I606-3DB9H-155.520 [ILSI]
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS; 10毫米×14毫米， FR- 4表面贴装VCXO ， LVPECL / LVDS
| 型号： | I606-3DB9H-155.520 |
| 厂家： | 
ILSI |
| 描述： | 10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS |
| 文件： | 总2页 (文件大小：50K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS
I606 Series
Product Features:
Applications:
14.3 Max.
Small Surface Mount Package
Low Noise
Pb Free/ RoHS Complient
Compatible with Leadfree Processing
SD/HD Video
Wireless Base Stations
Sonet /SDH
10.2 Max.
Server and Storage
6.0 Max.
Frequency
1 MHz to 180.000 MHz
Output Level
LVDS
LVPECL
0.5
Typ.
2.54
Vod = 393 mV Typ., 475 mV Max.
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
Duty Cycle
50% ±10%
Rise / Fall Time
0.6 nS Max.
Output Load
LVDS
LVPECL
100 Ω Differential
50 Ω to Vcc - 2.0 VDC
50 ppm Max.
Frequency Stability
Start-up Time
Supply Voltage
Current
Recommended pad layout
0.8
10 mS Max.
3.3 VDC ± 5%
LVDS = 90 mA Max., LVPECL = 130 mA Max.
15% Max.
8.8
Linearity
3.0
Pullability
See Table Below
Pin Connection
Control Voltage
Input Impedance
Jitter
1.65 VDC ± 1.5 VDC
1
2
3
4
5
6
Voltage Control
Enable/Disable
GND
Output
Comp. Outout
Vcc
50K Ω Min.
<1.0 pS RMS (12 kHz to 20 MHz)*
See Operating Temperature Table in Part Number Guide
-55° C to +125° C
Operating
Dimension Units: mm
Storage
Part Number Guide
Sample Part Number:
I606–1BC8H–155.520
Package
Operating
Stability
(in ppm)
**D = ±15
A = ±25
Pullability
Output
Enable /
Disable
Frequency
Temperature
1 = 0° C to +70° C
3 = -20° C to +70° C
2 = -40° C to +85° C
8 = LVDS
H = Enable
B = ±50 ppm
9 = LVPECL
C = ±100 ppm
-155.520 MHz
I606
B = ±50
C = ±100
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
*Frequency related, for additional information contact your sales representative. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 1
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS
I606 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
1000
Reel
A
B
16 +/-.3
8 +/-.2
C
D
E
F
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: XXXXX (I606-XXXXX- Freq)
Line 3: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 2
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