I607-2CC9H-77.760 [ILSI]
5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS; 为5mm× 7毫米陶瓷封装SMD VCXO ， LVPECL / LVDS
| 型号： | I607-2CC9H-77.760 |
| 厂家： | 
ILSI |
| 描述： | 5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS |
| 文件： | 总2页 (文件大小：50K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS
I607 Series
Product Features:
Small Surface Mount Package
Low Noise
Pb Free/ RoHS Complient
Compatible with Leadfree Processing
Applications:
SD/HD Video
Wireless Base Stations
Sonet /SDH
5.0 0.2
Server and Storage
7.0 0.3
2.0 Max.
Frequency
1 MHz to 77.760 MHz
Output Level
LVDS
Vod = 393 mV Typ., 475 mV Max.
5.08
LVPECL
‘0’ = Vcc - 1.63 V Max.
‘1’ = Vcc - 1.02 V Min.
Duty Cycle
50% ±10%
Rise / Fall Time
0.6 nS Max.
Output Load
LVDS
LVPECL
100 Differential
50 to Vcc - 2.0 VDC
50 ppm Max.
Frequency Stability
Start-up Time
Supply Voltage
Current
Recommended Pad Layout
10 mS Max.
3.3 VDC ± 5%
LVDS = 90 mA Max., LVPECL = 130 mA Max.
15% Max.
4.2
Linearity
Pullability
See Table Below
2.0
Bypass =0.01 uF
Control Voltage
Input Impedance
Jitter
1.65 VDC ± 1.5 VDC
Pin
1
Connection
Control Voltage
Enable / Disable
Ground
50K Min.
2
3
4
5
<1.0 pS RMS (12 kHz to 20 MHz)*
See Operating Temperature Table in Part Number Guide
-55 C to +125 C
Output
N.C.
Vdd
Operating
6
Dimension Units: mm
Storage
Part Number Guide
Sample Part Number:
I607–1BC8H–77.760
Package
Operating
Stability
(in ppm)
**D = 15
A = 25
Pullability
Output
Enable /
Disable
Frequency
Temperature
1 = 0 C to +70 C
3 = -20 C to +70 C
2 = -40 C to +85 C
8 = LVDS
H = Enable
B = 50 ppm
9 = LVPECL
C = 100 ppm
-77.760 MHz
I607
B = 50
C = 100
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise.
*Frequency related, for additional information contact your sales representative. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 1
5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS
I607 Series
Pb Free Solder Reflow Profile:
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
1000
Reel
A
B
16 +/-.3
8 +/-.2
C
D
E
F
7.5 +/-.2
17.5 +/-1
50 / 60 / 80
180 / 250
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
10/10_C
Specifications subject to change without notice
Page 2
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