I213-3FK3-56.000 [ILSI]
Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP; 含铅振荡器， VCXO ， TTL / HC- MOS金属封装，全尺寸DIP和半DIP
| 型号： | I213-3FK3-56.000 |
| 厂家： | 
ILSI |
| 描述： | Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP |
| 文件： | 总2页 (文件大小：47K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Leaded Oscillator, VCXO, TTL / HC-MOS
Metal Package, Full Size DIP and Half DIP
I212 / I213 Series
I203 Package
20.7
4
3
Product Features:
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
RoHS Compliant
Applications:
12.6
Server & Storage
Sonet /SDH
1
2
802.11 / Wifi
T1/E1, T3/E3
7.62
15.24
5.1 Max.
6 Min.
0.048
Frequency
51.84 MHz to 170.000 MHz
Output Level
HC-MOS
TTL
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
0.36
I202 Package
12.6
Duty Cycle
50% ±5%
4
3
Rise / Fall Time
10 nS Max.*
12.6
Output Load
HC-MOS
TTL
Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL
15 pF
1
2
7.62
Frequency Stability
Supply Voltage
Current
See Frequency Stability Table
See Input Voltage Table, tolerance ±10 %
50 mA Max.*
7.62
6 Min.
5.1 Max.
Control Voltage
1.65 VDC ±1.5 VDC for Vcc = 3.3 VDC, 2.5 VDC ±2.0 VDC for VCC
= 5.0 VDC
0.48
Slope
Positive
0.36
Dimension Units: mm
Pin Connection
Operating
Storage
See Operating Temperature Table in Part Number Guide
1
2
3
4
Control Voltage
GND
Output
-55° C to +125° C
Vcc
Part Number Guide
Operating
Sample Part Number: I212-1BC3-56.000 MHz
Package
Frequency
Stability
Pullability
Supply Voltage
Frequency
Temperature
5 = 5.0 VDC
3 = 3.3 VDC
1 = 0° C to +70° C
F = ±20 ppm
X = ±30 ppm
B = ±50 ppm min.
C = ±100 ppm min.
K = ±150 ppm min.
L = ±200 ppm min.
I212 -
I213 -
3 = -20° C to +70° C
- 56.000 MHz
4 = -30° C to +75° C
2 = -40° C to +85° C
B = ±50 ppm
C = ±100 ppm
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Frequency, supply, and load related parameters.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10
Specifications subject to change without notice
Page 1
Leaded Oscillator, VCXO, TTL / HC-MOS
Metal Package, Full Size DIP and Half DIP
I212 / I213 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4- (Sn / Cu / Ag over Ni over Kovar base metal).
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code
Line 2: XXXX (Part Number detail = I203-XXXX-Freq.)
Line 3: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10
Specifications subject to change without notice
Page 2
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