IN74HCT245ADW

更新时间:2024-09-18 07:29:29
品牌:IKSEMICON
描述:Octal 3-State Noninverting Bus Transceiver High-Performance Silicon-Gate CMOS

IN74HCT245ADW 概述

Octal 3-State Noninverting Bus Transceiver High-Performance Silicon-Gate CMOS 八路三态同相总线收发器的高性能硅栅CMOS

IN74HCT245ADW 数据手册

通过下载IN74HCT245ADW数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
TECHNICAL DATA  
IN74HCT245A  
Octal 3-State Noninverting  
Bus Transceiver  
High-Performance Silicon-Gate CMOS  
The IN74HCT245A is identical in pinout to the LS/ALS245.This  
device may be used as a level converter for interfacing TTL or NMOS  
outputs to High Speed CMOS inputs.  
The IN74HCT245A is a 3-state noninverting transceiver that is used  
for 2-way asynchronous communication between data buses. The device  
has an active-low Output Enable pin, which is used to place the I/O ports  
into high-impedance states. The Direction control determines whether  
data flows from A to B or from B to A.  
ORDERING INFORMATION  
IN74HCT245AN Plastic  
IN74HCT245ADW SOIC  
IN74HCT245ATDS SOIC  
TA = -55° to 125° C for all packages  
TTL/NMOS Compatible Input Levels  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 4.5 to 5.5 V  
Low Input Current: 1.0 μA  
PIN ASSIGNMENT  
LOGIC DIAGRAM  
FUNCTION TABLE  
Control Inputs  
PIN 20=VCC  
Output  
Enable  
Direction  
Operation  
PIN 10 = GND  
L
L
H
L
Data Transmitted  
from Bus B to  
Bus A  
H
X
Data Transmitted  
from Bus A to  
Bus B  
Buses Isolated  
(High Impedance  
State)  
X = don’t care  
Rev. 00  
IN74HCT245A  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
-0.5 to +7.0  
-1.5 to VCC +1.5  
-0.5 to VCC +0.5  
±20  
Unit  
V
VCC  
VIN  
VOUT  
IIN  
DC Supply Voltage (Referenced to GND)  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
DC Input Current, per Pin  
V
V
mA  
mA  
mA  
mW  
IOUT  
ICC  
DC Output Current, per Pin  
±35  
DC Supply Current, VCC and GND Pins  
±75  
PD  
Power Dissipation in Still Air, Plastic DIP+  
SOIC Package+  
750  
500  
Tstg  
TL  
Storage Temperature  
-65 to +150  
260  
°C  
°C  
Lead Temperature, 1 mm from Case for 10 Seconds  
(Plastic DIP or SOIC Package)  
*Maximum Ratings are those values beyond which damage to the device may occur.  
Functional operation should be restricted to the Recommended Operating Conditions.  
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C  
SOIC Package: : - 7 mW/°C from 65° to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
VCC  
Parameter  
Min  
4.5  
0
Max  
5.5  
Unit  
V
DC Supply Voltage (Referenced to GND)  
DC Input Voltage, Output Voltage (Referenced to GND)  
Operating Temperature, All Package Types  
Input Rise and Fall Time (Figure 1)  
VIN, VOUT  
TA  
VCC  
+125  
500  
V
-55  
0
°C  
ns  
tr, tf  
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.  
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this  
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND(VIN or  
V
OUT)VCC.  
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused  
outputs must be left open.  
Rev. 00  
IN74HCT245A  
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)  
VCC  
V
Guaranteed Limit  
Symbol  
Parameter  
Test Conditions  
Unit  
25 °C  
to  
85 125  
°C  
°C  
-55°C  
VIH  
VIL  
Minimum High-  
Level Input Voltage  
VOUT=0.1 V or VCC-0.1 V  
IOUT⎢≤ 20 μA  
4.5  
5.5  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
V
V
V
Maximum Low -  
Level Input Voltage  
VOUT=0.1 V or VCC-0.1 V  
IOUT⎢ ≤ 20 μA  
4.5  
5.5  
0.8  
0.8  
0.8  
0.8  
0.8  
0.8  
VOH  
Minimum High-  
Level Output Voltage  
VIN=VIH or VIL  
IOUT⎢ ≤ 20 μA  
4.5  
5.5  
4.4  
5.4  
4.4  
5.4  
4.4  
5.4  
VIN=VIH or VIL  
4.5  
3.98  
3.84  
3.7  
IOUT⎢ ≤ 6.0 mA  
VOL  
Maximum Low-  
Level Output Voltage  
VIN= VIL or VIH  
IOUT⎢ ≤ 20 μA  
4.5  
5.5  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
VIN= VIL or VIH  
4.5  
5.5  
0.26  
0.33  
0.4  
IOUT⎢ ≤ 6.0 mA  
IIN  
Maximum Input  
Leakage Current  
VIN=VCC or GND,  
Pin 1 or 19  
±0.1  
±1.0 ±1.0  
μA  
μA  
IOZ  
Maximum Three-  
State Leakage  
Current  
Output in High-Impedance  
State  
VIN= VIL or VIH  
VOUT=VCC or GND,  
I/O Pins  
5.5  
±0.5  
±5.0  
±10  
ICC  
Maximum Quiescent  
Supply Current  
(per Package)  
VIN=VCC or GND  
5.5  
4.0  
40  
160  
μA  
I
OUT=0μA  
Additional Quiescent VIN=2.4 V, Any One Input  
mA  
ΔICC  
-55°C  
2.9  
25°C to  
125°C  
Supply Current  
VIN=VCC or GND, Other  
Inputs  
5.5  
2.4  
IOUT=0μA  
Rev. 00  
IN74HCT245A  
AC ELECTRICAL CHARACTERISTICS (VCC =5.0 V ± 10%, CL=50pF,Input tr=tf=6.0 ns)  
Guaranteed Limit  
85°C 125°C  
Symbol  
Parameter  
Unit  
25 °C  
to  
-55°C  
tPLH, tPHL Maximum Propagation Delay, A to B or B to A  
(Figures 1 and 3)  
22  
32  
30  
12  
28  
40  
38  
15  
33  
48  
45  
18  
ns  
ns  
ns  
ns  
tPLZ, tPHZ Maximum Propagation Delay , Direction or  
Output Enable to A or B (Figures 2 and 4)  
tPZL, tPZH Maximum Propagation Delay , Direction or  
Output Enable to A or B (Figures 2 and 4)  
tTLH, tTHL Maximum Output Transition Time, Any Output  
(Figures 1 and 3)  
CIN  
Maximum Input Capacitance (Pin 1 or Pin 19)  
10  
15  
10  
15  
10  
15  
pF  
pF  
COUT  
Maximum Three-State I/O Capacitance  
(I/O in High-Impedance State)  
Power Dissipation Capacitance (Per Enable  
Output)  
Typical @25°C,VCC=5.0 V  
CPD  
Used to determine the no-load dynamic power  
consumption:  
97  
pF  
PD=CPDVCC2f+ICCVCC  
Figure 1. Switching Waveforms  
Figure 2. Switching Waveforms  
Rev. 00  
IN74HCT245A  
Figure 3. Test Circuit  
Figure 4. Test Circuit  
EXPANDED LOGIC DIAGRAM  
Rev. 00  
IN74HCT245A  
N SUFFIX PLASTIC DIP  
(MS - 001AD)  
A
Dimension, mm  
11  
10  
20  
1
Symbol MIN  
MAX  
26.92  
7.11  
B
24.89  
6.1  
A
B
C
D
F
5.33  
0.36  
1.14  
0.56  
F
L
1.78  
2.54  
7.62  
G
H
J
C
SEATING  
PLANE  
-T-  
K
N
0
10  
°
°
M
J
G
H
D
2.92  
7.62  
0.2  
3.81  
8.26  
0.36  
K
L
M
N
0.25 (0.010) M  
T
NOTES:  
1. Dimensions “A”, “B” do not include mold flash or protrusions.  
Maximum mold flash or protrusions 0.25 mm (0.010) per side.  
0.38  
D SUFFIX SOIC  
(MS - 013AC)  
A
20  
11  
Dimension, mm  
Symbol MIN  
MAX  
13  
H
B
P
12.6  
7.4  
A
B
C
D
F
7.6  
2.35  
0.33  
0.4  
2.65  
0.51  
1.27  
1
10  
G
R x 45  
C
-T-  
SEATING  
PLANE  
1.27  
9.53  
G
H
J
K
M
D
J
F
M
0.25 (0.010) M T C  
0
°
8
°
NOTES:  
0.1  
0.23  
10  
0.3  
0.32  
10.65  
0.75  
K
M
P
1. Dimensions A and B do not include mold flash or protrusion.  
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side  
for A; for B 0.25 mm (0.010) per side.  
0.25  
R
Rev. 00  
IN74HCT245A  
TSSOP-20  
Rev. 00  

IN74HCT245ADW 相关器件

型号 制造商 描述 价格 文档
IN74HCT245AN IKSEMICON Octal 3-State Noninverting Bus Transceiver High-Performance Silicon-Gate CMOS 获取价格
IN74HCT245ATDS IKSEMICON Octal 3-State Noninverting Bus Transceiver High-Performance Silicon-Gate CMOS 获取价格
IN74HCT273A IKSEMICON Octal D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS 获取价格
IN74HCT273ADW IKSEMICON Octal D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS 获取价格
IN74HCT273AN IKSEMICON Octal D Flip-Flop with Common Clock and Reset High-Performance Silicon-Gate CMOS 获取价格
IN74HCT27A INTEGRAL Triple 3-Input NOR Gate 获取价格
IN74HCT27AD INTEGRAL Triple 3-Input NOR Gate 获取价格
IN74HCT27AN INTEGRAL Triple 3-Input NOR Gate 获取价格
IN74HCT30A INTEGRAL 8-Input NAND Gate 获取价格
IN74HCT30AD INTEGRAL 8-Input NAND Gate 获取价格

IN74HCT245ADW 相关文章

  • Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
    2024-09-20
    6
  • Bourns 精密环境传感器产品选型手册(英文版)
    2024-09-20
    9
  • Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
    2024-09-20
    8
  • Bourns GMOV 混合过压保护组件产品选型手册(英文版)
    2024-09-20
    6