ILCX20-FF5F18-26.000 [ILSI]
Parallel - Fundamental Quartz Crystal, 26MHz Nom, SMD, 4 PIN;
| 型号： | ILCX20-FF5F18-26.000 |
| 厂家： | 
ILSI |
| 描述： | Parallel - Fundamental Quartz Crystal, 26MHz Nom, SMD, 4 PIN |
| 文件： | 总2页 (文件大小：40K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
4 Pad Ceramic Package Quartz Crystal, 1.2 mm x 1.6 mm
ILCX20 Series
Product Features:
Low Cost SMD Package
Ultra Miniature Package
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
1.6
+/-0.05
4
3
Compatible with Leadfree Processing
802.11 / Wifi
T1/E1, T3/E3
1.25
+/-0.05
2
1
0.40
+/-0.05
Frequency
26 MHz to 60 MHz
0.5
ESR (Equivalent Series Resistance)
0.4 +/-0.1
2
3
1
0.3
26.0 MHz – 39.9 MHz
40.0 MHz – 60.0 MHz
150 Max.
100 Max.
4
0.5 +/-0.1
Shunt Capacitance (C0)
5.0 pF Max.
Connection diagram
4
3
Frequency Tolerance @ 25 C
30 ppm Standard (see Part Number Guide for more options)
GND
Frequency Stability over
Temperature
50 ppm Standard (see Part Number Guide for more options)
GND
2
Crystal Cut
AT Cut
1
Load Capacitance
Drive Level
8 pF Standard
100 µW Max.
Recommended pad layout
0.6
0.5
3
2
4
1
Aging
5 ppm Max. / Year Standard
0.3
Temperature
0.5
Operating
Storage
-10 C to +60 C (see Part Number Guide for more options)
-40 C to +85 C
Dimension Units: mm
Part Number Guide
Sample Part Number:
ILCX20 - FB1F8 - 20.000
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
Operating
Mode
(overtone)
Load Capacitance
(pF)
Frequency
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
F = ±30 ppm
G = ±25 ppm
18 pF Standard
Or Specify
ILCX20 -
F = Fundamental
- 20.000 MHz
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm*
J = ±10 ppm**
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
05/24/12
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package Quartz Crystal, 1.2 mm x 1.6 mm
ILCX20 Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
3000
Reel
A
B
8 +/-.3
4 +/-.2
C
D
E
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
F
180
Environmental Specifications
Thermal Shock
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I, Date Code (yww)
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
05/24/12
Specifications subject to change without notice
Page 2
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