IN74HC125AD

更新时间:2024-09-18 07:29:29
品牌:IKSEMICON
描述:Quad 3-State Noninverting Buffers

IN74HC125AD 概述

Quad 3-State Noninverting Buffers 四路三态同相缓冲器

IN74HC125AD 数据手册

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TECHNICAL DATA  
IN74HC125A  
Quad 3-State Noninverting Buffers  
The IN74HC125A is identical in pinout to the LS/ALS125. The device  
inputs are compatible with standard CMOS outputs; with pullup resistors,  
they are compatible with LS/ALSTTL outputs.  
The IN74HC125A noninverting buffers are designed to be used with 3-  
state memory address drivers, clock drivers, and other bus-oriented systems.  
The devices have four separate output enables that are active-low.  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2.0 to 6.0 V  
Low Input Current: 1.0 µA  
ORDERING INFORMATION  
IN74HC125AN Plastic  
High Noise Immunity Characteristic of CMOS Devices  
IN74HC125AD SOIC  
TA = -55° to 125° C for all packages  
LOGIC DIAGRAM  
PIN ASSIGNMENT  
FUNCTION TABLE  
Inputs  
OE  
Output  
A
H
L
Y
H
L
Z
PIN 14 =VCC  
PIN 7 = GND  
L
L
H
X
X = don’t care  
Z = high impedance  
Rev. 00  
IN74HC125A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
-0.5 to +7.0  
-1.5 to VCC +1.5  
-0.5 to VCC +0.5  
±20  
Unit  
V
VCC  
VIN  
VOUT  
IIN  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
V
V
mA  
mA  
mA  
mW  
IOUT  
ICC  
DC Output Current, per Pin  
±35  
DC Supply Current, VCC and GND Pins  
±75  
PD  
Power Dissipation in Still Air, Plastic DIP+  
SOIC Package+  
750  
500  
Tstg  
TL  
Storage Temperature  
-65 to +150  
260  
°C  
°C  
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP or SOIC Package)  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C  
SOIC Package: : - 7 mW/°C from 65° to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
VCC  
Parameter  
Min  
2.0  
0
Max  
Unit  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
6.0  
VCC  
VIN, VOUT  
TA  
V
-55  
+125  
°C  
ns  
tr, tf  
Input Rise and Fall Time (Figure 1)  
VCC =2.0 V  
VCC =4.5 V  
VCC =6.0 V  
0
0
0
1000  
500  
400  
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.  
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this  
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or  
V
OUT)VCC.  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused  
outputs must be left open.  
Rev. 00  
IN74HC125A  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
VCC  
V
Guaranteed Limit  
Symbol  
VIH  
Parameter  
Test Conditions  
Unit  
V
25 °C  
to  
85 125  
°C  
°C  
-55°C  
Minimum High-  
Level Input Voltage  
VOUT= VCC-0.1 V  
IOUT⎢≤ 20 µA  
2.0  
4.5  
6.0  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
VIL  
Maximum Low -  
Level Input Voltage  
VOUT=0.1 V  
IOUT⎢ ≤ 20 µA  
2.0  
4.5  
6.0  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
V
VOH  
Minimum High-  
Level Output Voltage  
VIN=VIH  
IOUT⎢ ≤ 20 µA  
2.0  
4.5  
6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
V
VIN=VIH  
4.5  
6.0  
3.98  
5.48  
3.84  
5.34  
3.7  
5.2  
IOUT⎢ ≤ 6.0 mA  
IOUT⎢ ≤ 7.8 mA  
VOL  
Maximum Low-  
Level Output Voltage  
VIN=VIL  
IOUT⎢ ≤ 20 µA  
2.0  
4.5  
6.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
VIN=VIL  
4.5  
6.0  
0.26  
0.26  
0.33  
0.33  
0.4  
0.4  
IOUT⎢ ≤ 6.0 mA  
IOUT⎢ ≤ 7.8 mA  
IIN  
Maximum Input  
Leakage Current  
VIN=VCC or GND  
6.0  
±0.1  
±1.0 ±1.0  
µA  
µA  
IOZ  
Maximum Three-  
State Leakage  
Current  
Output in High-Impedance  
State  
VIN=VIL or VIH  
VIN=VCC or GND  
6.0  
±0.5  
±5.0  
±10  
ICC  
Maximum Quiescent VIN=VCC or GND  
6.0  
4.0  
40  
160  
µA  
Supply Current  
(per Package)  
I
OUT=0µA  
Rev. 00  
IN74HC125A  
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)  
VCC  
V
Guaranteed Limit  
Symbol  
Parameter  
Unit  
ns  
25 °C  
to  
85°C 125°C  
-55°C  
tPLH, tPHL Maximum Propagation Delay, Input A to  
Output Y (Figures 1 and 3)  
2.0  
4.5  
6.0  
90  
18  
15  
115  
23  
135  
27  
20  
23  
tPLZ, tPHZ Maximum Propagation Delay, Output Enable toY  
(Figures 2 and 4)  
2.0  
4.5  
6.0  
120  
24  
20  
150  
30  
26  
180  
36  
31  
ns  
tPZL, tPZH Maximum Propagation Delay, Output Enable toY  
(Figures 2 and 4)  
2.0  
4.5  
6.0  
90  
18  
15  
115  
23  
20  
135  
27  
23  
ns  
tTLH, tTHL Maximum Output Transition Time, Any Output  
(Figures 1 and 3)  
2.0  
4.5  
6.0  
60  
12  
10  
75  
15  
13  
90  
18  
15  
ns  
CIN  
Maximum Input Capacitance  
-
-
10  
15  
10  
15  
10  
15  
pF  
pF  
COUT  
Maximum Three-State Output Capacitance  
(Output in High-Impedance State)  
Power Dissipation Capacitance (Per Buffer)  
Typical @25°C,VCC=5.0 V  
CPD  
Used to determine the no-load dynamic power  
consumption:  
45  
pF  
PD=CPDVCC2f+ICCVCC  
Figure 1. Switching Waveforms  
Figure 2. Switching Waveforms  
Rev. 00  
IN74HC125A  
Figure 3. Test Circuit  
Figure 4. Test Circuit  
EXPANDED LOGIC DIAGRAM  
(1/4 of the Device)  
Rev. 00  
IN74HC125A  
N SUFFIX PLASTIC DIP  
(MS - 001AA)  
A
Dimension, mm  
Symbol  
MIN  
18.67  
6.1  
MAX  
19.69  
7.11  
8
7
14  
1
B
A
B
C
D
F
5.33  
0.36  
1.14  
0.56  
F
L
1.78  
C
2.54  
7.62  
G
H
J
-T-  
SEATING  
PLANE  
N
0
°
10  
°
M
J
G
K
H
D
2.92  
7.62  
0.2  
3.81  
8.26  
0.36  
K
L
M
N
0.25 (0.010) M  
T
NOTES:  
1. Dimensions “A”, “B” do not include mold flash or protrusions.  
Maximum mold flash or protrusions 0.25 mm (0.010) per side.  
0.38  
D SUFFIX SOIC  
(MS - 012AB)  
Dimension, mm  
A
14  
8
Symbol  
MIN  
8.55  
3.8  
MAX  
8.75  
4
A
B
C
D
F
H
B
P
1.35  
0.33  
0.4  
1.75  
0.51  
1.27  
1
7
G
R x 45  
C
1.27  
5.27  
G
H
J
-T-  
SEATING  
PLANE  
K
M
D
J
F
0°  
8°  
0.25 (0.010) M  
T
M
C
0.1  
0.25  
0.25  
6.2  
K
M
P
NOTES:  
0.19  
5.8  
1. Dimensions A and B do not include mold flash or protrusion.  
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side  
0.25  
0.5  
R
for A; for B 0.25 mm (0.010) per side.  
Rev. 00  

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