I631-31BB9H2-155.520 [ILSI]

5 mm x 7 mm Ceramic Low Noise SMD VCXO, LVCMOS / LVPECL / LVDS; 为5mm× 7毫米陶瓷低噪音SMD VCXO , LVCMOS / LVPECL / LVDS
I631-31BB9H2-155.520
型号: I631-31BB9H2-155.520
厂家: ILSI    ILSI
描述:

5 mm x 7 mm Ceramic Low Noise SMD VCXO, LVCMOS / LVPECL / LVDS
为5mm× 7毫米陶瓷低噪音SMD VCXO , LVCMOS / LVPECL / LVDS

石英晶振 压控振荡器
文件: 总3页 (文件大小:53K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
5 mm x 7 mm Ceramic Low Noise SMD VCXO,  
LVCMOS / LVPECL / LVDS  
I631 - Series  
Product Features  
Small Surface Mount Package  
Low RMS Phase Jitter  
Frequencies to 1500 MHz  
Pb Free/ RoHS Compliant  
Leadfree Processing  
Applications  
xDSL  
Broadcast video  
Wireless Base Stations  
Sonet /SDH  
Ethernet/LAN/WAN  
Optical modules  
Clock and data recovery  
FPGA/ASIC  
Backplanes  
GPON  
WiMAX/WLAN  
Server and Storage  
5.0 0.2  
Frequency  
LVCMOS  
LVPECL  
LVDS  
7.0 0.3  
10 MHz to 225 MHz  
10 MHz to 1500 MHz  
10 MHz to 1500 MHz  
Output Level  
LVCMOS  
LVPECL  
LVDS  
1.9 Max.  
VOH=90% VDD min., VOL=10 % VDD max.  
VOH=VDD-1.03V max. (Nom. Load), VOL=VDD-1.6V max. (Nom. Load)  
VOD=(Diff. Output) 350mV Typ.  
5.08  
Duty Cycle  
LVCMOS  
LVPECL  
LVDS  
50% ±5% @ 50%VDD  
50% ±5% @ 50%*  
50% ±5% @ 50%*  
Rise / Fall Time  
LVCMOS  
LVPECL  
LVDS  
3.0 ns max. (90%/10%)*  
0.6 ns max. (80%/20%)*  
0.6 ns max. (80%/20%)*  
Output Load  
LVCMOS  
LVPECL  
LVDS  
Recommended Pad Layout  
15pF  
50 to VDD - 2.0 VDC  
RL=100 /CL=10pF  
Frequency Stability  
Supply Voltage  
Current  
See Table Below  
4.2  
2.0  
3.3 VDC ± 10%, 2.5 VDC ± 5%  
1.9  
LVCMOS = 25 mA max., LVPECL = 60 mA max. LVDS = 35 mA max.  
Linearity  
10% max.  
Pin Connection  
Pullability  
See Table Below  
1
2
3
4
5
6
Voltage Control  
Enable/Disable or N/C  
GND  
Output  
Output or N/C  
VDD  
Control Voltage  
Input Impedance  
1.65 VDC ± 1.65 VDC @ 3.3V  
1.25 VDC ± 1.25 VDC @ 2.5V  
50K min.  
Phase Jitter (RMS)  
At 12kHz to 20 MHz  
Operating Temp.  
Range  
0.5 ps typical  
Dimension Units: mm  
See Table Below  
Storage  
-40C to +100C  
Part Number Guide  
Sample Part Number:  
I631–31AB9H2–155.520  
Package  
Input  
Operating  
Stability  
Pullabilty  
Output  
Enable / Disable  
(Pin 2)  
Complimentary  
Ouput (Pin 5) **  
Frequency  
Voltage  
Temperature  
(in ppm)  
3 = 3.3V  
6 = 2.5V  
B = 50  
C = 100  
3 = LVCMOS  
8 = LVDS  
H = Enable  
O = N/C  
1 = N.C.  
1 = 0C to +70C  
3 = -20C to +70C  
2 = -40C to +85C  
F = 20  
A = 25  
B = 50  
2 = Output  
-155.520 MHz  
I631  
9 = LVPECL  
NOTE: A 0.01 µF bypass capacitor is recommended between VDD (pin 6) and GND (pin 3) to minimize power supply noise. * Measured as percent of  
waveform. ** Available on LVDS and LVPECL ouput only.  
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com  
10/17/12_B  
Specifications subject to change without notice  
Page 1  
5 mm x 7 mm Ceramic Low Noise SMD VCXO,  
LVCMOS / LVPECL / LVDS  
I631 - Series  
SSB Phase Noise (typ.)  
Offset  
77.76 MHz  
155.52 MHz  
622.08 MHz  
10Hz  
100Hz  
1kHz  
10kHz  
100kHz  
-75 dBc/Hz  
-105 dBc/Hz  
-117 dBc/Hz  
-123 dBc/Hz  
-125 dBc/Hz  
-62 dBc/Hz  
-101 dBc/Hz  
-112 dBc/Hz  
-115 dBc/Hz  
-118 dBc/Hz  
-47 dBc/Hz  
-79 dBc/Hz  
-100 dBc/Hz  
-104 dBc/Hz  
-106 dBc/Hz  
Typical Application:  
Pb Free Solder Reflow Profile:  
*Units are backward compatible with 240C reflow processes  
Package Information:  
MSL = N.A. (package does not contain plastic, storage life is  
unlimited under normal room conditions).  
Termination = e4 (Au over Ni over W base metalization).  
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com  
10/17/12_B  
Specifications subject to change without notice  
Page 2  
5 mm x 7 mm Ceramic Low Noise SMD VCXO,  
LVCMOS / LVPECL / LVDS  
I631 - Series  
Tape and Reel Information:  
Quantity per  
1000  
Reel  
A
B
16 +/-.3  
8 +/-.2  
C
D
E
F
7.5 +/-.2  
17.5 +/-1  
50 / 60 / 80  
180 / 250  
Environmental Specifications  
Thermal Shock  
MIL-STD-883, Method 1011, Condition A  
MIL-STD-883, Method 1004  
MIL-STD-883, Method 2002, Condition B  
MIL-STD-883, Method 2007, Condition A  
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)  
Pb-Free / RoHS / Green Compliant  
JESD22-B102-D Method 2 (Preconditioning E)  
MIL-STD-883, Method 2004, Test Condition D  
MIL-STD-883, Method 1014, Condition C  
Moisture Resistance  
Mechanical Shock  
Mechanical Vibration  
Resistance to Soldering Heat  
Hazardous Substance  
Solderability  
Terminal Strength  
Gross Leak  
Fine Leak  
Solvent Resistance  
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s  
MIL-STD-202, Method 215  
Marking  
Line 1: ILSI and Date Code (YWW)  
Line 2: Frequency  
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com  
10/17/12_B  
Specifications subject to change without notice  
Page 3  

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