sequence Selection: Relevant only when mode[1:0]≠’00’
000 : wait Buck2 Buck1
001 : Buck2 Buck1 wait
010 : Buck2 wait Buck1
011 : Buck1 Buck2 wait
100 : wait Buck1 Buck2
101 : Buck1 wait Buck2
110 : Buck2 Buck1
111 : Buck1 & Buck2 wait
T3[6]
Buck1 SLEEP Mode Support: Relevant only when mode[1:0]=‘11’
0 : Buck1 not affected by SLEEP mode
1 : Buck1 supports SLEEP mode control
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© 2014 Integrated Device Technology, Inc.
IDTP9122
Advanced Datasheet
T3[7]
T3[8]
reserved
Buck2 SLEEP Mode Support: Relevant only when mode[1:0]=‘11’
0 : Buck2 not affected by SLEEP mode
1 : Buck2 supports SLEEP mode control
Trim
Bits
Parametric Trim
T3[10:9]
Power-On Sequencer Delay 1: Relevant only when mode[1:0]≠’00’
00 : 0.5ms
01 : 1ms
10 : 2ms
11 : 4ms
T3[12:11]
Power-On Sequencer Delay 2: Relevant only when mode[1:0]≠’00’
00 : 0.5ms
01 : 1ms
10 : 2ms
11 : 4ms
T3[19:13]
T3[26:20]
T3[33:27]
Vout1
000d : 1.800V(vout1) / 3.300V(vout2)
001d : 0.800V
002d : 0.825V
reserved
Vout2
003d : 0.850V
:
:
:
:
100d : 3.275V
101d : 3.300V
102d : 3.325V
≥103d : 3.3375V
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© 2014 Integrated Device Technology, Inc.
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IDTP9122
Advanced Datasheet
APPLICATION INFORMATION
Figure 7. Minimum component schematic of IDTP9122.
Package Information
Please refer to the documents located under http://www.idt.com/package/nbg24 for detailed package outline, recommended
footprint, carrier and RoHS information. IDTP9120 is using the P1-NBG24 package option (EP size: 2.8mm)
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© 2014 Integrated Device Technology, Inc.
IDTP9122
Advanced Datasheet
www.IDT.com
6024 Silver Creek Valley Road
San Jose, California 95138
Tel: 800-345-7015
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All
information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the
described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided
without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of
merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT
or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly
affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks u20141os and designs, are the property of IDT or their respective third
party owners.
© Copyright 2014. All rights reserved.
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© 2014 Integrated Device Technology, Inc.
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