ZWIR4512_18 [IDT]
Secure Low-Power Wireless IPv6 Module;
| 型号： | ZWIR4512_18 |
| 厂家： | 
INTEGRATED DEVICE TECHNOLOGY |
| 描述： | Secure Low-Power Wireless IPv6 Module 无线 |
| 文件： | 总28页 (文件大小：1146K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZWIR4512
Datasheet
Secure Low-Power Wireless IPv6 Module
Hardware Features
Description
The ZWIR4512 enables secure low-power wireless IPv6 com-
munication for sensors and small devices. IDT provides a user-
programmable, royalty-free 6LoWPAN stack with mesh routing
capability with the ZWIR4512. 6LoWPAN is an Internet Engineering
Task Force (IETF) standard for building wireless, low-power IP-
based sensor, and device networks. These networks can easily be
integrated into existing IT infrastructure or operate autonomously.
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License-free 868/915MHz frequency bands
ARM® Cortex™-M3 32-bit microcontroller
192kB flash and 32kB RAM for user applications
Unique EUI64 address
4 channels in EU mode; 10 channels in US mode
19 (ZWIR4512AC1) or 21 (ZWIR4512AC2) GPIOs with
multiplexed peripheral functions:
Secure communication is provided by standard-compliant imple-
mentations of the Internet Protocol Security (IPSec) protocol suite
and the Internet Key Exchange Protocol version 2 (IKEv2), which
enable highly secure end-to-end communication, including over
unsecure network nodes.
2 x UART, SPI, 3 x ADC, 2 x DAC, 11 x PWM, USB, CAN,
I2C, 8 x timer
Several 5V tolerant I/Os available
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Low current consumption: 3.5µA in Standby Mode; 10.5mA in
Receive Mode; 16.0mA in Transmit Mode at 0dBm
The module is powered by an ARM® Cortex™-M3 (ARM, Ltd.
trademark) microcontroller and provides a rich set of GPIO and
peripheral interfaces. Up to 192kB of flash and 32kB of RAM are
available for applications. Different low power modes are provided
to save energy in battery-operated devices. The modules provide
superior radio properties without the need for complicated external
RF design.
Modulation schemes
BPSK (20kBps EU, 40kBps US)
O-QPSK (100kBps EU, 250kBps US)
Receiver sensitivity: up to -110dBm
TX output power: up to 10dBm (US Mode)
Uniquely simple programmability
Standard-compliant security solution
No need for external microcontroller
Plug-and-play integration into local and wide-area networks
No RF design required
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Firmware Features
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Serial command interface with built-in security and over-the-
air update (OTAU) functionality
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Royalty-free library bundle for custom firmware: 6LoWPAN
communication library with mesh routing capability; IPSec and
IKEv2 security libraries; over-the-air update library; several
peripheral libraries
2D barcode label containing MAC address
Superior radio propagation
ETSI/FCC certified
Available Support
Supply voltage: 2.0V to 3.6V
Operating temperature: -40°C to +85°C
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Development Kit
30-pin edge-board contact package or 32-pin land grid array
package
Programming guide and application notes
Ethernet, USB and UART gateways
Free packet sniffer and example programs demonstrating
C-API usage
Typical ZWIR4512 Application Setup
.
Windows® (Microsoft Corp. trademark) and Linux® (Linus
Torvalds trademark) support tools
Specific Devices:
LAN
ZWIR45xx
Device
ZWIR45xx
Gateway
Typical Applications
.
The ZWIR4512 serves as a universal secure radio com-
munication module. Typical applications include home and
industry automation, health monitoring, smart metering /
smart grid applications, and keyless entry systems.
Off-the-Shelf
Components:
LAN
Router
Cloud /
Internet
Handheld
Device
.
Its very low current consumption makes the module
suitable for battery-operated devices.
Computer
PAN WAN
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ZWIR4512 Datasheet
Stack Architecture
ZWIR4512 Functional Block Diagram
RF – Transceiver
Microcontroller
UART
ADC
DAC
SPI
USB
CAN
I2C
ARM®
Cortex -M3
TIM
PWM
General Purpose & Peripheral IO
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ZWIR4512 Datasheet
Contents
1. Pin Assignments...........................................................................................................................................................................................5
2. Pin Descriptions............................................................................................................................................................................................6
3. Absolute Maximum Ratings........................................................................................................................................................................11
3.1 Absolute Maximum Voltage Characteristics ......................................................................................................................................11
3.2 Absolute Maximum Current Characteristics ......................................................................................................................................11
3.3 Absolute Maximum Thermal Characteristics .....................................................................................................................................11
4. Electrical Characteristics ............................................................................................................................................................................12
4.1 General Operating Conditions...........................................................................................................................................................12
4.2 Current Consumption per Operating Mode........................................................................................................................................13
5. Module Description.....................................................................................................................................................................................14
5.1 Radio Transceiver .............................................................................................................................................................................14
5.2 Microcontroller...................................................................................................................................................................................14
5.2.1
5.2.2
5.2.3
MCU Core...........................................................................................................................................................................14
Peripherals and Interfaces..................................................................................................................................................14
Programming and Debugging.............................................................................................................................................14
5.3 Firmware............................................................................................................................................................................................15
5.3.1
5.3.2
Serial Command Interface (SCI) Firmware.........................................................................................................................15
C Application Programming Interface (C-API)....................................................................................................................15
5.4 Power Modes.....................................................................................................................................................................................15
5.4.1
5.4.2
5.4.3
5.4.4
Run Mode...........................................................................................................................................................................16
Sleep Mode ........................................................................................................................................................................16
Stop Mode ..........................................................................................................................................................................16
Standby Mode ....................................................................................................................................................................16
6. Application Circuits.....................................................................................................................................................................................17
6.1 Power Supply ....................................................................................................................................................................................17
6.2 Reset and Boot Select.......................................................................................................................................................................18
6.3 Debug Access ...................................................................................................................................................................................18
6.4 Antenna .............................................................................................................................................................................................18
7. Customization.............................................................................................................................................................................................19
8. Certification.................................................................................................................................................................................................19
8.1 European R&TTE Directive Statements ............................................................................................................................................19
8.2 Federal Communication Commission Certification Statements.........................................................................................................19
8.2.1
8.2.2
Statements .........................................................................................................................................................................19
Requirements .....................................................................................................................................................................19
8.3 Supported Antennas..........................................................................................................................................................................20
9. Related Third-Party Documents .................................................................................................................................................................20
10. Glossary .....................................................................................................................................................................................................20
11. Package Outline Drawings .........................................................................................................................................................................21
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ZWIR4512 Datasheet
11.1 ZWIR4512AC1 ..................................................................................................................................................................................21
11.2 ZWIR4512AC2 ..................................................................................................................................................................................21
12. Soldering Information .................................................................................................................................................................................21
13. Marking Diagram ........................................................................................................................................................................................22
13.1 ZWIR4512AC1 Package Marking Diagram .......................................................................................................................................22
13.2 ZWIR4512AC2 Package Marking Diagram .......................................................................................................................................22
14. Ordering Information...................................................................................................................................................................................23
15. Revision History..........................................................................................................................................................................................24
List of Figures
Figure 1.1 ZWIR4512ACx Pinout ......................................................................................................................................................................5
Figure 6.1 Power Supply Schemes .................................................................................................................................................................17
Figure 6.2 External Circuitry for /RESET and BSEL........................................................................................................................................18
Figure 6.3 JTAG / SWD Connection for Programming and Debugging...........................................................................................................18
Figure 8.1 FCC Compliance Statement to be Printed on Equipment Incorporating ZWIR4512 Devices.........................................................20
Figure 12.1 Recommended Temperature Profile for Reflow Soldering (according to J-STD-020D) .................................................................22
List of Tables
Table 2.1 ZWIR4512ACx Pin Description ........................................................................................................................................................6
Table 2.2 ZWIR4512ACx GPIO Remapping ....................................................................................................................................................8
Table 2.3 ZWIR4512ACx GPIO Function Overview.........................................................................................................................................9
Table 5.1 Power Modes Overview..................................................................................................................................................................15
Table 6.1 External Power Supply Components..............................................................................................................................................17
Table 12.1 Soldering Profile Parameters (according to J-STD-020D)..............................................................................................................21
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ZWIR4512 Datasheet
1. Pin Assignments
The ZWIR4512 GPIO pins have different functionalities, controllable by software. The most commonly used functions available on each pin are
listed in Table 2.1. Furthermore, the GPIO peripheral functions are shown as an overview in Table 2.3. The full list of available functions of each
pin can be obtained from the STM32F103xC Datasheet.
Some peripheral I/O functions are available through different pins. The default GPIO pin for each peripheral function is marked with an in
Table 2.3. When it is possible to remap a peripheral function to another module pin, this is marked with a letter. The corresponding remapping
function is described in Table 2.2.
There are two variations on the package: ZWIR4512AC1 (30 pins) and ZWIR4512AC2 (32 pins). See Figure 1.1 for the pin layout.
Figure 1.1 ZWIR4512ACx Pinout
ZWIR4512AC1
ZWIR4512AC2
30 29 28 27 26 25
32 31 30 29 28 27
1
2
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
24
23
22
21
20
19
18
17
16
3
4
5
6
7
8
9
10
11 12 13 14 15 16
10 11 12 13 14 15
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ZWIR4512 Datasheet
2. Pin Descriptions
Table 2.1 ZWIR4512ACx Pin Description
Pins
Name
MCU Port Type[a]
5V
API Function [b], [c]
SCI Function [c], [d]
ZWIR4512AC1 ZWIR4512AC2
1
2
3
4
1
2
3
4
GPIO7
PA7
PA6
PA5
PA4
IO
IO
IO
IO
GPIO
SPI – MOSI
SPI1 – MOSI
ADC1 / ADC2 – channel 7
PWM
GPIO6
GPIO5
GPIO4
GPIO
SPI – MISO
SPI – SCK
SPI1 – MISO
ADC1 / ADC2 – channel 6
PWM
GPIO
SPI1 – SCK
DAC – OUT2
ADC1 / ADC2 – channel 5
GPIO
SPI – NSS
SPI1 – NSS
GPIO
USART2 – CK
DAC – OUT1
ADC1 / ADC2 – channel 4
5
6
7
8
5
6
7
8
GPIO3
GPIO2
GPIO1
GPIO0
PA3
PA2
PA1
IO
IO
IO
IO
GPIO
UART2 – RX
USART2 – RX
GPIO
ADC1 / ADC2 / ADC3 – channel 3
PWM
GPIO
UART2 – TX
USART2 – TX
ADC1 / ADC2 / ADC3 – channel 2
PWM
GPIO
GPIO
USART2 – RTS
UART2 - RTS
ADC1 / ADC2 / ADC3 – channel 1
PWM
PA0-
GPIO
GPIO
WKUP
WKUP
UART2 CTS
USART2 – CTS
ADC1 / ADC2 / ADC3 – channel 0
PWM
9
9
GPIO12
PC13
IO
GPIO
GPIO
TAMPER-RTC
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ZWIR4512 Datasheet
Pins
Name
VSTDBY
/RESET
GND
MCU Port Type[a]
5V
API Function [b], [c]
SCI Function [c], [d]
ZWIR4512AC1 ZWIR4512AC2
18
10
11
12
10
11
12
13
VBAT
NRST
GND
S
I
Alternative Standby Mode power supply
Reset
S
IO
Ground
GPIO9
PA10
GPIO
UART1 – RX
USART1 – RX
PWM
GPIO
13
14
GPIO8
PA9
IO
GPIO
UART1 – TX
USART1 – TX
PWM
GPIO
14
15
15
16
17
VCC
BSEL
VCC
BOOT0
PC14
S
I
Power supply
Boot mode selection
n/a
GPIO15
IO
GPIO
GPIO
GPIO
OSC32 – IN
n/a
16
18
19
GPIO16
GPIO10
PC15
PA11
IO
IO
GPIO
OSC32 – OUT
GPIO
GPIO
USART1 – CTS
USB – D-
CAN – RX
PWM
UART1 – CTS
17
19
20
21
GPIO11
TDO
PA12
PB3
IO
IO
GPIO
GPIO
USART1 – RTS
USB – D+
UART1 – RTS
CAN – TX
Timer Trigger (TIM1)
JTAG – TDO
GPIO
PWM
20
21
22
23
22
23
24
25
TMS
TDI
PA13
PA15
PA14
PB7
IO
IO
IO
IO
JTAG – TMS, SWDIO
GPIO
GPIO
GPIO
GPIO
GPIO
JTAG – TDI
GPIO
TCK
JTAG – TCK, SWCLK
GPIO
GPIO14
GPIO
I2C – SDA
UART1 – RX
PWM
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ZWIR4512 Datasheet
Pins
Name
MCU Port Type[a]
5V
API Function [b], [c]
SCI Function [c], [d]
ZWIR4512AC1 ZWIR4512AC2
24
26
GPIO13
PB6
IO
GPIO
GPIO
I2C-SCL
UART1 – TX
PWM
25
26
27
28
DIG1
–
–
O
O
Unused, leave unconnected
PACTLN
PA control (differential) complementary output, leave unconnected if
unused
27
28
29
30
29
30
31
32
PACTLP
GND
–
O
S
PA control (differential), leave unconnected if unused
GND
–
Ground
ANT
IO
S
Antenna pin
Ground
GND
GND
[a] The “Type” column indicates the type of the pin: IO = input/output, I = input only, O = output only, S = power supply.
[b] The listed functionalities include only the most important functionalities – please refer to the STM32F103xC data sheet for a full list.
[c] Functions listed in italic letters are selected by default if the device is not reprogrammed. GPIOs are analog inputs by default.
[d] Any pin marked as GPIO can be configured as indicator for incoming or outgoing packets on network or serial interfaces.
Table 2.2 ZWIR4512ACx GPIO Remapping
Name
Peripheral
Pin
RX
Change
PA10 PB7
Required Action
Write 1BIN to AFIO_MAPR[2]
TX
PA9 PB6
PA12 Ø
PA11 Ø
Ø PA7
A
UART1
(See sections 8.3 and 8.4.2 of the STM32F103xx Reference
Manual.)
RTS
CTS
CH1N
Ch2
Ch1
TDI
B
C
Timer 1
Timer 2
Write 01BIN to AFIO_MAPR[11:10]
Write 01BIN to AFIO_MAPR[9:8]
PA1 PB3
PA0 PA15
PA15 Ø
PB3 Ø
D
E
JTAG
JTAG
Write 010BIN to AFIO_MAPR[26:24]
Write 100BIN to AFIO_MAPR[26:24]
TDO
TMS
TCK
TDI
PA13 Ø
PA14 Ø
PA15 Ø
PB3 Ø
TDO
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ZWIR4512 Datasheet
Table 2.3 ZWIR4512ACx GPIO Function Overview
Note: See important notes at the end of the table.
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
13
12
14
13
17
18
19
16
20
17
21
19
22
20
23
21
24
22
25
23
26
24
ZWIR4512AC2-Pin
–
–
ZWIR4512AC1-Pin
MCU – GPIO Port
A7
A6
A5
A4
A3
A2
A1
A0 C13 A10 A9 C14 C15 A11 A12 B3[a] A13[b] A15[a] A14[b] B7
B6
RX
TX
A
A
RTS
CTS
,A
,A
RX
TX
RTS
CTS
CK
MOSI
MISO
SCK
NSS
SDA
SCL
D-
D+
RX
TX
Standby Wakeup
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ZWIR4512 Datasheet
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
13
12
14
13
17
18
19
16
20
17
21
19
22
20
23
21
24
22
25
23
26
24
ZWIR4512AC2-Pin
ZWIR4512AC1-Pin
MCU – GPIO Port
–
–
A7
B
A6
A5
A4
A3
A2
A1
A0 C13 A10 A9 C14 C15 A11 A12 B3[a] A13[b] A15[a] A14[b] B7
B6
T1 - Ch1N
T1 - Ch2
T1 - Ch3
T1 - Ch4
T2 - Ch1
T2 - Ch2
T2 - Ch3
T2 - Ch4
T3 - Ch1
T3 - Ch2
T4 - Ch1
T4 - Ch2
T5 - Ch1
T5 - Ch2
T5 - Ch3
T5 - Ch4
,B
,B
,B
C[a]
C[a]
,C
,C
Ch0
Ch1
Ch2
Ch3
Ch4
Ch5
Ch6
Ch7
DAC1
DAC2
TMS
TCK
TDI
[c]
[c]
[c]
TDO
[c]
SWDIO
,D [d]
SWDCLK
,D [d]
[a] GPIO or peripheral functionality of this port is only available with remap function D or E active.
[b] GPIO functionality of this port is only available with remap function E active.
[c] JTAG functionality is only available when remap functions D and E are inactive.
[d] SWD functionality is only available when remap function E is inactive.
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ZWIR4512 Datasheet
3. Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. The device might not function or be operable above the operating conditions. Stresses
exceeding the absolute maximum ratings might also damage the device. In addition, extended exposure to stresses above the operating
conditions might affect device reliability. IDT does not recommend designing to the “Absolute Maximum Ratings.”
3.1 Absolute Maximum Voltage Characteristics
Parameter
Symbol
VCC
Min
-0.3
-0.3
-0.3
-0.3
Max
Unit
V
Main supply voltage
4
4
Backup supply voltage
VBAT
V
Input voltage at 5V-tolerant GPIO pin
Input voltage at any other GPIO pin
5.5
V
VGPIO
VCC+0.3
V
3.2 Absolute Maximum Current Characteristics
Parameter
Maximum total current consumption
Symbol
IVCC
Max
175
±25
8
Unit
mA
mA
mA
Driving strength of each GPIOx pin
IGPIO
Driving strength of RF-control pins (PACTLN, PACTLP, DIG1)
IRFCTRL
3.3 Absolute Maximum Thermal Characteristics
Parameter
Symbol
TSTOR
TAMB
Value
Unit
°C
Storage temperature range
Ambient temperature range
-40 to +125
-40 to +85
°C
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ZWIR4512 Datasheet
4. Electrical Characteristics
4.1 General Operating Conditions
Note: See important notes at the end of the table.
Parameter
Electrical Characteristics
Main supply voltage – ADC not used
Main supply voltage – ADC used
Backup supply voltage
Symbol
Min
Typ
Max
Unit
VCC
VCC
VBKUP
VIH
2.0
2.4
3.6
3.6
3.6
V
V
V
V
V
V
V
1.8
Digital I/O high level input voltage
Digital I/O low level input voltage
Digital I/O high level output voltage
Digital I/O low level output voltage
MCU Clock Characteristics
MCU core clock frequency [a]
MCU core clock frequency accuracy range
MCU peripheral bus 1 clock frequency [b]
MCU peripheral bus 2 clock frequency [b]
RF Parameters
VCC – 0.4
VIL
0.4
0.4
VOH
VOL
VCC – 0.4
fAHB
∆fAHB
fAPB1
fAPB2
8
64
MHz
%
-2
2.5
4
8
MHz
MHz
Frequency range
fRF
865
-11
-3
928
10
MHz
dBm
dB
Output power [c]
Output power tolerance
+3
BPSK, EU Mode
-110
-108
-101
-101
20
dBm
BPSK, US Mode
Receiver sensitivity
QPSK, EU Mode
QPSK, US Mode
BPSK, EU Mode
BPSK, US Mode
Gross data rate
40
kBit/s
MHz
QPSK, EU Mode
100
250
1
QPSK, US Mode
EU Mode
Channel spacing
US Mode
2
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ZWIR4512 Datasheet
Parameter
EU Mode [d]
US Mode
Symbol
Min
Typ
1 (+3)
10
Max
Unit
Number of channels
Input/output impedance
Frequency offset
50
Ω
-10
+10
kHz
[a] The fCORE clock can be configured to be 8, 16, 32, or 64 MHz. After reset, the clock is set to 8MHz.
[b] fAPB1 and fAPB2 are derived from fAHB. Therefore, the same tolerances apply to these clocks.
[c] 10dBm output power is only available in US Mode; EU Mode provides 5dBm maximum output power.
[d] The IEEE802.15.4 standard defines only 1 channel for EU Mode, but extension channels are available in almost all EU countries.
4.2 Current Consumption per Operating Mode
Operating Mode
Condition
Typ [a]
10.5
16.1
15.5
23.4
22.8
14.9
14.2
18.0
17.3
24.0
23.4
0.7
Unit
Receiver active
Transmitter active, EU frequency band, BPSK, 0dBm
Transmitter active, EU frequency band, QPSK, 0dBm
Transmitter active, EU frequency band, BPSK, 5dBm
Transmitter active, EU frequency band, QPSK, 5dBm
Transmitter active, US frequency band, BPSK, 0dBm
Transmitter active, US frequency band, QPSK, 0dBm
Transmitter active, US frequency band, BPSK, 5dBm
Transmitter active, US frequency band, QPSK, 5dBm
Transmitter active, US frequency band, BPSK, 10dBm
Transmitter active, US frequency band, QPSK, 10dBm
TRX Off
Run Mode
mA
Stop Mode
TRX Off, RTC running
26.5
3.5
µA
µA
Standby Mode
TRX Off, RTC running
[a] Current consumption values refer to devices operating at 25°C with network stack library version 1.9 and an application that does not generate
a workload on the MCU.
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ZWIR4512 Datasheet
5. Module Description
The ZWIR4512 is a programmable wireless IPv6 communication module. Communication is based on 6LoWPAN, a free and open com-
munication standard developed by the Internet Engineering Task Force (IETF). This standard specifies how to transmit IPv6 (Internet Protocol
Version 6) packets over low-power wireless personal area networks.
ZWIR4512 modules are available with a preprogrammed command interface, allowing modem-like communication based on simple commands
sent over a serial interface. Alternatively, the module is freely programmable on the basis of an application programming interface (API) that
exposes abstract communication functionality to the programmer.
Both software options offer secure communication on the basis of the IP Security (IPSec) protocol suite. Additionally, an implementation of the
Internet Key Exchange Protocol version 2 (IKEv2) is provided, in order to make key management as easy as possible. IPSec and IKEv2 are
the mandated standards for securing IPv6 networks. Refer to ZWIR45xx Application Note—Using IPSec and IKEv2 in 6LoWPANs for more
detailed information about IPSec and IKEv2.
The module comprises an STM32F103RC ARM® Cortex™-M3 microcontroller from ST Microelectronics and a ZWIR4502 transceiver from IDT.
These components ensure leading-edge performance values at very low power consumption. The module provides a hardware-programmed
64-bit MAC address that is guaranteed to be globally unique.
5.1 Radio Transceiver
The module includes IDT’s ZWIR4502 radio transceiver. This circuit performs modulation and demodulation of outgoing and incoming data,
respectively. The modulation scheme is configurable according to the IEEE802.15.4 standard. The radio transceiver is never accessed directly
by application code. This task is performed by the communication stack, which encapsulates such low-level functionality in abstract functions.
5.2 Microcontroller
The protocol stack and the user application are executed on an STM32F103RC microcontroller (MCU) from ST Microelectronics. It provides
256kB flash and 48kB SRAM memory. The MCU provides a rich set of peripherals and a number of general purpose input/output (GPIO) ports.
The GPIO ports of the module are directly connected to the GPIOs of the MCU. Refer to Table 2.1 for an exact mapping.
5.2.1 MCU Core
The MCU core is an ARM® Cortex™-M3. This is a 32-bit RISC core with a performance of 1.25 DMIPS/MHz. Using IDT’s software stack, the
maximum operating frequency is 64MHz. This allows for computational intensive applications. In order to save power, the core can be shut off
completely, waking up only on external activity.
5.2.2 Peripherals and Interfaces
The module was designed to make maximum use of the controller’s internal peripherals. Up to 21 digital general purpose I/Os can be used by
the application. Most of these I/Os have alternative functions. Some of them are 5V-tolerant. Table 2.1 shows the most commonly used functions
available for each interface. Table 2.3 shows all functionalities on a single page, indicating which peripherals must not be used in parallel as
their GPIOs are interfering.
In addition to communication interfaces, the module also provides signal conversion peripherals. Three analog-to-digital converters (ADCs),
two digital-to-analog converters (DACs), and two pulse-width modulation (PWM) peripherals are available.
5.2.3 Programming and Debugging
Programming and debugging the module is typically done via JTAG. All required MCU ports are connected to module pins for that purpose.
Alternatively, Serial Wire Debug (SWD) can be used for programming and debugging. This requires just two pins that must be reserved,
providing two additional GPIO pins.
Alternatively, if debug functionality is not required, it is possible to program the module over a two-wire UART interface. For that purpose, the
MCU’s internal boot-loader must be started. This is done by holding the BSEL pin of the module high while a reset is performed or the module
is powered on. Refer to the MCU documentation for more information about serial programming.
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5.3 Firmware
5.3.1 Serial Command Interface (SCI) Firmware
A module programmed with the Serial Command Interface firmware acts as a network processor. In this configuration, the module is controlled
over a serial interface that is SPI, USB, or one of the two UARTs. The SCI firmware provides all standard communication functions for data
transmission and reception, as well as all security functions and over-the-air update (OTAU) functionality. Access to internal peripherals is
limited to digital control of the GPIO pins. Typically, an external microcontroller or a PC is required to control module operation. However, for
simple sensing or acting applications, it is also possible to configure the module to run autonomously without the need for an external controller.
Refer to the ZWIR45xx Serial Command Interface Manual for further information.
5.3.2 C Application Programming Interface (C-API)
A C-API is provided for applications that should run directly on the embedded microcontroller. Communication and security functionalities are
encapsulated in a set of libraries that export functions for accessing and controlling them. The library architecture is modular, allowing tailoring
applications to user needs. Applications running on the microcontroller can make use of the rich set of peripherals that are provided by the
controller.
Depending on the library configuration, there are up to 192kB of flash and 32kB of RAM available for the user application. This is sufficient even
for complex applications with high memory needs. If over-the-air update (OTAU) functionality is required, the amount of flash available for user
applications is reduced to one half. For further information on C-API programming and OTAU, refer to the ZWIR451x Programming Guide and
the ZWIR45xx Over-the-Air Update Manual.
5.4 Power Modes
The ZWIR4512 module provides a set of operating modes with different capabilities and power requirements. This document only highlights
the main features of these operating modes. Table 5.1 gives an overview of the characteristics of the available power modes. See section 4.2
for a table of typical current consumption in the different modes.
Refer to the ZWIR451x Programming Guide for detailed usage instructions for the low-power modes.
Table 5.1 Power Modes Overview
Wakeup
Source
Clock
Mode
Run
Time
MCU Core
Peripherals
On [b]
Context [a]
Retained
Retained
Retained
I/O
Transceiver
On [c]
On
Off
Off
As configured
As configured
As configured
Sleep
Stop
Any IRQ
RTC IRQ
1.8µs
5.4µs
Off [d]
Off [d]
Off
Off [d]
External IRQ
Standby
RTC IRQ
50µs
Off
Off
Lost
Analog input
Off
Wakeup pin
[a] Refers to the status of the RAM and peripheral register contents after wakeup – the backup registers of the MCU are always available.
[b] Clock is enabled for all peripherals that have been enabled by application code and all peripherals that are used by the library.
[c] Can be powered off by application code.
[d] Remains if peripheral/transceiver is selected as wakeup source.
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5.4.1 Run Mode
In Run Mode, all functions of the module are available. The microcontroller and all its peripherals are powered. Typically the transceiver is also
powered, but it can be disabled by software. The module enters Run Mode automatically after startup. The application software must switch to
one of the other operating modes if required.
5.4.2 Sleep Mode
In Sleep Mode, the microcontroller core is not clocked. The power state of the transceiver and the microcontroller peripherals depends on the
wakeup configuration. All peripherals that are selected as a wakeup source continue to operate. After wakeup, the application program continues
execution at the position it was stopped. Sleep Mode allows reacting to external events such as the reception of data, external interrupts, or
timer events. The power consumption in this mode strongly depends on which peripherals are enabled. The I/O configuration is not changed
during Sleep Mode.
5.4.3 Stop Mode
Stop Mode is an ultra-low-power mode with RAM retention. The MCU core and the MCU peripherals are not clocked. Only the internal real-
time clock or any external pin can be used for triggering wakeup from Stop Mode. After wakeup, the program continues execution at the position
it was stopped. In Stop Mode, all I/Os remain in the configuration that was active when entering Stop Mode.
5.4.4 Standby Mode
Standby Mode is the lowest power mode. The transceiver and all microcontroller peripherals are consequently powered off. RAM contents are
lost. Waking up from Standby Mode can be triggered by a real-time-timer event or by one dedicated pin. When going to Standby Mode, all I/Os
are put into analog input mode, so the application circuit must ensure that external components receive defined signal levels if required. When
the module exits Standby Mode, it is restarted from the reset handler in the same sequence as the restart after power-on or after the reset
button has been pressed.
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6. Application Circuits
ZWIR4512 modules are designed to require minimal external circuitry. The following sections illustrate how modules must be connected in
order to ensure proper power supply, reset behavior, programmability, and radio performance. Instructions for the connection of GPIO pins are
not given.
6.1 Power Supply
All internal components of the ZWIR4512 that require a stable power supply are internally decoupled with a number of capacitors. Nevertheless,
the module requires one external decoupling capacitor between VCC and GND. This is the minimal external circuitry required for proper
operation.
The module provides two different power supply pins: VCC and VSTDBY. VCC is the normal supply voltage that must be applied in Run, Sleep,
or Stop Mode. During Standby Mode, the module is powered by VSTDBY and VCC can be switched off.
Figure 6.1 shows two possible power supply schemes. Scheme a) connects VSTDBY to the same voltage source as VCC. This is the commonly
used configuration. However, scheme b) allows switching off VCC in Standby Mode. This can help reduce power dissipation in applications with
ultra-low power requirements. During the complete standby phase, VSTDBY is powered from a buffering capacitor.
Figure 6.1 Power Supply Schemes
a) Without Separate Standby Supply
b) With Capacitor Based Standby Supply
VSTDBY
VSTDBY
R1
D1
C2
VCC
VCC
v
v
C1
C1
GND
GND
Table 6.1 External Power Supply Components
Symbol
C1
Function
Value/Comment
Decoupling capacitor
Mandatory, 10µF
6.8kΩ
R1
Charge current limitation
D1
Buffering capacitor discharge protection
Buffering capacitor
Schottky diode; e.g., BAT54-02V
0.1µF
C2
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6.2 Reset and Boot Select
The /RESET pin is de-bounced and has a pull-up resistor on the PCB. Thus, a push-button can be connected directly to GND or the pin can be
left unconnected if it is not required. The boot select pin (BSEL) is pulled down internally. If BSEL is not required, it can be left unconnected.
Figure 6.2 shows how these pins are connected externally and illustrates the internal circuitry.
Figure 6.2 External Circuitry for /RESET and BSEL
VCC
VCC
/RESET
BSEL
GND
GND
6.3 Debug Access
The ZWIR4512 provides debug access by means of a JTAG or SWD interface. Figure 6.3 shows an example of connecting the module with a
20-pin standard ARM® JTAG header. If no JTAG connection is required, the dashed-line connections can be left out and two additional pins
are available as GPIOs.
Figure 6.3 JTAG / SWD Connection for Programming and Debugging
VCC
TDI
1
3
2
4
5
6
TMS
7
8
9
10
12
14
16
18
20
TCK
11
13
15
17
19
TDO
/RESET
GND
20 pin ARM
JTAG Header
6.4 Antenna
There are two options to connect an external antenna. The antenna can be connected to the module using a coaxial cable that is mounted on
the U.FL connector, or an external antenna terminal on the host PCB can be connected to the ANT pin. If the on-board U.FL connector is used,
the ANT pin must be left unconnected. An external antenna must be connected with a 50Ω microstrip wire.
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7. Customization
For larger order quantities, it is possible to deliver modules with preprogrammed customer firmware. Depending on the quantity and user
requirements, hardware customization to fit customer needs might be possible. Contact IDT’s support team for requests regarding module
customization.
8. Certification
8.1 European R&TTE Directive Statements
The ZWIR4512 module has been tested and found to comply with Annex IV of the R&TTE Directive 1999/5/EC and is subject to a notified body
opinion. The module has been approved for antennas with gains of 4dBi or less.
8.2 Federal Communication Commission Certification Statements
8.2.1 Statements
This equipment has been tested and found to comply with the limits for a Class B Digital Device, pursuant to Part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses,
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:
.
.
.
.
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from where the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Modifications not expressly approved by IDT could void the user's authority to operate the equipment.
The internal/external antennas used for this mobile transmitter must provide a separation distance of at least 20cm from all persons and must
not be co-located or operating in conjunction with any other antenna or transmitter.
8.2.2 Requirements
The ZWIR4512 complies with Part 15 of the FCC rules and regulations. In order to retain compliance with the FCC certification requirements,
the following conditions must be met:
Modules must be installed by original equipment manufacturers (OEM) only.
The module must only be operated with antennas adhering to the requirements defined in section 8.3.
The OEM must place a clearly visible text label on the outside of the end-product containing the text shown in Figure 8.1.
IMPORTANT: The compliance statement as shown in Figure 8.1 must be used without modifications for both ZWIR4512 product versions as
the FCC ID covers the ZWIR4512AC1 and the ZWIR4512AC2!
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ZWIR4512 Datasheet
Figure 8.1 FCC Compliance Statement to be Printed on Equipment Incorporating ZWIR4512 Devices
Contains FCC ID: COR-ZWIR4512AC1
This device complies with part 15 of the FCC Rules. Operation is
subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
8.3 Supported Antennas
The FCC compliance testing of the ZWIR4512 has been carried out using the MEXE902RPSM antenna from PCTEL Inc. This antenna has an
omnidirectional radiation pattern at an antenna gain of 2dBi. In order to be allowed to use the module without re-certification, the product
incorporating the ZWIR4512 module must either use the antenna mentioned above or must use an antenna with an omnidirectional radiation
pattern and a gain less than or equal to 2dBi.
9. Related Third-Party Documents
Visit the ZWIR4512 product page www.IDT.com/ZWIR4512 for IDT’s related documents.
The following related documents are available from third-parties:
Document
Related Website
STM32F103xC Data Sheet
STM32F103xx Reference Manual
www.st.com
www.st.com
10. Glossary
Term
Description
6LoWPAN
ADC
API
IPv6 over Low Power Wireless Personal Area Networks
Analog-to-Digital Converter
Application Programming Interface
Command Interface
CI
DAC
GPIO
IPv6
Digital-to-Analog Converter
General Purpose Input/Output
Internet Protocol Version 6
Joint Test Access Group
JTAG
MCU
OTAU
PCB
Microcontroller (STM32F103RC)
Over-the-Air Update
Printed Circuit Board
PWM
SWD
TRX
Pulse-Width Modulation
Serial Wire Debug
Transceiver (ZWIR4502)
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ZWIR4512 Datasheet
11. Package Outline Drawings
11.1 ZWIR4512AC1
The package outline drawings for the ZWIR4512AC1 parts are appended at the end of this document. The package information is the most
current data available.
11.2 ZWIR4512AC2
The package outline drawings for the ZWIR4512AC2 parts are appended at the end of this document and are accessible from the link below.
The package information is the most current data available.
https://www.idt.com/document/psc/zwir4512-package-outline-drawing-149-x-229-x-365-mm-body-20mm-pitch-mod0
12. Soldering Information
To ensure that soldered connections do not break during the reflow soldering process of the application PCB, the soldering profile described in
Table 12.1 and Figure 12.1 must be maintained. This profile is aligned with the profile defined in the IPC/JEDEC standard J-STD-020D.
Table 12.1 Soldering Profile Parameters (according to J-STD-020D)
Profile Feature
Symbol
Min
Max
8
Unit
min
°C
Time 25°C to TP
tH
Peak package body temperature
Preheat / Soak
TP
260
Soak temperature
Soak time
TS
tS
100
60
150
120
°C
s
Ramp-up
Ramp-up rate
TL to TP
3
°C/s
Time maintained above TL
Time within 5°C of TP
Ramp-down
tL
150
30
s
s
tP
Ramp-down rate
TP to TL
6
°C/s
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ZWIR4512 Datasheet
Figure 12.1 Recommended Temperature Profile for Reflow Soldering (according to J-STD-020D)
TP
TP-5°C
tP
TL
TSmax
TSmin
tL
tS
tH
Time
13. Marking Diagram
13.1 ZWIR4512AC1 Package Marking Diagram
Line 1 is the part number
Line 2 is the device MAC address
Line 3 is the device MAC address
13.2 ZWIR4512AC2 Package Marking Diagram
Line 1 is the part number
Line 2 is the device MAC address
Line 3 is the device MAC address
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ZWIR4512 Datasheet
14. Ordering Information
Orderable Part Number
Description and Package
MSL Rating
Carrier Type
Temperature
ZWIR4512AC1RA
30 pin SMT, 27.9 mm x 16.5 mm, unprogrammed
module for user application programs
MSL 3
Reel of 500
-40°C to +85°C
ZWIR4512AC1WA
ZWIR4512AC1RI
ZWIR4512AC1WI
ZWIR4512AC1RC
ZWIR4512AC1WC
ZWIR4512AC2RA
30 pin SMT, 27.9 mm x 16.5 mm, unprogrammed
module for user application programs
MSL 3
MSL 3
MSL 3
MSL 3
MSL 3
MSL 3
Reel of 100
Reel of 500
Reel of 100
Reel of 500
Reel of 100
Reel of 500
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
30 pin SMT, 27.9 mm x 16.5 mm, preprogrammed
module with serial command interface
30 pin SMT, 27.9 mm x 16.5 mm, preprogrammed
module with serial command interface
30 pin SMT, 27.9 mm x 16.5 mm, custom program
module
30 pin SMT, 27.9 mm x 16.5 mm, custom program
module
32 pin LGA, 23.1 mm x 15.1 mm, unprogrammed module
for user application programs
ZWIR4512AC2WA
32 pin LGA, 23.1 mm x 15.1 mm, unprogrammed module
for user application programs
MSL 3
Reel of 100
-40°C to +85°C
ZWIR4512AC2RI
ZWIR4512AC2WI
ZWIR4512DEVKITV2
32 pin LGA, 23.1 mm x 15.1 mm, preprogrammed
module with serial command interface
MSL 3
MSL 3
Reel of 500
Reel of 100
-40°C to +85°C
-40°C to +85°C
32 pin LGA, 23.1 mm x 15.1 mm, preprogrammed
module with serial command interface
ZWIR4512 Development Kit , includes 3 development boards, 3 antennas, 3 USB cables, 3 battery cables,
2 batteries
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ZWIR4512 Datasheet
15. Revision History
Revision
Date
Description
November 29, 2018
.
.
.
.
Update for IDT template.
Update for package drawings.
Minor edits.
Update for ordering codes.
January 25, 2016
Changed to IDT branding. Revision reference is now the revision date.
1.30
1.20
September 7, 2015
.
Updated module dimensions.
.
.
Fixed interchanged timer channels in remap function C.
Update for contact information and “Related Documents” section.
July 28, 2014
.
.
.
Updated power consumption figures with values for low-power enabled network stack.
New images, reflecting network stack changes.
Update for cover images and contacts. Conversion to US letter format.
1.10
1.00
January 24, 2014
April 15, 2013
.
.
Correction for interchanged USB and CAN pins in GPIO functional overview table.
Correction for interchanged pins in GPIO remapping table (Table 2.2).
First release of document.
Corporate Headquarters
Sales
Tech Support
www.IDT.com/go/support
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at an y time,
without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
way when installed in customer products. The information contained herein is provided without representation or warranty of a ny kind, whether express or implied, including, but not limited to, the suitability
of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not
convey any license under intellectual property rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trade marks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2018 Integrated Device Technology, Inc.
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30-LGA, Package Outline Drawing
16.51 x 27.94 x 3.80 mm Body, 2.54 mm Pitch
JC30D1, PSC-4782-01, Rev 00, Page 1
© Integrated Device Technology, Inc.
30-LGA, Package Outline Drawing
16.51 x 27.94 x 3.80 mm Body, 2.54 mm Pitch
JC30D1, PSC-4782-01, Rev 00, Page 2
Package Revision History
Description
Date Created Rev No.
Oct 31, 2018
Rev 00
Initial Release
© Integrated Device Technology, Inc.
IDT
www.IDT.com
IDT
www.IDT.com
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