ZAMC4100GA2R [IDT]
Actuator and Motor Controller;
| 型号： | ZAMC4100GA2R |
| 厂家： | 
INTEGRATED DEVICE TECHNOLOGY |
| 描述： | Actuator and Motor Controller |
| 文件： | 总155页 (文件大小：2852K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZAMC4100
Actuator and Motor Controller
Datasheet
Brief Description
Benefits
The ZAMC4100 Actuator and Motor Controller is an
integrated, single package solution that features a
high-performance ARM® Cortex™-M0* microcon-
troller (MCU), a 10-bit ADC, four general purpose
analog inputs, four half-bridge drivers, four high-side
switches, one output buffer for electrochromatic (EC)
mirror control with programmable output voltage (6
bit DAC), current source for external diode-based
temperature measurements, switchable voltage
source for external resistive sensors, and LIN (Local
Interconnect Network) bus interface.
•
Multi-chip-module concept with high functional
integrity
•
•
Low number of external components
Small footprint plastic QFN package with
exposed pad allowing better thermal
management
•
•
AEC-Q100 qualified product, optimized for
automotive environment
Smart power management concept for achieving
low sleep current consumption (<80µA)
This single-package solution with its rich diagnostic
features, optimized thermal performance, and LIN
bus interface, is well suited for automotive applica-
tions, such as high-end automotive exterior mirror
controllers, where small form-factor circuit board
designs and light wiring harnesses are required.
Available Support
•
•
•
Data sheet and application notes
Evaluation and Application Kits
Software Development Kit (SDK)
Physical Characteristics
Features
•
•
•
Ambient operation temperature: -40°C to +85°C
Wide power supply voltage range: 6V to 18V
Plastic QFN64 9x9mm package; exposed die pad
•
Two main operation modes
§
§
NORMAL Mode with all functionality
available
ZAMC4100
PQFN64ꢀTOPꢀVIEW
SLEEP Mode with very low current
consumption (less than 80µA)
•
•
10-bit ADC for measuring various parameters
4 general purpose ADC inputs configurable for
absolute or ratiometric mode
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
HB2a
VSS3
HB1b
VDDE2
VDDE3
HS1a
VDDE4
VDDE5
HS2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TCK
TMS
TDO
TDI
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
n.c.
•
4 low RDS (ON) half-bridge drivers and 4 low
RDS (ON) high-side switches
•
•
•
Analog EC mirror output controlled via 6-bit DAC
All outputs short circuit protected
EXPOSEDꢀPAD
(pinꢀ65)
Hardware 8-bit PWM control for half-bridge and
high-side drivers
HS1b
VDDE6
VDDE7
HB1a
HS3
VSS2
HB2b
•
•
•
Over-temperature protection with automatic
driver shut-down
CAP_MCU
CAP_3V3
CAP_1V8
Over-voltage and under-voltage detection with
automatic driver shut-down
Overload and open/short diagnostic for all
outputs
•
•
•
Embedded LIN 2.2/SAE J2602-2 transceiver
Embedded ARM® Cortex™-M0 microcontroller
8 user-configurable GPIO pins
* Note: The ARM® and Cortex™ trademarks are owned by ARM, Ltd.
© 2016 Integrated Device Technology, Inc.
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ZAMC4100
Actuator and Motor Controller
Datasheet
Typical Applications
ZAMC4100 Application Circuit for
Automotive Mirror Control
•
Automotive exterior rear view
mirror controllers
•
•
Intelligent DC motor drivers
R4
D1
C2
C1
C3
T1
Stand alone or slave actuator
controllers
Vbat
•
•
Power management for low
voltage electrical systems
C4
R5
Single chip solution for
optimized white goods’
controllers
CAP_CP VDDE VDDE1-8
CAP_5V0
HB1
M
HB2
HB3
C5
M
M
HB4
S_P
CAP_3V3
CAP_1V8
CAP_MCU
C6
C7
C8
P2
R3
R2
AIN1
AIN2
P1
S_N
Turn signal
HS4
ZAMC4100
GPIO0
Puddle lamp
BSD lamp
Heater
HS3
HS2
GPIO7
LIN
D2
C9
VSS_LIN
HS1
AIN3/TEMP1
AIN4/TEMP2
EC_RES
R1
ext. temp
_
EC M
VSSA VSSD1-2 VSS_IO VSS1-5
T2
EC Mirror
Note: Refer to the ZAMC4100 Data Sheet
for the values and functions of the external
components in the application circuit.
GND
Multi-Chip-Module Assembly: Microcontroller Unit (MCU) and System Basis Chip (SBC)
External pin bonding wires
Off-chip bonding wires
SBC
MCU
Exposed pad
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ZAMC4100 Datasheet
ZAMC4100 Block Diagram
TEST
TRSTN
TCK
TEST
TRSTN
TCK
System Basis Chip
SBC Analog
MCU chip
VSS_LIN
LIN
TEST
&
TEST CONTROL
LIN PHY
TMS
TDI
TMS
STO
FLASH PROGRAMMING
CONTROL
S_P
S_N
TDO
Analog Front-End
AIN1
SBC Dig. Core
TXD
TXD
SAR
ADC
LIN wake-up
Diagnostic & Control
AIN2
UART
Vref
AIN3/TEMP1
AIN4/TEMP2
VSSA
RXD
MCU_CLK
RXD
AFE Ctrl. & Data Path
Clk & Reset Ctrl
PORB
OVRV
Clk & Rst ctrl
GPIO0
POR
UNDV
GPIO1
OVRT
IRQ Ctrl
MCU_RSTN
WDT
GPIO2
VDDE
OSCL 125kHz
IRQN
DBGEN
CSN
GPIO3
IRQ Ctrl
Reg File
VSSD1
ARM Cortex M0
OSCH 20MHz
BG & Ref
GPIO4
GPIO5
VSS_IO
SPI Slave
& Control Logic
SPI_CLK
GPIO6
VDD1V8
VDD2V5
VDD3V3
VDD5V0
SPI
Master/Slave
CAP_1V8
CAP_5V0
CAP_3V3
CAP_CP
MOSI
MISO
GPIO7
Diagnostic
Analog Back-End Control
TIMER modules
RAM 2KB
DAC
Ctrl
Driver
CTRL
PWM
Charge Pump
Analog Back-End
Lamp & Defogger Driver
Motor driver
1V8_MCU
3V3_MCU
FLASH
32KB
CAP_MCU
VDDE1..8
VSS1..5
256B emulated
EEPROM (optional)
SENSORS INTERFACE PINS
DESCRIPTION
S_P
Positive supply for sensors (5V)
Negative supply for sensors (0V)
General purpose ADC input
General purpose ADC input
S_N
AIN1
AIN2
AIN3/TEMP1
AIN4/TEMP2
General purpose ADC input/temperature sensor input
General purpose ADC input/temperature sensor input
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ZAMC4100 Datasheet
ACTUATORS
INTERFACE PINS
COMMUNICATION
INTERFACE PINS
DESCRIPTION
DESCRIPTION
HB1a
HB1b
LIN
LIN bus
Output of half-bridge driver 1
GPIO0 to GPIO7
General purpose I/O pins
HB2a
TEST INTERFACE
PINS
Output of half-bridge driver 2
DESCRIPTION
HB2b
HB3
Output of half-bridge driver 3
Output of half-bridge driver 4
TEST
Global test enable pin
JTAG Low-active Reset
JTAG clock
HB4
TRSTN
TCK
HS1a
Output of high-side switch 1
HS1b
TMS
JTAG Mode Select
HS2
Output of high-side switch 2
Output of high-side switch 3
Output of high-side switch 4
Output for EC mirror control
Connection to external resistor for EC
DESCRIPTION
TDO
JTAG data out pin
HS3
TDI
JTAG data in pin
HS4
STO
SBC test data out
EC_M
EC_RES
SERVICE PINS
SUPPLY PINS
VDDE
DESCRIPTION
Supply for the system
High current supply for the drivers
High current ground for drivers
VDDE1 to VDDE8
VSS1 to VSS5
Connection to external capacitor for 5V
(SBC analog core supply)
CAP_5V0
CAP_3V3
CAP_1V8
CAP_MCU
Connection to external capacitor for 3.3V
(MCU peripheral supply)
Ground for LIN transceiver
VSS_LIN
VSSA
Connection to external capacitor for 1.8V
(SBC digital core supply)
Ground for analog blocks (low noise)
Ground for digital blocks of SBC
Connection to external capacitor for 1.8V
(MCU core supply)
VSSD1
CAP_CP
Connection to external capacitor for CP
Connected to digital ground
VSSD2
Ground for MCU
EXPOSED PAD
VSS_IO
Ground for SBC digital IOs
Ordering Information
Product Sales Code
ZAMC4100GA2R
Description
Package
ZAMC4100GA PQFN64 – Temperature range: -40°C to +85°C
ZAMC4100GA PQFN64 – Temperature range: -40°C to +85°C
13” Tape and Reel
Tray
ZAMC4100GA2V
ZAMC4100 Evaluation Kit V2.0 including the ZAMC4100 Evaluation Board; software available at www.IDT.com/ZAMC4100
ZAMC4100 Application Kit V1.0 including the ZAMC4100 Application Board
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
Sales
Tech Support
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
www.IDT.com/go/support
www.IDT.com
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
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ZAMC4100 Datasheet
Contents
1ꢀ IC Characteristics.......................................................................................................................................... 14ꢀ
1.1.ꢀ Absolute Maximum Ratings.................................................................................................................... 14ꢀ
1.2.ꢀ Electrical Parameters ............................................................................................................................. 15ꢀ
1.2.1.ꢀ Supply and Supply Monitoring ......................................................................................................... 15ꢀ
1.2.2.ꢀ Digital Interface (GPIOs).................................................................................................................. 17ꢀ
1.2.3.ꢀ LIN Physical Layer........................................................................................................................... 17ꢀ
1.2.4.ꢀ Output Drivers.................................................................................................................................. 18ꢀ
1.2.5.ꢀ Internal Reference Sources and Sensors........................................................................................ 21ꢀ
1.2.6.ꢀ Analog-to-Digital Converter.............................................................................................................. 22ꢀ
1.3.ꢀ Timing Parameters ................................................................................................................................. 22ꢀ
1.3.1.ꢀ Oscillators (OSCL and OSCH)......................................................................................................... 22ꢀ
1.3.2.ꢀ Analog-to-Digital Converter.............................................................................................................. 23ꢀ
1.3.3.ꢀ SPI Bus Timing ................................................................................................................................ 24ꢀ
1.3.4.ꢀ System Power-up Timing................................................................................................................. 25ꢀ
1.4.ꢀ MCU Flash Memory Parameters............................................................................................................ 26ꢀ
2ꢀ System Blocks Description............................................................................................................................ 27ꢀ
2.1.ꢀ Power Supply ......................................................................................................................................... 27ꢀ
2.2.ꢀ High-Frequency and Low-Frequency Oscillator ..................................................................................... 28ꢀ
2.3.ꢀ Watchdog Timer ..................................................................................................................................... 28ꢀ
2.4.ꢀ Analog-to-Digital Converter .................................................................................................................... 28ꢀ
2.5.ꢀ Output Drivers ........................................................................................................................................ 29ꢀ
2.6.ꢀ Driver’s Power Capability and Package Temperature............................................................................ 29ꢀ
2.7.ꢀ LIN Interface........................................................................................................................................... 30ꢀ
2.8.ꢀ SPI Bus .................................................................................................................................................. 31ꢀ
2.9.ꢀ Diagnostic Functionalities....................................................................................................................... 31ꢀ
2.10.ꢀ Microcontroller ARM® Cortex™ M0....................................................................................................... 31ꢀ
2.10.1.ꢀ MCU GPIOs..................................................................................................................................... 32ꢀ
2.10.2.ꢀ MCU Timer Module.......................................................................................................................... 32ꢀ
2.10.3.ꢀ MCU SPI Master.............................................................................................................................. 32ꢀ
2.10.4.ꢀ MCU LIN Controller.......................................................................................................................... 32ꢀ
3ꢀ ZAMC4100 SBC Functional Description ....................................................................................................... 33ꢀ
3.1.ꢀ System Power-Up Sequence ................................................................................................................. 33ꢀ
3.2.ꢀ Clock and Reset Sources of the ZAMC4100.......................................................................................... 34ꢀ
3.2.1.ꢀ Clock Sources.................................................................................................................................. 34ꢀ
3.2.2.ꢀ Reset Sources ................................................................................................................................. 35ꢀ
3.3.ꢀ Watchdog Timer (WDT).......................................................................................................................... 38ꢀ
3.3.1.ꢀ WDT Structure and Operation Principals......................................................................................... 38
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ZAMC4100 Datasheet
3.3.2.ꢀ WDT during SLEEP and STANDBY Mode ...................................................................................... 40ꢀ
3.3.3.ꢀ WDT Configuration Register............................................................................................................ 40ꢀ
3.4.ꢀ System Supply Monitoring...................................................................................................................... 41ꢀ
3.4.1.ꢀ Over-Voltage and Under-Voltage Detection .................................................................................... 41ꢀ
3.4.2.ꢀ ZAMC4100 Operation during Over-Voltage..................................................................................... 42ꢀ
3.4.3.ꢀ ZAMC4100 Operation during Under-Voltage................................................................................... 42ꢀ
3.4.4.ꢀ Charge Pump Voltage Monitoring.................................................................................................... 42ꢀ
3.5.ꢀ ZAMC4100 System Operational Modes................................................................................................. 43ꢀ
3.5.1.ꢀ NORMAL Mode................................................................................................................................ 43ꢀ
3.5.2.ꢀ SLEEP Mode ................................................................................................................................... 44ꢀ
3.5.3.ꢀ STANDBY Mode.............................................................................................................................. 46ꢀ
3.5.4.ꢀ Supported Wake-up Sources........................................................................................................... 46ꢀ
3.5.5.ꢀ Operational Modes Control.............................................................................................................. 47ꢀ
3.6.ꢀ SBC Interrupts........................................................................................................................................ 49ꢀ
3.6.1.ꢀ SBC Interrupts: Enabling, Flagging, and Clearing Procedure.......................................................... 50ꢀ
3.6.2.ꢀ SBC Global Interrupts Registers...................................................................................................... 50ꢀ
3.7.ꢀ Serial Peripheral Interface (SPI) Bus Interface ...................................................................................... 54ꢀ
3.7.1.ꢀ SBC and MCU SPI Connection Principles....................................................................................... 55ꢀ
3.7.2.ꢀ SPI Write Access ............................................................................................................................. 56ꢀ
3.7.3.ꢀ SPI Pipelined Write/Read Access.................................................................................................... 57ꢀ
3.7.4.ꢀ SPI Read Access............................................................................................................................. 57ꢀ
3.7.5.ꢀ SPI Slave Status Byte...................................................................................................................... 58ꢀ
3.8.ꢀ Half-Bridge Drivers ................................................................................................................................. 59ꢀ
3.8.1.ꢀ Half-Bridge Drivers Control and Status Register ............................................................................. 60ꢀ
3.8.2.ꢀ Half-Bridge Over-Current Protection................................................................................................ 61ꢀ
3.8.3.ꢀ Half-Bridge Driver Output Diagnostic Check.................................................................................... 63ꢀ
3.9.ꢀ High-Side Drivers ................................................................................................................................... 65ꢀ
3.9.1.ꢀ High-Side Control and Status Register............................................................................................ 66ꢀ
3.9.2.ꢀ High-Side Over-Current Protection.................................................................................................. 66ꢀ
3.9.3.ꢀ High-Side Drivers Output Diagnostic Check.................................................................................... 66ꢀ
3.10.ꢀ Pulse Width Modulation (PWM) ............................................................................................................. 68ꢀ
3.10.1.ꢀ Overview.......................................................................................................................................... 68ꢀ
3.10.2.ꢀ PWM Signal Generation .................................................................................................................. 69ꢀ
3.10.3.ꢀ Drivers PWM Control ....................................................................................................................... 70ꢀ
3.10.4.ꢀ PWM Initialization ............................................................................................................................ 71ꢀ
3.10.5.ꢀ PWM Module in SLEEP and STANDBY Mode................................................................................ 72ꢀ
3.11.ꢀ EC Mirror Driver...................................................................................................................................... 72ꢀ
3.11.1.ꢀ ECM Driver Current/Voltage Limitation and Protection against Short to GND or Vbat.................... 73
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ZAMC4100 Datasheet
3.11.2.ꢀ ECM Control Register...................................................................................................................... 75ꢀ
3.11.3.ꢀ ECM Driver Output Diagnostic Check.............................................................................................. 76ꢀ
3.12.ꢀ ZAMC4100 Analog to Digital Converter ................................................................................................. 77ꢀ
3.12.1.ꢀ ADC Overview ................................................................................................................................. 77ꢀ
3.12.2.ꢀ ADC External Inputs Configuration.................................................................................................. 79ꢀ
3.12.3.ꢀ ADC Input MUX Control................................................................................................................... 81ꢀ
3.12.4.ꢀ ADC Voltage References and Result Calculation............................................................................ 84ꢀ
3.12.5.ꢀ ADC Configuration and ADC Status Register.................................................................................. 85ꢀ
3.12.6.ꢀ ADC Sample Rate............................................................................................................................ 88ꢀ
3.12.7.ꢀ ADC Single and Continuous Conversion......................................................................................... 88ꢀ
3.12.8.ꢀ ADC Result Formatting Options....................................................................................................... 89ꢀ
3.12.9.ꢀ ADC Comparator and Counter......................................................................................................... 91ꢀ
3.12.10.ꢀExternal ADC Analog Inputs Open/Short Diagnostics and Protection............................................. 92ꢀ
3.13.ꢀ LIN Physical Layer (LIN PHY) ................................................................................................................ 95ꢀ
3.13.1.ꢀ Overview.......................................................................................................................................... 95ꢀ
3.13.2.ꢀ LIN PHY Operation .......................................................................................................................... 96ꢀ
3.14.ꢀ SBC Registers........................................................................................................................................ 99ꢀ
3.14.1.ꢀ SBC Registers Address Map ......................................................................................................... 100ꢀ
3.14.2.ꢀ Registers Write Access Signatures................................................................................................ 101ꢀ
3.15.ꢀ SBC Trimming ...................................................................................................................................... 102ꢀ
4ꢀ ZAMC4100 MCU Functional Description .................................................................................................... 103ꢀ
4.1.ꢀ Overview .............................................................................................................................................. 103ꢀ
4.2.ꢀ Memory Organization ........................................................................................................................... 104ꢀ
4.2.1.ꢀ Accessing Invalid Memory Location............................................................................................... 105ꢀ
4.2.2.ꢀ FLASH Memory ............................................................................................................................. 105ꢀ
4.2.3.ꢀ INFO Area...................................................................................................................................... 107ꢀ
4.2.4.ꢀ RAM Memory 2kB.......................................................................................................................... 107ꢀ
4.3.ꢀ MCU Clock and Reset Sources............................................................................................................ 108ꢀ
4.4.ꢀ MCU INTERRUPTS ............................................................................................................................. 110ꢀ
4.4.1.ꢀ Interrupts Organization .................................................................................................................. 110ꢀ
4.4.2.ꢀ Interrupts Configuration ................................................................................................................. 111ꢀ
4.5.ꢀ GPIO Module........................................................................................................................................ 111ꢀ
4.5.1.ꢀ Overview........................................................................................................................................ 111ꢀ
4.5.2.ꢀ GPIO Input Mode (default)............................................................................................................. 111ꢀ
4.5.3.ꢀ GPIO Output Mode ........................................................................................................................ 112ꢀ
4.5.4.ꢀ GPIO as Timer Trigger Operation.................................................................................................. 112ꢀ
4.5.5.ꢀ GPIO Interrupt Functionality .......................................................................................................... 112ꢀ
4.5.6.ꢀ GPIO Registers.............................................................................................................................. 112ꢀ
4.6.ꢀ 32-Bit TIMER Module ........................................................................................................................... 112
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ZAMC4100 Datasheet
4.6.1.ꢀ Timer Mode (MODETC = 0)........................................................................................................... 113ꢀ
4.6.2.ꢀ Counter Mode (MODETC = 1) ....................................................................................................... 113ꢀ
4.6.3.ꢀ TIMER Module Interrupt................................................................................................................. 113ꢀ
4.6.4.ꢀ TIMER Module Registers............................................................................................................... 113ꢀ
4.7.ꢀ SysTick................................................................................................................................................. 113ꢀ
4.8.ꢀ Master SPI Module............................................................................................................................... 114ꢀ
4.8.1.ꢀ Overview........................................................................................................................................ 114ꢀ
4.8.2.ꢀ Setup Requirements for the Slave SPI of SBC.............................................................................. 114ꢀ
4.8.3.ꢀ SPI Data Transfer Process ............................................................................................................ 115ꢀ
4.8.4.ꢀ Continuous SPI Data Streaming.................................................................................................... 115ꢀ
4.8.5.ꢀ Abrupt SPI Discontinuity ................................................................................................................ 115ꢀ
4.8.6.ꢀ Interrupts and Status Flags in the Z1_SPISTAT Register ............................................................. 115ꢀ
4.8.7.ꢀ Syncing the Data Transfer Rate via a Software Pause.................................................................. 116ꢀ
4.8.8.ꢀ Master SPI Registers..................................................................................................................... 116ꢀ
4.9.ꢀ SW-LIN Module .................................................................................................................................... 117ꢀ
4.9.1.ꢀ The Inactivity Timer........................................................................................................................ 117ꢀ
4.9.2.ꢀ The BREAK/SYNC Field Detector ................................................................................................. 118ꢀ
4.9.3.ꢀ SW-LIN Data Unit .......................................................................................................................... 118ꢀ
4.9.4.ꢀ Description of the Receive Operation ............................................................................................ 119ꢀ
4.9.5.ꢀ Description of Transmit Operation ................................................................................................. 120ꢀ
4.9.6.ꢀ General Remarks for SW-LIN Usage............................................................................................. 122ꢀ
4.9.7.ꢀ SW-LIN Registers .......................................................................................................................... 122ꢀ
4.10.ꢀ MCU Registers Description .................................................................................................................. 123ꢀ
4.10.1.ꢀ System Registers........................................................................................................................... 123ꢀ
4.10.2.ꢀ GPIO Registers.............................................................................................................................. 125ꢀ
4.10.3.ꢀ 32 Bit Timer Registers ................................................................................................................... 128ꢀ
4.10.4.ꢀ SPI Registers................................................................................................................................. 130ꢀ
4.10.5.ꢀ SW-LIN Registers .......................................................................................................................... 132ꢀ
4.10.6.ꢀ FLASH Memory Registers ............................................................................................................. 136ꢀ
5ꢀ ZAMC4100 Protection and Diagnostic Features......................................................................................... 140ꢀ
5.1.ꢀ Full-Time Diagnostic and Protection Features ..................................................................................... 140ꢀ
5.1.1.ꢀ Over-Current (OC) Protection........................................................................................................ 140ꢀ
5.1.2.ꢀ Over-Load (OVL) Detection using the ADC................................................................................... 140ꢀ
5.1.3.ꢀ Over-Temperature (OVT) Protection ............................................................................................. 141ꢀ
5.1.4.ꢀ Over-Voltage (OV) Detection......................................................................................................... 141ꢀ
5.1.5.ꢀ Under-Voltage (UV) Detection ....................................................................................................... 141ꢀ
5.1.6.ꢀ Short to GND or Vbat Protection of Sensor Supply Pin S_P and Analog Input Pins AIN1 and
AIN2............................................................................................................................................... 141ꢀ
5.1.7.ꢀ OSCL Output Clock Failure Detection ........................................................................................... 141
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ZAMC4100 Datasheet
5.2.ꢀ MCU Activated Diagnostic Functions ................................................................................................... 142ꢀ
5.2.1.ꢀ Open-Load Detection..................................................................................................................... 142ꢀ
5.2.2.ꢀ Short to Vbat or GND Detection..................................................................................................... 142ꢀ
5.2.3.ꢀ Floating Analog Input Detection..................................................................................................... 142ꢀ
5.2.4.ꢀ Short or Open Sensor Supply Detection........................................................................................ 143ꢀ
5.2.5.ꢀ ADC Ratiometric Test .................................................................................................................... 143ꢀ
5.2.6.ꢀ ADC Test Absolute ........................................................................................................................ 143ꢀ
5.2.7.ꢀ Reference Voltage Test ................................................................................................................. 144ꢀ
5.2.8.ꢀ 5.0V Supply Test............................................................................................................................ 144ꢀ
5.2.9.ꢀ 2.5V Supply Test............................................................................................................................ 144ꢀ
5.2.10.ꢀ Current Multiplexer Test................................................................................................................. 145ꢀ
6ꢀ Application Circuit and External Components............................................................................................. 146ꢀ
6.1.ꢀ Application Circuit Diagram for Mirror Controller.................................................................................. 146ꢀ
6.2.ꢀ External Components for Automotive Mirror Control Application ......................................................... 147ꢀ
7ꢀ Multi-chip Module Assembly, Pin Layout, and Pin Assignments................................................................. 148ꢀ
8ꢀ ZAMC4100 Outline Dimensions: Plastic QFN64 9x9mm (Package Type 1) .............................................. 152ꢀ
9ꢀ Ordering Information ................................................................................................................................... 153ꢀ
10ꢀ Related Documents..................................................................................................................................... 153ꢀ
11ꢀ Glossary...................................................................................................................................................... 153ꢀ
12ꢀ Document Revision History......................................................................................................................... 155ꢀ
List of Figures
Figure 1.1ꢀ ADC Timing Parameters Definition.................................................................................................. 23ꢀ
Figure 1.2ꢀ SPI Communication Timing Diagram............................................................................................... 24ꢀ
Figure 1.3ꢀ ZAMC4100 System Power-Up Sequence ....................................................................................... 25ꢀ
Figure 2.1ꢀ ZAMC4100 Supply Structure........................................................................................................... 27ꢀ
Figure 2.2ꢀ ZAMC4100 LIN Interface and Open Systems Interconnection (OSI) Layers Coverage.................. 30ꢀ
Figure 2.3ꢀ LIN Slave Node Implementation in the ZAMC4100......................................................................... 30ꢀ
Figure 3.1ꢀ SBC Power-Up State Diagram ........................................................................................................ 33ꢀ
Figure 3.2ꢀ ZAMC4100 Clock Sources .............................................................................................................. 35ꢀ
Figure 3.3ꢀ ZAMC4100 Reset Sources.............................................................................................................. 36ꢀ
Figure 3.4ꢀ ZAMC4100 Watchdog Timer ........................................................................................................... 38ꢀ
Figure 3.5ꢀ WDT Operation................................................................................................................................ 39ꢀ
Figure 3.6ꢀ ZAMC4100 Operational Modes ....................................................................................................... 43ꢀ
Figure 3.7ꢀ ZAMC4100 SLEEP and STANDBY Mode Behavior........................................................................ 45ꢀ
Figure 3.8ꢀ SBC Interrupt Logic Organization.................................................................................................... 49ꢀ
Figure 3.9ꢀ MCU-to-SBC Connection via SPI .................................................................................................... 55
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Figure 3.10ꢀ SPI Frames...................................................................................................................................... 56ꢀ
Figure 3.11ꢀ SPI Single or Burst Access.............................................................................................................. 57ꢀ
Figure 3.12ꢀ Structure of the Half-Bridge Drivers................................................................................................. 59ꢀ
Figure 3.13ꢀ Operation Principle of Over-Current Counter Integrator.................................................................. 62ꢀ
Figure 3.14ꢀ Structure of High-Side Drivers......................................................................................................... 65ꢀ
Figure 3.15ꢀ PWM Block Diagram........................................................................................................................ 68ꢀ
Figure 3.16ꢀ PWM Output Signal ......................................................................................................................... 69ꢀ
Figure 3.17ꢀ Recommended PWM Initialization Procedure with HS3 as an Example......................................... 71ꢀ
Figure 3.18ꢀ Effect of Driver Enable When the PWM is Running......................................................................... 72ꢀ
Figure 3.19ꢀ ECM Driver Structure....................................................................................................................... 73ꢀ
Figure 3.20ꢀ ADC Functional Diagram................................................................................................................. 78ꢀ
Figure 3.21ꢀ Ratiometric versus Absolute Measurement Inputs Configuration.................................................... 79ꢀ
Figure 3.22ꢀ Using AIN3 and AIN4 for External Temperature Measurement....................................................... 80ꢀ
Figure 3.23ꢀ Pipelined Measurement and Results Reading for the Driver Current.............................................. 89ꢀ
Figure 3.24ꢀ ADC Result Formatting Options ...................................................................................................... 90ꢀ
Figure 3.25ꢀ ADC Analog Inputs Protection and Open/Short Detection Circuitry ................................................ 92ꢀ
Figure 3.26ꢀ LIN PHY Block Diagram .................................................................................................................. 95ꢀ
Figure 3.27ꢀ LIN Wake-up Detection Depending on the Value of the LINWUMD Bit........................................... 96ꢀ
Figure 3.28ꢀ SBC Register File Organization....................................................................................................... 99ꢀ
Figure 3.29ꢀ Structure of SBC Trimming Data ................................................................................................... 102ꢀ
Figure 4.1ꢀ Structure of FLASH Memory and Page Details ............................................................................. 105ꢀ
Figure 4.2ꢀ Example of RAMSPLIT Address Configuration ............................................................................. 108ꢀ
Figure 4.3ꢀ RESET and CLOCK between SBC and MCU ............................................................................... 109ꢀ
Figure 4.4ꢀ MCU Interrupt Logic Organization ................................................................................................. 110ꢀ
Figure 4.5ꢀ Master SPI Block Diagram............................................................................................................. 114ꢀ
Figure 4.6ꢀ SW-LIN Block Diagram.................................................................................................................. 117ꢀ
Figure 4.7ꢀ Structure of LIN Frame .................................................................................................................. 118ꢀ
Figure 4.8ꢀ Block Diagram of the LIN Data Unit............................................................................................... 118ꢀ
Figure 4.9ꢀ Frame Format of Each LIN Field (PID, DATA, Checksum) and RX Sample Position ................... 119ꢀ
Figure 4.10ꢀ RX Control and Status Signal Waveforms..................................................................................... 120ꢀ
Figure 4.11ꢀ Waveforms of the TX and RX Control and Status Signals ............................................................ 121ꢀ
Figure 6.1ꢀ ZAMC4100 Application Circuit for Automotive Mirror Control........................................................ 146ꢀ
Figure 7.1ꢀ ZAMC4100 Multi-chip-Module Assembly....................................................................................... 148ꢀ
Figure 7.2ꢀ Pin Layout for ZAMC4100 PQFN65 – Top View ........................................................................... 148ꢀ
Figure 8.1ꢀ ZAMC4100 Package Dimensions – Plastic QFN64....................................................................... 152ꢀ
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List of Tables
Table 1.1ꢀ Absolute Maximum Ratings............................................................................................................. 14ꢀ
Table 1.2ꢀ Thermal Specifications .................................................................................................................... 14ꢀ
Table 1.3ꢀ ESD Protection ................................................................................................................................ 15ꢀ
Table 1.4ꢀ Supply Voltages and Currents......................................................................................................... 15ꢀ
Table 1.5ꢀ System Resets and Supply Monitoring............................................................................................ 16ꢀ
Table 1.6ꢀ GPIO Electrical Characteristics ....................................................................................................... 17ꢀ
Table 1.7ꢀ LIN Electrical Parameters................................................................................................................ 17ꢀ
Table 1.8ꢀ Drivers Static Parameters................................................................................................................ 18ꢀ
Table 1.9ꢀ EC Driver Static Parameters............................................................................................................ 19ꢀ
Table 1.10ꢀ Drivers Dynamic Parameters........................................................................................................... 20ꢀ
Table 1.11ꢀ Internal Die Temperature Sensor .................................................................................................... 21ꢀ
Table 1.12ꢀ Internal Reference Sources............................................................................................................. 21ꢀ
Table 1.13ꢀ ADC and Analog Input Pins Static Parameters ............................................................................... 22ꢀ
Table 1.14ꢀ Timing Parameters: Low-Power Oscillator and High-Frequency Oscillator..................................... 22ꢀ
Table 1.15ꢀ ADC Timing Parameters.................................................................................................................. 23ꢀ
Table 1.16ꢀ ZAMC4100 SPI Bus Timing Parameters ......................................................................................... 24ꢀ
Table 1.17ꢀ System Power-up and Reset Timing Parameters............................................................................ 25ꢀ
Table 1.18ꢀ Flash Timing Parameters................................................................................................................. 26ꢀ
Table 3.1ꢀ RSTSTAT Register Bits Mapping .................................................................................................... 37ꢀ
Table 3.2ꢀ RSTSTAT Register Bits Description................................................................................................ 37ꢀ
Table 3.3ꢀ WDTCONF Register Bits Mapping .................................................................................................. 40ꢀ
Table 3.4ꢀ WDTCONF Register Bits Description.............................................................................................. 41ꢀ
Table 3.5ꢀ SMDCTRL Register Bits Mapping ................................................................................................... 47ꢀ
Table 3.6ꢀ SMDCTRL Register Bits Description............................................................................................... 48ꢀ
Table 3.7ꢀ IRQCTRL Register Bits Mapping..................................................................................................... 51ꢀ
Table 3.8ꢀ IRQCTRL Register Bits Description................................................................................................. 52ꢀ
Table 3.9ꢀ IRQSTAT Register Bits Mapping..................................................................................................... 53ꢀ
Table 3.10ꢀ IRQSTAT Register Bits Description................................................................................................. 53ꢀ
Table 3.11ꢀ SPI Lines Description ...................................................................................................................... 55ꢀ
Table 3.12ꢀ SPI Slave Status Bits Descriptions (SSB) ....................................................................................... 58ꢀ
Table 3.13ꢀ HBDCTRL Register Bits Mapping.................................................................................................... 60ꢀ
Table 3.14ꢀ HBDCTRL Bits Description.............................................................................................................. 60ꢀ
Table 3.15ꢀ HBDSTAT Register Bits Mapping.................................................................................................... 61ꢀ
Table 3.16ꢀ HBDSTAT Register Bit Descriptions................................................................................................ 61ꢀ
Table 3.17ꢀ HBDDIAG Register Bits Mapping .................................................................................................... 63ꢀ
Table 3.18ꢀ HBDDIAG Register Bits Description................................................................................................ 63ꢀ
Table 3.19ꢀ Half-Bridge Diagnostic Bit Descriptions........................................................................................... 64
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Table 3.20ꢀ HSDCTRL Register Bits Mapping.................................................................................................... 66ꢀ
Table 3.21ꢀ HSDCTRL Register Bits Description ............................................................................................... 66ꢀ
Table 3.22ꢀ HSDSTAT Register Bits Mapping.................................................................................................... 67ꢀ
Table 3.23ꢀ HSDSTAT Register Bits Description................................................................................................ 67ꢀ
Table 3.24ꢀ High-Side Diagnostic Bits Description ............................................................................................. 67ꢀ
Table 3.25ꢀ PWMDREN Register Bits Mapping.................................................................................................. 70ꢀ
Table 3.26ꢀ PWMDREN Register Bits Description ............................................................................................. 70ꢀ
Table 3.27ꢀ ECMCTRL Register Bits Mapping ................................................................................................... 75ꢀ
Table 3.28ꢀ ECMCTRL Register Bits Description............................................................................................... 75ꢀ
Table 3.29ꢀ ECMDIAG Register Bits Mapping.................................................................................................... 76ꢀ
Table 3.30ꢀ ECMDIAG Register Bits Description................................................................................................ 76ꢀ
Table 3.31ꢀ ECMOSF Diagnostic Bit Meaning.................................................................................................... 77ꢀ
Table 3.32ꢀ AINCONF Register Bits Mapping .................................................................................................... 80ꢀ
Table 3.33ꢀ AINCONF Register Bits Description ................................................................................................ 81ꢀ
Table 3.34ꢀ ADCCTRL Register Bits Mapping.................................................................................................... 82ꢀ
Table 3.35ꢀ ADCCTRL Register Bits Description ............................................................................................... 82ꢀ
Table 3.36ꢀ Input MUX Control Bits Description ................................................................................................. 83ꢀ
Table 3.37ꢀ ADCCONF Register Bits Mapping................................................................................................... 86ꢀ
Table 3.38ꢀ ADCCONF Register Bits Description............................................................................................... 86ꢀ
Table 3.39ꢀ ADCSTAT Register Bits Mapping.................................................................................................... 87ꢀ
Table 3.40ꢀ ADCSTAT Register Bits Description................................................................................................ 87ꢀ
Table 3.41ꢀ ADC Sample-Rate Configuration..................................................................................................... 88ꢀ
Table 3.42ꢀ ADCCMPH and ADCCMPL Bits Description................................................................................... 91ꢀ
Table 3.43ꢀ AINDIAG Register Bits Mapping...................................................................................................... 93ꢀ
Table 3.44ꢀ AINDIAG Register Bits Description.................................................................................................. 93ꢀ
Table 3.45ꢀ External ADC Inputs Diagnostic Bits Description ............................................................................ 94ꢀ
Table 3.46ꢀ LINCTRL Registers Bit Mapping..................................................................................................... 97ꢀ
Table 3.47ꢀ LINCTRL Registers Bits Description................................................................................................ 98ꢀ
Table 3.48ꢀ LINSTAT Register Bits Mapping...................................................................................................... 98ꢀ
Table 3.49ꢀ LINSTAT Register Bits Mapping...................................................................................................... 98ꢀ
Table 3.50ꢀ SBC Registers Address Map......................................................................................................... 100ꢀ
Table 4.1ꢀ MCU Memory Map......................................................................................................................... 104ꢀ
Table 4.2ꢀ INFO Page 0 Structure .................................................................................................................. 107ꢀ
Table 4.3ꢀ MCU Peripheral Interrupts............................................................................................................. 111ꢀ
Table 4.4ꢀ Configuration of Timer Trigger Behavior........................................................................................ 113ꢀ
Table 4.5ꢀ Register [0x4000_0000] SYS_CLKCFG........................................................................................ 123ꢀ
Table 4.6ꢀ Register [0x4000_0004] SYS_MEMPORTCFG ............................................................................ 123ꢀ
Table 4.7ꢀ Register [0x4000_0008] SYS_MEMINFO ..................................................................................... 124
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Table 4.8ꢀ Register [0x4000_000C] SYS_RSTSTAT ..................................................................................... 124ꢀ
Table 4.9ꢀ Register [0x4000_1400] GPIO_DIR .............................................................................................. 125ꢀ
Table 4.10ꢀ Register [0x4000_1404] GPIO_IN................................................................................................. 125ꢀ
Table 4.11ꢀ Register [0x4000_1408] GPIO_OUT............................................................................................. 126ꢀ
Table 4.12ꢀ Register [0x4000_140C] GPIO_SETCLR...................................................................................... 126ꢀ
Table 4.13ꢀ Register [0x4000_1410] GPIO_IRQSTAT..................................................................................... 126ꢀ
Table 4.14ꢀ Register [0x4000_1414] GPIO_IRQEN ......................................................................................... 127ꢀ
Table 4.15ꢀ Register [0x4000_1418] GPIO_IRQEDGE.................................................................................... 127ꢀ
Table 4.16ꢀ Register [0x4000_141C] GPIO_TRIGEN ...................................................................................... 127ꢀ
Table 4.17ꢀ Register [0x4000_1000] T32_CTRL.............................................................................................. 128ꢀ
Table 4.18ꢀ Register [0x4000_1004] T32_TRIGSEL........................................................................................ 129ꢀ
Table 4.19ꢀ Register [0x4000_1008] T32_CNT................................................................................................ 129ꢀ
Table 4.20ꢀ Register [0x4000_100C] T32_REL................................................................................................ 129ꢀ
Table 4.21ꢀ Register [0x4000_1820] Z1_SPICFG............................................................................................ 130ꢀ
Table 4.22ꢀ Register [0x4000_1824] Z1_SPIDATA.......................................................................................... 130ꢀ
Table 4.23ꢀ Register [0x4000_1828] Z1_SPICLKCFG..................................................................................... 131ꢀ
Table 4.24ꢀ Register [0x4000_182C] Z1_SPISTAT.......................................................................................... 131ꢀ
Table 4.25ꢀ Register [0x4000_1800] Z1_LINCFG ............................................................................................ 132ꢀ
Table 4.26ꢀ Register [0x4000_1804] Z1_LINSTAT........................................................................................... 133ꢀ
Table 4.27ꢀ Register [0x4000_1808] Z1_LINDATA .......................................................................................... 134ꢀ
Table 4.28ꢀ Register [0x4000_180C] Z1_LINIRQEN........................................................................................ 134ꢀ
Table 4.29ꢀ Register [0x4000_1810] Z1_LINBAUDLOW.................................................................................. 135ꢀ
Table 4.30ꢀ Register [0x4000_1814] Z1_LINBAUDHIGH................................................................................. 135ꢀ
Table 4.31ꢀ Register [0x4000_0800] FC_RAM_ADDR..................................................................................... 136ꢀ
Table 4.32ꢀ Register [0x4000_0804] FC_FLASH_ADDR................................................................................. 136ꢀ
Table 4.33ꢀ Register [0x4000_080C] FC_EXE_CMD....................................................................................... 136ꢀ
Table 4.34ꢀ Register [0x4000_0808] FC_CMD_SIZE....................................................................................... 137ꢀ
Table 4.35ꢀ Register [0x4000_0810] FC_IRQ_EN ........................................................................................... 137ꢀ
Table 4.36ꢀ Register [0x4000_0814] FC_STAT_CORE ................................................................................... 138ꢀ
Table 4.37ꢀ Register [0x4000_0818] FC_STAT_PROG................................................................................... 139ꢀ
Table 4.38ꢀ Register [0x4000_081C] FC_STAT_DATA .................................................................................. 139ꢀ
Table 6.1ꢀ Parameters for External Components in Typical Automotive Mirror Control Application............... 147ꢀ
Table 7.1ꢀ Pin Description............................................................................................................................... 149ꢀ
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ZAMC4100 Datasheet
1
IC Characteristics
1.1. Absolute Maximum Ratings
Stresses above those listed in this clause may cause immediate and permanent device failure. It is not implied
that more than one of these conditions can be applied simultaneously. Operation outside the operating ranges for
extended periods may affect device reliability. Total cumulative dwell time above the maximum operating rating
for power supply or temperature must be less than 100 hours.
Table 1.1 Absolute Maximum Ratings
Parameter
Symbol
Value
UNIT
Supply Voltage
System supply voltage
VVDDE
-0.3 to 28
-0.3 to 40
V
V
System supply voltage under transient conditions
VVDDE_max
Input Pin Voltage
AIN1-4
VIN(ANALOG)
VIN(MCU)
-0.3 to 5.5
-0.3 to 3.6
V
V
GPIO0-7
LIN Bus Voltage
Bus voltage
VBUS(SS)
VBUS(PK)
-18 to 40
V
V
Transient input voltage (per ISO7637 Specification)
GPIO Supply current
-150 to 100
Total GPIO sink/source current (referenced to 3.3V)
IGPIO
5
mA
Table 1.2 Thermal Specifications
Parameter
Symbol
Value
UNIT
Thermal Ratings
Operating ambient temperature
Operating junction temperature 1), 2)
Storage temperature
TA
TJ
-40 to 85
-40 to 125
-40 to 150
˚C
˚C
˚C
TSTG
Thermal Characteristics
Thermal resistance junction to case 3),4)
Thermal resistance junction to ambient 3),4)
ΘJC
ΘJA
0.4
21
˚C/W
˚C/W
1)
The limiting factor is the operating temperature of the FLASH memory within the MCU where the data retention is guaranteed for temperatures up to
85˚C. In order to keep the MCU temperature below 85˚C when the SBC is running at maximum temperature, the application should provide a sufficient
heat sink. For more information, contact IDT technical support.
2)
3)
4)
The device will automatically shut down the drivers at 125°C.
IDT uses test boards in conformance with the JESD51-7 (JEDEC) for thermal impedance measurement.
This value applies for the JEDEC board profile and specific environment only for package performance comparison. Care should be taken when apply-
ing in the actual application where the printed circuit board (PCB) profile and environment are different. Contact IDT technical support for assistance.
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ZAMC4100 Datasheet
Table 1.3 ESD Protection
Test Method
Guaranteed ESD/Latch-up
Robustness on IC Level
Test Setup Standard
HBM (Human Body Model)
MIL 883C, Method 3015.7
or EIA/JESD22A114-A
± 2kV (all pins) with 100pF and 1.5kΩ
CDM (Charged Device Model)
System Level (Human Body Discharge)
Latch-up
AEC – Q100 – 011 Rev. B
IEC 61000-4-2
± 500V (all pins)
± 6kV for LIN(1) and VBAT(2)
100mA@25˚C
EIA/JESD78A
(1) External circuitry is required for meeting the system-level ESD specification for the LIN interface.
(2) VBAT is the common supply terminal on the application PCB where all ZAMC4100 supply pins are connected.
1.2.
Electrical Parameters
Note: Parameters are specified for junction temperature range -40°C to 125°C unless otherwise stated.
1.2.1.
Supply and Supply Monitoring
Table 1.4 Supply Voltages and Currents
Parameter
Symbol
Min.
Typ.
Max.
Unit
Supply Voltage Range (voltage drop in external circuitry not included)
Nominal operating voltage
VSUP
6
7
-
-
18
18
V
V
LIN operating voltage
VSUP_LIN
Supply Current Range
NORMAL Mode
IRUN
ISTBY
ISLEEP
-
-
-
14
10
-
-
-
mA
mA
µA
STANDBY Mode
SLEEP Mode (measured at TJ=27°C; VSUP=13V through all VSS pins)
Switchable Analog Supply Voltage (to S_P pin)
Voltage range (S_P pin unloaded)
Voltage range (S_P pin loaded with 5mA)
Nominal output current
80
VSP
VSP_5mA
ISP
4.5
3.8
0
5
4.5
-
5.5
5.2
5
V
V
mA
mA
Current limitation in case of short to GND
GPIO Supply Voltage
ISP_OC
6
-
9
Voltage range
VGPIO
2.97
3.3
3.63
V
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ZAMC4100 Datasheet
Charge Pump
Charge pump output voltage (with respect to VDDE1; drivers disabled)
Charge pump output current (through CAP_CP pin)
External Capacitor Pins Voltage
VCP
4.5
-
5.0
-
5.5
10
V
ICAP_CP
µA
REG5V0 capacitor pin CAP_5V0
VCAP_5V0
VCAP_3V3
VCAP_1V8
VCAP_MCU
VCAP_CP
4.5
2.97
1.62
1.62
4.3
5.0
3.3
1.8
1.8
-
5.5
3.63
1.98
1.98
5.5
V
V
V
V
V
REG3V3 capacitor pin CAP_3V3
REG1V8 capacitor pin CAP_1V8 (on SBC side)
REG1V8 capacitor pin CAP_MCU (on MCU side)
Charge pump capacitor pin CAP_CP (with respect to VDDE1 pin)
Table 1.5 System Resets and Supply Monitoring
Parameter
Power-On Reset
Threshold 1)
Symbol
Min.
Typ.
Max.
Unit
PORTH
4.2
0.2
4.5
0.3
4.8
0.4
V
V
Hysteresis
PORHYST
Under-Voltage Detection
Threshold 1)
UVDTH
5.7
6.0
0.2
6.3
0.3
V
V
Hysteresis
UVDHYST
0.05
Over-Voltage Detection
Threshold 1)
OVDTH
17.7
0.3
18.6
0.5
19.5
0.7
V
V
Hysteresis
OVDHYST
Over-Temperature Drivers Shut-Down
Threshold 2)
OVTTH
-
-
125
5
-
-
°C
°C
Hysteresis 2)
OVTHYST
1)
2)
These parameters are defined with respect to the potential at the VDDE pin.
Junction temperature of the SBC chip. Parameter guaranteed by process monitoring but not tested during production.
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ZAMC4100 Datasheet
1.2.2.
Digital Interface (GPIOs)
Table 1.6 GPIO Electrical Characteristics
Parameter
Symbol
VIL
Min.
-0.3
2
Typ.
Max.
0.8
3.6
1.6
1.3
1
Unit
V
Input low voltage
-
Input high voltage
VIH
-
V
Schmitt Trigger Low to High Threshold Point
Schmitt Trigger High to Low Threshold Point
Input leakage current (at VI =3.3V or 0V)
Tri-state output leakage current (at VI =3.3V or 0V)
Output low voltage
VT+
1.4
1.1
-1
1.5
V
VT-
1.2
V
II
-
-
-
-
-
-
µA
µA
V
IOZ
-1
1
VOL
VOH
ISOURCE
ISINK
-
0.4
-
Output high voltage
2.4
-
V
Single GPIO source current
5
mA
mA
Single GPIO sink current
-
5
1.2.3.
LIN Physical Layer
Note: LIN parameters are specified for an ambient temperature range from -40°C to 125°C. Although the internal
over-temperature protection might be activated due to device self-heating, LIN communication and MCU
operation remain unaffected.
Table 1.7 LIN Electrical Parameters
Note: See important notes at end of table.
LIN Spec 2.2
Parameter
Symbol
Min
Typ.
Max
Unit
Reference
Parameter 12
Parameter 13
Parameter 14
Parameter 15
Parameter 16
Parameter 17
Parameter 18
Current limitation for driver dominant state
Input leakage current, dominant state, driver off
Input leakage current, recessive state, driver off
Control unit disconnected from ground 1)
VBAT supply disconnected
IBUS_LIM
IBUS_PAS_dom
IBUS_PAS_rec
IBUS_NO_GND
IBUS_NO_BAT
VBUSdom
40
-1
-
-
200
-
mA
mA
-
-
20
µA
-1
-
-
1
mA
-
100
0.4
-
µA
Receiver dominant state (VSUP > 7V)
Receiver recessive state (VSUP > 7V)
Center of receiver threshold
-
-
VSUP
VSUP
VSUP
VSUP
V
VBUSrec
0.6
-
0.5
-
VBUS_CNT
VHYS
Parameter 19 0.475
0.525
0.175
1
Receiver hysteresis voltage
Parameter 20
Parameter 21
Parameter 22
Parameter 23
-
0.4
-
Voltage drop at serial diodes 2)
Battery shift(2)
VSerDiode
0.7
-
VSHIFT_BAT
VBUS_GND
0.115
0.115
VBAT
VBAT
Ground shift 2)
-
-
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ZAMC4100 Datasheet
LIN Spec 2.2
Reference
Parameter
Symbol
Min
Typ.
Max
Unit
Difference between battery shift and ground shift 2)
LIN pull-up resistor
VSHIFT_Difference Parameter 24
0
-
40
-
8
%
kΩ
-
Parameter 26
RSLAVE
D1
20
60
Duty cycle 1
Parameter 27 0.396
Parameter 28
Parameter 29 0.417
-
0.581
-
Duty cycle 2
D2
-
-
-
Duty cycle 3
D3
-
-
Duty cycle 4
D4
Parameter 30
Parameter 31
Parameter 32
-
-
-
0.590
6
-
Receiver propagation delay
tRX_pdr
-
µs
Receiver propagation delay symmetry between rising
and falling edge
tRX_sym
-2
-
2
µs
Capacitance of slave node 2)
LIN pin capacitance 1)
CSLAVE
CLIN
Parameter 23
-
-
-
250
30
pF
pF
-
-
-
-
-
-
Over-current shutdown threshold
LIN wake-up filter time
IOC_LIN
tLINWU
tDOM
45
100
11
-
-
175
150
-
mA
µs
125
TxD dominant time out time
LIN fast mode data rate (Cbus = 1nF, Rbus = 1kΩ) 1)
-
-
ms
LBFAST
115
kbps
1) Parameter guaranteed by process monitoring but not tested during production.
2)
Standard LIN network parameter which specifies operating condition for the IC.
1.2.4.
Output Drivers
Table 1.8 Drivers Static Parameters
Parameter
Symbol
Min.
Typ.
Max.
Unit
HS1 (High-Side Switch)
Switch-on resistance (at 27°C; VSUP=13.5V; IHS1=1A)
RDSON_HS1
110
170
230
mΩ
Over-current shut down
Leakage current
IOC_HS1
ILEAKAGE_HS1
CSR_HS1
5.5
-
6.1
6.7
15
A
μA
-
<0.5
Current sense ratio
650000
695000
740000
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HS2-4 (High-Side Switches)
Switch-on resistance (at 27°C; VSUP=13.5V; IHS2,3,4=0.3A)
Over-current shut down
RDSON_HS2,3,4
IOC_HS2,3,4
ILEAKAGE_HS2,3,4
CSR_HS2,3,4
500
0.35
-
700
0.45
900
0.55
5
mΩ
A
Leakage current
<0.5
μA
-
Current sense ratio
47000
52500
58000
HB1,2 (Half-Bridges) 1)
Switch-on resistance (at 27°C; VSUP=13.5V; IHB1,2=1A)
Over-current shut down
RDSON_HB1,2
IOC_HB1,2
ILEAKAGE_HB1,2
CSR_HB1,2
150
3.0
240
3.5
330
4.0
mΩ
A
Leakage current
-
<0.5
10
μA
-
Current sense ratio
350000
385000
420000
HB3,4 (Half-Bridges) 1)
Switch-on resistance (at 27°C; VSUP=13.5V; IHB3,4=0.5A)
Over-current shut down
RDSON_HB3,4
IOC_HB3,4
ILEAKAGE_HB3,4
CSR_HB3,4
700
0.6
900
0.7
1100
0.8
mΩ
A
Leakage current
-
<0.5
76500
7
μA
-
Current sense ratio
70000
83000
Open/Short Diagnostic Parameters (all HB and HS Drivers)
IHB1..4_CS
IHS1..4_CS
,
Diagnostic current source/sink
Open/short flag threshold level
80
100
-
120
1.5
μA
V
VOSF_DR
0.4
1)
Parameters specified for both halves: high-side and low-side.
Table 1.9 EC Driver Static Parameters
Parameter
High-Side
Symbol
Min.
Typ.
Max.
Unit
Over-current shut down
Leakage current
IOC_EC_RES
0.4
-
-
-
A
ILEAKAGE_EC_RES
0.1
7
μA
Low-Side
Switch-on resistance (at 27°C ; VSUP=13.5V; IEC_RES=0.1A)
Over-current shut down
Leakage current
RDSON_EC_M
IOC_EC_M
500
0.4
-
1000
1500
-
mΩ
A
-
ILEAGAGE_EC_M
5
10
μA
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Parameter
EC Driver Output Voltage
Symbol
Min.
Typ.
Max.
Unit
Nominal output voltage range
VEC
VECMAX
dVEC
0
1.311
-5
-
1.38
-
1.38
V
V
Maximum output voltage
1.449
Output voltage tolerance
5
-
%
bit
DAC resolution
ECDAC_RES
-
6
Open/Short Diagnostic Parameters (for EC_M and EC_RES Pins)
IECM_CS
IECRES_CS
VOSF_ECM
,
Diagnostic current source/sink
Open/short flag threshold level
50
120
-
190
0.9
μA
V
0.6
Table 1.10 Drivers Dynamic Parameters
Note: See important notes at end of table.
Parameter
HS1 (High-Side Driver)
Symbol
Min.
Typ.
Max.
Unit
Propagation delay 1), 2)
tD_HS1
tOC_HS1
SLHS1
5
-
11
20
17
-
µs
µs
Over-current shut down integration time 3)
Slew rate (IHS1=5A) 2), 4)
0.3
0.8
1.1
V/µs
HS2-4 (High-Side Drivers)
Propagation delay 1), 2)
tD_HS2,3,4
tOC_HS2,3,4
SLHS2,3,4
3
-
7
11
-
µs
µs
Over-current shut down integration time 3)
Slew rate (IHS2,3,4=0.3A) 2), 4)
HB1,2 (Half-Bridges)
20
1.3
0.6
2.0
V/µs
Propagation delay 1), 2)
tD_HB1,2
tOC_HB1,2
SLHB1,2
5
-
11
20
17
-
µs
µs
Over-current shut down integration time 3)
Slew rate (IHB1,2=2.7A) 2), 4)
HB3,4 (Half-Bridges)
0.6
1.1
1.6
V/µs
Propagation delay 1), 2)
tD_HB3,4
tOC_HB3,4
SLHB3,4
4
-
12.5
20
21
-
µs
µs
Over-current shut down integration time 3)
Slew rate (IHB3,4=0.6A) 2), 4)
0.6
1.1
1.6
V/µs
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Parameter
Symbol
Min.
Typ.
Max.
Unit
EC Driver
Transition time 5), 2)
tS_EC
4
5
10
µs
1)
2)
3)
4)
5)
The time between driver enable/disable and reaching 10% of the reaction at the output.
Parameter guaranteed by process monitoring but not tested during production.
Accumulative time for over-current event. After this period, the driver is automatically switched off (see sections 3.8.2 and 3.9.2).
Between 10% and 90% of the output voltage swing.
After DAC code switching from 0 to 31 for the range of 10% to 90% at the output reaction.
1.2.5.
Internal Reference Sources and Sensors
Table 1.11 Internal Die Temperature Sensor
Parameter
Symbol
SVT
Min.
1.76
0.52
Typ.
1.80
0.54
Max.
1.84
0.56
Unit
mV/°C
V
Voltage/Temperature Slope 1)
Output Voltage (at 27°C)
Vt27
1)
Parameter guaranteed by process monitoring but not tested during production.
Table 1.12 Internal Reference Sources
Parameter
Symbol
VREF
Min.
-
Typ.
2.4
-
Max.
Unit
V
Reference voltage
-
2
Reference voltage accuracy 1)
Reference current (at 27°C after trimming)
Reference current temperature drift 1)
dVREF
IREF
-2
%
9.7
-3
10
-
10.3
3
µA
%
dIREF
1)
Parameter guaranteed by process monitoring but not tested during production.
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1.2.6.
Analog-to-Digital Converter
Table 1.13 ADC and Analog Input Pins Static Parameters
Parameter
Symbol
Min.
Typ.
Max.
Unit
ADC Parameters
Input voltage (AIN1 to AIN4) ratiometric measurement 1)
VIN_RM
VIN_AM
VSN
0
-
-
VSP
V
V
Input voltage (AIN1 to AIN4) absolute voltage
measurement 2)
VREF
Resolution
BADC
INL
-
-3
10
-
-
Bits
LSB
Integral non-linearity
Differential non-linearity
Offset error
+3
+2
+3
0.2
DNL
OFE
GE
-2
-
LSB
-3
-
LSB
Gain error 3)
-0.2
-
% FSR
AIN1 to AIN4, S_N, and S_P Pins Parameters
Switch resistance between S_N and VSSA pins
Equivalent input capacitance (AIN1 to AIN4 pins)
Equivalent input series resistance (AIN1 to AIN4)
Diagnostic current source/sink (S_P and AIN1 to AIN4)
Open/Short flag threshold level (S_P and AIN1 to AIN4)
RDSON_SN
CIN
10
-
-
-
40
15
Ω
pF
kΩ
µA
V
RS_IN
-
-
1.5
12
IAIN_CS, ISP_CS
VOSF_AIN
8
10
-
2.3
3.3
1)
2)
VSN is the potential of the S_N pin. Considered to be 0V in the application.
The minimum specification for VIN_AM is 0 with respect to the VSSA pin.
As a percent of the input full-scale range (FSR).
3)
1.3. Timing Parameters
Note: Parameters are specified for a junction temperature range from -40°C to 125°C unless otherwise stated.
1.3.1. Oscillators (OSCL and OSCH)
Table 1.14 Timing Parameters: Low-Power Oscillator and High-Frequency Oscillator
Parameter
OSCL (Low Power Oscillator)
Symbol
Min.
Typ.
Max.
Unit
Base frequency (at 27°C, after trimming)
Frequency temperature drift
FOSCL
122
-10
125
-
128
10
kHz
%
FDRIFT_OSCL
OSCH (High Frequency Oscillator)
Base frequency (at 27°C, after trimming)
Frequency temperature drift
FOSCH
19.7
-5
20
-
20.3
5
MHz
%
FDRIFT_OSCH
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1.3.2.
Analog-to-Digital Converter
Table 1.15 ADC Timing Parameters
Note: See Figure 1.1 for parameter definitions. All timing parameters below are calculated for the typical value of
the OSCH frequency.
Parameter
ADC maximum sample rate 1), 2)
Symbol
SRMAX
Min.
Typ.
Max.
Unit
Ksps
µs
-
4
32
14
-
250
-
-
512
512
522
-
ADC continuous conversion phase
ADC continuous conversion phase (external temperature mode)
ADC single conversion phase
tCCNV
tCCNV_TM
tSCNV
-
µs
-
µs
ADC single conversion phase (external temperature mode) 3)
ADC settling time 4)
tSCNV_TM
tADC_STL
tADC_SMP
tADC_SMP_TM
tADC_CNV
tADC_IDLE
42
10
-
µs
-
-
µs
ADC sampling time 5)
1
-
509
-
µs
ADC sampling time (external temperature mode) 6)
29
3
µs
ADC conversion time
-
-
µs
3), 6), 7)
ADC idle time
0
-
480
µs
1) The absolute maximum IDT target for ADC sample rate is 250ksps. IDT reserves the right to change the maximum ADC sample rate
if driven by further design considerations.
2) The maximum possible sample rate for external temperature conversion is SRMAX/8
.
3) The ADC idle time is 0 for single external temperature conversion and continuous conversion at maximum SR.
4) Added to each single conversion and to the first conversion in continuous mode.
2n SRMAX
− tADC_CNV
, where n = [0:7] and n is the
5) The parameter tADC_SMP is calculated using the formula:
tADC_SMP
=
decimal equivalent of the value configured in bit field ADCSR[2:0] in the ADCCONF register (see Table 3.37).
6) For external temperature measurement, the ADC sample time is fixed. Changing ADCSR[2:0] changes the ADC idle time.
2n SRMAX
− tADC_SMP_TM −tADC_CNV
, where n = [3:7]
)
7) The parameter tADC_IDLE is calculated using the formula:
tADC_IDLE
=
(
and n is the decimal equivalent of the value configured in bits ADCSR[2:0]. Important: For n = [0:2], tADC_IDLE = 0.
Figure 1.1 ADC Timing Parameters Definition
t
CCNV
SCNV
t
All other ADC
conversions
t
ADC_STL
tADC_SMP
t
ADC_CNV
t
CCNV_TM
SCNV_TM
t
Ext. temperature
ADC conversion
tADC_STL
t
ADC_IDLE
t
ADC_SMP_TM
t
ADC_CNV
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1.3.3.
SPI Bus Timing
Refer to Figure 1.2 and Table 1.16 for the definitions of the SPI timing parameters.
Table 1.16 ZAMC4100 SPI Bus Timing Parameters
Parameter
Symbol
tCLK
Min.
0.3
Typ.
Max.
Unit
µs
SPI clock period 1)
SPI pulse width
-
6.4
tP
40% tCLK
1.0
50% tCLK
60% tCLK
µs
Chip-select setup time 2)
Chip-select hold time 2)
SPI access time
tCSNSU
tCSNHD
tACC
-
-
-
-
-
µs
1.0
µs
1.0
2.0
µs
1)
2)
The maximum tCLK value is determined by the maximum value that can be programmed in MCU register Z1_SPICLKCFG[7:2] (see Table 4.23).
The parameters tCSNSU and tCSNHD require at least 3 OSCH clock cycles. When oscillator OSCH is not trimmed, it runs at a lower frequency.
Figure 1.2 SPI Communication Timing Diagram
tCSNSU
tCLK
tCSNHD
tACC
tP
CSN
SPI_CLK
MOSI
MISO
7
7
6
6
5
5
1
1
0
0
7
7
6
6
5
1
1
0
0
7
7
6
6
5
CMD/SSB
R/W DATA
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1.3.4.
System Power-up Timing
Refer to Figure 1.3 and Table 1.17 for the definitions of the power-up and reset timing parameters.
Table 1.17 System Power-up and Reset Timing Parameters
Parameter
Power-on-reset (POR) hold time
Symbol
tHDPOR
tPWRT
Min.
10
Typ.
-
Max.
80
Unit
µs
Power-up timer delay
0.32
1.1
-
0.78
1.66
-
1.24
2.5
2
ms
ms
ms
MCU supply check time 1)
Charge pump voltage settling time 2)
tMSC
tCP_STL
MCU reset pulse duration generated by the watchdog
timer (WDT) 3)
tMCU_RST
tSYS_RST
-
8
-
µs
System reset pulse duration generated by WDT
0.4
0.95
1.5
ms
1)
2)
Time window in which the valid flags for both MCU supplies are expected. For more information, refer to section 3.1.
The charge pump is considered as settled when the ZAMC4100 supply voltage is in the nominal operating range specified by parameter VSUP (see
Table 1.4).
3)
Parameters calculated for the typical value of OSCL frequency.
Figure 1.3 ZAMC4100 System Power-Up Sequence
VDDE
TYP
Vrise
PORTH
PORHYST
Vfall
t
porb
tHDPOR
tHDPOR
t
t
t
rstn
t
PWRT
t
PWRT
Analog
Circuitry
SETTLING
SUPLIED
STABLE
STABLE
SETTLING
SUPPLIED
UNSUP
UNSUP
t
CP_STL
tCP_STL
Charge
Pump
SETTLING
STABLE
SETTLING
STABLE
t
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1.4. MCU Flash Memory Parameters
Table 1.18 Flash Timing Parameters
Parameter
Symbol
tPERASE
tMERASE
tWPROG
Min.
Typ.
17
Max.
Unit
ms
ms
µs
Page erase time 1), 2)
-
-
-
-
-
-
Mass erase time 1), 2)
17
Single word program time 1), 2)
78
1)
2)
Parameters given for the typical value of OSCH frequency.
Timing for flash controller commands execution. During that time the program execution is halted.
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2
System Blocks Description
2.1. Power Supply
As illustrated in Figure 2.1, the internal supply voltages of the system are generated by four linear regulators and
one buffer:
•
•
•
REG5V0 Primary analog supply voltage: 5.0V typical. REG5V0 is not switched-off in SLEEP Mode.
REG2V5 Secondary analog supply voltage: 2.5V typical. REG2V5 is switched-off in SLEEP Mode.
REG3V3 MCU periphery (GPIO, FLASH) digital supply voltage: 3.3V typical. REG3V3 is switched off in
SLEEP Mode.
•
•
REG1V8 SBC digital supply voltage: 1.8V typical. This voltage is used as a reference for the MCU core
supply. REG1V8 is not switched off in SLEEP Mode.
BUF1V8 Power supply for the MCU core referenced to the SBC digital supply voltage. BUF1V8 is switched
off in SLEEP Mode.
Figure 2.1 ZAMC4100 Supply Structure
VDDE
CAP_5V0
REG5V0
REG2V5
REG3V3
REG1V8
BUF1V8
VSSA
VSS
CAP_3V3
CAP_1V8
CAP_MCU
VSSD
VSSD
VSSD
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2.2. High-Frequency and Low-Frequency Oscillator
The ZAMC4100 system has two built-in oscillators: OSCH and OSCL. Oscillator OSCH generates the 20 MHz
clock used directly in the MCU chip and divided by 5 in SBC chip. OSCL is a very low-power oscillator which
provides 125kHz clock frequency used by LIN wake-up logic during SLEEP Mode and used as an autonomous
clock for the watchdog timer. When SLEEP Mode is enabled, the SBC switches from OSCH to OSCL clock and
vice versa when SLEEP Mode is exited.
2.3. Watchdog Timer
The SBC features an integrated watchdog timer (WDT), running on an autonomous 125kHz clock provided by
OSCL oscillator. The WDT enables monitoring unresponsive states within the MCU and the SPI bus.
The WDT will generate configurable time-out intervals and when expired will reset the MCU. To avoid this, the
MCU firmware should periodically reset the WDT via the SPI interface.
The WDT has a separate counter that counts the number of MCU resets (N = 4, 8 as configured in the
WDTCONF register; see Table 3.3). When expired, it generates global reset for the whole system. This
guarantees that all drivers are automatically disabled if abnormal MCU behavior occurs (e.g., frozen code).
2.4. Analog-to-Digital Converter
The SBC features a high-accuracy 10-bit successive approximation ADC with a front-end multiplexer (MUX) that
selects one of the external or internal input signals for sampling and further processing by the MCU.
The ADC supports three types of external measurements, depending on the configuration setting in the firmware:
ratiometric mode, absolute mode, or temperature measurement using internal current sources. For more details,
refer to section 3.12.2.
Summary of possible measurements:
•
•
•
•
Absolute voltage measurement with internal reference voltage
Absolute current measurement with internal reference current
Ratiometric measurement
Measurements of internal input signals for the ADC:
•
•
•
•
•
Supply voltage; i.e., the voltage between the VDDE and VSSA pins
Internal temperature: the average temperature of the SBC die
Current through each half-bridge and high-side driver output (does not include EC mirror driver)
Actual output voltage of EC mirror driver (at EC_M pin)
Diagnostic measurements, which are used during the self-diagnostic mode
•
External analog inputs AIN1-AIN4. Pins AIN3/TEMP and AIN4/TEMP feature switchable current sources
allowing optional direct connection to external temperature sensors
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2.5. Output Drivers
The ZAMC4100 features three types of drivers:
•
Half-bridge drivers – Low-side and high-side switches are connected between the positive supply rail
and the negative supply rail
•
•
High-side drivers – High-side switches connected to the positive supply rail VDDE
EC mirror control driver (ECM driver) – Output power stage, digital-to-analog converter (DAC) for
controlling the output voltage level, and analog feedback circuit
Each driver provides the following functionalities:
•
•
•
Low-resistance power switches optimized for high-current operation.
PWM control available for all half-bridge and high-side drivers.
The ECM driver is a special type of power driver designed for electrochromatic mirror control. For more
details, refer to section 3.11.
•
•
•
Integrated diagnostic and protection features.
Detects high impedance output state.
Except for the ECM, all switches have an integrated current measurement capability. If selected, these
signals are digitized by the ADC. For the ECM driver, a dedicated internal channel is implemented for
direct measurement of the actual output voltage (potential at EC_M pin).
All switches use an NMOS device for optimal low resistance channels. For driving the high-side switches, an
integrated charge pump provides voltages higher than VDDE.
2.6. Driver’s Power Capability and Package Temperature
One of the features of the ZAMC4100 is very low channel resistance; therefore, the package is less likely to
overheat in performance of high current operations. However it is the responsibility of the application design
engineer to properly evaluate thermal behavior in the application to avoid premature safety shutdown by the
internal temperature protection circuitry.
The thermal behavior of the ZAMC4100 is very dependent on the PCB layout, encapsulate material, and heat
sinking. Poor quality PCB layout resulting in high thermal resistance will likely cause over-heating, which will
trigger an over-temperature event and prematurely shut down the driver. It is likely that there will be a delay
before the package junction returns to a safe temperature level, depending on the rate of heat dispersion into the
ambient environment.
The MCU could incorporate additional firmware referred to as Smart Power Management, depending on the
application; for example for an automotive heater mirror, where demand for a high current level can be reduced
by implementing a low-frequency PWM method when the ZAMC4100’s package temperature exceeds a specified
temperature level. This feature is designed to prolong the operation period and therefore enhanced reliability. For
more information, contact IDT’s technical support.
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2.7. LIN Interface
The ZAMC4100 features a LIN slave interface with hardware resources covering the physical and data link
communication layers (see Figure 2.2). The network layer must be implemented as part of the MCU firmware.
The LIN PHY is built into the SBC chip and is LIN2.0/2.1 compatible. It supports LIN wake-up detection, short-
circuit detection/protection and dominant time-out detection/protection. All events are captured as interrupt flags in
the SBC interrupt controller, and the MCU can access them via the SPI interface.
Figure 2.2 ZAMC4100 LIN Interface and Open Systems Interconnection (OSI) Layers Coverage
OSI Model
NETWORK
Path Determination &
Logical Addressing
MCU: Firmware
(LIN Protocol Engine)
PACKETS
FRAMES
DATA LINK
Physical Addressing
MCU: LIN Controller
PHYSICAL
Media, Signal & Binary
Transmission
SBC: LIN PHY,
Wake-up, Diagnostics
BITS
The block diagram in Figure 2.3 shows the ZAMC4100 LIN interface structure and the partitioning between the
SBC and MCU chips. The hardware for covering the LIN data link layer is implemented in the MCU chip as a LIN
controller. The MCU LIN controller features a UART module for the LIN frame generation, BREAK/SYNC
detection fields, and LIN bus inactivity timer.
Figure 2.3 LIN Slave Node Implementation in the ZAMC4100
SBC Chip
MCU Chip
LIN Wake-up
Diag & Ctrl
LIN PHY
LIN Controller
LIN
TXD
RXD
TXD
RXD
TXD
LIN Pwr Crtl
TX
sh
pd
UART
LIN Short
(debounced)
BREAK/SYNC
Detection
Dominant
Time-Out
RXD
Inactivity Timer
(4 sec)
RX
LIN Wake-up
sh = short
pd = power down
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2.8. SPI Bus
The Serial Peripheral Interface (SPI) bus is used as a primary communication bus between the MCU and SBC
peripherals, including the drivers. The SPI mastering is done by the MCU which configures and controls the SBC
peripherals (output drivers, ADC, LIN, etc.). The SBC SPI slave supports byte-wise frame transfer with 8 data bits
per frame. In order to secure the communication, the SBC SPI supports frame length validation.
2.9. Diagnostic Functionalities
ZAMC4100 has a number of built-in protection and diagnostic features that enable the MCU to perform system
self-checks and to detect abnormal functionality. The main diagnostic functions supported by the ZAMC4100 are
as follows:
•
•
•
•
•
•
Open/short detection for each driver output
System supply monitoring and under/over-voltage detection
Open/short detection at ADC inputs
ADC internal circuitry check
LIN over-current and dominant time-out detection
SBC-to-MCU SPI connectivity check
2.10. Microcontroller ARM® Cortex™ M0
The microcontroller unit (MCU) of the ZAMC4100 features a 32-bit ARM® Cortex™-M0 processor core with
memory resources:
•
32 Kbytes program FLASH memory featuring
-
-
Minimum 10,000 erase/write cycles
10 years data retention at 85°C
•
2 Kbytes SRAM
The MCU peripherals include the following:
•
•
•
•
•
8 configurable GPIO
SW-LIN controller
32-bit timer module
Master SPI
Interrupt controller
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2.10.1. MCU GPIOs
Each general-purpose input/output (GPIO) pin can be individually configured to operate as an input or output. If
configured as an output, the value driven at the GPIO can be directly written or controlled via a set-clear register.
Additionally, each GPIO pin can be enabled to be used as a trigger source or as interrupt source with a selectable
edge.
2.10.2. MCU Timer Module
The MCU timer module provides event counting with a 32-bit resolution. It is capable of counting clock events in
timer mode and events from a selectable external trigger signal in counter mode. The external trigger can be
configured to operate on rising or falling edges as well as on a low or high level.
2.10.3. MCU SPI Master
The integrated SPI is a pure master interface that is used for communication with the SBC chip. The CSN line
must be controlled by software. The SPI clock frequency is configurable by software with a maximum frequency of
half of the system clock frequency.
2.10.4. MCU LIN Controller
The software-controlled LIN controller provides the logic to handle the LIN bus communication on the frame level
(see Figure 2.3). It consists out of BREAK/SYNC detector, 4-second inactivity timer, and a UART data unit for
frame receiving/transmitting. The LIN wake-up event is detected in the SBC chip and the interrupt on the IRQN
line is generated. The packet-level LIN communication (network layer in Figure 2.2) is handled by the MCU
firmware.
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3
ZAMC4100 SBC Functional Description
This section describes the functionality of the system with respect to the modes of operation - SBC analog
peripherals including the transistor drivers, analog-to-digital converter (ADC), LIN interface, interrupt sources, SPI
interface, etc.
3.1. System Power-Up Sequence
After powering up, ZAMC4100 enters the NORMAL operation mode executing the sequence shown in Figure 3.1.
Figure 3.1 SBC Power-Up State Diagram
SBC
MCU
Power supply
POR
No
generated
Yes
Sys. Reset
No
T
PWRT?
Yes
MCU SUPPLY ON
No
No
MCU supply
valid?
TMSC?
Yes
Yes
SLEEP Mode
entry
1) Enable MCU clock
2) Release MCU reset
MCU SW initialization
SW diagnostic check:
1) SBC-to-MCU
connectivity check
2) ADC check
3) Output drivers check
Enable SBC
NORMAL Mode
MCU application
routine execution
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The power-up sequence of the whole system is handled by the SBC chip. When the voltage at the VDDE pin
reaches the power-on-reset level (refer to Table 1.5), the system reset is generated. After power-on-reset, the
power-up timer in the SBC starts counting a time tPWRT needed for stabilizing the oscillators and the other analog
circuitry (see Table 1.17). When the analog circuitry is stable, the SBC enables the MCU power supply and
checks its validity. During the MCU supply validity check, the SBC checks that both supply voltages (BUF1V8 and
REG3V3) needed for the MCU operation are in range.
When the supply is valid, the SBC enables the MCU clock and releases its reset. At this point, the SBC chip
switches to the NORMAL Mode, and the MCU can start executing the initialization firmware, running the
diagnostic checks, and switch to the application routine.
If the MCU supply is not valid, the SBC chip executes a time loop in which the internal supply-valid flags are
continuously checked. If the time tMSC expires and the MCU supply is still not in range, the SBC switches to
SLEEP Mode. Switching to SLEEP Mode in the event of an MCU supply failure guarantees that the system stays
passive with very low current consumption (less than 80µA). The ZAMC4100 can switch back to NORMAL Mode
if a valid LIN wake-up is detected. In this case, the MCU supply is checked again and depending on the result, the
system stays in NORMAL Mode or switches to SLEEP Mode.
The ZAMC4100 start-up timing parameters are specified in Table 1.17. Details regarding the ZAMC4100 SLEEP
Mode are given in section 3.5.2.
3.2. Clock and Reset Sources of the ZAMC4100
All clocks and resets for ZAMC4100 system are generated in the SBC chip. The clock structure of the ZAMC4100
is shown in Figure 3.2, and the reset structure is shown in Figure 3.3.
3.2.1.
Clock Sources
OSCH is the main clock generator for the SBC and MCU. The output clock from OSCH goes directly to the MCU
at 20MHz and to the divider for the SBC resulting in a 4MHz SBC clock.
In SLEEP Mode, the MUX sets the SBC clock to the125kHz OSCL clock. The main purpose of this clock in
SLEEP Mode is to drive the LIN wake-up detection. Also the OSCL clock is used continuously by the WDT.
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Figure 3.2 ZAMC4100 Clock Sources
MCU Clock
SBC Clock
4MHz
20MHz
125kHz
OSCH
OSCL
5
0
1
SLEEP
WDT
LIN
Wake-up
OSCL Failure
Detection
OSCLEIF
OSCL Failure Detection
In order to increase the system robustness, the ZAMC4100 features a mechanism for failure detection in the
OSCL clock generation. This ensures that the MCU is alerted by an interrupt in the event of the watchdog timer
not functioning (caused by an OSCL clock stop).
The OSCL clock is observed by dedicated circuitry running on the OSCH clock. If for any reason the OSCL clock
stops, then an OSCL failure event is detected, captured in the flag OSCLEIF (see Table 3.1), and propagated as
an interrupt to the MCU. Then the MCU firmware can determine whether to perform any failure protection actions
(for example, a failure report to the electronic control unit ECU via LIN) or to continue with the regular firmware
execution.
Note: In SLEEP Mode, the OSCL failure detection is disabled because the OSCH clock is stopped, i.e. no OSCL
clock observation is possible.
3.2.2.
Reset Sources
The ZAMC4100 system has three resets all generated within the SBC chip. Each reset source has its own flag bit.
The MCU can distinguish between the different resets by reading the contents of register RSTSTAT (Table 3.1
and Table 3.2). The flags of the RSTSTAT register are cleared by writing a ‘1’ in the corresponding bit of the
RSTSTAT register.
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Figure 3.3 ZAMC4100 Reset Sources
OVTIF
DRIVERS
OVT
RSTN
PORF
PWRT
POR
SBC
tPWRT
RSTN
SBC clock
sys_rst
WDT
WDTSYSF
SLEEP
STBY
MCU
RSTN
mcu_rst
WDTMCUF
Power-on-Reset (POR)
This global system reset is generated when the supply at the VDDE pin crosses the voltage thresholds specified
in Table 1.5.
WDT Reset
There are two types of watchdog timer resets: the MCU reset and the global system reset. In the event of an
abnormal condition in which the MCU fails to periodically clear the WDT counter, the WDT will attempt to reset the
MCU. However after a configurable number of consecutive MCU resets, the WDT will invoke a global system
reset where both the SBC and MCU will be re-initialized.
OVT Drivers Control Reset
The over-temperature (OVT) reset is generated if the SBC chip temperature reaches the value specified by the
parameter OVTTH (125ºC; see Table 1.5). If an OVT reset occurs, it clears all drivers’ control registers. From a
functional point of view, the OVT reset is equivalent to a shut-down signal for the drivers. It is implemented in a
way that ensures that the drivers shut down even if the system clock is not present.
The driver control registers that are reset by an OVT reset event are HBDCTRL (Table 3.13), HBDDIAG (Table
3.17), HSDCTRL (Table 3.20), and ECMCTRL (Table 3.27). The OVT reset does not influence the MCU or the
other SBC registers. If an OVT event has taken place, it is indicated in interrupt flag OVTIF of register RSTSTAT
(see Table 3.1), and if interrupt by OVT is enabled (bit OVTIE = 1), the IRQN line is forced low.
In order to recover from an OVT event (i.e., to enable the drivers again), the MCU software should first clear
interrupt flag OVTIF and then write the driver control registers again. As soon as the OVT event is active, the
driver control registers are kept in reset; i.e., the drivers cannot be enabled. In order to ensure that the OVT event
has been resolved, the MCU should try to clear OVTIF and re-check the flag. Successfully clearing OVTIF means
that the chip has cooled-down to a temperature below 125°C; i.e., it will be possible to re-enable the drivers. As
an additional step before re-enabling the drivers, it is recommended that the MCU measures the internal chip
temperature (using the ADC). This avoids enabling the drivers when the SBC temperature is close to 125°C (e.g.,
120°C) and as a result, the chip goes in OVT again a short time after the drivers are enabled.
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Table 3.1 RSTSTAT Register Bits Mapping
Name
Bit No
RSTSTAT
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
1
Access
Address
R/Wc
R/Wc
R/Wc
R/Wc
R/Wc
R/Wc
R/Wc
R/Wc
0x00
R/Wc = Read/Write ‘1’ to clear; U = Unimplemented, read as ‘0.’
Table 3.2 RSTSTAT Register Bits Description
Bit
Description
OSCLEIF: Low frequency oscillator (OSCL) error interrupt flag.
1 = The 125kHz clock has stopped due to OSCL failure.
0 = The OSCL is operating and the 125kHz clock is present.
7
CPVEIF: Charge pump voltage error interrupt flag.
1 = The charge pump voltage is out of range during driver operation or in the act of driver enabling. If this event
occurs, all drivers are automatically disabled.
6
0 = Charge pump voltage is in range.
OVIF: Overvoltage interrupt flag.
5
4
3
2
1
0
1 = Overvoltage event occurred. If OVDP=1, all drivers are automatically disabled (see Table 3.5).
0 = Overvoltage event did not occur.
UVIF: Under-voltage interrupt flag.
1 = Under-voltage event occurred. If UVDP=1, all drivers are automatically disabled (see Table 3.5).
0 = Under-voltage event did not occur.
OVTIF: Over-temperature interrupt flag
1 = Over-temperature event occurred, and all drivers are disabled.
0 = Over-temperature event did not occur.
WDTSYSF: Watchdog timer system reset flag.
1 = The MCU has failed several times in clearing the WDT timer and system reset was generated.
0 = There is no system reset by WDT.
WDTMCUF: Watchdog timer MCU reset flag.
1 = MCU reset was caused by the WDT.
0 = There is no MCU reset by WDT.
PORF: Power-on-reset flag.
1 = System reset was caused by the POR block.
0 = There is no system reset by the POR block.
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3.3. Watchdog Timer (WDT)
The ZAMC4100 has a watchdog timer implemented in the SBC chip with the following features:
•
•
•
•
•
•
•
•
MCU reset and system reset generation
Running on the dedicated oscillator clock (125kHz)
8 programmable time-outs for MCU reset generation
4 settings for system reset generation
Configuration register lock bit for avoiding unintentional configuration changes
WDT clearing mechanism using bit toggling
WDT reset status bit showing the reset event (MCU or system reset)
Usage as a wake-up event during SLEEP and STANDBY Mode
3.3.1. WDT Structure and Operation Principals
The watchdog timer (WDT) has a dedicated free running oscillator (OSCL), which allows operation even when the
main oscillator has stopped (e.g., in SLEEP Mode). The WDT structure is shown in Figure 3.4.
Figure 3.4 ZAMC4100 Watchdog Timer
WDTIE
STBY
STBY
wake-up
WDTIF
mcu_rst
SLEEP
STBY
WDT time-base
Osc
10ms
Postscaler
MCU reset
Postscaler
System reset
sys_rst
Divider
125kHz
en
clr
SLEEP
wake-up
3
2
WDTEN
WDTPMEN
SLEEP
STBY
WDTCLR
MWDPOS[2:0]
SWDPOS[1:0]
The WDT is configured and controlled via register WDTCONF (see Table 3.3). The WDT is enabled with bit
WDTEN = 1. Once enabled, it continuously generates 10ms periods that are counted by two post-scalers and two
time-out resets are generated:
1. Time-out for a MCU reset: after the configured time, the WDT resets the MCU.
2. Time-out for system reset: after the configured number of consecutive MCU resets, the WDT resets the
whole system (SBC and MCU chip).
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Toggling the WDTCLR bit periodically will clear the WDT as well as both post-scalers which will consequently
avoid the WDT reset event. In order to toggle the WDTCLR bit, the MCU should do the following sequence:
1. Read the WDTCONF register
2. Invert the WDTCLR bit
3. Write back the WDTCONF register
This method requires SPI interface to be functional, which is effectively self-diagnostic. This ensures firmware
within the MCU is operational and free from abnormal behavior.
Once the WDT is configured, the write access to register WDTCONF can be locked with setting bit WDTLCK = 1.
This avoids unintentional WDT reconfiguration or disabling caused by an MCU firmware malfunction. If the WDT
is disabled, the current post-scaler values are automatically cleared.
Figure 3.5 shows an example of the MCU and system reset generation by the WDT. Parameters tMCU_RST and
tSYS_RST are specified in Table 1.17. The duration of the system reset pulse is longer than the MCU reset pulse
because the power-off/on cycle of the MCU regulators is executed.
Important notes:
1. If the WDT is enabled and the bit WDTLCK is set, the MCU cannot disable the WDT until the next
power-on-reset.
2. Once the WDTLCK bit is set, it can be cleared only by a power-on reset.
3. The WDTLCK bit does not lock the write for the WDTCLR bit.
4. If the WDT is enabled, the configuration for the MCU reset and system reset time-out (bits SWDPOS and
MWDPOS of register WDTCONF) cannot be changed.
5. The WDT time-base period of 10ms is calculated for the typical value of the OSCL frequency (see
Table 1.14).
6. If a system reset by WDT is generated, the same flow is executed as in the case of a power-on reset (see
Figure 3.1).
Figure 3.5 WDT Operation
WDTEN
MWDPOS
SWDPOS
"000" (MCU reset time-out tMCU_TO = 10ms)
"10" (System reset time-out tSYS_TO = 4x10ms)
tMCU_TO
tMCU_TO
tMCU_TO
MCU_RSTN
(internal pin)
tMCU_RST
SYS_RSTN
(internal signal)
tSYS_TO
tSYS_RST
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3.3.2. WDT during SLEEP and STANDBY Mode
By default the WDT is disabled when the SLEEP or STANDBY Mode is activated. Since it uses a dedicated clock,
if needed, the WDT can continue running when the system is in SLEEP or STANDBY Mode. This feature is
enabled by setting bit WDTPMEN = 1 in register SMDCTRL (see Table 3.5).
If the WDT is running during the SLEEP Mode, then the system reset time-out (if enabled by SWDPOS
configuration in the WDTCONF register) generates a wake-up from sleep instead of a system reset. Refer to
section 3.5.4 for more information regarding wake-up sources.
If the WDT is running during STANDBY Mode, the “MCU reset time-out” generates a wake-up from standby
instead of an MCU reset. Refer to section 3.5.4 for more information regarding wake-up sources.
Note: If the WDT configuration register is locked, the time-out intervals cannot be modified before SLEEP or
STANDBY Mode entry.
3.3.3. WDT Configuration Register
The WDT configuration register bits mapping and description are given in Table 3.3 and Table 3.4 respectively.
After POR, the WDT is enabled with a 160ms MCU time-out reset and no system reset generation.
Table 3.3 WDTCONF Register Bits Mapping
Name
Bit No
WDTCONF
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
1
0
0
0
1
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x04
R/W = Read/Write
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Table 3.4 WDTCONF Register Bits Description
Bit
Description
WDTCLR: WDT clear bit. Toggling this bit periodically to clear the WDT in order to avoid MCU reset.
1 = Next written value should be 0.
7
0 = Next written value should be 1.
Note: The WDTLCK bit does not lock the write for the WDTCLR bit.
SWDPOS: WDT post-scaler for system time-out reset generation.
00 = No system reset generated by the WDT.
01 = System reset is generated at each MCU reset by the WDT.
10 = System reset is generated after 4 consecutive MCU resets.
11 = System reset is generated after 8 consecutive MCU resets.
6:5
MWDPOS: WDT postscaler for MCU time-out reset generation.
000 = 1:1
001 = 1:2
010 = 1:4
011 = 1:8
100 = 1:16
101 = 1:32
110 = 1:64
WDT time-out after 10 ms.
WDT time-out after 20 ms.
WDT time-out after 40 ms.
WDT time-out after 80 ms.
WDT time-out after 160 ms.
WDT time-out after 320 ms.
WDT time-out after 640 ms.
4:2
111 = 1:128 WDT time-out after 1280 ms.
Note: WDT time-out period is calculated for the typical value of the OSCL frequency.
WDTLCK: WDT configuration lock bit.
1
0
1 = The writing to the WDTCONF register is not possible and writing can be enabled only after a power-on reset.
0 = The write access of WDTCONF is enabled.
WDTEN: WDT enable bit.
1 = The WDT is enabled, and if a time-out occurs, it will generate an MCU reset.
0 = The WDT is disabled. No reset is generated by WDT.
3.4. System Supply Monitoring
The ZAMC4100 continuously monitors the supply at the VDDE pin. If the VDDE voltage crosses the upper or
lower ends of the supply range (see Table 1.5), an over-voltage or under-voltage interrupt is generated. In
addition, the charge pump voltage is monitored for being in or out of range.
3.4.1.
Over-Voltage and Under-Voltage Detection
If an over-voltage or under-voltage event occurs, it is indicated in the OVIF and UVIF flags respectively in the
RSTSTAT register (see Table 3.1). Both interrupt flags in an OR-function generate the supply error interrupt flag
(SEIF), which is accessible via the IRQSTAT register (see
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Table 3.9). In order to clear the SEIF flag, the MCU should clear the OVIF and UVIF flags.
In order to prevent false over-voltage or under-voltage events being flagged (caused by supply spikes), the OV
and UV interrupt signals are passed through a de-bounce circuit that filters out all events shorter than 20µs.
If the over-voltage or under-voltage event still exists, the OVIF and UVIF flags remain high even if the MCU is
attempting to clear them.
If the SEIFAC bit of register SMDCTRL (Table 3.5) is set high, the OVIF and UVIF flags are automatically cleared
when the over-voltage or under-voltage event is corrected and the supply remains stable for more than 20µs.
3.4.2.
ZAMC4100 Operation during Over-Voltage
During an over-voltage event, the SBC and MCU are fully functional. By default, the over-voltage event
automatically disables all drivers in order to prevent load damage. The MCU can re-enable the drivers by clearing
the OVIF flag. If this protection is not needed, it can be disabled by clearing the OVDP bit of the SMDCTRL
register (section 3.5.5).
3.4.3.
ZAMC4100 Operation during Under-Voltage
When an under-voltage event occurs, the MCU chip is still fully functional. The SBC analog circuitry is
operational, but its supply is out of range; therefore the analog parameters cannot be guaranteed.
During an under-voltage event, the internal charge pump voltage is out of range, and proper driver operation is
not guaranteed. By default the under-voltage event automatically disables all drivers. The MCU can re-enable the
drivers by clearing the UVIF flag in the RSTSTAT register (Table 3.1).
Important note: The under-voltage driver protection can be disabled by clearing the UVDP bit in the SMDCTRL
register (section 3.5.5). This feature is implemented for test purposes only and is not recommended to be used in
the regular application.
3.4.4.
Charge Pump Voltage Monitoring
ZAMC4100 has internal circuitry for charge pump (CP) voltage monitoring, which is continually enabled during
system operation. If the charge pump voltage is out of range, an interrupt is generated and the drivers are
disabled. In order to prevent a false “charge pump voltage error” event flag (caused by supply spikes), the CP
interrupt signal passes through de-bounce circuitry that filters out all events shorter than 20µs.
A charge pump voltage error interrupt is indicated by the CPVEIF flag in the RSTSTAT register (Table 3.1). If
CPVEIF = HIGH, i.e. the CP voltage is out of range, all drivers are automatically disabled regardless of the value
of the driver enable bits.
The MCU can clear the interrupt by writing ‘1’ in the CPVEIF flag, but only if the CP voltage has recovered to its
valid range. If the CPVEIFAC bit of the SMDCTRL register (Table 3.5) is set high, then the CPVEIF flag is
automatically cleared when the CP voltage recovers to its valid range and remains valid for more than 20µs.
The CP voltage needs a settling time specified in Table 1.17 by parameter tCP_STL. Because tCP_STL is greater than
the power-up timer delay (tPWRT), after POR and wake-up from SLEEP, the CPVEIF flag will be set HIGH. If
CPVEIF auto-clear is enabled, the flag will be automatically cleared when time tCP_STL has expired, i.e. the CP
voltage has reached its valid range.
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3.5. ZAMC4100 System Operational Modes
The ZAMC4100 supports three operational modes: NORMAL, SLEEP, and STANDBY. The transition between
the different operational modes is shown in Figure 3.6.
Figure 3.6 ZAMC4100 Operational Modes
SUPPLY
FAIL
MCU supply
check
Power-down
Reset
PASS
SLEEP = 1
WAKE-UP
WAKE-UP
N x WDT
MCU reset
SLEEP
NORMAL
S
T
B
Y
=
1
STANDBY
After power-on-reset, the SBC performs an MCU supply check ensuring that both MCU voltages (BUF1V8 and
REG3V3 – see section 2.1) are present and in range. Once the supply check has passed, the SBC enters
NORMAL Mode; otherwise it enters SLEEP Mode and no further operation is allowed. In this way, it assures the
correct functionally of the system in the event of unexpected faults.
3.5.1.
NORMAL Mode
In NORMAL Mode, the system is fully functional waiting to receive LIN commands and controlling the drivers.
From this mode, the system can branch in three directions:
•
•
•
Power-save in SLEEP Mode (see section 3.5.2)
Suspended MCU in STANDBY Mode (see section 3.5.3)
WDT reset event, where software fails to clear the WDT’s flag within the appropriate timing (see section
3.3.1)
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3.5.2.
SLEEP Mode
In SLEEP Mode, current consumption is very low, less than 80µA. The MCU chip is powered-down and the SBC
supports only the functionality necessary for detecting a LIN wake-up or WDT wake-up event (see section 3.5.4).
In this mode, all drivers are automatically disabled. The MCU enables SLEEP Mode by setting the SLEEP bit in
the SMDCTRL register (Table 3.5). SLEEP Mode is exited if the SBC detects a wake-up event from the LIN bus
and consequently it re-activates the MCU as well as re-enabling the drivers.
Figure 3.7 shows the system behavior when the SLEEP Mode is enabled. The procedure starts with switching-off
the MCU supply and SBC analog blocks supply. In order to minimize power consumption, the SBC digital clock
switches to the OSCL (125kHz).
Important note: If there is a failure in the OSCL (see section 3.2), the SLEEP Mode entry command is ignored.
As a result, the system avoids undefined states with a powered-off MCU but with power supplied for the analog
circuitry (see SLEEP Mode entry flow in Figure 3.7).
When a valid LIN wake-up is detected, the SBC chip starts the procedure for returning to the NORMAL Mode.
During this procedure, the analog blocks are powered-up, the SBC digital clock is switched to 4MHz, and the
MCU supply is enabled. Before enabling the MCU clock and releasing the MCU reset, the SBC performs an MCU
supply check that is the same as the checks at system start-up. If the MCU supply voltages are in range, it starts
operating; otherwise the system switches back to SLEEP Mode.
Important notes:
1) Activation of a driver immediately after wake-up from Sleep Mode is not possible due to the relatively slow
settling time of the charge pump (see parameter tCP_STL in Table 1.17). The CP condition is continuously
monitored by the CPVEIF flag, which can be auto-cleared when a stable CP voltage is present if that
functionality is enabled. Refer to section 3.4.4 for more details regarding charge pump voltage monitoring.
2) When SLEEP Mode is enabled, all drivers are automatically disabled. If needed, after wake-up the MCU
should re-enable the drivers by setting the corresponding enable bits.
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Figure 3.7 ZAMC4100 SLEEP and STANDBY Mode Behavior
ZAMC4100 SLEEP Mode
ZAMC4100 STANDBY Mode
SBC
MCU
MCU
SBC
MCU application
routine execution
MCU application
routine execution
SPI SMDCTRL write
SLEEP = 1
SPI SMDCTRL write
STBY = 1
NORMAL Mode
NORMAL Mode
SLEEP
STBY
LIN wake-up enable
MCU clock gate
MCU suspended
MCU SUPPLY OFF
Clock switch
4MHz à 125kHz
LIN
Yes
wake-up?
Analog blocks
power-down
No
No
Other IRQ
event?
LIN
No
wake-up?
Yes
Yes
No
IRQN = 0
IRQN = 0?
Analog blocks
power-up
Yes
MCU clock enable
Clock switch
125kHz à 4MHz
MCU SUPPLY ON
No
Yes
No
MCU supply
valid?
T
MSC?
Yes
1) Enable MCU clock
2) Release MCU reset
MCU SW initialization
SW Diagnostic Check:
1) SBC-to-MCU
connectivity check
2) ADC check
3) Output drivers check
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3.5.3.
STANDBY Mode
In STANDBY Mode, the clock in the MCU is suspended rather than powered down. This MCU suspension
reduces power consumption (by a factor of two compared to the NORMAL Mode). Because the SBC analog
circuitry and MCU remain supplied, the system quickly returns to functionality when coming out from STANDBY
Mode.
The sequence of STANDBY Mode entry is shown in Figure 3.7. The MCU enables this mode by setting the STBY
bit in the SMDCTRL register (Table 3.5). After enabling the STANDBY Mode, the MCU firmware must execute a
dedicated clock gating instruction that will stop the MCU clock and therefore the program execution.
The MCU clock is enabled again if it receives an SBC interrupt on the IRQN line (see block diagram on page 4).
The interrupt can be generated by a LIN wake-up event or from another SBC peripheral event. The IRQN
interrupt generation automatically clears the STBY bit and the SBC switches to NORMAL Mode.
Note:
1) Before entering the STANDBY Mode, the MCU must clear all SBC interrupt flags in order to have the
IRQN line = ‘1’. Otherwise setting the STBY bit = 1 will not take effect.
2) When STANDBY Mode is enabled, all drivers are automatically disabled. If needed after wake-up, the
MCU should re-enable the drivers by setting the corresponding enable bits.
3) In order to have a LIN wake-up in STANDBY Mode, the interrupt enable bit LINIE in the IRQCTRL
register (Table 3.7) should be set high.
3.5.4.
Supported Wake-up Sources
When the ZAMC4100 system is in SLEEP or STANDBY Mode, it returns to NORMAL operation mode when a
valid wake-up event is detected. The next sections describe the wake-up events supported by the ZAMC4100.
LIN Bus Wake-up
The wakeup detection protocol of the ZAMC4100 is based on the LIN 2.1 specification and discussed in detail in
section 3.13.2. The LIN wake-up detection is automatically enabled when SLEEP or STANDBY Mode is invoked.
When a LIN wake-up event occurs, it generates an interrupt that is indicated in the LINWUIF flag. Disabling the
LIN wake-up interrupt does not disable the wake-up event.
WDT Wake-up on MCU Reset Time-Out (STANDBY Mode)
This wake-up is generated only when the system is in STANDBY Mode and the watchdog timer is enabled to run
in STANDBY Mode. This is enabled by setting the WDTPMEN bit to ‘1’ in the SMDCTRL register (Table 3.5). If
the MCU reset time-out occurs it does not generate an MCU reset, only a wake-up event and return to NORMAL
Mode.
If the WDT interrupt is enabled, it is indicated by the WDTIF bit in the IRQSTAT register (
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Table 3.9). This interrupt is useful if the MCU has executed a clock-gating instruction and the software execution
is stopped until an event on the IRQN line occurs.
WDT Wake-up on System Reset Time-Out (SLEEP Mode)
This wake-up is generated only when the system is in SLEEP Mode and the watchdog timer is enabled to run in
SLEEP Mode (WDTPMEN = 1). When a system reset time-out occurs, it does not generate system reset, only a
wake-up event and return to the NORMAL Mode.
Wake-up on SBC Interrupt (STANDBY Mode)
The previous sections described the most common sources for waking up the system and returning to the
NORMAL Mode: the LIN wake up and WDT time-out. In general when the system is in STANDBY Mode, any SBC
interrupt propagated on the IRQN line will restore the MCU clock and switch the system to the NORMAL Mode.
3.5.5.
Operational Modes Control
Switching from NORMAL to SLEEP or STANDBY Mode is initiated by the MCU by setting the SLEEP or STBY
bits of register SMDCTRL (Table 3.5).
The SLEEP Mode is activated by setting the SLEEP bit = 1. The STANDBY Mode is activated by setting the
STBY bit = 1. If the MCU reads the SLEEP or STBY bits, the returned result is 0.
NOTE: If the MCU tries to set both bits at the same time, the write command will be ignored.
Table 3.5 SMDCTRL Register Bits Mapping
Name
Bit No
SMDCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
0
0
0
1
1
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
W
W
0x03
R/W = Read/Write bit; W = Write-only bit, read as 0;
U = Unimplemented, read as ‘0’
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Table 3.6 SMDCTRL Register Bits Description
Bit
Description
CPVEIFAC: “Charge Pump Voltage Error Interrupt Flags Automatic Clear” enable bit.
6
1 = CPVEIF in the RSTSTAT register (Table 3.1) is automatically cleared when the interrupt event is resolved.
0 = Automatic clearing of CPVEIF is disabled.
SEIFAC: “Supply Error Interrupt Flags Automatic Clear” enable bit.
1 = Supply error flags UVIF and OVIF in the RSTSTAT register are automatically cleared when the interrupt
event is resolved.
5
0 = Automatic clear of supply error flags is disabled.
WDTPMEN: Bit for enabling the WDT during SLEEP and STANDBY Modes.
1 = WDT is enabled and running in SLEEP and STANDBY Modes.
0 = WDT is disabled in SLEEP and STANDBY Modes.
4
3
2
1
0
OVDP: “Over-Voltage Drivers Protection” enable bit.
1 = Over-voltage event automatically disables all drivers (HB, HS, ECM).
0 = The drivers are enabled even if an over-voltage event is detected.
UVDP: “Under-Voltage Drivers Protection” bit.
1 = Under-voltage event automatically disables all drivers (HB, HS, ECM).
0 = The drivers are enabled even if an under-voltage event is detected.
STBY: STANDBY Mode enable bit.
1 = Enables the STANDBY Mode.
0 = The system stays in NORMAL Mode.
SLEEP: SLEEP Mode enable bit.
1 = Enables the SLEEP Mode.
0 = The system stays in NORMAL Mode.
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3.6. SBC Interrupts
Most of the interrupts are generated by the peripherals within SBC and MCU chips. The interrupt organization of
the SBC chip is shown in Figure 3.8. The SBC interrupts are captured by the interrupt controller and after OR-
reduction are propagated to the MCU via IRQN line. The IRQN line is active-low and appears as an external
interrupt input to the MCU.
As shown in Figure 3.8, the interrupt logic has two levels: global interrupts and peripheral interrupts. Each
interrupt source has an individual interrupt enable (IE) and interrupt flag (IF) bit. Some of the IF bits are mapped
to the slave status byte and are shifted out to the MCU whenever a SPI command byte is shifted in to the SBC
(Figure 3.10-D).
The global interrupts are controlled via the IRQCTRL register and read via IRQSTAT (see section 3.6.2). The
peripheral interrupts are grouped by source and functionality and are combined using an OR-function to be a
single global interrupt bit. This allows the MCU to first determine which peripheral is causing an interrupt and then
to check the particular event. For example if the ADCIF interrupt flag bit is set, the reason might be that the ADC
conversion is finished (ADCRDYIF=1) or it might come from the ADC result comparator (ADCCMPIF=1) (see
section 3.7.5).
Figure 3.8 SBC Interrupt Logic Organization
IRQCTRL
SBC Global
Interrupts
IRQSTAT
WDTIF
&
WDTIE
SBC Peripheral Interrupts
ZAMC4100
OSCLEIF
OVTIF
CPVEIF
SBC
MCU
&
&
&
&
&
&
&
RSTSTAT
OVTIE
OVIF
UVIF
SEIF
SEIE
CMPEN
&
ADCRDYIF
ADCCMPIF
ADCSTAT
HBDSTAT
ADCIF
ADCIE
MCU
Interrupt
Controller
IRQN
HB1OCIF
HB2OCIF
HB3OCIF
HB4OCIF
HBOCIF
HBOCIE
HSOCIF
HSOCIE
HS1OCIF
HS2OCIF
HS3OCIF
HS4OCIF
HSDSTAT
LINSTAT
ECMOCIF
ECMOCIE
LINWUIF
LINDTOIF
LINSHIF
LINIF
LINIE
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3.6.1.
SBC Interrupts: Enabling, Flagging, and Clearing Procedure
Each SBC global interrupt source has an individual interrupt enable (IE) bit. If an interrupt is enabled and the
interrupt event occurs, it affects the IRQN line by forcing it to low. On power-on-reset all interrupts are disabled.
All interrupt sources are continuously observed during the system operation. If an interrupt event occurs, it is
detected and indicated by setting the corresponding interrupt flag (IF) bit to ‘1,’ which remains high until the MCU
clears it. The interrupt events are detected and the corresponding interrupt flag is set even if the interrupt is
disabled.
Each interrupt flag can be cleared by the MCU. In order to clear an interrupt, the MCU should write a logic ‘1’ into
its flag bit. This is a dummy write that is executed by the SBC as an IF clearing. In order to clear a global interrupt
flag, the MCU must clear all peripheral interrupts belonging to the global flag. If the MCU executes the interrupt
clearing procedure but the interrupt event is still present, the flag will not be cleared.
The ADCRDYIF flag (Table 3.12) supports a second clearing method, which is reading the ADC result register
(see section 3.12.8). Another exception is the WDTIF watchdog interrupt, which is cleared by clearing the WDT
(Table 3.4).
3.6.2.
SBC Global Interrupts Registers
The SBC registers used for global interrupt enabling and reading are IRQCTRL and IRQSTAT. All global interrupt
enable and flag bits are given in Table 3.7 and
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Table 3.9. The details for each peripheral interrupt are given in the sections where the corresponding periphery is
described.
Table 3.7 IRQCTRL Register Bits Mapping
Name
Bit No
IRQCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x02
R/W = Read/Write
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Table 3.8 IRQCTRL Register Bits Description
Bit
Description
WDTIE: Watchdog timer interrupt enable bit during STANDBY Mode.
1 = WDT interrupt is enabled.
7
0 = WDT interrupt is disabled.
Note: This interrupt is generated only when the system is in STANDBY Mode.
OVTIE: Over-temperature interrupt enable bit.
1 = OVT interrupt is enabled.
6
0 = OVT interrupt is disabled. Important: If an over-temperature event occurs, the drivers will be shut down
automatically regardless of the interrupt enable bit status.
SEIE: Supply error (over-voltage or under-voltage) interrupt enable bit.
1 = Supply error interrupt is enabled.
5
4
3
2
1
0
0 = Supply error interrupt is disabled.
ADCTIE: Global ADC interrupt enable bit.
1 = ADC interrupt is enabled.
0 = ADC interrupt is disabled.
HBOCIE: Global half-bridge driver over-current interrupt enable bit.
1 = Half-bridge driver over-current interrupt is enabled.
0 = Half-bridge driver over-current interrupt is disabled.
HSOCIE: Global high-side driver over-current interrupt enable bit.
1 = High-side driver over-current interrupt is enabled.
0 = High-side driver over-current interrupt is disabled.
ECMOCIE: Electrochromatic mirror (ECM) driver over-current interrupt enable bit.
1 = ECM over-current interrupt is enabled.
0 = ECM over-current interrupt is disabled.
LINIE: Global LIN PHY interrupt enable bit.
1 = LIN PHY interrupt is enabled.
0 = LIN PHY interrupt is disabled.
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Table 3.9 IRQSTAT Register Bits Mapping
Name
Bit No
IRQSTAT 1)
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
R
R
R
R
R
R
R
R
Address
0x01
R = Read-only bit
1)
The ECMOCIF is physically implemented in register ECMDIAG (Table 3.30) and mapped to IRQSTAT.
Table 3.10 IRQSTAT Register Bits Description
Bit Description
WDTIF: WDT interrupt flag.
1 = Watchdog timer time-out occurred during STANDBY Mode.
7
0 = Watchdog timer interrupt did not occur.
Note: In order to clear WDTIF, the MCU must clear the WDT by toggling the WDTCLR bit (see Table 3.4).
OVTIF: Over-temperature interrupt flag.
1 = Over-temperature event occurred.
6
5
0 = Over-temperature event did not occur.
Note: In order to clear OVTIF, the MCU should clear the OVTF flag in register RSTSTAT (Table 3.1).
SEIF: Supply error interrupt flag.
1 = The system supply voltage is out of range. There was an overvoltage or under-voltage event, and as a result,
one of the flags OVIF or UVIF is set.
0 = A supply error interrupt has not occurred. The supply voltage is in range.
Note: The SEIF cannot be directly cleared. In order to clear SEIF, the MCU should clear the CPVEIF, OVIF, and
UVIF flags in the RSTSTAT register.
ADCIF: ADC global interrupt flag.
1 = ADC interrupt occurred. The ADC conversion is ready or the comparator threshold has been reached.
0 = ADC interrupt did not occur.
4
3
Note: The ADCIF interrupt flag cannot be directly cleared. ADCIF is cleared by clearing the correlated ADCRDYIF or
ADCCMPIF flags in the ADCSTAT register (Table 3.39).
HBOCIF: Half-bridge driver over-current global interrupt flag.
1 = An over-current event was detected in one or more of the half-bridge drivers. To determine the specific over-
current source, the MCU should read the HBxOCIF bits in the HBDSTAT register (Table 3.15).
0 = A half-bridge driver over-current event was not detected.
Note: The HBOCIF interrupt flag cannot be directly cleared. In order to clear HBOCIF, the MCU should clear the
HBxOCIF flags in the HBDSTAT register.
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Bit Description
HSOCIF: High-side driver over-current global interrupt flag.
1 = An over-current event has been detected in one or more high-side drivers. To determine the specific over-current
source, the MCU should read the HSxOCIF bits in the HSDSTAT register.
2
0 = Half-bridge driver over-current event was not detected.
Note: The HSOCIF interrupt flag cannot be directly cleared. In order to clear HSOCIF, the MCU should clear
HSxOCIF flags of register HSDSTAT (Table 3.22).
ECMOCIF: Over-current interrupt flag for the ECM driver. This bit is physically implemented in register ECMDIAG
and mapped to the IRQSTAT.
1 = An over-current event has been detected at the ECM output and the driver has been disabled.
0 = There is no over-current at the ECM output.
1
0
Note: The ECMOCIF interrupt flag can be cleared in the ECMDIAG register (Table 3.29).
LINIF: LIN PHY global interrupt flag.
1 = LIN PHY interrupt has occurred. There was a LIN wake-up, dominant time-out, or LIN short detected.
0 = LIN PHY interrupt did not occur.
Note: The LINIF interrupt flag cannot be directly cleared. In order to clear LINIF, the MCU should clear the correlated
LINWUIF, LINDTOIF, or LINSHIF flags of the LINSTAT register (Table 3.48).
3.7. Serial Peripheral Interface (SPI) Bus Interface
The ZAMC4100 features an integrated Serial Peripheral Interface (SPI) that connects between the MCU and
SBC. It operates as a synchronous serial interface performing full-duplex data exchange driven by the clock
generated by the MCU. In the MCU, the SPI circuit block operates in MASTER mode and controls the SBC
peripherals (drivers, ADC, LIN).
SPI Features:
•
•
•
•
Byte-wise frame structure
8-bit data read/write access
Clock polarity = 1 (clock idle = 1, falling edge first)
Clock phase = 1
§ Data shift-out on falling edge
§ Data capturing on rising edge
•
•
•
•
•
Low-active chip select (CSN)
8-bit SBC status automatically shifted out to MCU
Pipelined write/read access for fastest SBC to MCU interaction
Data write frame validation feature
The SPI read starts at the specified address, and if the clock continues, it continues shifting out the data
from next address
•
Continuous data read mode (of a single address) without intermediate CSN toggling
§ Useful for ADC result data access
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3.7.1.
SBC and MCU SPI Connection Principles
The SBC to MCU connections using the SPI bus are shown in Figure 3.9. The SPI line definitions are given in
Table 3.11.
Figure 3.9 MCU-to-SBC Connection via SPI
ZAMC4100
SBC
MCU
IRQ0
IRQ1
Processor
Core
Interrupt
Logic
IRQN
IRQn
CSN
8
8
MISO
SBC
Registers
SPI Master
MOSI
SPI Slave
SPI_CLK
wr_en
rd_en
Table 3.11 SPI Lines Description
Line Name
Description
CSN
Active-low chip select with an internal pull-up in the SBC. The falling edge of the CSN line
initiates the SPI data transfer. A high level on CSN disables the SPI of SBC.
MOSI
Master-Out Slave-In. The SBC has an internal pull-down resistor.
Master-In Slave-Out.
MISO
SPI_CLK
SPI clock with an internal pull-up in the SBC. In inactive state, the SPI_CLK line is in high. The
value on the MISO and MOSI lines is changed on the falling edge of SPI_CLK and captured on
the rising edge of SPI_CLK.
The SPI slave recognizes two frames: the data WRITE frame and the data READ frame (see Figure 3.10).
The SPI communication starts when the MCU switches the CSN line to LOW and ends when the CSN line goes
HIGH. Each SPI frame begins with a command byte followed by the data byte(s).
The SPI command frame (Figure 3.10–C) contains the R/
W
bit for indicating the access type, five address bits
for pointing to the accessed SBC register, and the B bit for enabling the burst read mode.
As the command byte is shifted in, the SBC automatically shifts out the slave status byte containing the important
interrupt status bits (Figure 3.10–D).
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Figure 3.10 SPI Frames
A) Data WRITE Frame
CSN
7
7
7
0
0
0
0
MOSI
MISO
CMD
WR DATA
PTR DATA
7
SSB
B) Data READ Frame
CSN
7
7
7
7
7
0
0
0
0
0
MOSI
MISO
CMD
7
0
SSB
RD DATA
RD DATA
C) Command Byte Structure
D) Slave Status Byte Structure
ACCSIG
2
7
6
1 0
Address[4:0]
B
ADCRDYIF
ADCCMPIF
HBOCIF
HSOCIF
ECMCLIF
SEIF
R/W
Legend:
R/W
= Read / not Write
B= Burst read enable
Reserved bits (keep at 0)
LINIF
7
6 5 4 3 2 1 0
3.7.2.
SPI Write Access
In order to write data in the SBC registers, the MCU should send a WRITE frame as shown in Figure 3.10-A.
There are two bytes that the MCU master should send to SBC:
1. Command byte (CMD) with the R/
W
bit = 0, 5-bit address value and bit B = 0.
2. Data byte with the binary value that is going to be written into the corresponding address
When the data is shifted into the SBC, it shifts out the following bytes:
3. Slave status byte.
4. The value of the register pointed to by the SPIDPTR register (for more details, see Table 3.50). By
default, SPIDPTR points to the SBC interrupt status register (IRQSTAT).
Note: Because the burst mode is not allowed during an SPI write, the B bit value is “don’t care.” Keep this value
as ‘0’ for future product compatibility.
In order to have a successful data write, the SPI frame length should be exactly 2 bytes, i.e., 16 clocks. If the SPI
slave receives more than 16 clocks between the falling and rising CSN edges, the WRITE frame is ignored and
no WRITE command is executed.
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If the data is successfully shifted into the SBC, the WRITE command is executed on the rising edge of CSN. This
allows the MCU to control precisely the moment when the data is written. For example, the drivers are enabled by
writing in their control register (see sections 3.8, 3.9, or 3.11) and in this case the CSN rising edge marks the
beginning of the motor operation.
3.7.3.
SPI Pipelined Write/Read Access
In order to provide bidirectional data transfer, the SBC SPI slave provides functionality for performing a register
data READ while the WRITE frame is transferred. This functionality is implemented as automatic indirect
addressing of the SBC registers using the SPIDPTR register (Table 3.50) as the data pointer.
Register SPIDPTR points to the address of the register from which content will be automatically shifted out while
the SBC receives the data WRITE byte. This feature allows pipelining of the ADC conversion and the data WRITE
(see section 3.12.7).
3.7.4.
SPI Read Access
To read data from SBC registers, the MCU sends a frame as shown in Figure 3.10–B.
1) Command byte (CMD) with the R/
W
bit = 1, the 5-bit address of the register that is going to be read, and
the B bit with a value depending on the READ access type:
a. Single data read: B = 0
b. Burst data read: B = 1
2) Data byte: The MCU sends dummy data bits (keep as 0) while the SBC shifts out the contents of the
register pointed to by the address value in the command field.
The SPI read access allows the MCU to read more than one data byte. The SBC shifts out data as long as the
CSN line is low and the SPI clock is running. If bit B = 0, the SBC shifts out all data from only one address, i.e.
continuous reading of a single address (Figure 3.11-A). If bit B = 1, the SBC shifts out multiple consecutive data
bytes and increments the address after sending each byte (Figure 3.11-B). In the case of a one-byte READ, the B
bit value is “don’t care.”
Figure 3.11 SPI Single or Burst Access
A) Single Address SPI READ
CSN
7
7
7
7
7
7
0
0
0
0
0
0
Address[4:0]
SSB
MOSI
MISO
1
0
RD DATA(Addr)
RD DATA (Addr)
B) Burst SPI READ
CSN
7
7
7
7
7
0
0
0
0
0
0
Address[4:0]
SSB
MOSI
MISO
1
1
7
RD DATA(Addr)
RD DATA (Addr+1)
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3.7.5. SPI Slave Status Byte
The SPI slave status byte (SSB) contains important status bits that the SBC shifts out while the command SPI
byte is shifted in. The purpose of each SSB bit is described in Table 3.12. Most of the SSB bits are copies of the
SBC interrupt flags.
Table 3.12 SPI Slave Status Bits Descriptions (SSB)
Bit Name
Description
7
6
5
4
3
2
1
0
ACCSIG
ADCRDYIF
ADCCMPIF
HBOCIF
HSOCIF
ECMOCIF
SEIF
The access signature that is currently configured. See section 3.14.2.
ADC ready interrupt flag. See section 3.12.7.
ADC comparator interrupt flag. See section 3.12.9.
Over-current interrupt flag for half-bridge drivers. See section 3.8.
Over-current interrupt flag for high-side drivers. See section 3.9.
ECM driver interrupt flag. See section 3.11.
Supply error interrupt flag. See section 3.4.
LINIF
LIN interrupt flag. See section 3.13.
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3.8. Half-Bridge Drivers
Within the SBC chip, there are 4 half-bridge (HB) drivers for HB1 to HB4. Figure 3.12 shows the block diagram,
which is the same for each HB driver.
Figure 3.12 Structure of the Half-Bridge Drivers
Charge
Pump
VDDE
OCH
Limit
Detect
HBxHEN
Driver H
CSH
OVTIF
CPVEIF
OVIF
OVT Reset
VSS
HBxCSHEN
Open/Short
Detect
UVIF
HBxOSF
HBxOCIF
HBx pin
20µs Counter
Integrator
HBx
PWMEN
HBxCSLEN
From PWM Block
5V
OVT Reset
Driver L
CSL
HBxLEN
OCL
Limit
Detect
VSS
VSS
Features of the HB Drivers:
•
Separate enable bit for each MOSFET. If both enable bits are set, then both MOSFETs are off; this safety
logic avoids the possibility of turning on both NMOS.
•
•
Separate PWM enable bit for each driver.
Each MOSFET has over-current detection (OCH and OCL for the high and low side drivers respectively)
and protection circuitry. The over-current event automatically disables the driver (see section 3.8.2).
•
•
If an over-voltage or under-voltage is detected at the VDDE pin the drivers are automatically disabled
(see section 3.4).
Each driver has diagnostic circuitry for detection of open or short conditions in the output load (see
section 3.8.3).
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3.8.1. Half-Bridge Drivers Control and Status Register
All half-bridge drivers are enabled and disabled using the HBDCTRL register. The bit mapping of HBDCTRL is
given in Table 3.13, and the bit descriptions are in Table 3.14. The over-current and diagnostic status bits are
allocated in register HBDSTAT, which is described in Table 3.15 and Table 3.16.
Table 3.13 HBDCTRL Register Bits Mapping
Name
Bit No
HBDCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x06
R/W = Read/Write
Table 3.14 HBDCTRL Bits Description
Bit
Description
HBxHEN: 1), 2), 3), 4) High-side MOSFET enable bit for half-bridge driver x, (x=4 to 1)
1 = High-side MOSFET enabled
7,5,3,1
0 = High-side MOSFET disabled
HBxLEN: 1), 2), 3), 4) Low-side MOSFET enable bit for half-bridge driver x, (x=4 to 1)
6,4,2,0 1 = Low-side MOSFET enabled
0 = Low-side MOSFET disabled
1)
When both enable bits of one driver are set or cleared (for example, HB1HEN = 1 and HB1LEN = 1 or HB1HEN = 0 and HB1LEN = 0), the driver is
disabled.
2)
3)
4)
Bits HBxHEN and HBxLEN are automatically cleared upon entry into SLEEP or STANDBY Mode.
These bits are automatically cleared if there is an over-temperature event.
These bits are gated if a failure event (OVT, OC, OV, UV, or CPVE) is detected, and a corresponding interrupt flag is set (see Figure 3.12).
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Table 3.15 HBDSTAT Register Bits Mapping
Name
Bit No
HBDSTAT
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R
R
R
R
R/Wc
R/Wc
R/Wc
R/Wc
0x0A
R/Wc = Read/Write 1 to clear, R = Read-only
Table 3.16 HBDSTAT Register Bit Descriptions
Bit Description
HBxOSF: Open/short status flag for half-bridge driver x (x = 4 to 1, for HB4 to HB1 respectively). This flag is not
registered; i.e., its value stays as long as the diagnostic event takes place.
7:4
3:0
The meaning of these bits depends on the settings of bits HBxCSLEN and HBxCSHEN of the HBDDIAG register and
are given in Table 3.19 as explained in section 3.8.3.
HBxOCIF: Over-current interrupt flag for half-bridge driver x (x = 4 to 1, for HB4 to HB1 respectively). See section
3.8.2.
1 = There is an over-current in the output of driver x. The driver x is disabled as long as this bit is set.
0 = There is no over-current in the output of driver x.
3.8.2. Half-Bridge Over-Current Protection
In the case of an over-current event, the corresponding driver automatically limits the current in order to prevent
damage in the MOSFET stage. If the over-current condition continues more than 20µs, the corresponding
interrupt flag (HBxOCIF; Table 3.16) is set and the driver is automatically disabled. The MCU can re-enable the
driver by clearing its interrupt flag. If the over-current condition still exists after 20µs, the driver will be disabled
again.
The time of 20µs is counted by a counter functioning like an integrator. The counter works in increment or
decrement mode determined by following conditions:
•
•
The counter only increments per unit time in response to an over-current occurrence.
The counter only decrements (to zero) per unit time in response to normal current operation.
Figure 3.13 illustrates the over-current function using three typical examples of over-current occurrences in an
application:
Case A: Operating with persistent over-current occurrence for more than 20µs. The counter increments
constantly until expiration after 20µs, the interrupt flag is set, and the MOSFET is automatically
disabled.
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Case B: The over-current event occurs and then is resolved after 10µs. The counter will increment for
10µs and then decrement for 10µs until its value is back to zero.
Case C: There are three consecutive over-current events of 10µs duration with 5µs intervening pauses. In
this case, the counter increments for 10µs, then decrements for 5µs, again increments for 10µs
and so on. The process continues until the counter value reaches 20µs, the interrupt flag is set,
and the MOSFET is disabled.
Case C shows the main idea of the counter integrator concept: consecutive over-current events with a duration
shorter than 20µs are integrated over the time period and can set the over-current flag, which disables the driver.
This guarantees no chip overheating in the case of frequent over-current events shorter than 20µs.
Figure 3.13 Operation Principle of Over-Current Counter Integrator
HS or LS Over-
Current Event
Case A
Case B
Case C
0
10
20
30
40
50
60
70
80
90 100 110
t [µs]
OC Counter
(integrator)
20µs
20µs
15µs
10µs
10µs
10µs
5µs
0
0
10
20
30
40
40
50
60
60
70
70
80
80
90 100 110
t [µs]
t [µs]
HBxOCIF
HBxOCIF clear
10
20
30
50
90 100 110
Note: One counter step = 250ns
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3.8.3. Half-Bridge Driver Output Diagnostic Check
Each half-bridge driver has dedicated diagnostic circuitry that is able to detect open/short failures in the output
load. The HB driver diagnostic circuitry is controlled by the HBDDIAG register (Table 3.17 and Table 3.18), and
the diagnostic flags are monitored by reading register HBDSTAT.
Table 3.19 gives the meaning of the corresponding HBxOSF flags in the HBDSTAT register with respect to the
load configuration and the combination of the HBxCSHEN and HBxCSLEN bits of HBDDIAG register, which
controls the diagnostic current sources/sinks.
Important note: When the diagnostic circuitry is enabled (one of the HBxCSHEN bits or the HBxCSLEN bits is
set), then the corresponding over-current protection circuitry is not active. Therefore, enabling the driver when the
diagnostic circuitry is enabled is not recommended!
Table 3.17 HBDDIAG Register Bits Mapping
Name
Bit No
HBDDIAG
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x07
R/W = Read/Write bit
Table 3.18 HBDDIAG Register Bits Description
Bit
Description
HBxCSHEN: 1), 2) High-side current source enable bit for driver x, (x = 4 to 1, for HB4 to HB1 respectively).
1 = The high-side current source of driver x is enabled.
7,5,3,1
0 = The high-side current source of driver x is disabled.
HBxCSLEN: 1), 2) Low-side current source enable bit for driver x, (x = 4 to 1, for HB4 to HB1 respectively).
6,4,2,0 1 = The low-side current source of driver x is enabled.
0 = The low-side current source of driver x is disabled.
1) In order to keep current consumption as low as possible, the MCU software should disable the current sources before enabling the
SLEEP or STANDBY Modes.
2)
In the event of an over-temperature event, these current sources are automatically disabled.
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Table 3.19 Half-Bridge Diagnostic Bit Descriptions
Note: See important notes at end of table.
HBxCSHEN 1)
HBxCSLEN 1)
HByLEN 1)
HBxOSF 1)
Description 2)
0
1
1
0
1
1
“don’t care”
0
Diagnostic disabled.
Undefined result.
Not applicable.
0
1
“don’t care”
0
Low-resistance load connected to VSS
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
1
-
-
-
-
-
-
-
-
0
0
1
1
1
0
0
1
Normal load or short to VSS.
Short to VDDE.
Open load.
Invalid.
Low-resistance load connected to VDDE
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
1
-
-
-
-
-
-
-
-
0
0
1
1
1
0
0
1
Short to VSS.
Normal load or short to VDDE.
Open load.
Impossible.
Load connected between two half-bridges 3)
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
1
1
0
0
1
0
0
1
1
1
0
0
0
1
0
1
Short to VSS.
Short to VDDE.
Normal load.
Open load.
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HBxCSHEN 1)
HBxCSLEN 1)
HByLEN 1)
HBxOSF 1)
Description 2)
0
1
0
1
0
1
1
0
0
0
0
1
Invalid.
1)
In the case of a load connected between two half-bridges (full-bridge configuration), “x” corresponds to one of the half-bridges (x = 1 to 4) and “y”
corresponds to the other half-bridge (y = 1 to 4). In the case of a load connected between the output of the driver and one of the supply rails, the column
“HByLEN” is not applicable. See Table 3.13 for more information about the HByLEN bits.
2)
3)
Important: The result of the diagnostic procedure is correct only if the drivers involved are switched-off during the diagnostic procedure and are turned
on only when explicitly required according to this table.
The diagnostic procedure for full-bridge configuration includes enabling one of the low-side drivers, which makes a complete diagnostic of the load
possible.
3.9. High-Side Drivers
Within the SBC, there are 4 high-side drivers for HS1 to HS4. Figure 3.14 shows the block diagram for the each
driver. It is essentially the same as the half-bridge but without the low-side MOSFET.
Figure 3.14 Structure of High-Side Drivers
HSx
PWMEN
Charge
Pump
VDDE
From PWM
Block
OCH
Limit
Detect
HSxEN
Driver H
CS
OVT Reset
VSS
HSxCSEN
OVTIF
CPVEIF
OVIF
20µs Counter
Integrator
HSxOCIF
HSx pin
UVIF
RLOAD
Open/Short
Detect
HSxOSF
VSS
Features of High-Side Drivers:
•
•
•
Separate enable bit for each driver.
Separate PWM enable bit for each driver.
Each NMOS has over-current detection and protection circuitry. The over-current event automatically
disables the driver.
•
•
If an over-voltage or under-voltage condition is detected at VDDE pin the drivers are automatically disabled.
Each driver has diagnostic circuitry for detecting an open or short in the output load.
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3.9.1.
High-Side Control and Status Register
Table 3.20 HSDCTRL Register Bits Mapping
Name
Bit No
HSDCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x08
R/W = Read/Write
Table 3.21 HSDCTRL Register Bits Description
Bit Description
HSxCSEN: 1), 2) Current source enable bit for high-side driver x, (x = 4 to 1).
7:4 1 = The current source of high-side driver x is enabled.
0 = The current source of high-side driver x is disabled.
2), 3), 4)
HSxEN:
High-side driver enable.
1 = High-side driver x (x = 4 to 1) enabled.
0 = High-side driver x (x = 4 to 1) disabled.
3:0
Note: Bits HSxEN are automatically cleared at SLEEP or STANDBY Mode entry.
1)
2)
3)
4)
To keep current consumption as low as possible, the MCU software should disable the current sources before enabling the SLEEP or STANDBY Modes.
These bits are automatically cleared in the event of an over-temperature event.
Bits HSxEN are automatically cleared at SLEEP or STANDBY Mode entry.
These bits are gated if failure event (OVT, OC, OV, UV, CPVE) is captured in interrupt flag (see Figure 3.14).
3.9.2. High-Side Over-Current Protection
The high-side over-current protection circuitry is identical to the protection for the half-bridge driver previously
discussed in section 3.8.2.
3.9.3. High-Side Drivers Output Diagnostic Check
Each high-side driver has a dedicated diagnostic circuitry that is able to detect an open/short failure in the output
load. The diagnostic functionality is controlled and monitored respectively by registers HSDCTRL (Table 3.20 and
Table 3.21) and HSDSTAT (Table 3.22 and Table 3.23). Table 3.24 gives the meaning of the HSxOSF flags in the
HSDSTAT register with respect to the value of bit HSxCSEN in the HSDCTRL register, which controls the
corresponding diagnostic current source.
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Important note: When the diagnostic circuitry is enabled (one of the HSxCSEN bits is set), then the
corresponding over-current protection circuitry is not active. Therefore enabling the driver when the diagnostic
circuitry is enabled is not recommended!
Table 3.22 HSDSTAT Register Bits Mapping
Name
Bit No
HSDSTAT
3
7
6
5
4
2
1
0
Bit name
Reset
0
0
0
0
0
R/Wc
0x0B
0
0
0
Access
Address
R
R
R
R
R/Wc
R/Wc
R/Wc
R/Wc = Read/Write 1 to clear; R = Read-only bit
Table 3.23 HSDSTAT Register Bits Description
Bit
Description
HSxOSF: Open/short status flag of the high-side driver x (x = 4 to 1). This flag is not registered; i.e., its value
remains as long as the diagnostic event takes place.
7:4
Refer to Table 3.24 for the descriptions of the HSxOSF bits.
HSxOCIF: Over-current interrupt flag of the high-side driver x (x = 4 to 1).
1 = There is an over-current in the output of driver x. The driver x is disabled as long as this bit is set.
0 = There is no over-current in the output of driver x.
3:0
Table 3.24 High-Side Diagnostic Bits Description
HSxCSHEN
HSxOSF
Description1)
0
1
0
1
0
1
0
1
0
0
0
1
1
1
1
0
Normal load or short to VSS 2)
Open load
Short to VDDE
Not possible in normal application
1)
2)
Important: The diagnostic result is correct only if the corresponding driver is switched off.
In the event of a short, an over-current will occur.
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3.10. Pulse Width Modulation (PWM)
The ZAMC4100 SBC incorporates an 8-bit pulse width modulation module (PWM), which is designed to regulate
discrete power levels of the half-bridge and high-side driver’s output. The PWM module is a highly configurable
solution by the MCU via SPI.
3.10.1. Overview
The PWM block supports the following features:
•
•
•
•
•
•
PWM control for each half-bridge or high-side driver
Two or more drivers can be simultaneously controlled by a PWM block
When PWM control is not required, it can be disabled
Maximum frequency: ~1kHz
PWM frequency resolution: 8-bit
PWM duty-cycle resolution: 8-bit
Figure 3.15 PWM Block Diagram
PWMDREN
PWMDCFG
8
HB1PWMEN
HB1PWM
HB4PWM
PWMDCFG Shadow
8
HB4PWMEN
PWM Signal
Comparator
8
PWMFCFG
HS1PWMEN
HS4PWMEN
HS1PWM
HS4PWM
8
Fosch/80
PWM
8-bit
Prescaler
PWM Counter
This module has three registers as summarized below:
•
•
•
PWM frequency configuration register PWMFCFG (Table 3.50)
PWM duty cycle configuration register PWMDCFG (Table 3.50)
PWM driver control enable register
PWMDREN (see Table 3.25)
On power-on-reset, the value of register PWMDCFG is zero and the PWM output is continuously low; i.e. the
PWM is disabled. In order to start the PWM signal generation, the MCU should write to register PWMDCFG with a
value different than zero. The PWMDCFG register can be written at any time, but internally the duty-cycle value is
latched in a shadow register each time the PWM counter crosses zero. This guarantees a glitch-free signal at the
PWM output by avoiding duty-cycle changes within the PWM period.
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Register PWMDREN contains local bits for enabling the PWM control for each half-bridge or high-side driver.
When all bits of PWMDREN are 0 (power-on-reset value), there is no driver using PWM control. In this case, the
PWM module is automatically disabled even if PWMDCFG is not 0.
3.10.2. PWM Signal Generation
The PWM module is enabled when at least one bit of the PWMDREN register is set (see section 3.10.3). In that
case, a signal with an adjustable frequency and duty-cycle is generated at the output of the PWM module (see
Figure 3.16).
Figure 3.16 PWM Output Signal
PWMFCFG
PWMFCFG
PWMDCFG
PWMDCFG
PWM
signal
The PWM frequency is configured via register PWMFCFG and is calculated using the formula:
(Fosch / 80)
PWMfreq =
,[Hz] → PWMFCFG ∈
[
0:255
]
256 × [PWMFCFG + 1]
The value of PWMFCFG determines the division ratio of the PWM prescaler (see Figure 3.15). The prescaler
determines the speed of incrementing the PWM counter value from 0 to 255, i.e. the duration of the PWM period.
Setting a minimum value for PWMFCFG provides a maximum PWM frequency of approximately 976Hz. Each
time the counter crosses zero, the following procedure is executed:
1) The comparator (PWM) output is set to high (if PWMDCFG = 0, the output is not set)
2) The PWM duty-cycle value from register PWMDCFG is latched to the shadow register (see Figure 3.15).
The PWM output stays high as long as the counter value is less than the value configured in register PWMDCFG.
When counter’s value matches the value of PWMDCFG, the comparator (PWM) output is cleared. This is the end
of the PWM duty cycle. The PWM duty cycle is calculated using the following formula:
[PWMDCFG]
PWMdc =
×100,[%] → PWMDCFG∈
[
0:255
]
256
A duty-cycle of 50% is achieved by writing the value 128DEC in register PWMDCFG. Writing 0 to PWMDCFG
produces a continuous low level at the output of PWM module. The maximum PWMDCFG value 255DEC produces
a duty-cycle of 99.6%.
Note: In order to have a continuously enabled driver (i.e. duty-cycle of 100%), the MCU should clear the
corresponding PWM enable of register PWMDREN.
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3.10.3. Drivers PWM Control
The PWM signal is propagated to all half-bridge and high-side drivers. Each driver has a PWM enable bit that
determines whether the driver’s output is pulse-width modulated or not. The PWM enable bits for all drivers are
mapped to register PWMDREN (see Table 3.25 and Table 3.26). If needed, the MCU can enable simultaneous
PWM control for two or more drivers by setting more PWM enable bits in register PWMDREN.
Once the PWM is enabled (PWMDCFG ≠ 0), the write access to register PWMDREN is disabled. In order to
enable the PWM control for another driver, the MCU must disable the PWM generation (write PWMDCFG =
00HEX) and then modify the value of the PWMDREN register. For a successful PWMDREN change, the following
sequence is recommended:
1) Disable the PWM by writing to PWMDCFG = 00HEX
2) Wait for a time longer than one PWM period to ensure that register PWMDCFG is updated; i.e. PWM is
disabled. This requirement comes from the ZAMC4100 PWM glitch-free feature (see section 3.10.1).
3) Write the new value in register PWMDREN
4) Enable the PWM again (PWMDCFG ≠ 0x00)
Table 3.25 PWMDREN Register Bits Mapping
Name
Bit No
PWMDREN
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x1B
R/W = Read/Write bit
Table 3.26 PWMDREN Register Bits Description
Bit
Description
HSxPWMEN: 1), 2) Enables PWM control for high-side drivers x (x = 1 to 4).
7:4
1 = The output of the corresponding high-side driver is pulse-width modulated.
0 = There is no pulse width modulation at the driver’s output.
HBxPWMEN: 1), 2) Enables PWM control for half-bridge drivers x (x = 1 to 4).
1 = The output of the corresponding half/bridge driver is pulse-width modulated.
0 = There is no pulse width modulation at the driver’s output.
3:0
1)
2)
Bits HSxPWMEN and HBxPWMEN are automatically cleared at SLEEP or STANDBY Mode entry.
When all bits of the PWMDREN register are 0, the PWM module is disabled.
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3.10.4. PWM Initialization
This section describes the recommended PWM initialization flow which ensures no latency between the SPI driver
enable and driver’s output response. As an example, the initialization process using PWM control of the driver
HS3 is illustrated. In order to have pulse-width modulation at the HS3 pin, the MCU should execute the following
procedure (see Figure 3.17):
1) Enable PWM control for the HS3 driver by setting the HS3PWMEN bit of the PWMDREN register (see
Table 3.25).
2) Enable driver HS3 by setting the HS3EN bit of the HSDCTRL register (Table 3.20).
3) Configure the PWM frequency by writing to register PWMFCFG (Table 3.50).
4) Configure the PWM duty cycle by writing in register PWMDCFG (Table 3.50) a value greater than zero.
Until step 4 is executed, the driver’s output is disabled. After configuring the duty-cycle (in step 4), the PWM
module starts operating; i.e., it starts modulating the HS3 output.
In order to disable the PWM at the driver’s output, the MCU should execute the following (recommended)
procedure (see Figure 3.17):
1) Write zero in register PWMDCFG in order to stop PWM generation. As shown in Figure 3.17, the PWM
stops after the end of the current period. The value in the PWMFCFG register can be left unchanged.
2) Disable the driver by clearing bit HS3EN of register HSDCTRL.
3) Disable the PWM for driver HS3 by clearing the HS3PWMEN bit. If step 2 is omitted (bit HS3EN still set),
the execution of this step will enable the driver.
Figure 3.17 Recommended PWM Initialization Procedure with HS3 as an Example
3
1
HS3PWMEN
HS3EN
2
2
3
PWMFCFG
PWMDCFG
0x00
0x1C (example value)
0x3A (example value)
1
4
0x00
0x00
PWM start
PWM stop
PWM signal
HS3
The initialization flow explained above should be considered as a recommendation for ensuring that the
application has no latency between setting the enable bits and driver’s output reaction.
The ZAMC4100 has internal synchronization logic that prevents glitches at each driver’s output in case the
driver’s enable bit is set when the generation of PWM signal is already running. In this event, the driver enable will
be synchronized with the PWM signal, which will cause a latency of one PWM period (worst case). See Figure
3.18 for an illustration of the synchronization effect.
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Figure 3.18 Effect of Driver Enable When the PWM is Running
PWM signal
HS3PWMEN
HS3EN
START
STOP
HS3
3.10.5. PWM Module in SLEEP and STANDBY Mode
When SLEEP or STANDBY Mode is activated, the PWM signal generation is automatically disabled by clearing
the value of register PWMDCFG (i.e., zero the duty-cycle). The drivers’ PWM enable bits in register PWMDREN
are also cleared. If needed after wake-up, the MCU can reinitialize the PWM unit following the procedure
explained in the previous section.
As a recommended practice, before entering the SLEEP or STANDBY Mode, the MCU should stop the PWM in
order to ensure that the drivers will not be disabled during the PWM pulse generation phase; i.e. no glitches at the
drivers’ outputs.
3.11. EC Mirror Driver
The structure of the EC mirror (ECM) driver is shown in Figure 3.19. It is controlled via register ECMCTRL (see
Table 3.27). Setting the ECMEN bit in this register enables the driver while the output voltage is controlled by a 6-
bit DAC programmed by the ECMDAC bits.
The driver operates as the DAC voltage is continuously compared with the voltage measured at the EC_M pin by
the error amplifier. Depending on the comparison result, it controls both transistors of the output stage to provide
a current with a direction and value necessary for achieving the desired voltage across the electrochromatic
mirror terminals. The reflectivity of the mirror is controlled precisely with respect to the desired level (set by bits
ECMDAC[5:0] in the ECMCTRL register).
In order to limit the current through the load and to reduce the power dissipation of the driver inside the chip, an
external resistor is connected in series between the high-side transistor of the output stage and the EC mirror. It
must withstand power in the range of 0.5W to 1W depending on the nominal supply voltage, the static current
consumption, and the expected dynamic current consumption.
For achieving maximum reflectivity of the mirror in the fastest possible way, it is necessary that the voltage across
the electrochromatic material (CECM) to be reduced to zero. This is achieved by completely turning on the low-side
transistor of the output stage of the ECM driver, which shorts the terminals of the mirror and provides a low
resistance current path for discharging. If the equivalent resistance of that switch is low (see Table 1.9), the time
necessary for that transition is determined mainly by the parameters of the EC mirror (CECM, RECMs, RECMp) and the
initial voltage to which it has been charged. This feature is enabled by the dedicated bit DSCEN in the ECMCTRL
register.
Like all other power drivers in the ZAMC4100, the ECM driver is automatically disabled in the event of an
over/under voltage event or overheating of the system.
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Figure 3.19 ECM Driver Structure
VDDE
ECMEN
OVT Reset
ECM Control
EN
OVIF
CSH
HS
UVIF
Ctrl
ECMCSHEN
ECMCSLEN
EC_RES
6
DAC
Error
Amplifier
EC_M
OC
Detect
ECMOCIF
CSL
LS
ctrl
RECMs
DSCEN
Open/Short
Detect
ECMOSF
RECMp
CECM
VSS
VSS
3.11.1. ECM Driver Current/Voltage Limitation and Protection against Short to GND or Vbat
The limitation of the current through the load to safe levels for all conditions is achieved by adding an external
resistor between the EC_RES pin and the mirror terminal. Its value is chosen considering the characteristics of
the EC mirror and the nominal supply voltage of the system (see Table 6.1 for recommended external com-
ponents). In addition, the maximum voltage at the output of the driver is limited to the level specified in Table 1.9.
The limitation of this voltage relies on the feedback connection between the mirror terminal and the EC_M pin. If
this connection is missing, the voltage applied by the driver to its load could rise up to the supply of the system, so
an important step before activating the driver is to perform an open/short diagnostic check (see 3.11.3).
The current through both transistors (high-side and low-side) of the output stage is sensed for protecting the
driver against a short to Vbat or GND of both output pins (EC_RES and EC_M). In the event of such failures, if
the current exceeds a specified threshold level (see Table 1.9), the output stage of the ECM driver is
automatically disabled. This event generates an interrupt to the MCU and the ECMOCIF flag bit in the ECMDIAG
register is set (the ECMOCIF bit in IRQSTAT register is set; see
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Table 3.9). Recovering from that state to normal functionality requires that the ECMOCIF flag to be cleared by
writing “1” to its position in the ECMDIAG register. The procedure for recovering from that state to normal
functionality goes through the following steps:
As previously discussed, it is strongly recommended that the MCU performs an open/short diagnostic check
before re-enabling the driver:
•
If the result is “Normal load or short to VSS” (see section 3.11.3), then “Normal load” condition is
assumed and the MCU should proceed with the driver enable. If enabling the driver generates an over-
current event, then there is a “short to VSS” failure at the output.
•
If the diagnostic (and eventual activating of the driver as described above) results in “short to VSS,”
“Short to VDDE,” or “Open load,” the ECM driver should not be enabled until the failure is present.
ECM “Short to VSS” and “Short to VDDE” Failures
For ZAMC4100 failures for the ECM, “Short to VSS” and “Short to VDDE” must be considered differently on the
module level compared to the ZAMC4100 level. On the module level, the short failures are defined for each point
in the outside circuitry, including external connections, components and loads, and reflect their specifics. On the
ZAMC4100 level, failure is defined inside the IC, also including the pins on the package.
This clarification is important because module-level failures are not always IC-level failures. For example in the
case of a “Short to VSS” of the EC mirror terminal (module-level failure), the current through the output of the
ECM driver is limited by the external resistor R1 (see the application diagram in Figure 6.1) to a value in the
normal operation range for the ZAMC4100 (see parameters IOC_EC_M and IOC_EC_RES in Table 1.9). As a result, this
particular event will not be detected by the internal over-current protection circuitry of the ECM driver and no over-
current event will be detected and captured in the ECMOCIF interrupt flag (see section 3.11.3,
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Table 3.9, and Table 3.1).
To cover all possible failure scenarios, the ZAMC4100 features different resources for detecting short failures on
the module level and on the IC level. Failures on the IC level are detected using internal diagnostic current
sources and over-current protection, while detecting failures on the module level also requires the dedicated ADC
channel for direct measuring of the EC_M pin voltage (see Table 3.36). Because the EC_M pin is used for
sensing the potential at the mirror terminal, it gives precise information for the overall status and current operating
condition of the ECM functionality. Any failure on the IC or module level will result in an unexpected or inaccurate
response at the EC_M potential with respect to the configuration in the ECMCTRL register (see section 3.11.2).
The ADC ECM voltage channel together with the “open/short diagnostic check” (see 3.11.3) provides all the
necessary information for the MCU firmware to distinguish between different types of ECM short failures.
3.11.2. ECM Control Register
Table 3.27 ECMCTRL Register Bits Mapping
Name
Bit No
ECMCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x09
R/W = Read/Write bit
Table 3.28 ECMCTRL Register Bits Description
Bit
Description
ECMEN: 1) 2) 3) Electrochromatic mirror driver enable bit.
1 = ECM driver is enabled.
7
0 = ECM driver is disabled.
DSCEN: 1) 2) Electrochromatic mirror discharge enable bit.
1 = ECM driver low-side MOSFET is ON; EC mirror discharge enabled.
0 = ECM driver low-side MOSFET is OFF; EC mirror discharge disabled.
6
ECMDAC[5:0]: 1) 2) Electrochromatic control DAC bits.
5:0 111111 = ECM driver provides maximum output voltage (see Table 1.9).
000000 = ECM driver provides minimum output voltage (see Table 1.9).
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1)
2)
3)
These bits are automatically cleared on an over-temperature event.
These bits are automatically cleared upon SLEEP or STANDBY Mode entry.
This bit is gated in case a failure event (OC, OV, UV) is captured in an interrupt flag (see Figure 3.19).
3.11.3. ECM Driver Output Diagnostic Check
The ECM driver diagnostic circuitry is able to detect open/short failures in the driver output. The diagnostic
functionality is controlled and monitored by register ECMDIAG (Table 3.29 and Table 3.30).
Table 3.31 gives the meaning of the ECMOSF bit in the ECMDIAG register with respect to the combination of
ECMCSHEN and ECMCSLEN bits that enable the diagnostic current sources/sinks connected to the EC_M and
AC_RES pins respectively.
Table 3.29 ECMDIAG Register Bits Mapping
Name
Bit No
ECMDIAG 1)
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
U
U
U
U
U
U
0
0
0
0
Access
Address
R/W
R/W
R
R/Wc
0x0C
R/W = Read/Write; R = Read-only bit; U = Unimplemented, read as ‘0’;
R/Wc = Read/Write 1 to clear
1)
The ECMOCIF is physically implemented in register ECMDIAG and mapped to IRQSTAT (Table 3.10).
Table 3.30 ECMDIAG Register Bits Description
Bit Description
7:4 Unimplemented bits. Read as 0.
ECMCSHEN(1): ECM high-side current source enable bit.
3
1 = High-side current source is enabled.
0 = High-side current source is disabled.
ECMCSLEN(1): ECM low-side current source enable bit.
1 = Low-side current source is enabled.
2
1
0 = Low-side current source is disabled.
ECMSOF: Open/short status flag of the ECM driver. This flag is not registered; i.e., its value remains as long as the
diagnostic event takes place (see Table 3.31).
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Bit
Description
ECMOCIF (2): Over-current interrupt flag of the ECM driver.
1 = Over-current event has been detected at the ECM output, and the driver has been disabled.
0 = There is no over-current at ECM output.
0
1)
2)
To keep current consumption as low as possible, the MCU software should disable the current sources before enabling SLEEP or STANDBY Modes.
This bit is also mapped to IRQSTAT register.
Table 3.31 ECMOSF Diagnostic Bit Meaning
ECMCSHEN
ECMCSLEN
ECMOSF 1)
Description
Diagnostic disabled
0
1
1
0
1
0
1
0
1
0
0
1
0
1
0
1
0
1
0
1
x
x
0
0
1
1
1
0
0
1
Result not defined
Normal load or short to VSS 2)
Short to VDDE
Open load
Unused
1)
2)
Important: The diagnostic result is correct only if the driver is disabled.
In the event of a short to VSS, the output stage of the driver will be automatically disabled if the current exceeds the threshold specified in Table 1.9. If
the current is limited to levels below that threshold due to specifics of the EC mirror glass used, distinguishing between the two possible states, which
are “Normal load” or “Short to VSS,” can be done by an additional ADC channel and software procedure for measuring the potential at EC_M pin (for
more details, see section 3.11.1).
3.12. ZAMC4100 Analog to Digital Converter
The ZAMC4100 features a 10-bit successive approximation ADC with a front-end multiplexer for digitizing the
multi-channel inputs, including four external ports.
3.12.1. ADC Overview
The ZAMC4100 ADC block has the following key features:
•
•
•
SAR (successive approximation) conversion, 10-bit resolution, single or continuous conversion
High conversion speed (see Table 1.15)
Multi-channel front-end multiplexer with access to various input signals as shown in the Figure 3.20;
4 external channel ports with versatile options
•
•
•
•
Internal voltage and current references
Configurable result format
Result comparator with counter
Interrupt support for various type of events
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Figure 3.20 illustrates the block diagram of the ADC module with the result comparator at the bottom of the
diagram.
Figure 3.20 ADC Functional Diagram
AINCONF
INPSEL[4:0]
CCNV SCNV
ADCRDYIF
4
5
AIN1
AIN2
AIN3
AIN4
Int.Ref
VREF
5V
Analog
Inputs
8
8
10
ADC
HB1 H/L*
HB2 H/L
HB3 H/L
HB4 H/L
NMOS
Current
Inputs
VSSA
SysClk
ADC
2
Rate
HS1 H
HS2 H
HS3 H
HS4 H
RESFMT
NMOS
Current
Inputs
3
ADCCMPIF
ADCSR[2:0]
10
Internal
Temp
CMP
Counter
ADCCMPH ADCCMPL
ECM
2
8
10 CMPTH
Internal
Diag
8
VDDE
CMPMD
CNTDEC RCMPCNT
*H/LꢀꢀHꢀ=ꢀHIGHꢀSIDEꢀNMOS,ꢀLꢀ=ꢀLOWꢀSIDEꢀNMOS
This module is highly versatile due to a comprehensive register structure as summarized below:
•
•
•
•
•
•
ADC External Port Configuration Register
ADC Multiplexer and Control Register
ADC Configuration Register
AINICONF
ADCCTRL
ADCCONF
ADC Status Register with Interrupts Flags
ADC Compare and Counter Registers
ADC Digitized and Formatted Results
ADCSTAT
RESCMPH, RESSCMPL, RCMPCNT
ADCRESH and ADCRESL
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3.12.2. ADC External Inputs Configuration
The external analog inputs AIN1-AIN4 of the ADC can be configured for measurement in ratiometric or absolute
mode or for temperature measurement using internal current sources. All AINx inputs are configured via settings
in the AINCONF register (see Table 3.32 and Table 3.33).
Figure 3.21 Ratiometric versus Absolute Measurement Inputs Configuration
Ratiometric Inputs Configuration
A) External Sensor Supply
B) Internal Sensor Supply
C) Absolute Measurement
VDD5V0
VDD5V0
SPSWEN
+VE
S_P
S_P
AINx
S_N
Int.Ref
V
REF
V
REFP
AINx
ADC
V
REFP
AINx
ADC
V
REFN
V
REFN
Signal
Source
S_N
SNSWEN
VSSA
-VE
VSSA
VSSA
Ratiometric Measurement on AIN1-AIN4
By default, the analog input pins are configured for ratiometric measurements with the external supply source as
shown in the Figure 3.21-A. The ADC reference inputs are connected to the S_P or S_N pins, which “sense” the
sensor supply voltage and ensure accurate ratiometric conversion results.
The supply switches SPSWEN and SNSWEN are controlled by the AINCONF register. This register will
determine the usage of the external or internal supply source for the sensor and the ADC reference as shown in
Figure 3.21-A and Figure 3.21-B. In general, when the external sensor supply source is used, the measurement
can provide more accurate results because the voltage drop across the connections to the S_P and S_N pins is
negligible due to the very low current through them.
If the signed ADC result mode is used, the sign is determined as positive if the measured voltage is in the upper
half of the voltage difference between S_P and S_N pins and negative if in the lower half.
Absolute Measurement on AIN1-AIN4
Absolute measurement as shown in Figure 3.21-C can be achieved by setting the AINxMD bits in the AINCONF
register (where x = channel 1 to 4). During the absolute measurement, the ADC uses its internal reference and
the sensor absolute voltage is measured at the corresponding AINx pin.
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Diode Temperature Measurement on AIN3, AIN4
If the application requires external temperature measurements using a diode-based sensor, it can be connected
to input AIN3 or AIN4 (Figure 3.22). Both inputs have an internal current source that is enabled with bits
AIN3TMEN and AIN4TMEN in register AINCONF (Table 3.32). The current sources are internally controlled by
the ADC in order to provide two currents with a fixed ratio 1:10. This ratio is used for the calculation of the
temperature based on the measured results.
Figure 3.22 Using AIN3 and AIN4 for External Temperature Measurement
VDD5V0
ZAMC4100
Int.Ref
VREF
CS ratio
1:10
AINxTMEN
VREFP
AIN3/4
ADC
VREFN
Temp.
Sensor
VSSA
For more information about the temperature measurement including the LM135 and thermistors, refer to the
ZAMC4100 Application Note – ADC.
Table 3.32 AINCONF Register Bits Mapping
Name
Bit No
AINCONF
7
6
5
4
3
2
1
0
Bit name
Reset
0
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x10
R/W = Read/Write bit
Note: When the ADC conversion is running, the AINCONF register is accessed as
read-only.
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Table 3.33 AINCONF Register Bits Description
Bit
Description
SPSWEN: Bit for connecting the internal 5.0V supply to the S_P pin.
1 = Pin S_P is connected to the internal supply.
7
0 = Pin S_P is connected to an external source.
SNSWEN: Bit for connecting the VSSA to pin S_N.
1 = Pin S_N is connected to VSSA.
6
0 = Pin S_N is connected to an external source.
AINxTMEN: Enable external temperature measurement at pins AIN3, AIN4.
1 = Pin AINx (x=3, 4) is configured for temperature measurement.
0 = Pin AINx (x=3, 4) is used as a general-purpose pin.
5:4
3:0
Note: When AINxTMEN = 1, the bits AINxMD are “don’t care.”
AINxMD: Analog inputs absolute or ratiometric configuration bit.
1 = Pin AINx (x=1 to 4) is configured for absolute measurement.
0 = Pin AINx (x=1 to 4) is configured for ratiometric measurement.
3.12.3. ADC Input MUX Control
The ADC input multiplexer is controlled via the INPSEL[4:0] bits in the ADCCTRL register (see Table 3.34). The
settings for combinations of INPSEL bits are described in Table 3.36 and illustrated in Figure 3.20Figure 3.21.
After setting the INPSEL for a corresponding channel, the ADC control circuitry automatically processes the
following operations:
1) It configures the analog circuitry to provide required reference voltage.
2) When the conversion is started, it runs the conversion algorithm depending on the type of selected input.
Bits SCNV and CCNV of register ADCCTRL are used for starting a single or continuous ADC conversion.
Supported ADC conversion modes and conversion enable bits are discussed in section 3.12.7.
Note: When an ADC conversion is running, the WRITE access for the INPSEL bits is blocked.
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Table 3.34 ADCCTRL Register Bits Mapping
Name
Bit No
ADCCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
0
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0x12
R/W = Read/Write bit; U = Unimplemented, read as ‘0.’
Note: When the ADC conversion is running, bits INPSEL[4:0] are accessed
as read-only.
Table 3.35 ADCCTRL Register Bits Description
Bit
Description
7
Unimplemented bit. Read as 0.
CCNV: Continuous Conversion Mode.
1 = ADC performs Continuous Conversion Mode.
0 = ADC idle.
6
SCNV: Single Conversion Mode.
5
1 = ADC performs Single Conversion Mode. Cleared automatically at completion of ADC conversion.
0 = ADC idle.
4:0
INPSEL: Input MUX Select Channels. See Table 3.36.
Note: When CCNV and SCNV are both set, the ADC performs in the Continuous Conversion Mode.
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Table 3.36 Input MUX Control Bits Description
Channel
Number
INPSEL[4:0] value
Selected Channel Name
Notes
[DEC]
Application mode ADC channels
00000
00001
0
1
AIN1
AIN2
AIN3
AIN4
HB1H
HB1L
HB2H
HB2L
HB3H
HB3L
HB4H
HB4L
HS1
The type of measurement depends on the value
of the AICONF register.
00010
2
00011
3
00100
4
00101
5
00110
6
Current measurement mode. Measures the
current through the high-side/low-side transistor
of the half-bridge drivers 1-4.
00111
7
01000
8
01001
9
01010
10
11
12
13
14
15
16
17
18
19-24
01011
01100
01101
HS2
Current measurement mode. Measures the
current through high-side drivers 1-4.
01110
HS3
01111
HS4
10000
VDDE
INTTMP
ECM
-
Supply voltage at VDDE pin.
Internal chip temperature.
Measures EC_M pin voltage.
Reserved.
10001
10010
[10011 to 11000]
Diagnostic mode ADC channels (see section 5.2)
11001
11010
11011
11100
11101
11110
11111
25
26
27
28
29
30
31
Internal reference
Internal reference
Ratiometric ADC diagnostic
Ratiometric ADC diagnostic
Internal reference
Absolute voltage measurement
ADC reference voltage diagnostic
Internal VDD2V5 supply diagnostic
Internal VDD5V0 supply diagnostic
Absolute current measurement diagnostic
ADC VREF
REG2v5 regulator voltage
REG5v0 regulator voltage
Current multiplexer
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3.12.4. ADC Voltage References and Result Calculation
The ZAMC4100 ADC features different reference sources depending on the configured measurement mode. The
reference voltage is automatically selected depending on the INPSEL setting and the analog inputs configuration
(AINCONF register; Table 3.32). These settings also configure the result interpretation as described below.
Note: In the following descriptions of the measurement options, the coefficients CSR_X, IREF, VREF and Vt27 can
vary from chip to chip. If more precise calculations are needed their factory-trimmed values can be obtained from
the MCU FLASH memory (refer to section 4.2.3); otherwise the default values from Table 1.8, Table 1.11, and
Table 1.12 are used.
Ratiometric measurement
In the ratiometric measurement mode, the reference voltage for the ADC is the voltage between the S_P and S_N
sensor pins. The result of the ADC conversion is calculated as the RATIO of the voltage between the S_P, S_N
pins and the voltage at input AINx:
RATIO ∗
(
210 −1
100%
)
RESCODE =
Depending on the application requirements, the result format can be configured as signed or unsigned. For
example, the signed ratiometric result can be used for position adjusting while the unsigned result format is
convenient for level measurement.
Absolute voltage measurement
The absolute voltage measurement mode is used for analog inputs measurement, for system supply measure-
ment (the voltage at VDDE pin), and for the EC_M pin diagnostic measurement (see Table 3.36). In this case, the
reference voltage for the ADC is provided by the internal reference source (VREF) with the value that is specified in
Table 1.12. The formula used for result calculation is
AINx[V] ∗ 210
RESCODE =
VREF [V]
For VDDE measurements, the equation is:
VDDE[V] ∗ 210
RESCODE =
8 ∗VREF[V]
Absolute current measurement
This measurement is for internal channels associated with half-bridge and high-side drivers. The equation below
represents a current measurement in RESCODE (unsigned) after internal translation using two constants:
CSR_X = Current Sense Ratio Coefficient (specified for each high-side and half bridge driver in Table 1.8)
IREF = Calibrated internal reference current as specified in Table 1.12 (typically 10µA)
IIN [µA] ∗ 210
RESCODE =
CSR_ X ∗IREF [µA]
Where IIN = Input current up to full-scale range equal to (CSR_X Û IREF
)
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External temperature measurement
For a basic understanding of external temperature measurement for the diode-based sensor, the equation below
provides a temperature measurement result (unsigned) within RESCODE (other additional factors apply in final
applications; contact IDT for more details using the contact information on page 155):
k ∗ln(10)
210
RESCODE = 32 ∗T[K] ∗
∗
q
VREF[V]
T[K]
RESCODE =
0.1538 ∗VREF[V]
Where: q = elementary charge (1.60217646 x 10-19
k = Boltzmann constant (1.3806503 x 10-23
)
)
Internal temperature measurement
The formula for temperature calculation in correspondence with the conversion unsigned result is
VREF [V] ∗103
V
t27[V] ∗103
⎛
⎜
⎜
⎝
⎞
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
⎟
T[°C] =
(
512 + RESCODE
)
−
+ 27
⎟
3072 ∗SVT [mV/ °C]
SVT [mV/ °C]
⎠
Where the parameter SVT is the voltage/temperature slope of the internal temperature sensor and Vt27 is the
output voltage at 27°C (both specified in Table 1.11).
3.12.5. ADC Configuration and ADC Status Register
ZAMC4100 ADC configurations define the conversion rate, result format (sign and justification) and continuous
conversion mode in the ADCCONF register. The mapping of bits in this register is described in Table 3.37 and the
purpose of the bits is described in the following sections.
The interrupt flags of the ADC module are allocated in the ADCSTAT register described in Table 3.39.
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Table 3.37 ADCCONF Register Bits Mapping
Name
Bit No
ADCCONF
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
U
U
0
0
0
0
0
0
Access
Address
R/W
R/W
R/W
R/W
R/W
R/W
0x11
R/W = Read/Write bit; U = Unimplemented, read as ‘0.’
Note: When the ADC conversion is running, the ADCCONF register is accessed as read-only.
Table 3.38 ADCCONF Register Bits Description
Bit
Description
7:6
Unimplemented bits. Read as 0.
RESJSTF: Result register justification format. Details provided in section 3.12.8.
1 = Right-justified result in ADCRESx.
5
4
0 = Left-justified result in ADCRESx.
RESSIGN: Result register in signed or unsigned format.
1 = Signed value (RESCODE = -512 to +511 full-scale range).
0 = Unsigned value (RESCODE = 0 to 1023 full-scale range).
CCNVMD: Continuous conversion versus ADC result register read mode.
1 = After ADC sample, halt next ADC sample operation until ADCRESx register is read.
3
0 = After ADC sample, proceed to next ADC sample operation regardless of whether the ADCRESx register has
been read or not. This means that the ADCRESx register will be overwritten by the next conversion result.
2:0
ADCSR: Sample rate configuration (see Table 3.41).
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Table 3.39 ADCSTAT Register Bits Mapping
ADCSTAT
Name
Bit No
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
U
U
U
U
U
U
U
U
U
U
0
0
Access
Address
R/Wc R/Wc
0x0D
R/Wc = Read/Write 1 to clear, U = Unimplemented, read as ‘0’
Note: When the comparator is enabled (bit CMPEN = ‘1’), the ADCRDYIF flag bit is automatically
masked. As a result, the global ADC interrupt (see Figure 3.8) is not generated at the end of
each conversion cycle; it is generated only when a valid comparator event is detected.
Table 3.40 ADCSTAT Register Bits Description
Bit Description
7:2 Unimplemented bits. Read as 0.
ADCCMPIF: ADC comparator counter interrupt flag.
1
0
1 = Compare counter (CMP) matches the value programmed in reference RCMPCNT register (Table 3.50).
0 = There is no result matching detected by comparator counter.
ADCRDYIF: ADC ready interrupt flag.
1 = Current ADC conversion has finished and ADCRESx (Table 3.50) contains results ready to be read by
the MCU.
0 = ADC conversion has not finished and/or the result has not been read from the ADCRESX register.
Note: If CMPEN is set, this flag is masked; see Table 3.42.
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3.12.6. ADC Sample Rate
The ADC sampling rate is calculated as the maximum sampling rate (250Ksps) divided by the value configured in
bits ADCSR[2:0] of register ADCCONF (Table 3.37). Table 3.41 gives the definitions of the ADCSR[2:0] bits. tCCNV
is the ADC continuous conversion phase. For more information on this and other ADC timing parameters, refer to
section 1.3.2.
The time between two consecutive conversion results is calculated as the sum of the following:
•
•
•
ADC sample time (see Table 1.15 and Figure 1.1): configurable parameter (via ADCSR[2:0] bits) for all
modes except the external temperature conversion for which it is fixed.
ADC conversion time (see Table 1.15 and Figure 1.1): fixed parameter which depends only on the OSCH
clock accuracy.
ADC idle time (see Table 1.15 and Figure 1.1): configurable parameter (via ADCSR[2:0] bits) which
determines the sample rate for the external temperature conversion.
Each ADC start conversion command (single or continuous) counts a 10µs period needed for proper settling of
the ADC input stage.
Table 3.41 ADC Sample-Rate Configuration
ADCSR[2:0]
Sample Rate 1), 2)
tCCNV
000
001
010
011
100
101
110
111
SRmax
SRmax/2
SRmax/4
SRmax/8
SRmax/16
SRmax/32
SRmax/64
SRmax/128
4µs
8µs
16µs
32µs
64µs
128µs
256µs
512µs
1)
2)
The value of SRmax is specified in Table 1.15. The tCCNV (ADCSR=0) is calculated based on 1/SRmax =
1/250Ksps.
The maximum possible sample rate for the external temperature conversion is SRMAX/8. For
ADCSR[2:0] values in the range from 000 to 011, the external temperature conversion is running at
SRmax/8
3.12.7. ADC Single and Continuous Conversion
Single or continuous conversion operation is defined by the SCNV and CCNV bits respectively, in the ADCCTRL
register (Table 3.34). If this bit is set, the ADC will automatically start the conversion process. It sets the interrupt
flag ADCRDYIF in the ADCSTAT register (Table 3.39) when the conversion process is completed with the results
(after the formatting process) stored in registers ADCRESH and ADCRESL (Table 3.50). This interrupt flag is
cleared after reading the result registers. If both of the SCNV and CCNV bits are set, the ADC operates in
continuous conversion mode.
The output of the ADC goes to the results formatting block, where there are four options for result representation
as detailed in section 3.12.8.
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Single ADC Conversion and SPI Pipeline Concept
The MCU starts a single ADC conversion by setting bit SCNV=1. When the conversion finishes, bit SCNV is
automatically cleared and the interrupt flag ADCRDYIF is set.
Since the SCNV and INPSEL bits share a register (ADCCTRL), the MCU starts a single conversion on only the
selected channel with one SPI WRITE access. Using the pipelined SPI WRITE/READ feature of the ZAMC4100
SBC, the MCU can pipeline the channel’s measurement and results monitoring. Figure 3.23 shows an example
for SPI communication when the MCU is measuring the current of the high-side drivers. See Table 3.50 for details
for the SPIDPRT register.
Figure 3.23 Pipelined Measurement and Results Reading for the Driver Current
SPI Bus: Pipelining ADC Conversion and Result Read
CMD = ADCCTRL write SCNV = 1, INPSEL = HS1 CMD = ADCCTRL write SCNV = 1, INPSEL = HS2 CMD = ADCCTRL write SCNV = 1, INPSEL = HS3
MCU
MCU
SBC
SSB
ADCRESH
SSB à CNVRDYIF
ADCRESH = I(HS1)
SSB à CNVRDYIF
ADCRESH = I(HS2)
Settings:
Register SPIDPTR = ADCCTRL address
Result formatting: truncated 8-bit result
ADC Continuous Conversion
With the CCNV bit set, the ADC operates in continuous conversion mode at the sampling rate determined by the
ADCSR[2:0] bits. After each conversion with formatted data in the results register, the ADC generates the
interrupt flag ADCRDYIF (Table 3.39). The CCNVMD bit provides two options affecting the way the result register
is handled by the MCU:
Bit CCNVMD = 0
The ADC continuous conversion is running and the results registers ADCRESH and
ADCRESL (Table 3.50) contain the latest conversion value. If the MCU does not read the
value, it is overwritten with the next one.
Bit CCNVMD = 1
When the result is available, the ADC continuous conversion is halted until the MCU reads
the result value. Reading the conversion result clears the ADCRDYIF flag and the ADC
automatically continues with the next conversion. This mode allows the MCU to control the
ADC sample rate by controlling the time between two SPI READ accesses.
Note: Before enabling continuous conversion with CCNVMD = 1, the MCU should clear the ADCRDYIF bit (by
reading the result from previous conversions) in order to start the new ADC conversion.
3.12.8. ADC Result Formatting Options
While the SPI bus only handles 8-bit data transfers, the ADC result of 10 bits is split into two registers: ADCRESH
and ADCRESL. Prior to this, the ADC digitized data are formatted in accordance with the settings for the bits
RESJSTF and RESSIGN of register ADCCONF (Table 3.37). Bit RESJSTF configures left or right result
justification as explained in the following sections.
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Left-Justified ADC Results
This setting applies when bit RESJSTF = 0. The digitized data of bits [9:2] go to ADCRESH, while the remaining
bits [1:0] go to ADCRESL as shown in Figure 3.24. For correct SPI extraction of the result, the ADRESH is read
first, where it clears the interrupt flag ADCRDYIF as well as updating the value ADCRESL. This guarantees
protection of the results from the next conversion.
Right-Justified ADC Results
This setting applies when bit RESJSTF = 1. The digitized data of bits [7:0] go to ADCRESL, while the remaining
bits [9:8] go to ADCRESH as shown in Figure 3.24. For correct SPI extraction of the result, the ADRESL is read
first, where it clears the interrupt flag ADCRDYIF as well as updating the value ADCRESH. This guarantees
protection of results from the next conversion.
Signed or Unsigned ADC Results
Bit RESSIGN configures the signed or unsigned result format when the ADC is performing ratiometric conversion.
When RESSIGN = 0, the ADC result is represented as unsigned value. When RESSIGN = 1, the ADC result is
represented as signed value.
Note: If the ADC is performing absolute or temperature conversion, the result is unsigned regardless of the value
of the RESSIGN bit.
Note: For the right-justified signed results format, the unused bits of ADCRESH have the value of the sign bit.
Figure 3.24 ADC Result Formatting Options
LEFT JUSTIFIED
7
0
0
7
7
6
6
ADCRESH
ADCRESH
ADCRESL
Read 0
Unsigned RESSIGN = 0
Signed RESSIGN = 1
7
ADCRESL
Read 0
S
S = Sign bit:
0 = Positive result
1 = Negative result
9
2 1 0
=> RESCODE (ADCRES[9:0])
(Software Variable)
1
1
0
7
7
0
7
6
ADCRESH
ADCRESL
RIGHT JUSTIFIED
Unsigned RESSIGN = 0
Read 0
0
7
6
0
ADCRESH
Read S
ADCRESL
Signed RESSIGN = 1
S
S = Sign bit:
0 = Positive result
1 = Negative result
9
8 7
0
=> RESCODE (ADCRES[9:0])
(Software Variable)
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3.12.9. ADC Comparator and Counter
The ZAMC4100 features a 10-bit result comparator that allows continuous ADC running and signed result
comparison within the SBC. After each conversion, the ADC comparator checks the result for being less than or
greater than a pre-configured value. If the result of the comparison is TRUE, the comparator counter is
incremented. If the result is FALSE, the counter value is decremented or cleared depending on the value of the
CNTDEC bit in the ADCCMPH register (Table 3.42). When the comparator counter value reaches the value
programmed in the RCMPCNT register (Table 3.50), a comparator interrupt is generated and indicated in the
ADCCMPIF flag in the ADCSTAT register (Table 3.39).
Using the ADC comparator together with the counter allows filtering out the short-term deviations in the measured
analog values (currents, voltages, positions, etc.).
Note: When the comparator is enabled (bit CMPEN = ‘1’), the ADCRDYIF flag is automatically masked. In this
way, the global ADC interrupt (see Figure 3.8) is not always generated at the end of every conversion cycle, only
when a valid comparator event is detected.
Signed or Unsigned Comparison
Whether the results are signed or unsigned in ADC comparator mode is determined automatically depending on
the type of the ADC conversion and the value of the RESSIGN bit (see section 3.12.8). When the ADC performs
ratiometric conversion, the ADC comparison runs in signed mode if bit RESSIGN = 1 and in unsigned mode if
RESSIGN = 0. For absolute or temperature ADC conversion, the comparator performs unsigned results
comparison.
ADCCMPH and ADCCMPL Registers
These registers are used for configuring the comparator mode and threshold value. The bits of both registers are
described in Table 3.42. The reset values for registers ADCCMPH and ADCCMPL are 00HEX
.
Note: When the ADC conversion is running, WRITE access to registers ADCCMPH and ADCCMPL is disabled.
Table 3.42 ADCCMPH and ADCCMPL Bits Description
Bit
Register ADCCMPH
CMPEN: Comparator enable bit.
Description
7
6
5
1 = The comparator is enabled.
0 = The comparator is disabled.
CMPMD: Comparison mode bit.
1 = The comparison returns TRUE if the ADC result is less than the programmed value.
0 = The comparison returns TRUE if the ADC result is greater than or equal to the programmed value.
CNTDEC: Determines the comparator’s counter decrement behavior.
1 = When the comparison returns FALSE, the counter value is decremented by one.
0 = When the comparator returns FALSE, the counter value is cleared.
4:2
1:0
Unimplemented bits. Read as 0.
CMPTH[9:8]: Bits 9:8 of the ADC comparator threshold value.
Register ADCCMPL
7:0
Bits 7:0 of the ADC comparator threshold value.
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Register RCMPCNT
This register contains the number of the consecutive comparator matches before interrupt ADCCMPIF is
generated. If the value of RCMPCNT (Table 3.50) is 00HEX (default value), the counter is bypassed and the
interrupt flag ADCCMPIF (Table 3.39) is set on the first match. When the conversion is running, this register is
accessed as read-only.
3.12.10. External ADC Analog Inputs Open/Short Diagnostics and Protection
ZAMC4100 provides open/short diagnostics for the analog input pins (AINx) and the sensor supply pin S_P as
well. Pins S_P and AIN1,2 also have short-to-battery protection. The internal protection and diagnostic structure
of the S_P and AINx pins is shown in Figure 3.25.
The diagnostic functionality for all pins (S_P, AINx) is controlled by register AINDIAG described in Table 3.43 and
Table 3.44. Table 3.45 gives the meaning of the corresponding open/short flag from the AINDIAG register with
respect to the combination of AINCSHEN and AINCSLEN bits that enable the diagnostic current sinks/sources
connected to the analog input pins.
The protection against a short to Vbat on the S_P and AIN1,2 pins relies on Zener-like structure inside the
ZAMC4100 that limits the voltage propagated to the internal circuitries to a safe level. The limitation of the current
through the S_P pin in the event of such a failure is achieved with an internal resistor connected in series (see
Figure 3.25-A. For the AIN1,2 pins this resistor is external (R2 and R3 on the application diagram as shown in
Figure 6.1).
The protection against a short to GND on the S_P pin is achieved by limitation of the load current. Its value is
specified in Table 1.4 as parameter ISP_OC
.
Note: Enabled diagnostic current sources during ADC conversion might result in inaccurate results. Disable all
AINx and S_P pin diagnostics before starting an ADC conversion.
Figure 3.25 ADC Analog Inputs Protection and Open/Short Detection Circuitry
B) AINx pin diagnostic
A) S_P pin protection and diagnostic
ZAMC4100
ZAMC4100
VDD5V0
VDD5V0
VDD5V0
AINCSHEN
AINCSHEN
SPSWEN
Open/Short
Detect
Open/Short
Detect
SPOSF
AINxOSF
S_P
AINx
AINCSLEN
AINCSLEN
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Table 3.43 AINDIAG Register Bits Mapping
Name AINDIAG
Bit No
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
0
0
0
0
0
0
0
Access
Address
R
R
R
R
R
R/W R/W
0x16
R/W = Read/Write bit; R = Read-only bit;
U = Unimplemented, read as ‘0’
Table 3.44 AINDIAG Register Bits Description
Bit Description
SPOSF: Open/short status flag of positive sensor supply pin (S_P).
This flag is not registered; i.e. its value stays as long as the diagnostic event takes place.
Refer to Table 3.45 for SPOSF bit description.
6
AINxOSF: Open/short status flag of the ADC external inputs AINx (x = 1 to 4).
5:2 This flag is not registered; i.e. its value stays as long as the diagnostic event takes place.
Refer to Table 3.45 for the interpretation of the AINxOSF bits.
AINCSHEN: 1), 2) High-side current source enable bit for inputs AINx (x = 1 to 4) and S_P.
1
0
1 = The high-side current source is enabled.
0 = The high-side current source is disabled.
AINCSLEN: 1), 2) Low-side current source enable bit for inputs AINx (x = 1 to 4) and S_P.
1 = The low-side current source is enabled.
0 = The low-side current source is disabled.
1)
2)
In order to keep current consumption as low as possible, the MCU software should disable the current sources before enabling the SLEEP or
STANDBY Modes.
Make sure this bit is ‘0’ when ADC conversion is enabled.
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Table 3.45 External ADC Inputs Diagnostic Bits Description
AINCSHEN
AINCSLEN
SPOSF or AINxOSF
Description 1)
Diagnostic disabled
Undefined result
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
x
x
0
0
0
1
1
1
1
0
Normal sensor or short to VSSA
Open sensor connection
Short to sensor supply
Not possible in normal application
1)
The descriptions given are based on use of the external connections shown on the application diagram (see Figure 6.1). If another configuration of
external connections is used, the meaning of the SPOSF and AINxOSF bits will be different.
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3.13. LIN Physical Layer (LIN PHY)
3.13.1. Overview
The block diagram of the LIN PHY layer is as shown in Figure 3.26. It is situated within the SBC chip and is
designed to be conformant to the LIN Specification Rev. 2.1. The LIN PHY has following functionality:
•
•
•
•
LIN bus wake-up detection
LIN TXD dominant time-out detection
LIN short detection
LIN PHY power control
Figure 3.26 LIN PHY Block Diagram
LIN PHY
ZAMC4100 SBC
LIN Wake-up
LINWUIF
Detect
VDDE
LINWUMD
Pull-up
RXD
TXD
RX
LINFAST
LIN
TX
PD
Dominant Time-
Out Detect
LINDTOIF
VSS
LINSHDB
2
SLEEP
STBY
LIN Short
Debounce
LINSHIF
This module has two registers:
•
•
LIN control register LINCTRL (see Table 3.46)
LIN status register LINSTAT (see Table 3.48)
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3.13.2. LIN PHY Operation
The status of the LIN PHY is checked by reading its interrupt flags mapped in the LINSTAT register. When an
interrupt flag is set, the MCU can clear it by “dummy” writing ‘1’ in the corresponding LINSTAT register bit.
LIN Wake-Up Detection
When the system is in SLEEP or STANDBY Mode, the LIN transmitter is powered-down and only the receiver is
functional. The last is used for detecting the LIN bus wake-up event.
The ZAMC4100 supports two wake-up scenarios depending on the value of the LINWUMD bit (see Table 3.46). If
LINWUMD = 0 (see Figure 3.27-A), a wake-up is detected when there is a falling edge at the LIN pin followed by
a dominant bus level longer than time tLINWU. If bit LINWUMD = 1 (Figure 3.27-B), a wake-up is detected when
there is falling edge at the LIN pin, followed by a dominant bus level longer than tLINWU and a rising edge at the
LIN pin. The value of the parameter tLINWU is defined in Table 1.7.
Figure 3.27 LIN Wake-up Detection Depending on the Value of the LINWUMD Bit
DOM.
LIN pin
state
t
LINWU
REC.
wake-up
SLEEP
wake-up
NORMAL
A) LINWUMD=0
B) LINWUMD=1
SLEEP
NORMAL
When a valid wake-up is detected, the interrupt flag LINWUIF is set to high and the LIN transmitter is enabled.
The status of this flag can be checked by reading the LINSTAT register (Table 3.48).
LIN Baud Rate
The LIN PHY supports a fast mode which provides a higher baud-rate communication than is specified in the
standard (see Table 1.7). The LIN fast mode is enabled by setting high the LINFAST bit of register LINCTRL.
The LIN PHY has two self-diagnostics protections: LIN short and LIN dominant time-out.
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LIN Short Protection
If there is a valid LIN short event, after the debounce time configured in the LINCTRL register (Table 3.46), the
LIN short interrupt is generated, and the LIN transmitter is disabled. This interrupt is indicated in the LINSHIF flag
bit in the LINSTAT register.
The ZAMC4100 detects a LIN short event if it is transmitting frames to a master device and the following
conditions are both met concurrently:
1) The current through the output stage of the LIN transmitter exceeds the value specified by the parameter
IOC_LIN (see Table 1.7).
2) The MCU transmits the dominant state, but the LIN bus remains in the recessive state.
LIN Dominant Time-Out Protection
If the dominant state at the LIN transmitter’s output continues more than 11ms, the logic detects this as a
dominant time-out event and consequently disables the LIN transmitter. The dominant time-out detection
generates an interrupt that is captured in the LINDTOIF flag of register LINSTAT. When LINDTOIF = HIGH, the
LIN transmitter is automatically powered-down. In this way, the dominant state caused by the ZAMC4100 is
isolated; i.e., the LIN bus is released and the other devices can continue to communicate.
Important Notes:
1. ZAMC4100 detects a LIN dominant time-out ONLY if it is caused by the device itself; i.e., due to an
internal error in the ZAMC4100 LIN transmitter path. If the LIN bus is forced into dominant state externally
(for more than 11ms), this is not a valid dominant time-out for the ZAMC4100 because it is not caused by
its transmitter stage. This prevents detection of a dominant time-out that is caused by another device on
the LIN bus, i.e. not by the ZAMC4100.
2. For robustness, the ZAMC4100 dominant time-out detection is implemented using both oscillators (OSCL
and OSCH), which ensures that this type of failure event will be detected even if one of the oscillators has
stopped.
3. The LIN dominant time-out detection feature is permanently enabled and cannot be disabled by software.
Table 3.46 LINCTRL Registers Bit Mapping
Name
Bit No
LINCTRL
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
U
U
U
U
U
U
0
0
0
0
Access
R/W
R/W
R/W
R/W
Address
0x17
R/W = Read/Write bit
U = Unimplemented, read as ‘0’
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Table 3.47 LINCTRL Registers Bits Description
Bit Description
LINWUMD: LIN wake-up detection mode (see Figure 3.27).
1 = LIN wake-up is detected if there is a falling edge at the LIN pin followed by a dominant state longer
than tLINWU and a rising edge at the LIN pin.
3
0 = LIN wake-up is detected if there is a falling edge at the LIN pin followed a by dominant state > tLINWU
LINSHDB: LIN short de-bounce time configuration.
.
00 = LIN short is detected if it is longer than 96 cycles of OSCH/5 clock.
2:1 01 = LIN short is detected if it is longer than 128 cycles of OSCH/5 clock.
10 = LIN short is detected if it is longer than 192 cycles of OSCH/5 clock.
11 = LIN short is detected if it is longer than 255 cycles of OSCH/5 clock.
LINFAST: LIN fast mode enable bit.
0
1 = Fast mode is enabled.
0 = Fast mode is disabled.
Table 3.48 LINSTAT Register Bits Mapping
Name LINSTAT
Bit No
7
6
5
4
3
2
1
0
Bit name
Reset
U
U
U
U
U
U
U
U
U
U
0
0
0
Access
Address
R/W
R/W
R/W
0x18
R/W = Read/Write ‘1’ bit; U = Unimplemented, read as ‘0’
Table 3.49 LINSTAT Register Bits Mapping
Bit Description
LINSHIF: LIN short interrupt flag.
2
1
1 = LIN short has been detected, and the transmitter is disabled.
0 = LIN short has not been detected.
LINDTOIF: LIN dominant time-out interrupt flag.
1 = Dominant time-out has been detected, and the transmitter is disabled.
0 = Dominant time-out has not been detected.
LINWUIF: LIN wake-up interrupt flag.
1 = Wake-up event has been detected on the LIN bus; i.e., the transition from SLEEP to NORMAL Mode is
caused by the LIN bus.
0
0 = Wake-up event has not been detected on the LIN bus; i.e. any transition from SLEEP to NORMAL
Mode has been caused by the WDT (see section 3.5.4).
Note: All LIN interrupt flags are cleared by writing ‘1’ in the corresponding LINSTAT bit.
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3.14. SBC Registers
All SBC registers are organized as one register file that is read/write accessible via the SPI. The SBC register file
organization is shown in Figure 3.28.
Figure 3.28 SBC Register File Organization
SBC Register Block
0x00
Global system control and
status registers
Control and status
registers for drivers
Control and status
registers for ADC
LIN PHY registers
PWM control registers
0x1B
0x1C
Analog trim registers
AUTHSIG
0x1F
The SBC register address space is 5-bits and is divided into two partitions: application registers and analog trim
registers. The application registers are READ/WRITE accessible and contain system and periphery control
registers.
The analog trim registers are WRITE-protected and can only be authorized by writing the correct code in
AUTHSIG (see section 3.14.2).
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Note: When the TRIM signature is set, the WRITE access to the application registers is forbidden. After the trim
registers are written, the MCU should set the APPLICATION signature (see section 3.14.2) in order to have
regular access to the application registers.
3.14.1. SBC Registers Address Map
Table 3.50 SBC Registers Address Map
Reset
Value,
[HEX]
Address
Register Name
Description
[HEX]
Global control and status registers
00
01
02
03
04
05
RSTSTAT
IRQSTAT
IRQCTR
01
00
00
0C
11
01
Reset status
Interrupt status
Interrupt control
System mode control
SMDCTRL
WDTCONF
SPIDPTR
Watchdog timer configuration
SPI data pointer
Drivers’ control and status registers
06
07
08
09
0A
0B
0C
HBDCTRL
HBDDIAG
HSDCTRL
ECMCTRL
HBDSTAT
HSDSTAT
ECMDIAG
00
00
00
00
00
00
00
Half-bridge driver control
Half-bridge driver diagnostics enable
High-side driver control
Electrochromatic driver control
Half-bridge driver status
High-side driver diagnostics and status
ECM driver diagnostics
ADC control and status registers
0D
0E
0F
10
11
12
13
14
15
16
ADCSTAT
ADCRESH
ADCRESL
AINCONF
ADCCONF
ADCCTRL
ADCCMPH
ADCCMPL
RCMPCNT
AINDIAG
00
00
00
00
00
00
00
00
00
00
ADC status
ADC result high byte
ADC result low byte
Analog input pins configuration
ADC configuration
ADC control
ADC result comparator threshold high byte
ADC result comparator threshold low byte
ADC comparator counter
Analog inputs diagnostic
LIN PHY control and status registers
17
18
LINCTRL
LINSTAT
00
00
LIN control
LIN PHY status
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Reset
Value,
[HEX]
Address
[HEX]
Register Name
Description
PWM control registers
19
PWMDCFG
PWMFCFG
PWMDREN
00
00
00
PWM duty cycle configuration
1A
PWM frequency configuration
PWM driver enable
1B
Analog trim registers
1C
1D
1E
1F
OSCHTRM
OSCLTRM
CREFTRM
AUTHSIG
00
00
10
00
OSCH frequency trimming
OSCL frequency trimming
Reference current trimming
Authentication signature write
3.14.2. Registers Write Access Signatures
There are two signatures pertaining to WRITE access for registers:
•
•
APPLICATION signature: enables the WRITE access in the application registers.
TRIM signature: enables the WRITE access in analog trim registers.
Both signatures are mutually exclusive. This means that if the application registers are WRITE accessible, the
analog trim registers are READ-only and vice versa. The purpose of this logic is to avoid unintentional overwriting
of the trim registers by the MCU and losing the correct calibration values.
The SBC indicates which signature is set with the ACCSIG bit, which is allocated in the slave status byte (see
section 3.7.5):
•
•
Bit ACCSIG = 0: APPLICATION access signature is set.
Bit ACCSIG = 1: TRIM access signature is set.
AUTHSIG register
The AUTHSIG register is allocated at address 1FHEX in the SBC register file. It is not physically implemented.
Writing the correct values in this register will set the corresponding access signature. Reading the register will
return a zero value.
TRIM signature setting
In order to set the TRIM signature, the MCU must consecutively write the AUTHSIG register (address 1FHEX) with
the values ADHEX and B6HEX. For successful signature setting, both values should be written as two consecutive
SPI WRITE accesses. If between the two writes, the MCU executes READ or WRITE access for another address,
then no TRIM signature will be set.
APPLICATION signature setting
Once the TRIM signature is set, the MCU can return to having application registers access by writing the value
00HEX in the AUTHSIG register.
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3.15. SBC Trimming
All SBC analog circuitry trimming values are stored in the INFO page 0 of the MCU FLASH memory (Figure 4.1)
during the ZAMC4100 production test. The MCU firmware has READ-only access to this partition; i.e., no trim
data corruption is possible due to firmware malfunction.
This procedure must be implemented as part of the MCU firmware and executed during system initialization.
When executed, the trimming procedure reads the OSCH, OSCL and Reference Current trim values from the
FLASH INFO page and transfers them to the corresponding SBC trim registers.
ZAMC4100 trimming procedure
Trimming data is located in the INFO page 0 at offset 00000040HEX. Trimming data is programmed in one word
and has the following structure:
Figure 3.29 Structure of SBC Trimming Data
Byte 3
Byte 2
Byte 1
Byte 0
Not Used
CREF
OSCH
OSCL
The trimming procedure is given below. It must be executed as soon as the device is powered:
1. Disable the watchdog timer.
2. Write ADHEX to the AUTHSIG register of the SBC.
3. Write B6HEX to the AUTHSIG register of the SBC.
4. Write OSCH to the OSCHTRM register of the SBC.
5. Write OSCL to the OSCLTRM register of the SBC.
6. Write CREF to the CREFTRM register of the SBC.
7. Write 00HEX to AUTHSIG.
8. Setup and enable the watchdog timer. This step is optional.
This procedure prepares the MCU clock and current sources to be at their optimal value. It must be executed
immediately after each MCU reset.
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4
ZAMC4100 MCU Functional Description
4.1. Overview
The ZAMC4100 features a 32-bit ARM® Cortex™-M0 MCU with following peripherals:
•
•
•
•
•
•
32KB FLASH program memory
2KB SRAM data memory
SPI master
32-bit timer
8 configurable GPIOs
LIN UART
Note: Since the ZAMC4100 MCU is based on common Cortex M0 core architecture the description below
excludes this topic. Refer to the ARM® CORTEX™-M0 Document Kit for MCU core details.
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4.2. Memory Organization
The MCU contains two memory blocks: FLASH (program) memory and SRAM (data) memory. Together with the
peripheral and system registers, their addresses are mapped as shown in Table 4.1. By default, the flash is
mirrored to address 0x0. Software can change this and mirror the SRAM to address 0x0 instead by writing to the
register field MEMSWAP in register SYS_MEMPORTCFG (see Table 4.6).
Table 4.1 MCU Memory Map
Address
0xFFFF_FFFF
Description
Reserved
0xE010_0000
0xE00F_FFFF
0xE000_0000
0xDFFF_FFFF
0x4000_1C00
0x4000_1BFF
0x4000_1800
0x4000_17FF
0x4000_1400
0x4000_13FF
0x4000_1000
0x4000_0FFF
0x4000_0C00
0x4000_0BFF
0x4000_0800
0x4000_07FF
0x4000_0400
0x4000_03FF
0x4000_0000
0x3FFF_FFFF
0x2000_0800
0x2000_07FF
0x2000_0000
0x1FFF_FFFF
0x1000_8000
0x1000_7FFF
0x1000_0000
0x0FFF_FFFF
0x0000_0000
Private Peripheral Bus; see the ARM® CORTEX™-M0 documentation for details
Reserved
(SPI, SW-LIN)
GPIO
32-Bit Timer
FLASH Info Page
FLASH Controller
Reserved
System Management Unit
Reserved
SRAM Bank 2KB
Reserved
FLASH Bank 32KB
Reserved
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4.2.1.
Accessing Invalid Memory Location
A default slave replies with an error response if unused parts of the memory space are accessed. For more
details, refer to the “AMBA 3 AHB-Lite Protocol Specification” section of the ARM® CORTEX™-M0 Document Kit.
4.2.2.
FLASH Memory
FLASH memory implements three regions (see Figure 4.1):
•
INFO
Contains READ-only parameter data set by manufacturing as well as memory protection
management.
•
•
BOOT Optionally used by a bootloader. The size of this area is programmable.
PROG Program code memory, up to 32KB.
Each FLASH memory region is built with several pages of 512 bytes each. Each page is built with 4 rows and
each row contains of 32 words (1 word = 32 bits). One flash page is the smallest block that can be erased.
As the FLASH memory has some dedicated timings for the control signals when erasing (all or part of) the FLASH
and when writing data to the FLASH, a flash controller is used to support all mandatory operations (READ,
WRITE, ERASE) to be performed on the different locations and to guarantee the correct timings for write and
erase operations. Additionally, it is checked if the different operations are allowed to be performed depending on
the memory protection scheme.
Figure 4.1 Structure of FLASH Memory and Page Details
32K
0x07FFF
1ꢀPageꢀ=ꢀ512ꢀByte
Row-1
1ꢀROWꢀ=ꢀ32ꢀWORDS
Row-2
PROG
Row-3
Row-4
0x00E00
0x00000
progStartꢀ[0x07]
31
1ꢀWORD,ꢀ½ꢀWORDꢀandꢀByteꢀAccess
0
1ꢀWORDꢀ=ꢀ32Bits
1K
BOOT
0x0
INFO
MAIN
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4.2.2.1. FLASH Single Bits Error Correction (ECC)
Each word is protected by ECC logic with a hamming distance of 4, which enables the system to correct a single
bit error and to detect two-bit errors within a word. The correct ECC code bits are automatically appended on
each WRITE access to the FLASH. When a single error within a word is detected during a READ access, it is
automatically corrected.
The occurrence of bit errors is signaled via dedicated status bits in registers FC_STAT_DATA (Table 4.38) and
FC_STAT_PROG (Table 4.37) inside the FLASH controller. The status bits distinguish between an erased
FLASH word (PROGALL1 flag), the detection and correction of a single-bit error (PROG1ERR flag), and the
detection of more than one bit error (PROG2ERR flag). The condition of more than one bit error is not correctable.
The two status register sets are distinguished by the type of FLASH access:
FC_STAT_PROG status bits are used when errors occur during an instruction fetch
•
An instruction fetch to an erased memory location (PROGALL1 flag set) or the detection of more than one
bit error within a word will also assert a non-maskable interrupt (NMI) as the program is corrupted.
•
The detection and correction of a single-bit error within a word is signaled via a normal interrupt (ARM®
interrupt line 0).
FC_STAT_DATA status bits are used when errors occur during a load operation
•
Loads from an erased memory location as well as the detection (and correction) of errors within a word
are signaled via a normal interrupt (ARM® interrupt line 0).
4.2.2.2. FLASH Main Area
The MAIN area of the FLASH is physically located within the address range 0x1000_0000 to 0x1000_7FFF. It can
also be mirrored to address 0x0000_0000 by clearing the MEMSWAP bit in the SYS_MEMPORTCFG register
(see Table 4.6), which is a default setting.
The FLASH MAIN area is split into two sections: BOOT and PROG. Each section is built with multiple FLASH
blocks of 512 bytes. The BOOT and PROG sections must contain at least one FLASH block. This partition is only
needed for writes when memory protection is active and also for some erase commands.
The MAIN area can be READ with byte, half-word and word size. It can always be read by the ARM® processor
but reads via the JTAG interface are blocked when memory protection is active. The different sections have no
influence on READ accesses.
4.2.2.3. FLASH Controller
The flash controller handles all accesses to the different flash locations (INFO pages; MAIN area). It provides
different types of commands for modifying the flash contents, guarantees all required timings for the different
accesses to the FLASH, and checks the ECC code.
The FLASH controller contains a set of registers that are needed for command execution (see Table 4.33) and
observing their status. These registers are also used to enable the different interrupt sources to drive the interrupt
line. Additionally, there are two non-maskable interrupt sources that are connected to the NMI of the ARM® core.
Information for FLASH controller registers is given in section 4.10.6, and FLASH command timing is defined in
Table 1.18.
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4.2.3.
INFO Area
The INFO area is mapped into the system address space between 0x4000_0C00 and 0x4000_0FFF. No memory
location in the INFO pages can be directly written. The INFO area contains two pages of 512 bytes each:
•
INFO page 0 (lower half of addresses) contains traceability information and trimming values for SBC
analog circuitry (see section 3.15). This page is only readable and cannot be accessed indirectly by the
flash controller (no WRITE, no ERASE). The INFO page 0 base address is 0x4000_0C00.
•
INFO page 1 (upper half of addresses) is a mirror copy of INFO page 0 for redundancy of INFO page
data content.
Table 4.2 INFO Page 0 Structure
Offset
Size
Description
0x00000000 to 0x0000003C
0x00000040
Traceability data
SBC Trim Data
Reserved
1 word
0x00000044 to 0x000000C0
0x000000C4
1 word
1 word
1 word
Exact value for IREF (see Table 1.12)
Note: The number stored represents IREF in nA.
0x000000C8
0x000000CC
Exact value for VREF (see Table 1.12)
Note: The number stored represents VREF in mV.
Exact value for Vt27 (see Table 1.11)
Note: The number stored represents Vt27 in mV.
0x000000D0
0x000000D4
0x000000D8
0x000000DC
0x000000E0
0x000000E4
0x000000E8
0x000000EC
0x000000F0
0x000000F4
0x000000F8
0x000000FC
1 word
1 word
1 word
1 word
1 word
1 word
1 word
1 word
1 word
1 word
1 word
1 word
Exact current sense ratio for HS1 (see Table 1.8)
Exact current sense ratio for HS2 (see Table 1.8)
Exact current sense ratio for HS3 (see Table 1.8)
Exact current sense ratio for HS4 (see Table 1.8)
Exact current sense ratio for HB1 high-side (see Table 1.8)
Exact current sense ratio for HB1 low-side (see Table 1.8)
Exact current sense ratio for HB2 high-side (see Table 1.8)
Exact current sense ratio for HB2 low-side (see Table 1.8)
Exact current sense ratio for HB3 high-side (see Table 1.8)
Exact current sense ratio for HB3 low-side (see Table 1.8)
Exact current sense ratio for HB4 high-side (see Table 1.8)
Exact current sense ratio for HB4 low-side (see Table 1.8)
4.2.4.
RAM Memory 2kB
The SRAM is physically located at addresses 0x2000_0000 to 0x2000_07FF. It can be accessed (READ and
WRITE) with byte, half-word, and word size. The SRAM can also be mirrored to address 0x0000_0000 by setting
the MEMSWAP bit in register SYS_MEMPORTCFG (see Table 4.6).
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The entire RAM is always accessible by the ARM® processor, but there are restrictions for RAM access via the
JTAG interface. From the perspective of the JTAG interface, the RAM is split into two sections with a boundary
configurable via the RAMSPLIT bit field in the SYS_MEMINFO register (see Table 4.7).
Figure 4.2 Example of RAMSPLIT Address Configuration
0x007FF
0x007FF
ProgrammedꢀRAMSPLITꢀaddressꢀ
[0x18F]ꢀ(0x0063C>>2)
0x0063F
0x0063B
0x0063C
0x00638
SRAM
0x00007
0x00003
0x00004
0x00000
4ꢀByteꢀ=ꢀ1ꢀWord
The RAMSPLIT address is word-aligned and stored in the FLASH. The upper section starting with address
RAMSPLIT can always be accessed via JTAG. The lower section can only be accessed via JTAG when no
memory protection is active. The stack used by software must be placed into the lower section to avoid
unauthorized access, which could result in potentially damaging changes.
Notes:
1. Always place the software stack into the lower section of the RAM. The lower section ends one word
address before the address RAMSPLIT.
2. The RAMSPLIT address can always be determined from register SYS_MEMINFO (see Table 4.7). The
last two address bits are not included in the read value as they are always 0.
4.3. MCU Clock and Reset Sources
The RESET and clock operation are managed by the SBC as detailed in section 3.2. The main clock frequency is
set to 20MHz for the MCU core.
As shown in Figure 4.3, the MCU_CLK from the SBC go to the clock divider with 1:1 as the default divider. The
CLKDIV bit field in the SYS_CLKCFG register (Table 4.5) can be configured for other settings for the divider so
that the system runs at 20MHz, 10MHz, 5MHz, or 2.5MHz. It is not advisable to change the clock division setting
during any of these operations:
•
•
FLASH programming
LIN operations, unless the LIN module is put into the safe state, which is achieved by setting the
STOPRX bit and clearing the ENTOCNT bit in the Z1_LINCFG register (Table 4.25).
•
Active operations associated with the 10msec reference of the SYST_CALIB register of the ARM® core.
This must be disabled before making adjustments for the clock division.
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The SBC has full control in configuring the SLEEP and NORMAL operation modes. In STANDBY Mode, the
ARM® Cortex™-M0 core is internally put into the SLEEP Mode by suspending the processor clock. Refer to the
ARM® Cortex™-M0 Document Kit for more details. Refer to section 3.5 for more information about the SLEEP
and NORMAL Modes.
Figure 4.3 RESET and CLOCK between SBC and MCU
SYS_CLKCFG
CLOCK DIVIDER
MCU_CLK
1 / 2 / 4 / 8
Clk & Reset Ctrl
MCU_RSTN
MCU
SBC
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4.4. MCU INTERRUPTS
4.4.1. Interrupts Organization
Figure 4.4 shows the peripheral interrupts with the related control and status registers. Each peripheral has a
unique IRQ line that is attached to dedicated interrupt lines 0 to 5, which go to the nested vector interrupt
controller (NVIC) module within the ARM® CORTEX™-M0 processor. For more information about the NVIC, refer
to the NVIC chapter of the ARM® CORTEX™-M0 Document Kit.
Figure 4.4 MCU Interrupt Logic Organization
ECC
PROG: Double Bit Error
FLASH
NMI
FC-STAT-CORE
FC-IRQ-EN
Line 0
Line 1
Line 2
Line 3
Line 4
Line 5
IRQN
SBC
Interrupt
Controller
NVIC
Z1_LINSTAT
Z1_LINIRQEN
SW-LIN
SPI
Interrupt
Controller
CORTEX™-M0ꢀ
PROCESSOR
CONTAINSꢀIRQꢀENꢀBITS
Z1_SPISTAT
Z1_SPICFG
TIMER MODULE
(Counter Overflow)
32 BIT TIMER
GPIO
IRQEDGE
IRQEN
SBC
MCU
Peripherals
ARM® CORTEX™-M0 CORE
Note: The Systick has an NVIC number of -1 which is within the Cortex™-M0 core. For more details, refer to the
ARM® CORTEX™-M0 Document Kit.
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4.4.2.
Interrupts Configuration
As defined in Table 4.3, the MCU peripheral interrupts can have one of two types of interrupt input responses:
level-sensitive or pulse (edge) triggered:
Table 4.3 MCU Peripheral Interrupts
Interrupt Line
Interrupt line 0
Interrupt line 1
Interrupt line 2
Interrupt line 3
Interrupt line 4
Interrupt line 5
MCU Peripheral Interrupt
Flash controller interrupt
Type
Level-sensitive
Level-sensitive
Level-sensitive
Level-sensitive
Pulse
External interrupt (from SBC)
SW-LIN interrupt
SPI interrupt
32-bit timer interrupt
GPIO interrupt
Level-sensitive
The effect of the pulse and level type is explained in the ARM™ Cortex™-M0 Documentation Kit in the NVIC
section.
4.5. GPIO Module
4.5.1.
Overview
There are 8 GPIO pins (GPIO00 to GPIO07) implemented in the MCU. Each GPIO pin can be individually
configured to operate as an input or output. When configured as an output, the value driven out of the GPIO pin
can be directly written or controlled via a set-clear register (see section 4.5.3).
GPIO pin configurations:
•
Output mode: enabled by clearing a corresponding bit in registers GPIO_DIR (Table 4.9) and GPIO_OUT
(Table 4.11); e.g., bit 0 = GPIO00 configuration, bit 1 = GPIO01, etc.
•
Schmitt trigger input mode with internal pull-down resistors: enabled by setting a corresponding bit in
registers GPIO_DIR and GPIO_IN (Table 4.10)
•
•
Generation of interrupt events on a selectable edge
Trigger source for the 32-bit timer
By default all GPIOs are set in input mode. Each register in a GPIO module can be accessed with a byte, half-
word and word size.
4.5.2.
GPIO Input Mode (default)
Assigned bits in register GPIO_DIR must be cleared for the input operation for a specific GPIO pin (bit numbers
correspond to GPIO numbers). The value for each pin can be read by reading register GPIO_IN. The values from
any GPIO pins that are configured as outputs or which have other functionality should be ignored.
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4.5.3.
GPIO Output Mode
Assigned bits in the GPIO_DIR register must be set for output operation for a specific GPIO pin (bit numbers
correspond to GPIO numbers). The value can be written into the GPIO_OUT register, which defines the GPIO
output level. If a single GPIO bit is to be modified, a more direct way to configure the bit is via the GPIO_SETCLR
register (see Table 4.12), which can be used instead of performing the read-modify-write operation.
Corresponding bits in the SETOUT[7:0] bit field are for setting the bit to 1 and corresponding bits in the
CLROUT[23:16] bit field are for clearing the bit.
Note: Write the initial value to the GPIO_OUT register before defining GPIO_DIR for the output.
4.5.4.
GPIO as Timer Trigger Operation
Each GPIO pin can be used as an external trigger source for the 32-bit timer (see section 4.6.1). To enable the
trigger functionality, the GPIO pin must be configured as an input and the trigger functionality must be enabled via
the GPIO_TRIGEN register (Table 4.14).
4.5.5.
GPIO Interrupt Functionality
Each GPIO pin can be used as an external, edge-sensitive interrupt source. To enable the interrupt functionality,
the GPIO pin must be configured as an input and the interrupt functionality must be enabled via register
GPIO_IRQEN (Table 4.14). Additionally, the GPIO_IRQEDGE register (Table 4.15) can be used to select whether
a rising or falling edge on the GPIO pin activates the interrupt.
All GPIO pins enabled as an external interrupt source drive a single interrupt line connected to the ARM®
interrupt 5. The user can determine which GPIO pin caused the interrupt by reading register GPIO_IRQSTAT
(Table 4.13). All interrupt status bits are cleared when reading register GPIO_IRQSTAT.
Note: As the synchronization flip-flops are only continuously clocked when the trigger or interrupt functionality is
enabled for the corresponding GPIO pin, it is possible that an unwanted interrupt occurs when enabling the
interrupt functionality. To avoid this, the following sequence must be guaranteed by software:
•
•
•
Enable the GPIO trigger functionality and select the desired interrupt edge to be used.
Enable the GPIO interrupt functionality at least three cycles after enabling as a trigger.
Disable the GPIO trigger functionality.
4.5.6.
GPIO Registers
Refer to section 4.10.2 for GPIO register details.
4.6. 32-Bit TIMER Module
The timer provides event-counting on the rising clock edge with a 32-bit resolution. When enabled (EN bit = 1 in
register T32_CTRL; see Table 4.17), the timer counts clock events in timer mode or counts events from a
selectable external trigger signal in counter mode as described in the next two sections. The external trigger can
be configured to operate on rising/falling edges or on a low/high level via the MODEPN and MODELE bits.
Additionally, the MODESR bit can be used to select whether the timer/counter stops when it overflows or
continues its operation.
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4.6.1.
Timer Mode (MODETC = 0)
In timer mode, the counter register is incremented in each clock cycle. When the counter reaches 0xFFFF_FFFF,
the reload value is copied into the counter register and it sets both the OVERFLOW flag bit and the interrupt line.
The OVERFLOW bit (see Table 4.17) and interrupt line are set high for one clock cycle.
When reload mode is enabled (bit MODESR = 0 in the T32_CTRL register), the counter continues counting.
Otherwise the counter stops. The two other control bits, MODELE and MODEPN in the T32_CTRL register, have
no meaning in this mode.
4.6.2.
Counter Mode (MODETC = 1)
The counter register is incremented in each clock cycle when the trigger is active. When the counter has a value
of 0xFFFF_FFFF and the trigger is active, the reload value is copied into the counter register and the
OVERFLOW bit and the interrupt line are set high for one clock cycle. When the reload mode is enabled
(MODESR = 0 in the T32_CTRL register), the counter continues counting. Otherwise the counter stops.
The two control bits MODELE and MODEPN are used to configure the trigger as shown in Table 4.4.
Table 4.4 Configuration of Timer Trigger Behavior
MODELE
MODEPN
Sensitivity
Falling Edge
Rising Edge
LOW
Behavior
0
0
1
1
0
1
0
1
Trigger is active when trigger input has a falling edge between clock cycles.
Trigger is active when trigger input has a rising edge between clock cycles.
Trigger is active when trigger input is low.
HIGH
Trigger is active when trigger input is high.
4.6.3.
TIMER Module Interrupt
The timer has an interrupt line that is active-high and set high for a single clock cycle whenever the counter
overflows. The interrupt line is connected to the ARM® interrupt 4.
4.6.4.
TIMER Module Registers
The TIMER module uses the following registers:
•
•
•
•
T32_CTRL
TIMER control and configuration register (Table 4.17)
T32_TRIGSEL Trigger select register (Table 4.18)
T32_CNT
T32_REL
Register containing current TIMER value (Table 4.19)
Register containing (Table 4.20)
For detailed register address mapping and bit descriptions, refer to section 4.10.3.
4.7. SysTick
The Cortex™-M0 core has an integrated SysTick module. For configuration information, refer to the ARM®
Cortex™-M0 Documentation Kit.
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4.8. Master SPI Module
4.8.1. Overview
The integrated SPI is a pure four-wire master interface that is used for communication with the SBC. As shown in
Figure 4.5, the three lines SPICLK, MOSI, and MISO are fully controlled by hardware while the chip select CSN
line is controlled by software in accordance with the setup time requirement as per SPI bus timing (for
specifications, see section 1.3.3).
Figure 4.5 Master SPI Block Diagram
SPICLK
SPICFG
SPISTAT
CSN
SPI
CONTROL
LOGIC
SBC
SPI SLAVE
SPICLKCFG
MOSI
MISO
SHIFTREG
TxBUF
RxBUF
IRQ
SPIDATA
MCU
SBC
4.8.2.
Setup Requirements for the Slave SPI of SBC
For compatibility with the SBC SPI SLAVE, the following settings must be made in the MCU SPI MASTER:
•
•
Clock phase = 1 and clock polarity = 1. This is the default configuration (after MCU reset) implemented
via the CPHA and CPOL bits of the Z1_SPICLKCFG register respectively (Table 4.23).
FOSCH
SPI clock frequency calculated by the formula:
FSPICLK
=
2∗
(
CDIV +1
)
Where CDIV is the clock divider value bit field in the Z1_SPICLKCFG register.
Note: For the SPI to operate within its valid speed range, the value programmed in CDIV must not be less than 2.
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4.8.3.
SPI Data Transfer Process
To start a transfer, the SPI SLAVE module must be enabled by setting the SPIEN bit in the Z1_SPICFG register
(Table 4.21) and then setting the clock period via the CDIV bit field in the Z1_SPICLKCFG register (Table 4.23).
The software then sets the SSN bit low, which enables the SPI SLAVE within the SBC. In addition, any necessary
interrupt source must be enabled. Note that the TX buffer (TxBUF) illustrated in Figure 4.5 is empty until the data
transfer has been started.
Upon expiration of the specified SSN set-up time period (see Table 1.16), the first byte to be transmitted is set up
by writing a data byte into the SPIDATA register. This will clear the TXEMPTY flag bit in the Z1_SPISTAT register
(Table 4.24). In the next system clock cycle, this byte is transferred into the shift register and this causes the
TXEMPTY and BUSY flag bits to be set in the Z1_SPISTAT register. This allows the user to place a second byte
into the TX buffer. The first byte is shifted out on the MOSI line and the SPI clock is generated.
Simultaneously, the MISO line is sampled and shifted in. Normally, the MISO line is sampled in the middle of a
transmitted bit. While the MOSI line changes its value at the same time as the SPI clock, there is a delay
regarding the MISO line as first the clock must be driven out of the chip into the connected SLAVE and then the
data must be driven back from the connected SLAVE. To relax the timing, especially for fast SPI clocks, the RX
data can be sampled at the end of a transmitted bit if configured via the SAMPLEPOS bit in the Z1_SPICFG
register.
When the complete byte has been shifted in and the RX buffer is empty, the byte is stored into the RX buffer at
the byte boundary and the RXFULL flag bit is set in the Z1_SPICFG register, signaling the end of the byte
transfer.
If the RX buffer is already full and the byte inside the RX buffer is not read in the same cycle, the byte currently
received is rejected (lost) and the RXOF flag bit is set in the Z1_SPISTAT register (Table 4.24).
Note: Because the SPI module operates in a full-duplex mode, a dummy byte must be placed into the TX buffer if
a byte must be read from the SLAVE without any WRITE to the SLAVE.
4.8.4.
Continuous SPI Data Streaming
When a new byte is written into TX buffer before the end of an active byte transfer, the transfer of the new byte
starts immediately after the actual transfer. This means that the BUSY flag bit in the Z1_SPISTAT register stays
active at the end of the first transmitted byte.
4.8.5.
Abrupt SPI Discontinuity
Since it can be possible that the software disables the SPI while a transfer is in progress (not recommended), a
byte could be present in the TX buffer indicated by a low value of the TXEMPTY flag bit in the Z1_SPISTAT
register. This byte can be removed from the TX buffer by writing a 1 to the CLRTXBUF bit of the Z1_SPISTAT
register as it would be transmitted when SPI is enabled again.
4.8.6.
Interrupts and Status Flags in the Z1_SPISTAT Register
There are five status flags available in the Z1_SPISTAT register. Only four of them can be enabled to drive the
interrupt lines as summarized below and in Table 4.24. The software is required to deal with interrupt events for
proper SPI operation. The BUSY flag is used to reflect the operation state of the SPI module.
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RXOVERFLOW: This bit is set by hardware when it is not able to store a received byte into the RX buffer (RX
buffer is already full). It is cleared by a software READ access to the status register. To prevent losing any
information, the set condition has higher priority than the clear condition. This bit is not set when the byte in the
RX buffer is read in the same system clock cycle when the next received byte will be stored.
RXFULL: This bit is set by hardware when a received byte is stored into the RX buffer and cleared when the byte
is read by the software. To prevent losing any information, the set condition has higher priority than the clear
condition. This situation occurs when the byte in the RX buffer is read in the same system clock cycle when the
next received byte will be stored.
TXEMPTY: This flag is active on default. It is cleared when software writes a byte to the TX buffer and is set by
hardware when it moves this byte into the shift register. As it might be possible that both actions happen in the
same system clock cycle, the clear condition has the higher priority.
WRCOLLISION: This flag is set when the software writes a byte into the TX buffer while the TX buffer is not
empty and its contents have not been moved into the shift register in the same system clock cycle. The byte that
the software intends to write is rejected to avoid loss of data. It is cleared by a software READ access to the
status register.
4.8.7.
Syncing the Data Transfer Rate via a Software Pause
When the software is not able to read the RX byte before the next byte is received (RXOVERFLOW bit = 1 in the
Z1_SPISTAT register), the timing can be relaxed by not writing the second TX byte until the first RXFULL interrupt
in the Z1_SPISTAT register. Instead the second TX byte can be written after this interrupt. This guarantees that
no RX overflow can occur but introduces some delay between two consecutive bytes as the module waits for the
next byte transfer until data is present.
4.8.8.
Master SPI Registers
The following registers are used by the SPI MASTER module:
•
•
Z1_SPICFG
SPI configuration register
Z1_SPIDATA
READ/WRITE access to this register accesses the SPI RX data buffer and the TX data
buffer respectively
•
•
Z1_SPICLKCFG SPI clock configuration
Z1_SPISTAT Collects SPI status flags
For detailed register address mapping and bits description, refer to section 4.10.4.
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4.9. SW-LIN Module
The SW-LIN provides the logic for communication on the LIN bus via the LIN PHY within the SBC. It is compliant
with LIN Specifications Rev. 2.1 and operates as a LIN SLAVE only. Most of the protocol must be handled in
software.
Figure 4.6 SW-LIN Block Diagram
CTRLꢀSIGNAL
BreakSync
SYNC;BANDRATE
Detector
TIMEOUT
Inactivity
Timer
CTRLꢀSIGNAL
Data Unit
(LIN UART)
LINꢀRXD
LINꢀTXD
RX Sync & Filter
LIN
SBC
LIN-PHY
IRQ
SBC
MCU
The hardware consists of a BREAK/SYNC field detector for bus synchronization and baud rate detection, an
inactivity timer, a data unit similar to a UART for communication, and a small block to synchronize and filter the
incoming data line.
The BREAK/SYNC field detector is used to detect any occurrence of a BREAK field and a SYNC field as
described in the LIN standard on the bus. It generates a sync strobe at the rising edge of RXD at the beginning of
the STOP bit and updates the baud rate as needed. The LIN standard defines the baud rate as being between
1kBaud and 20kBaud; however the SW-LIN is able to operate at even higher baud rates. The maximum baud rate
depends on the clock divider value and whether or not the LIN is operating in fast mode. In slow mode, the
maximum baud rate is 30kBaud independent of the clock divider value. In fast mode, the maximum baud rate is
75kBaud for a clock divider value of 3, 150kBaud for a clock divider value of 2, and 200kBaud for others.
The inactivity timer observes the RXD line and generates an interrupt when the LIN bus is inactive for more than 4
seconds as required by the LIN standard.
4.9.1.
The Inactivity Timer
The SW-LIN contains an inactivity timer. This module is required as the LIN standard requires that a LIN SLAVE
goes to sleep after more than 4s but less than 10s of inactivity on the bus. As bus inactivity means that there is no
change on the bus regardless of whether the bus is high or low, a timer is implemented which is reset on each
transition on the bus (falling or rising edge of the RXD line) and which is incremented when the timer has not
expired. When this timer expires, an interrupt is generated so that the software can disable the SW-LIN.
The LIN standard describes two ways of going to sleep. In addition to the inactivity timeout, the LIN SLAVES must
go to sleep when the corresponding SLEEP command has been received. If the LIN master in the full application
guarantees that a SLEEP command is always sent if the bus is not required anymore and a timeout can never
occur. The software can disable the inactivity timer to save power.
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4.9.2.
The BREAK/SYNC Field Detector
As described in the LIN standard, each transaction on the bus is initiated by the LIN master sending the header of
a LIN frame. This header consists of the BREAK field, the SYNC field, and the PID field. The first two fields are
used by the slave to determine the baud rate used for the rest of the transaction while the PID is used to
determine the type of the transaction (receive response; transmit response; do nothing). To enable the slave to
receive the PID, the baud rate must be detected before the START bit of the PID field. As a new BREAK and
SYNC field can occur at any time, an active transaction is interrupted when those fields are detected.
Figure 4.7 Structure of LIN Frame
FRAME
RESPONSE
HEADER
RESPONSEꢀSPACE
PROTECTED
IDENTIFIER
FIELD
DATA-1
DATA-2
DATA-N
CHECKSUM
BREAK
FIELD
SYNC
FIELD
INTER-BYTEꢀSPACE
INTER-BYTEꢀSPACE
4.9.3.
SW-LIN Data Unit
The data unit handles the reception and transmission of bytes (PID, DATA, and CRC as described in the LIN
standard). It contains all registers accessible by the user and generates the interrupt (Figure 4.8).
Figure 4.8 Block Diagram of the LIN Data Unit
LINIRQEN
RXD
LIN
CONTROL
TXD
LINCFG
LOGIC
IRQ
LINSTATUS
RXBIT
TXBIT
BAUDRATE
SHIFTREG
RxBUF TxBUF
LINDATA
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Although the fields to be received and transmitted have the same structure as a UART, the control logic is
different as the TX and RX channel are not independent. Each transfer consists of 8 data bits enclosed by a
leading START bit and a trailing STOP bit. On reception, the receiver synchronizes on the falling edge of the RXD
line (START) and samples the incoming data stream in the middle of each data bit. Additionally it checks that the
STOP bit is high. For transmission, the module itself generates the data stream, but it also checks that it can
receive the bits sent on its RXD line.
Figure 4.9 Frame Format of Each LIN Field (PID, DATA, Checksum) and RX Sample Position
START
D[0]
D[1]
D[2]
D[3]
D[4]
D[6]
D[5]
D[7]
STOP
(BAUDRATE+1)ꢀ
/ꢀF(MODULE)
RXꢀSAMPLING
4.9.4.
Description of the Receive Operation
The receive path is directly controlled by the LIN bus. Whenever a valid BREAK and SYNC field is detected by
the BREAK/SYNC field detector, the baud rate registers are updated, the receiver is enabled (RXEN bit is set to 1
in the Z1_LINCFG register; see Table 4.25) but placed into an inactive state (RXACTIVE bit is set to 0 in
Z1_LINCFG), and the RX control logic is set appropriately. Additionally, the SYNCDET interrupt flag in the
LINSTAT register (Table 4.26) is set, which must be cleared by software. If the receiver was already active on
reception of the sync strobe, the active transfer is discarded as it was receiving a new SYNC field.
After being enabled in inactive state, the bus is observed for a START condition (falling edge on the RXD line).
When a START condition is detected, the receiver is placed into the active state (RXACTIVE bit is set to 1 in the
Z1_LINCFG). The data is sampled into the shift register in the middle of each data bit. When the complete byte
has been shifted in, the receiver is placed back into its inactive state in the middle of the STOP bit. When the
STOP bit is high (as it should be), the received byte is placed into the RX buffer if this buffer is empty and then the
buffer is marked as full (RXFULL bit is set to 1 in LINSTAT). Otherwise the actual received byte is rejected and
the RX overflow flag is set (RXOVERFLOW bit is set to 1 in LINSTAT). If the STOP bit is low (wrong baud rate
detection or another BREAK and SYNC field is send by the master), no data is placed into the RX buffer. Instead
the receiver is disabled (RXEN bit is set to 0 in Z1_LINCFG) and a new BREAK/SYNC field is needed to restart
the receiver.
After the first byte (PID) was received, the receiver remains enabled but inactive as a DATA byte can be sent via
the bus by the LIN master or another slave. In parallel, triggered by the RXFULL flag bit in the LINSTAT register,
the software must read the received byte (PID) and must determine how to proceed. If the PID signals that the
SW-LIN will receive data bytes, no more actions need to be taken as the receiver remains enabled. The software
only has to wait for the next RXFULL interrupt bit for the successful reception of the first data byte. If the PID
indicates that this module is not part of the following transfer or if the last byte (checksum) has been received,
software should stop the receiver. This is done by writing 1 to the STOPRX bit in Z1_LINCFG. This register is a
strobe register (cleared after one clock cycle) and is used to clear both the RXEN bit and RXACTIVE flag in
Z1_LINCFG, as well as to place the RX control logic into a safe state.
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The receiver is re-enabled again after reception of the next synchronization strobe. If the PID indicates that this
SW-LIN must transmit data bytes, there is no need to disable the receiver by writing 1 to the STOPRX bit in
Z1_LINCFG although it is allowed. The receiver is also disabled (and the transmitter is started) when the software
writes a byte to be transmitted into the TX buffer.
There is also the capability to completely disable the receiver so that it is not even re-enabled by an incoming
BREAK and SYNC field. This can be done by writing 1 to the DISABLERX bit in Z1_LINCFG. However, disabling
the receiver completely must only be done when the clock divider value will be changed, the system clock will be
stopped, or for debugging purposes when the LIN can operate as a transmitter only. In the first two cases,
disabling the receiver is required to avoid any malfunction. In addition to the receiver being disabled, the inactive
timer must also be switched off via the ENTOCNT bit in Z1_LINCFG.
Figure 4.10 RX Control and Status Signal Waveforms
SYNCDET
CLEARED BY SW
SYNCDET_R
CLEARED BY SW
(STOPRX)
RXENABLE_R
END OF STOP BIT
RXD
RXACTIVE_R
DATA READ by SW
RXFULL_R
_R = REGISTERED SIGNAL
4.9.5.
Description of Transmit Operation
A transmission is started by writing the data to be transmitted into the TX buffer. It is in the responsibility of the
software to start the transmitter only when needed (correct PID was received) taking the LIN protocol into
account. When data is written into the TX buffer, the receiver is disabled (RXEN and RXACTIVE bits are set to 0
in the Z1_LINCFG register; see Table 4.25) and the transmitter is started (TXACTIVE bit is set to 1 in LINCFG).
The TXEMPTY flag bit in the Z1_LINSTAT register (Table 4.26) is cleared on write access to the TX buffer. It is
immediately set again in the next cycle as the data to be transmitted is copied into the shift register allowing the
software to write the next byte to be transmitted into the TX buffer. If software attempts to write into the TX buffer
while it already contains data (TXEMPTY bit is 0 in Z1_LINSTAT), the written byte is rejected and the WRCOLL
bit in LINSTAT is set. This flag will be cleared on a READ access to the status register.
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In a successful transmission, the transmitter first sends a 1 (STOP bit is placed at the beginning so that software
does not have to take care about the length of the previously received STOP bit), then sends a 0 (START bit) and
then the data byte is appended. At the end of the data byte transmission, the bus is released. If further data is
present, the transmitter remains active and continues transmission. If the TX buffer is empty, the transmitter is de-
activated (TXACTIVE is set to 0 in Z1_LINCFG).
Because several slaves might attempt to send data on the bus, it is possible that a conflict could occur on the bus
(first error condition). This can only be detected when the module sends a 1 (recessive value) but receives a 0
(dominant value). There are three checks implemented for this:
•
•
•
The receiver is already activated when the transmitter will be started
A falling edge is detected on the bus while sending the STOP bit at the beginning
A 0 is received during the data byte while transmitting a 1
In all three cases, the transmitter is stopped (TXACTIVE bit is set to 0 in Z1_LINCFG) and the TX buffer is cleared
(TXEMPTY bit is set in LINSTAT) to prevent invalid data from remaining in the buffer. The CONFLICT flag in the
LINSTAT register is also set.
There is a second error condition that might occur. For some error conditions (see section 3.13), the LIN PHY can
protect the bus by disabling the transmitter. This can be detected when sending a 0 but receiving a 1. This
condition is checked at the end of each transmitted bit. When this error condition is detected, the transmitter is
stopped (TXACTIVE bit is set to 0 in LINSTAT) and the TX buffer is cleared (TXEMPTY is set in LINSTAT) to
prevent invalid data remaining in the buffer. Additionally the TXOFF flag bit in the LINSTAT register is set.
It is also possible that the master generates a BREAK and SYNC field while the SW-LIN is transmitting and that
no bus conflict occurs. Therefore the transmitter is also de-activated when a sync strobe is detected.
Figure 4.11 Waveforms of the TX and RX Control and Status Signals
CLEARED BY DATA
PRESENT IN TX BUFFER
RXENABLE_R
RXACTIVE_R
CLEARED BY NO DATA
PRESENT IN TX BUFFER
TXACTIVE_R
SET BY DATA PRESENT
IN TX BUFFER
RXD_I
END OF STOP BIT FROM RECEIVED PID
TXEMPTY_R
TXD_O
TX-START
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4.9.6.
General Remarks for SW-LIN Usage
Here is a short summary of how to handle the SW-LIN:
•
•
•
At power-up, the receiver is not completely disabled, but the inactivity timer is disabled.
When the inactivity timer is needed, it has to be enabled.
When the system clock divider will be changed, both the receiver and the inactivity timer must be disabled
by writing 0x2 or 0x6 to the Z1_LINCFG register.
•
•
•
•
When the system clock will be switched off, both the receiver and the inactivity timer must be disabled by
writing 0x2 or 0x6 to the Z1_LINCFG register.
It is in the responsibility of the software that switching to transmit happens in accordance with the LIN
protocol.
If there is no need to receive the data following the PID, software should stop the receiver by writing 0x1 or
0x5 to the Z1_LINCFG register.
If data will be transmitted after reception of the PID, software can also stop the receiver by writing 1HEX or
5HEX to the Z1_LINCFG register. However, the receiver is also stopped by writing data to be transmitted
into the TX buffer.
•
•
The baud rate must not be written as it is automatically set by the BREAK/SYNC field detector. The only
exception is in debugging mode, when the receiver is fully disabled and the SW-LIN will operate as a TX
UART.
The protocol is handled in software. Although the receiver is stopped and is waiting for a new sync strobe
when the STOP bit is zero (this situation is possible when the MASTER changes the baud rate), it is also
possible that a SYNC field is detected as a correct byte when the master has increased the baud rate and
the receiver samples the data line for the STOP bit when the RXD line is high; e.g., during transmission of
the SYNC field. Therefore software must ignore all received bytes (but clear the buffer) after the checksum
has been received until a new synchronization has occurred (interrupt SYNCDET). To avoid this, software
can also stop the receiver by writing 1 to the STOPRX bit in Z1_LINCFG. Then the receiver does not
receive anything before a new synchronization has occurred.
4.9.7.
SW-LIN Registers
The following registers are used by the SW-LIN module:
•
•
Z1_LINCFG
SW-LIN configuration register (Table 4.25)
Z1_LINDATA
READ/WRITE access to this register accesses the LIN RX data buffer and TX data
buffer respectively (Table 4.27)
•
•
•
Z1_LINIRQEN Interrupt enable register (Table 4.28)
Z1_LINSTAT Interrupt status register (Table 4.26)
Z1_LINBAUDHIGH:Z1_LINBAUDLOW: Baud rate value for LIN interface (Table 4.30 and Table 4.29)
For detailed register address mapping and bits description, refer to section 4.10.5.
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4.10. MCU Registers Description
4.10.1. System Registers
The SMU registers are mapped into the system address space between 0x4000_0000 and 0x4000_03FF.
Unused addresses must not be accessed.
Table 4.5 Register [0x4000_0000] SYS_CLKCFG
SYS_CLKCFG
ADD: 0x4000_0000
Ext.
Access
Int.
Access
Reset
Value
Bit
Name
Description
1:0
CLKDIV
R / W
R
0
Clock divider value:
0: Incoming clock is divided by 1
1: Incoming clock is divided by 2
2: Incoming clock is divided by 4
3: Incoming clock is divided by 8
6 : 2
7
---
---
---
R
R/W
R
---
R
0
0
0
Unused; always read as 0.
Reserved.*
31 : 8
---
Unused; always read as 0.
Table 4.6 Register [0x4000_0004] SYS_MEMPORTCFG
SYS_MEMPORTCFG ADD: 0x4000_0004
Reset
Value
Ext.
Access
Int.
Access
Bit
Name
Description
7 : 0
PPNOD
R / W
R
0
Output configuration bits.
It can be individually selected for each GPIO whether it
functions as an open-drain (set to 0) or as a push-pull
(set to 1).
15 : 8
17 : 16
20 : 18
23 : 21
29 : 24
30
N/A
N/A
N/A
N/A
N/A
N/A
R
N/A
N/A
N/A
N/A
---
0
0
0
0
0
0
Reserved.
Reserved, do not write to these bits.
Reserved, do not write to these bits.
Reserved, do not write to these bits.
Unused; always read as 0.
N/A
N/A
---
LINTEST
R / W
R
Configuration bit for LIN test. When set, RXD and TXD
lines are directly connected to the GPIO.
31
MEMSWAP
R / W
R
0
Memory swap bit. It can be selected whether the FLASH
MAIN area (set to 0) or the RAM (set to 1) will be
mirrored to system address 0x0.
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Table 4.7 Register [0x4000_0008] SYS_MEMINFO
SYS_MEMINFO ADD: 0x4000_0008
Reset
Value
Ext.
Access
Int.
Access
Bit
Name
Description
7 : 0
PROGSTART
LOGSTART
RAMSPLIT
R
R
R
R / W
R / W
R / W
0xFF
This register represents the first page where the program
section inside the FLASH starts. This value is read from
FLASH during the power-up phase and is updated by
some flash commands.
Note: To determine the correct FLASH address offset,
seven "0" must be appended.
15 : 8
0xFF
This register represents the first page where the log
section inside the FLASH starts. This value is read from
the FLASH during the power-up phase and is updated by
some FLASH commands.
Note: To determine the correct FLASH address offset,
seven "0" must be appended.
26 : 16
0x7FF
This register represents the first RAM word that is
accessible by JTAG although the memory is locked. This
value is read from FLASH during the power-up phase and
is updated by some FLASH commands.
Note: To determine the correct RAM address offset, two
"0" must be appended.
27
---
R
R
---
0
Unused; always read as 0.
31 : 28
PROTINFO
R / W
0xF
This register represents the memory protection scheme.
This value is read from FLASH during the power-up
phase and is updated by some FLASH commands.
[0]: key-based lock
[1]: permanent lock
[3:2]: number of failed unlock attempts
Table 4.8 Register [0x4000_000C] SYS_RSTSTAT
SYS_RSTSTAT ADD: 0x4000_000C
Ext. Int.
Reset
Access Access Value
NAME
Bit
Description
0
EXTRST
RC
RC
RC
---
W
W
1
0
0
This bit reflects if an external reset has occurred. It is cleared
when the register is read.
1
2
SYSRSTREQ
LOCKUPRST
This bit reflects if a reset forced by a system reset request
has occurred. It is cleared when the register is read.
This bit reflects if a reset was forced by a detected lockup
when this reset was enabled. It is cleared when the register is
read.
3
JTAGRST
---
RC
R
W
---
0
0
This bit reflects if a reset that was forced by a JTAG reset
request has occurred. It is cleared when the register is read.
6 : 4
Unused; always read as 0.
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SYS_RSTSTAT
ADD: 0x4000_000C
Ext. Int.
Reset
Access Access Value
NAME
Bit
Description
7
ENLOCKUP
R
R
0
This bit reflects whether a lockup from the ARM® core is
allowed to reset the system (set to 1) or not (set to 0).
7 : 0
SETENLOCKUP
W
---
0
To enable the lockup reset, 0xC9 must be written to bits 7:0.
It can be disabled by writing another value. This bit is reset by
all four reset sources (extRst, sysRstReq, lockupRst,
jtagRst).
15:8
---
R
---
R
0
0
Unused; always read as 0.
23 : 16
JTAGRSTREQ
W
To generate a reset via the JTAG interface, 0x3A must be
written to bits 23:16. These bits cannot be written by the
ARM® core.
31 : 24
---
R
---
0
Unused; always read as 0.
4.10.2. GPIO Registers
The GPIO registers are mapped into the system address space between 0x4000_1400 and 0x4000_17FF.
Unused addresses must not be accessed.
Table 4.9 Register [0x4000_1400] GPIO_DIR
GPIO_DIR
Bit
ADD: 0x4000_1400
Ext.
Int.
Reset
Name
Description
Access
Access Value
7 : 0
GPIODIR
R / W
R
0
1: GPIO pin is switched as output direction.
0: GPIO pin is switched as input direction.
15 : 8
---
---
N/A
R
N/A
---
0
0
Reserved.
31 : 16
Unused; always read as 0.
Table 4.10 Register [0x4000_1404] GPIO_IN
GPIO_IN
Bit
ADD:0x4000_1404
Ext.
Int.
Reset
Name
Description
Access
Access Value
7 : 0
15 : 8
31 : 8
GPIOIN
---
R
N/A
R
R / W
N/A
---
0
0
0
Synchronized input value.
Reserved.
---
Unused; always read as 0.
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Table 4.11 Register [0x4000_1408] GPIO_OUT
GPIO_OUT
Bit
ADD:0x4000_1408
Ext.
Int.
Reset
Name
Description
Access
Access Value
7 : 0
15 : 8
31 : 16
GPIOOUT
R / W
N/A
R
R
N/A
---
0
0
0
Value to be driven out of each GPIO.
Reserved.
---
---
Unused; always read as 0.
Table 4.12 Register [0x4000_140C] GPIO_SETCLR
GPIO_SETCLR
ADD:0x4000_140C
Reset
Value
Ext.
Access
Int.
Access
Bit
Name
Description
7 : 0
SETOUT
R / W
R
0
Writing a 1 to the corresponding bit will set the GPIO output
to 1.
Lower priority than clear. Always read as 0.
Reserved.
15 : 8
---
N/A
N/A
R
0
0
23 : 16
CLROUT
R / W
Writing a 1 to the corresponding bit will set the GPIO output
to 0.
Higher priority than set. Always read as 0.
Reserved.
31 : 24
---
N/A
N/A
0
Table 4.13 Register [0x4000_1410] GPIO_IRQSTAT
GPIO_IRQSTAT ADD:0x4000_1410
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
7 : 0
IRQSAT
RC
R/W
0
This register reflects the interrupt status of each GPIO that is
enabled as interrupt. Reading this register will clear the
interrupt status bit.
15 : 8
---
---
N/A
R
N/A
---
0
0
Reserved.
31 : 16
Unused; always read as 0.
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Table 4.14 Register [0x4000_1414] GPIO_IRQEN
GPIO_IRQEN
ADD:0x4000_1414
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
7 : 0
IRQEN
R / W
R
0
When set to 1, the corresponding interrupt is allowed to drive
the interrupt line when the appropriate edge occurs.
15 : 8
---
---
N/A
R
N/A
---
0
0
Reserved.
31 : 16
Unused; always read as 0.
Table 4.15 Register [0x4000_1418] GPIO_IRQEDGE
GPIO_IRQEDGE ADD:0x4000_1418
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
7 : 0
IRQEDGE
R / W
R
0
0: rising edge on the corresponding GPIO triggers the IRQ line
1: falling edge on the corresponding GPIO triggers the IRQ line
15 : 8
---
---
N/A
R
N/A
---
0
0
Reserved.
31 : 16
Unused; always read as 0.
Table 4.16 Register [0x4000_141C] GPIO_TRIGEN
GPIO_TRIGEN
Bit
ADD:0x4000_141C
Ext.
Int.
Reset
Name
Description
Access
Access Value
7 : 0
15 : 8
31 : 16
TRIGEN
R / W
N/A
R
R
N/A
---
0
0
0
When set to 1, the corresponding GPIO drives its trigger line.
Reserved.
---
---
Unused; always read as 0.
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4.10.3. 32 Bit Timer Registers
The 32-bit timer registers are mapped into the system address space between 0x4000_1000 and 0x4000_13FF.
Unused addresses must not be accessed.
Table 4.17 Register [0x4000_1000] T32_CTRL
T32_CTRL
ADD:0x4000_1000
Ext. Int.
Reset
Access Access Value
Bit
Name
Description
0
EN
R / W
R / W
0
Enable bit for timer. This bit is cleared by hardware if an over-
flow occurs and the module is operating in single shot mode.
1
2
MODETC
MODESR
R / W
R
0
Select between timer and counter mode:
0: timer mode
1: counter mode
R / W
R
0
Select between reload and single shot mode:
0: reload mode; at overflow, reload value is copied into
counter register and counter continues
1: single shot mode; at overflow, reload value is copied into
counter register and counter stops
3
4
MODELE
MODEPN
R / W
R / W
R
R
0
0
Select between level or edge sensitive trigger;
counter mode only:
0: trigger is used as level sensitive
1: trigger is used as edge sensitive
Selects between rising or falling edge active trigger
(MODELE = 1) or high or low level (MODELE = 0);
counter mode only
0: Trigger on falling edge/low level
1: Trigger on rising edge/high level
5
OVERFLOW
---
R
R
R / W
---
0
0
Overflow flag (strobe); set for a single cycle when counter
overflows. This bit also drives the interrupt line.
31 : 6
Unused; always read as 0.
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Table 4.18 Register [0x4000_1004] T32_TRIGSEL
T32_TRIGSEL
Bit
ADD:0x4000_1004
Ext.
Int.
Reset
Name
TRIGSEL
Description
Access
Access Value
4 : 0
R / W
R
0
Select signal for the trigger source:
0x00: no trigger source
0x01: GPIO00 is used as trigger source
0x02: GPIO01 is used as trigger source
…
0x07: GPIO07 is used as trigger source
0x08 to 0x1F: no trigger source
31 : 5
---
R
---
0
Unused; always read as 0.
Table 4.19 Register [0x4000_1008] T32_CNT
T32_CNT
Bit
ADD:0x4000_1008
Name
Ext.
Int.
Reset
Value
Description
Access
Access
31 : 0
COUNTER
R / W
R / W
0
Timer value; this register can be written directly regardless of
whether timer is enabled or not. It is set to the reload value
when the reload value is written.
Table 4.20 Register [0x4000_100C] T32_REL
T32_REL
Bit
ADD:0x4000_100C
Name
Ext.
Int.
Reset
Value
Description
Access
Access
RELOADVAL
31 : 0
R / W
R
0
Timer-reload value; when the timer (counter) overflows, the
reload value is copied into the counter register. In reload
mode, the timer continues; however it stops if reload mode is
not enabled.
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4.10.4. SPI Registers
The registers of the SPI module are mapped into the system address space between 0x4000_1820 and
0x4000_1BFF. Unused addresses must not be accessed.
Table 4.21 Register [0x4000_1820] Z1_SPICFG
Z1_SPICFG
Bit
ADD:0x4000_1820
Ext.
Int.
Reset
Name
Description
Access
Access Value
0
1
2
3
RXOVERFLOW
RXFULL
R / W
R / W
R / W
R / W
R
R
R
R
0
0
0
0
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
TXEMPTY
WRCOLL
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
4
5
---
R
---
R
0
0
Unused; always read as 0.
SAMPLEPOS
R / W
This bit selects whether data on MISO will be sampled at the
sampling edge (set to 0) or at shift edge (set to 1).
Note: Change this bit only when the module is disabled
(SPIEN = 0) or when no transfer is in progress.
6
7
SSN
SPIEN
---
R / W
R / W
R
R / W
R / W
---
1
0
0
This bit directly controls the SSN line.
Enable for SPI module.
31 : 8
Unused; always read as 0.
Table 4.22 Register [0x4000_1824] Z1_SPIDATA
Z1_SPIDATA
Bit
ADD:0x4000_1824
Name
Ext.
Int.
Reset
Description
Access
Access Value
7 : 0
SPIDATA
R / W
R / W 0
When writing a byte to this register, the value is stored in the
TxBuffer. Additionally a WRITE access to this register clears
the TXEMPTY flag in the Z1_SPISTAT register (Table 4.24).
When reading this register, the contents of the RxBuffer is
returned. Additionally a READ access to this register clears
the RXFULL flag in Z1_SPISTAT.
Note: When writing to this register when TxBuffer is full, the
TxBuffer keeps its contents and the written byte is rejected.
This is signaled by the WRCOLL flag in Z1_SPISTAT.
31 : 8
---
R
---
0
Unused; always read as 0.
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Table 4.23 Register [0x4000_1828] Z1_SPICLKCFG
Z1_ SPICLKCFG ADD:0x4000_1828
Bit
Name
Ext.
Int.
Reset
Description
Access
Access Value
0
CPOL
CPHA
CDIV
---
R / W
R / W
R / W
R
R
R
1
1
1
0
Clock polarity; the content of this bit directly affects the idle
state of the clock.
Note: Change this bit only when the module is disabled
(SPIEN=0 in register Z1_SPICFG; see Table 4.21).
1
Clock phase; data is centered on the first (set to 0) or to the
second (set to 1) clock edge.
Note: Change this bit only when the module is disabled
(SPIEN=0).
7 : 2
31 : 8
R
Clock divider value; SPI clock period is 2∗(CDIV+1) times the
system clock.
Note: Change this bit only when the module is disabled
(SPIEN=0) or when no transfer is in progress.
---
Unused; always read as 0.
Table 4.24 Register [0x4000_182C] Z1_SPISTAT
Z1_ SPISTAT
ADD:0x4000_182C
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
0
RXOF
RC
W
0
This bit signals that an RX overflow has occurred.
Note: This bit is cleared when the status is read.
Note: The received byte causing the overflow is rejected; the
previous received byte is kept in the RX buffer.
1
RXFULL
R
R
R / W
R / W
W
0
1
0
This bit reflects the status of the RX buffer. It is set when a
new byte is transferred into the RX buffer.
Note: This bit is cleared when SPIDATA is read (Table 4.22).
2
3
TXEMPTY
WRCOLL
This bit reflects the status of the TX buffer. It is set when a
byte is transferred from the TX buffer into the shift register.
Note: This bit is cleared when SPIDATA is written.
RC
This bit is set when SPIDATA is written while TX buffer is
already full.
Note: This bit is cleared when the status is read.
This bit reflects the status of the SPI module.
Unused; always read as 0.
4
6 : 5
7
BUSY
---
R
R
R / W
---
0
0
0
CLRTXBUF
W1C
R
Writing a 1 to this bit clears the TX buffer.
Note: Write only when SPI is disabled; always read as 0.
31 : 8
---
R
---
0
Unused; always read as 0.
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4.10.5. SW-LIN Registers
The registers of the SW-LIN module are mapped into the system address space between 0x4000_1800 and
0x4000_181F. Unused addresses must not be accessed.
Table 4.25 Register [0x4000_1800] Z1_LINCFG
Z1_LINCFG
ADD:0x4000_1800
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
0
STOPRX
R / W
R
0
This bit is a strobe register to stop the receiver.
When writing 1 to this bit, the state machine of the data
reception unit is placed into its default state (RXEN and
RXACTIVE are cleared) and waits for a new sync strobe. This
can be used by software to reject incoming data after the PID
field has been evaluated as a non-used PID.
1
2
DISABLERX
FASTMODE
R / W
R / W
R
R
0
0
When set to 1, this bit completely disables the BREAK/SYNC
field detector, the RX data path, and the RX filter. It must be
set when the system clock will be switched off, when the clock
divider will be changed, when LIN will go to sleep but the
MCU will continue operation, or for debugging purposes.
This bit distinguishes between slow (0) and fast (1) mode.
In slow mode, the detected baud rate is between 1kBaud and
30kBaud.
In fast mode, the detected baud rate is up to 200KBaud for
CLKDIV values 0, 1, and 2 and up to 100KBaud for CLKDIV
value of 3 (see Table 4.5).
3
ENTOCNT
R / W
R
0
This bit enables the timeout counter for bus inactivity. The LIN
protocol requires that the LIN controller must go to sleep when
either a SLEEP command was received or after more than 4s
of inactivity. If the overall system guarantees that LIN
communication is always stopped with a SLEEP command,
there is no need to activate the timeout counter.
4
5
RXEN
R
R
R / W
R / W
0
0
This bit reflects the status of the receiver.
It is set when a BREAK/SYNC field is detected and it is
cleared when software stops the receiver (STOPRX = 1) or
when a transmission is started.
RXACTIVE
This bit reflects the status of the receiver.
It is set when a START condition is detected on the bus
(falling edge of RXD line after synchronization). It is cleared
when the software stops the receiver (STOPRX = 1), when a
new sync strobe occurs, in the middle of a received STOP bit,
or when a transmission is started.
6
TXACTIVE
R
R / W
0
This bit reflects the status of the transmitter. It is set if data is
present in the TX buffer to be transmitted. It is cleared if a sync
strobe or a bus conflict (sending 1 but receiving 0) is detected,
if the transmitter is forced to 1 by protection logic (sending 0
but receiving 1), or when no more data to be transmitted is
present in the TX buffer at the end of an active transmission.
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Z1_LINCFG
Bit
ADD:0x4000_1800
Ext.
Int.
Reset
Name
Description
Unused; always read as 0.
Access
Access Value
31 : 7
---
R
---
0
Table 4.26 Register [0x4000_1804] Z1_LINSTAT
Z1_LINSTAT
ADD:0x4000_1804
Reset
Value
Ext.
Int.
Bit
Name
Description
Access Access
0
1
2
SYNCDET
RXFULL
RC
R
R / W
R / W
R / W
0
0
1
This bit is set by hardware when a BREAK/SYNC field has
been detected by the break-/sync-field detector. It is cleared
when software reads this register.
This bit is set by hardware when a received byte is placed into
the RX buffer. It is cleared when the software reads the data
out of the RX buffer (read from LINDATA;Table 4.27).
TXEMPTY
R
This bit is set when a byte to be transmitted is read out of the
TX buffer to be shifted out on the LIN bus. It is cleared when
the software puts a new byte into the TX buffer (write to
LINDATA).
3
4
5
6
CONFLICT
RXOVERFLOW
WRCOLL
RC
RC
RC
RC
R / W
R / W
R / W
R / W
0
0
0
0
This bit is set by hardware when it has detected a bus conflict
during an active transmission. This can only occur when
sending a 1 but receiving a 0. It is cleared when software
reads this register.
This bit is set by hardware if the receiver attempts to place a
received byte into the RX buffer while this buffer is already
full. The new received byte is rejected and lost. This bit is
cleared when software reads this register.
This bit is set by hardware if software tries to write a byte into
the TX buffer while this buffer is already full. The new written
byte is rejected. This bit is cleared when the software reads
this register.
TXOFF
This bit is set by hardware if it is transmitting a 0 but receives
a 1. As 0 is the dominant level on the bus; this can only occur
due to hardware error or if the bus protection circuit has
disabled the output driver in the LIN PHY. This bit is cleared
when software reads this register.
7
INACTIVE
RC
R / W
o
This bit is set when the timeout counter for inactivity has
expired. This bit is cleared when software reads this register.
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Table 4.27 Register [0x4000_1808] Z1_LINDATA
Z1_LINDATA
ADD:0x4000_1808
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
7 : 0
LINDATA
R / W
R / W
0
When writing a byte to this register, the value is stored in the
TX buffer. A WRITE access to this register also clears the
TXEMPTY flag in the Z1_LINSTAT register (Table 4.26).
When reading this register, the content of the RX buffer is
returned. A READ access to this register also clears the
RXFULL flag in the Z1_LINSTAT register.
Note: When writing to this register if TX buffer is full, the TX
buffer keeps its contents and the written byte is rejected. This
is signaled by the WRCOLL flag in the Z1_LINSTAT register.
31 : 8
---
R
---
0
Unused; always read as 0.
Table 4.28 Register [0x4000_180C] Z1_LINIRQEN
Z1_LINIRQEN
Bit
ADD:0x4000_180C
Ext. Int.
Access Access Value
Reset
Name
Description
0
SYNCDET
RXFULL
R / W
R / W
R / W
R / W
R / W
R / W
R / W
R / W
R
R
R
R
R
R
R
R
R
---
0
0
0
0
0
0
0
0
0
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
1
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
2
TXEMPTY
CONFLICT
RXOVERFLOW
WRCOLL
TXOFF
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
3
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
4
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
5
6
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
7
INACTIVE
---
When set to 1, the corresponding status bit is allowed to drive
the IRQ output.
31 : 8
Unused; always read as 0.
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Table 4.29 Register [0x4000_1810] Z1_LINBAUDLOW
Z1_LINBAUDLOW ADD:0x4000_1810
Ext.
Access
Int.
Reset
Bit
Name
LINBAUDLOW
Description
Access Value
7 : 0
R / W
R / W 0xE7 Baud rate for LIN interface
baud rate = CLK/({LINBAUDHIGH, LINBAUDLOW} + 1)
Note: In NORMAL operating mode, this register must not be
written. It is updated by the BREAK/SYNC detector.
Note: For debugging purposes, the LIN controller can function
as a TX UART. For this purpose, the baud rate can be selected
by software but must be at least 0x3.
31 : 8
---
R
---
0
Unused; always read as 0.
Table 4.30 Register [0x4000_1814] Z1_LINBAUDHIGH
Z1_LINBAUDHIGH ADD:0x4000_1814
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
6 : 0
LINBAUDHIGH R / W
R / W 0x3
Baud rate for LIN interface
baud rate = clk / ( {LINBAUDHIGH, LINBAUD LOW} + 1)
Note: In NORMAL operating mode, this register must not be
written. It is updated by the BREAK/SYNC detector.
Note: for debugging purposes, the LIN controller can function as
a TX UART. For this purpose, the baud rate can be selected by
software but must be at least 0x3.
31 : 7
---
R
---
0
Unused; always read as 0.
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4.10.6. FLASH Memory Registers
The registers of the FLASH controller are mapped into the system address space between 0x4000_0800 and
0x4000_0BFF. Unused addresses must not be accessed. Read accesses to registers are always performed even
if a command is executed or a direct WRITE is active. Write accesses to the registers are postponed until the
active command/direct-write access has finished.
Table 4.31 Register [0x4000_0800] FC_RAM_ADDR
FC_RAM_ADDR
ADD:0x4000_0800
Ext.
Access
Int.
Reset
Bit
Name
ADDRRAM
Description
Access Value
10 : 0
R / W
R / W
0
RAM word address where data to be written into flash is
located (first address); hardware increments this address
when more than one word has to be written.
Note: The last two address digits of the RAM are not included
as they are always 0. For programming, the RAM address
needs to be shifted right by two bits.
31 : 11
---
R
---
0
Unused; always read as 0.
Table 4.32 Register [0x4000_0804] FC_FLASH_ADDR
FC_FLASH_ADDR ADD:0x4000_0804
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
FLASHADD
R
14 : 0
R / W
R
0
FLASH word address (first address) where data is to be
written; also used as the pointer to a page to be erased.
Note: the last two address digits of the FLASH are not
included as they are always 0. For programming, the FLASH
address needs to be shifted right by nine bits.
31 : 15
---
R
---
0
Unused; always read as 0.
Table 4.33 Register [0x4000_080C] FC_EXE_CMD
FC_EXE_CMD
Bit
ADD:0x4000_080C
Ext.
Int.
Reset
Name
Description
Access
Access Value
0
EXECMD
---
R / W
R
0
0
Writing 1 to this bit starts the execution of the configured
command; always read as 0.
31 : 1
R
---
Unused; always read as 0.
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Table 4.34 Register [0x4000_0808] FC_CMD_SIZE
FC_CMD_SIZE
Bit
ADD:0x4000_0808
Ext.
Int.
Reset
Name
Description
Access
Access Value
Command to be executed by flash controller
Valid commands:
3 : 0
COMMAND
R / W
R
0
0HEX: ERASE_MAIN_CMD
2HEX: ERASE_BOOT_PROG_CMD
3HEX: ERASE_PROG_CMD
4HEX: ERASE_MAINPAGE_CMD
6HEX: ERASE_KEY_CMD
8HEX: UNLOCK_CMD
9HEX: GETENV_CMD
AHEX: WRITE_CMD
CHEX: SET_KEY_CMD
DHEX: SET_BOUNDARY_CMD
EHEX: LOCK_PERM_CMD
FHEX: LOCK_KEY_CMD
7:4
---
R
---
R
0
0
Unused; always read as 0.
12:8
WRSIZE
R / W
Number of words to be written to FLASH; 0 is interpreted as 32.
Note: Writing is always performed within a row. 1 row contains
32 words. While the RAM address is always incremented, the
FLASH address wraps at the row boundary to the beginning of
the row. It is in the responsibility of the user to ensure this.
31 : 13
---
R
---
0
Unused; always read as 0.
Table 4.35 Register [0x4000_0810] FC_IRQ_EN
FC_IRQ_EN
ADD:0x4000_0810
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
0
ENIRQ0
R / W
R
0
When set to 1, the status signal CMDRDY in the
FC_STAT_CORE register is allowed to drive the interrupt
line. See Table 4.36 for the related status signals for bits [3:0]
this register.
1
2
3
4
ENIRQ1
ENIRQ2
ENIRQ3
ENIRQ4
R / W
R / W
R / W
R / W
R
R
R
R
0
0
0
0
When set to 1, the status signal INVALIDCMD is allowed to
drive the interrupt line.
When set to 1, the status signal INVALIDAREA is allowed to
drive the interrupt line.
When set to 1, the status signal UNLOCKFAIL is allowed to
drive the interrupt line.
When set to 1, the status signal DATAALL1 in the
FC_STAT_DATA register is allowed to drive the interrupt line.
See Table 4.38 for the related status signals for bits [6:4] this
register.
5
ENIRQ5
R / W
R
0
When set to 1, the status signal DATA1ERR is allowed to
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FC_IRQ_EN
Bit
ADD:0x4000_0810
Ext.
Int.
Reset
Name
Description
Access
Access Value
drive the interrupt line.
6
7
ENIRQ6
ENIRQ7
R / W
R / W
R
R
0
0
When set to 1, the status signal DATA2ERR is allowed to
drive the interrupt line.
When set to 1, the status signal PROG1ERR in the
FC_STAT_PROG register (Table 4.37) is allowed to drive the
interrupt line.
31 : 8
---
R
---
0
Unused; always read as 0.
Table 4.36 Register [0x4000_0814] FC_STAT_CORE
FC_STAT_CORE ADD:0x4000_0814
Ext.
Access
Int.
Reset
Bit
Name
Description 1)
Access Value
0
CMDRDY
RC
RC
RC
R / W
R / W
R / W
0
0
0
This bit is set when a command execution has finished; it is
cleared when this register is read.
1
2
INVALIDCMD
INVALIDAREA
This bit is set when an invalid command was executed; it is
cleared when this register is read.
This bit is set when a command is executed targeting a
protected area; e.g., performing ERASE_MAINPAGE_CMD
to program space when flash is locked; it is cleared when this
register is read.
3
UNLOCKFAIL
COREACTIVE
ALLOWKEY
ALLOWBOOT
ALLOWPROG
CLRALLOW
---
RC
R
R / W
R / W
R / W
R / W
R / W
R
0
0
0
0
0
0
0
This bit is set when the UNLOCK_CMD fails; it is cleared
when this register is read.
4
This bit reflects the status of the core state machine; when
set core is active.
5
R
When this bit is set but FLASH is locked, the
ERASE_KEY_CMD is allowed to be performed.
6
7
R
When this bit is set but FLASH is locked, the WRITE_CMD is
allowed to be performed on the boot space.
R
When set but FLASH is locked, the WRITE_CMD is allowed
to be performed on the program space.
8
W1C
Writing 1 to this bit clears ALLOWKEY, ALLOWBOOT, and
ALLOWPROG flags.
31 : 9
R
---
Unused; always read as 0.
1)
For related FLASH controller command codes, see Table 4.34.
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Table 4.37 Register [0x4000_0818] FC_STAT_PROG
FC_STAT_PROG ADD:0x4000_0818
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
17 : 0
ADDRPROG
R
R / W
0
This register contains the address of the instruction fetch
error that caused the first of the three flags below to be set;
the highest bit is used to distinguish between MAIN (0) and
INFO (1) area.
28 : 18
29
---
R
---
0
0
Unused; always read as 0.
PROGALL1
RC
R / W
This bit is set when an instruction fetch occurs to an erased
memory address; it is cleared when this register is read.
30
31
PROG1ERR
PROG2ERR
RC
RC
R / W
R / W
0
0
This bit is set when a correctable error occurs during an
instruction fetch; it is cleared when this register is read.
This bit is set when an un-correctable error occurs during an
instruction fetch; it is cleared when this register is read.
Table 4.38 Register [0x4000_081C] FC_STAT_DATA
FC_STAT_DATA ADD:0x4000_081C
Ext.
Access
Int.
Reset
Bit
Name
Description
Access Value
17 : 0
ADDRDATA
R
R / W
0
This register contains the address of the read error which
caused the first of the three flags below to be set; the highest
bit is used to distinguish between MAIN (0) and INFO (1)
area.
28 : 18
29
---
R
---
0
0
Unused; always read as 0.
DATAALL1
RC
R / W
This bit is set when a READ is performed to an erased
memory address; it is cleared when this register is read.
30
31
DATA1ERR
DATA2ERR
RC
RC
R / W
R / W
0
0
This bit is set when a correctable error occurs during a read;
it is cleared when this register is read.
This bit is set when an un-correctable error occurs during a
READ; it is cleared when this register is read.
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5
ZAMC4100 Protection and Diagnostic Features
This section is a summary description of all protection and diagnostic features available in the ZAMC4100. The
description is structured similarly to the way the diagnostics are handled:
event
detection capturing reaction
à à à
5.1. Full-Time Diagnostic and Protection Features
It includes features that might always be present whenever the system is powered and do not interrupt or
influence the normal operation. They are executed in the background automatically and interrupt the normal
operation only if a specific event occurs. Some of these features might be masked by the software and MCU;
others cannot be masked (mainly protection functions).
5.1.1. Over-Current (OC) Protection
Event
The current through one of the output driver transistors is above the maximum specified value for
the corresponding output.
Detection
Continuous comparison with a fixed reference level with pure analog circuitry; possible measuring
with the ADC in parallel; invoked by the software.
Capturing
Reaction
Captured in the digital SBC.
Response in both digital and analog domains:
1) The driver of this transistor automatically limits the current in order to avoid silicon damage.
Important: This reaction is implemented as analog circuitry, and it cannot be masked.
2) An over-current interrupt flag is set in the digital SBC, and the drivers are automatically
disabled.
5.1.2. Over-Load (OVL) Detection using the ADC
Event
The current through one of the output driver transistors is above a certain limit (OVL level) that is
considered as a maximum current allowed for the driven load. The OVL level is always below the
OC level.
Detection
Initiated by the MCU firmware. The measured current by the ADC is compared with the OVL level
in the MCU or with the ADC comparator.
Capturing
Reaction
The event is captured in the MCU.
A response should be implemented in the MCU software depending on the application
requirements.
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5.1.3. Over-Temperature (OVT) Protection
Event
The internal chip temperature exceeds the maximum specified junction temperature for the
system (see Table 1.2).
Detection
Continuous comparison between the internal reference and the internal temperature sensor’s
voltage.
Capturing
Reaction
The event is captured in the SBC, and an interrupt is propagated to the MCU.
All drivers are automatically disabled.
5.1.4. Over-Voltage (OV) Detection
Event
The voltage at the VDDE pin is higher than the upper supply range limit specified in Table 1.5.
Detection
Capturing
Reaction
Continuous comparison of the internal reference and VDDE pin voltage.
The event is captured in the SBC, and an interrupt is propagated to the MCU.
All drivers are automatically disabled. This feature can be turned off if not needed.
5.1.5. Under-Voltage (UV) Detection
Event
The voltage at the VDDE pin is higher than the lower supply range limit specified in Table 1.5.
Detection
Capturing
Reaction
Continuous comparison of the internal reference and VDDE pin voltage.
The event is captured in the SBC, and an interrupt is propagated to the MCU.
All drivers are automatically disabled. This feature can be switched-off if not needed.
5.1.6. Short to GND or Vbat Protection of Sensor Supply Pin S_P and Analog Input Pins AIN1
and AIN2
Event
The pin is shorted to the GND or Vbat rail (for the AIN1 and AIN2 pins through the external
protection resistors; see the application diagram in Figure 6.1).
Detection
Capturing
Reaction
A Zener-like structure limits the voltage propagated through these pins to internal blocks.
The event is not captured.
Limit the voltage in order to protect the internal circuitry, or limit the current through the S_P pin in
the event of a short to ground.
5.1.7. OSCL Output Clock Failure Detection
Event
There is a failure in the OSCL clock generation. The 125kHz clock is missing.
Detection
Internal circuitry running at the OSCH clock continuously observes the output of OSCL. If OSCL
stops, a failure event is detected.
Capturing
Reaction
The event is captured in the SBC, and an interrupt is propagated to the MCU.
A response should be implemented in the MCU software depending on application requirements.
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5.2. MCU Activated Diagnostic Functions
All hardware resources needed for these diagnostics are available in the SBC, but the procedures must be
executed by the MCU.
5.2.1. Open-Load Detection
Event
There is an open in one or more drivers’ outputs.
Detection
A current source is connected to the output and the voltage drop over the load is observed. If the
load is open, the voltage drop is zero. More information for this procedure is given in sections
3.8.3, 3.9.3, and 3.11.3. Also see Table 1.8 and Table 1.9 for electrical specifications.
Capturing
Reaction
The event is captured as diagnostic status flag in SBC chip and can be read via the SPI.
Should be implemented in MCU software depending on the application requirements.
5.2.2. Short to Vbat or GND Detection
Event
The driver output is shorted to Vbat or GND.
Detection
Two current sources (sink and source) are connected to the output and the voltage drop over
them is observed. If an event occurs, the potential will not be changed (zero in the event of a
short to GND or Vbat in the event of a short to Vbat). More information for this procedure is given
in sections 3.8.3, 3.9.3, and 3.11.3. See Table 1.8 and Table 1.9 for electrical specifications.
Capturing
Reaction
The event is captured as a diagnostic status flag in the SBC and can be read via the SPI.
A response should be implemented in MCU software depending on the application requirements.
Note: The short to Vbat or GND diagnostic is possible only for the half-bridge drivers. For high-side drivers, only short to VBAT
can be detected independently. Short to GND will cause an over-current event.
5.2.3. Floating Analog Input Detection
Event
One of the analog inputs (AINx pins) is floating or shorted.
Detection
Current sink and source are connected to the pin and the voltage drop over them is monitored.
More information is given in section 3.12.10. See Table 1.13 for electrical specifications.
Capturing
Reaction
The event is captured as a diagnostic status flag in the SBC and can be read via the SPI.
A response should be implemented in the MCU software depending on application requirements.
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5.2.4. Short or Open Sensor Supply Detection
Event
The sensor supply pin S_P is shorted to one of the supply rails, or it is floating.
Detection
Current sink and source are connected to the pin and the voltage drop over them is monitored.
More information is given in section 3.12.10. See for Table 1.13 for electrical specifications.
Capturing
Reaction
The event is captured as a diagnostic status flag in the SBC and can be read via the SPI.
A response should be implemented in the MCU software depending on application requirements.
5.2.5. ADC Ratiometric Test
Event
There is a failure in the ADC analog or digital control/data path.
Detection
The input multiplexer connects the input of the ADC to fixed points from the resistive divider of the
position potentiometers’ supply voltage. The measurement is ratiometric and does not depend on
internal reference sources. The conversion result is compared with the expected one.
Details for software implementation:
ADC channel selected by the ADCCTRL register: IMPSEL[4:0] = 19HEX (i.e., channel 25DEC
)
Expected ADC conversion result:
ADCRES[9:0] = 682 ± 15 (unsigned result)
ADC channel selected by ADCCTRL register:
Expected ADC conversion result:
IMPSEL[4:0] = 1AHEX
ADCRES[9:0] = 341 ± 15 (unsigned result)
Notes:
1. For proper execution of this test, the internal sensor supply should be enabled (set bits SPSWEN and
SNSWEN in AINCONF register) or the external sensor supply should be applied between the S_P and
S_N pins.
2. The expected conversion results are specified for maximum sampling rate: 125ksps. At higher speeds,
the ADC conversion results obtained will be out of the specified range.
Capturing
Reaction
The event is captured in the MCU by reading the ADC conversion value.
A response should be implemented in the MCU software depending on application requirements.
5.2.6. ADC Test Absolute
Event
There is a failure in the ADC analog or digital control/data path.
Detection
The ADC input is connected to the internal reference voltage. The value of this voltage is Vref/2
and the ADC should return the midscale value.
Details for software implementation:
ADC channel selected by ADCCTRL register:
Expected ADC conversion result:
IMPSEL[4:0] = 1BHEX
ADCRES[9:0] = 512 ± 15 (unsigned result)
Capturing
Reaction
The event is captured in the MCU by reading the ADC conversion value.
A response should be implemented in the MCU software depending on application requirements.
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5.2.7. Reference Voltage Test
Event
There is failure in the ADC reference voltage.
Detection
The ADC input is connected to the internal reference voltage (this is not the ADC reference). The
value of this voltage is expected to be Vref/2 and the ADC should return the midscale value.
Details for software implementation:
ADC channel selected by the ADCCTRL register: IMPSEL[4:0] = 1CHEX
Expected ADC conversion result:
ADCRES[9:0] = 512 ± 30 (unsigned result)
Capturing
Reaction
The event is captured in the MCU by reading the ADC conversion value.
A response should be implemented in the MCU software depending on application requirements.
5.2.8. 5.0V Supply Test
Event
Regulator VDD5V0 voltage is out of range.
Detection
The regulator’s output is measured with the ADC. The expected result is the ADC midscale value.
Details for software implementation:
ADC channel selected by the ADCCTRL register: IMPSEL[4:0] = 1DHEX
Expected ADC conversion result:
ADCRES[9:0] = 512 ± 50 (unsigned result)
Capturing
Reaction
The event is captured in the MCU by reading the ADC conversion value.
A response should be implemented in the MCU software depending on application requirements.
5.2.9. 2.5V Supply Test
Event
Regulator VDD2V5 voltage is out of range.
Detection
The regulator’s output is measured with the ADC. The expected result is the ADC midscale value.
Details for software implementation:
ADC channel selected by the ADCCTRL register: IMPSEL[4:0] = 1EHEX
Expected ADC conversion result:
ADCRES[9:0] = 512 ± 50 (unsigned result)
Capturing
Reaction
The event is captured in the MCU by reading the ADC conversion value.
A response should be implemented in the MCU software depending on application requirements.
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5.2.10. Current Multiplexer Test
Event
There is a failure in the current multiplexer or the current to voltage converter
Detection
A dedicated diagnostic channel of the current multiplexer with fixed current level is connected to
the ADC. The expected result is 10% of the ADC unsigned full-scale range.
Details for software implementation:
ADC channel selected by ADCCTRL register: IMPSEL[4:0] = 1Fh
Expected ADC conversion result:
ADCRES[9:0] = 102 ± 10 (unsigned result)
Capturing
Reaction
The event is captured in MCU by reading the ADC conversion value
Should be implemented in MCU software depending on the application requirements.
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6
Application Circuit and External Components
6.1. Application Circuit Diagram for Mirror Controller
Figure 6.1 shows a typical application for ZAMC4100 as a controller for an automotive outside rear mirror.
See section 6.2 for the values and functions of the external components.
Figure 6.1 ZAMC4100 Application Circuit for Automotive Mirror Control
R4
D1
C2
C1
C3
T1
Vbat
C4
R5
CAP_CP VDDE VDDE1-8
CAP_5V0
HB1
M
HB2
HB3
C5
M
M
HB4
S_P
CAP_3V3
CAP_1V8
CAP_MCU
C6
C7
C8
P2
R3
R2
AIN1
AIN2
P1
S_N
Turn signal
HS4
ZAMC4100
GPIO0
Puddle lamp
BSD lamp
Heater
HS3
HS2
GPIO7
LIN
D2
C9
VSS_LIN
HS1
AIN3/TEMP1
AIN4/TEMP2
EC_RES
R1
ext. temp
_
EC M
VSSA VSSD1-2 VSS_IO VSS1-5
T2
EC Mirror
GND
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6.2. External Components for Automotive Mirror Control Application
Table 6.1 lists the values, purpose, and tolerances for the external components shown in Figure 6.1.
Table 6.1 Parameters for External Components in Typical Automotive Mirror Control Application
Component
Function
Supply filtering
Supply filtering
Supply filtering
Charge pump
Min
Typ
100
10
68
68
220
47
47
47
100
-
Max
Tol
10%
10%
10%
10%
10%
10%
10%
10%
1%
Units
nF
µF
nF
nF
nF
nF
nF
nF
pF
-
Note
C1
C2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
Capacitor (ceramic)
IRF7470
C3
C4
C5
Regulator stability
Regulator stability
Regulator stability
Regulator stability
LIN
C6
C7
C8
C9 1)
T1
Reverse polarity
-
T2 2)
External temperature
sensor
-
-
-
MMBT3904
R1
R2/3
R4
Load for EC mirror
Short to Vbat prot.
Reverse polarity circuit
Reverse polarity circuit
Position sensors
-
-
47
1
-
-
5%
10%
10%
10%
10%
-
Ω
kΩ
Ω
Resistor/~1W
Resistor
-
4.7
2.2
-
Resistor
R5
-
-
MΩ
kΩ
-
Resistor
P1/2
D1
2
-
5
-
Potentiometer
BAT54
Reverse polarity
-
1)
2)
According to the LIN 2.0 standard, the total capacitance of the SLAVE LIN pin must be less than 220pF.
Optional component for external temperature measurement.
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7
Multi-chip Module Assembly, Pin Layout, and Pin Assignments
ZAMC4100 is a highly integrated solution consisting of Microcontroller Unit (MCU) and System Basis Chip (SBC)
within a single plastic QFN package as shown below. Both chips are assembled in a multi-chip-package placed
horizontally alongside one another. The exposed pad allows better thermal performance.
Figure 7.2 gives the pin layout and assignments. See Table 7.1 for the description of the pins.
Figure 7.1 ZAMC4100 Multi-chip-Module Assembly
External pin bonding wires
Off-chip bonding wires
SBC
MCU
Exposed pad
Figure 7.2 Pin Layout for ZAMC4100 PQFN65 – Top View
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
HB2a
VSS3
HB1b
VDDE2
VDDE3
HS1a
VDDE4
VDDE5
HS2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TCK
TMS
TDO
TDI
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
n.c.
EXPOSEDꢀPAD
(pinꢀ65)
HS1b
VDDE6
VDDE7
HB1a
HS3
VSS2
HB2b
CAP_MCU
CAP_3V3
CAP_1V8
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ZAMC4100 Datasheet
Table 7.1 Pin Description
Note: See important table notes at the end of the table.
Pin Name
Position
Purpose
Mode
Description
SUPPLY PINS
VDDE
VDDE1
32
64
4
Supply
Input
Supply for the system
VDDE2
VDDE3
5
VDDE4
7
Supply
Input
High current supply for the drivers
VDDE5
8
VDDE6
11
12
17
20
15
2
VDDE7
VDDE8
VSS1 (1)
VSS2 (1)
VSS3 (1)
Supply
Input
High current ground for drivers
VSS4 (1)
VSS5 (1)
62
58
54
24
31
51
53
65
VSS_LIN (1)
VSSA (1)
VSSD1 (1)
VSSD2 (1)
VSS_IO (1)
EXPOSED PAD (2)
Supply
Supply
Supply
Supply
Supply
Heat sink
Input
Input
Input
Input
Input
-
Ground for LIN transceiver
Ground for analog blocks (low noise)
Ground for digital blocks of SBC
Ground for MCU
Ground for SBC digital IOs
Connected to digital ground
Connection to external capacitor for 5V
(analog supply)
CAP_5V0 (3)
CAP_3V3 (3)
CAP_1V8 (3)
CAP_MCU (3)
CAP_CP (3)
30
34
33
35
56
Analog
Analog
Analog
Analog
Analog
In/Out
In/Out
In/Out
In/Out
In/Out
Connection to external capacitor for 3.3V
(MCU peripheral supply)
Connection to external capacitor for 1.8V
(SBC digital and MCU core supply)
Connection to external capacitor for MCU
1V8 core voltage supply
Connection to external capacitor for the
charge pump
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ZAMC4100 Datasheet
Pin Name
Position
Purpose
Mode
Description
SENSORS INTERFACE
S_P
29
26
28
27
Analog
Analog
Analog
Analog
Output
Output
Input
Positive supply for sensors (5V)
Negative supply for sensors (0V)
General purpose ADC input
General purpose ADC input
S_N (4)
AIN1 (5)
AIN2 (5)
Input
General purpose ADC input/temperature
sensor input
AIN3/TEMP1 (5)
AIN4/TEMP2 (5)
23
25
Analog
Analog
In/Out
In/Out
General purpose ADC input/temperature
sensor input
ACTUATORS INTERFACE
HB1a
HB1b
HB2a
HB2b
HB3
13
Analog
Analog
Output
Output
Output of half-bridge driver 1
Output of half-bridge driver 2
3
1
16
61
21
6
Analog
Analog
Output
Output
Output of half-bridge driver 3
Output of half-bridge driver 4
HB4
HS1a
HS1b
HS2
Analog
Output
Output of high-side switch 1
10
9
Analog
Analog
Analog
Analog
Analog
Output
Output
Output
Output
Input
Output of high-side switch 2
Output of high-side switch 3
Output of high-side switch 4
Output for EC mirror control
Connection to external resistor for EC
HS3
14
57
59
60
HS4
EC_M
EC_RES
COMMUNICATION INTERFACE
LIN
55
44
43
42
41
40
39
38
37
Analog
Digital
Digital
Digital
Digital
Digital
Digital
Digital
Digital
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
In/Out
LIN bus
GPIO0 (5)
GPIO1 (5)
GPIO2 (5)
GPIO3 (5)
GPIO4 (5)
GPIO5 (5)
GPIO6 (5)
GPIO7 (5)
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
General purpose I/O pin
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ZAMC4100 Datasheet
Pin Name
Position
Purpose
Mode
Description
TEST INTERFACE
Global test enable pin; connect this pin to
GND in application
TEST
50
Digital
In
TRSTN
TCK
49
48
47
46
45
Digital
Digital
Digital
Digital
Digital
In
In
JTAG low-active reset
JTAG clock
TMS
TDO
TDI
In
JTAG mode select
JTAG data out pin
JTAG data in pin
Out
In
SBC test data out; leave this pin open in
the application
STO
n.c.
52
Digital
-
Out
-
18,19,
22,36,63
Not bonded package pins; connect them to
ground
(1)
The ground connections of the ZAMC4100 on the PCB should be separated into three specific planes for ground decoupling and
better noise immunity:
•
Analog ground: VSSA, S_N, CAP_5V0 (ground plate)
•
Digital ground: VSSD1, VSSD2, VSS_IO, VSS_LIN, CAP_3V3 (ground plate), CAP_1V8 (ground plate), CAP_MCU (ground
plate)
•
Power ground: VSS1 to 5
All three ground planes must be connected to pin 65 (ZAMC4100 exposed pad), which must be a single common GND point on
the PCB.
(2)
(3)
(4)
(5)
In the application, the exposed pad (pin 65) must be connected to ground.
Do not supply any external circuitry via these pins.
If the S_N pin is not used for supplying sensors, it must be connected to the GND rail on the PCB.
All unused ADC inputs (pins AIN1 to 4) and GPIO ports (pins GPIO0 to 7) can be left open or grounded for better EMI.
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ZAMC4100 Datasheet
8
ZAMC4100 Outline Dimensions: Plastic QFN64 9x9mm (Package Type 1)
Figure 8.1 ZAMC4100 Package Dimensions – Plastic QFN64
0ꢀ-ꢀ12o
49
48
64
1
+
NOTCHꢀ=ꢀPINꢀ1
0.18
0.23
0.30
0.5ꢀBSC
9.00
5.90
0.30
0.40
0.50
BSC
6.00
6.10
SQR
SQR
EXPOSEDꢀPAD
BOTTOMꢀVIEW
0.24
0.42
0.60
x4
16
17
33
32
0.60
0.65
0.2ꢀREF
0.24
0.42
0.60
x4
0.70
0.05ꢀMAX
0.80
0.85
0.90
SCALE
- DRAWING NOT TO SCALE
- ALL DIMENSIONS IN MILLIMETER
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ZAMC4100 Datasheet
9
Ordering Information
Product Sales Code
Description
Package
ZAMC4100GA2R
ZAMC4100GA2V
ZAMC4100GA PQFN64 – Temperature range: -40°C to +85°C
ZAMC4100GA PQFN64 – Temperature range: -40°C to +85°C
13” Tape and Reel
Tray
ZAMC4100 Evaluation Kit V2.0 including the ZAMC4100 Evaluation Board; software available at www.IDT.com/ZAMC4100
ZAMC4100 Application Kit V1.0 including the ZAMC4100 Application Board
10 Related Documents
Document
ZAMC4100 Feature Sheet
ZAMC4100 Evaluation Kit Description
ZAMC4100 Application Kit Description
Visit the ZAMC4100 product page at www.IDT.com/zamc4100 or contact your nearest sales office for the latest
version of these documents.
11 Glossary
Abbreviation Description
ADC
Analog-to-Digital Converter
ARM®
Cortex™-M0
CRC
Advanced RISC Machine (RISC = Reduced Instruction Set Computing)
32-bit RISC processor core licensed by ARM
Cyclic Redundancy Check
CS
Current Source
CSH
Current Source High-Side
CSL
Current Source Low-Side
CSN
Chip Select (Negative)
DAC
Digital to Analog Converter
DDM
Driver Door Module
ECC
Error Correction Controller
ECM
Electrochromatic Mirror
ECU
Electronic Control Unit
EEPROM
Electrically Erasable Programmable Read-Only Memory
Non-volatile memory that can be electrically erased and programmed. Usually where the program is
stored.
FLASH
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ZAMC4100 Datasheet
Abbreviation Description
FSR
Full-Scale Range
GND
GPIO
IC
Ground potential of the application
General Purpose Input Output interface
Integrated Circuit
IRQN
JTAG
LIN
Interrupt Request (Negative)
Based on IEEE 1149.1 Standard Test Access Port and Boundary-Scan Architecture
Local Interconnect Network
LIN Physical layer
LIN PHY
MCU
MOSI
MISO
MUX
NMI
Microcontroller Unit
Master Out Slave In
Master In Slave Out
Multiplexer
Non-maskable Interrupt
N-type MOSFET
NMOS
NVIC
OC
Nested Vector Interrupt Controller
Over-Current
OCH
OCL
Over-Current for High-Side Driver
Over-Current for Low-Side Driver
High frequency oscillator
Low frequency oscillator
Open Systems Interconnection
Over-Voltage
OSCH
OSCL
OSI
OV
OVL
Over-Load
OVT
Over-Temperature
PCB
Printed Circuit Board
POR
PWM
RESCODE
SAR
Power-On-Reset
Pulse-Width Modulation
Result Code from ADC
Successive Approximation
System Basis Chip
SBC
SPI
Serial Peripheral Interface
System-in-Package
SIP
SRAM
Static RAM (RAM = Random Access Memory)
© 2016 Integrated Device Technology, Inc.
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ZAMC4100 Datasheet
Abbreviation Description
SW-LIN
STBY
UART
UV
Software layer of the LIN protocol
Standby
Universal Asynchronous Receiver Transmitter
Under Voltage
VBAT
WDT
Battery supply
Watchdog Timer
12 Document Revision History
Revision
Date
Description
1.00
May 11, 2015
January 25, 2016
First release
Changed to IDT branding.
Corporate Headquarters
Sales
Tech Support
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
155
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