7703407NA [INFINEON]
Regulator, 1 Output, BIPolar,;
| 型号： | 7703407NA |
| 厂家： | 
Infineon |
| 描述： | Regulator, 1 Output, BIPolar, 输出元件 调节器 |
| 文件： | 总50页 (文件大小：331K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
P
DESCRIPTION
DATE (YR-MO-DA)
93-10-02
APPROVED
M. A. FRYE
Add case outline M. Technical changes and corrections to table I. Editorial
changes throughout.
R
T
Add class V level devices. Update boilerplate. - ro
99-06-08
99-09-23
R. MONNIN
R. MONNIN
Add case outline N. Make changes to 1.2.4, P , theta JC, I
D
as specified in
MAX
1.3, table I, and figure 1. - ro
U
V
Add radiation hardened requirements to device types 02 and 07 for case
outline U. Add terminal assignment table for case outline N as specified in
figure 1.
00-10-11
03-12-10
R. MONNIN
R. MONNIN
Add case outline 4 for device type 07. - ro
Add case outlines 5 and 6. Make changes to 1.2.4, P , theta JC, I
as
D
MAX
specified in 1.3, table I, and figure 1. Update boilerplate to reflect current
requirements. - rrp
W
X
Add a footnote to the case outline U, TO-257 package as specified under 1.2.4
and figure 1. - ro
05-02-07
06-01-30
R. MONNIN
R. MONNIN
For case outline “T” only, add a footnote 1/ under 1.2.4 and make change to
note 3 under figure 1. For device types 02, 04, 07, and 08 add pin outs under
case outline 2 in figure 1. -rrp
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
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36
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REV STATUS
OF SHEETS
PMIC N/A
SHEET
1
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PREPARED BY
WILLIAM E. SHOUP
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
C.R. JACKSON
STANDARD
MICROCIRCUIT
DRAWING
APPROVED BY
N. A. HAUCK
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
MICROCIRCUIT, LINEAR, ADJUSTABLE
VOLTAGE REGULATOR, MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
77-09-15
AMSC N/A
REVISION LEVEL
X
SIZE
A
CAGE CODE
77034
67268
SHEET
1
OF
45
DSCC FORM 2233
APR 97
.
5962-E015-06
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
77034
01
M
X
Drawing number
For device class V:
5962
Device type
(see 1.2.2)
Case outline
(see 1.2.4)
Lead finish
(see 1.2.5)
-
77034
01
V
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
For device classes M, Q, and V radiation hardened devices:
5962
R
77034
02
M
U
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
Circuit function
01
02
03
04
05
06
07
08
LM117
LM117HV
LM137
LM137HV
LT117A
LT137A
Positive adjustable voltage regulator
Positive adjustable voltage regulator, high voltage
Negative adjustable voltage regulator
Negative adjustable voltage regulator, high voltage
Positive adjustable voltage regulator
Negative adjustable voltage regulator
LT117AHV
LT137AHV
Positive adjustable voltage regulator, high voltage
Negative adjustable voltage regulator, high voltage
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
2
DSCC FORM 2234
APR 97
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device except for those devices that use a RHA
designator
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
M
N
T 1/
U 1/
X
Y
Z
2
4
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
MBFM1-P2
MBFM4-P2
CQCC1-N20
See figure 1
See figure 1
See figure 1
3
3
3
3
3
2
2
20
3
Power surface mount
Surface mount
TO-257 flange mount, glass sealed
TO-257 flange mount with isolated tab, glass sealed
TO-39 can
Flange mount
Flange mount
Square leadless chip carrier
SMD-257-A flange mount, glass sealed
Rectangular leadless chip carrier
Rectangular leadless chip carrier
5
6
18
18
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 2/
Power dissipation (PD):
Case X ....................................................................................................... 2 W
Cases M, N, T, U, Y, Z and 4 (internally limited) ....................................... 20 W
Case 2:
At TA = +25°C ......................................................................................... 1.1 W
At TC = +25°C ........................................................................................ 6.2 W
Cases 5 and 6 at TC = +25°C ..................................................................... 10 W
Input-output voltage differential:
Device types 01, 03, 05, 06 ....................................................................... 40 V dc
Device types 02, 07 ................................................................................... 60 V dc
Device types 04, 08 ................................................................................... 50 V dc
Operating junction temperature range ........................................................... -55°C to +150°C
Storage temperature ..................................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds) ................................................... 300°C
Thermal resistance, junction to case (θJC):
Cases M, N, and T ................................................................................... 3.5°C/W
Cases U and 4 ........................................................................................ 4.2°C/W
Case X .................................................................................................... 15°C/W
Case Y .................................................................................................... 3°C/W
Case Z .................................................................................................... 5°C/W
Case 2 ..................................................................................................... See MIL-STD-1835
Cases 5 and 6 ......................................................................................... 13°C/W
1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal.
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
3
DSCC FORM 2234
APR 97
1.3 Absolute maximum ratings – Continued. 2/
Maximum output current (IMAX):
Cases X, 2, 5, and 6 ................................................................................ 0.5 A
Cases M, N, T, U, Y, Z, and 4 ................................................................. 1.5 A
1.4 Recommended operating conditions.
Output voltage range:
Device types 01, 05 ................................................................................. 1.2 to 37 V dc
Device types 02, 07 ................................................................................. 1.2 to 57 V dc
Device types 03, 06 ................................................................................. -1.2 to -37 V dc
Device types 04, 08 ................................................................................. -1.2 to -47 V dc
Ambient operating temperature range (TA) ................................................. -55°C to +125°C
Input voltage range:
Device types 01, 05 ................................................................................. 4.25 V dc to 41.25 V dc
Device types 03, 06 ................................................................................. -4.25 V dc to -41.25 V dc
Device types 02, 07 ................................................................................. 4.25 V dc to 61.25 V dc
Device types 04, 08 ................................................................................. -4.25 V dc to -51.25 V dc
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s): 3/
Device types 02 and 07 ........................................................................... 100 Krads(Si)
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
4
DSCC FORM 2234
APR 97
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 52 (see MIL-PRF-38535, appendix A).
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Cases X, 2, 5 and 6
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
01
1.20
1.20
1.20
1.30
1.30
1.30
±9
V
Line regulation
RLINE
01
01
mV
mV
3.0 ≤ VDIFF ≤ 40 V,
V
OUT = VREF
3.3 ≤ VDIFF ≤ 40 V,
OUT = VREF
2,3
1
±23
±15
±15
±15
±15
±3.1
V
Load regulation 1/
RLOAD
VDIFF = 3 V,
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
10 mA ≤ IL ≤ 500 mA
VDIFF = 40V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
1
10 mA ≤ IL ≤ 100 mA
VIN = +14.6 V,
Thermal regulation
VRTH
01
mV
IL = 300 mA, t = 20 ms,
PD = 4 W, TA =+25°C
Ripple rejection
RN
4,5,6
01
01
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF 2/
Adjustment pin current
IADJ
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
100
100
100
±5
µA
Adjustment pin current
change
VDIFF = 3 V,
01
∆IADJ
µA
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
±5
±5
±5
10 mA ≤ IL ≤ 500 mA
VDIFF = 40 V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 100 mA
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Cases X, 2, 5 and 6 - Continued.
Adjustment pin current
change
1
2,3
1
01
01
∆IADJ
3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 40 V
VDIFF = 3.0 V,
±5
±5
5
µA
Minimum load current
ILMIN
mA
V
OUT = 1.4 V (forced)
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
OUT = 1.4 V (forced)
2,3
5
5
V
1,2,3
V
Current limit 2/
ICL
VDIFF = 15 V
1,2,3
1
01
01
0.5
1.65
0.65
A
V
VDIFF = 40 V
0.15
Cases M, N, T, U, Y, Z
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
1.20
1.20
1.20
1.30
1.30
1.30
±9
Line regulation
RLINE
VOUT = VREF
3.0 V ≤ VDIFF ≤ 40 V
VOUT = VREF
,
01
01
mV
mV
,
2,3
1
±23
±15
±15
±15
±15
±16
3.3 V ≤ VDIFF ≤ 40 V
VDIFF = 3 V,
Load regulation 1/
RLOAD
10 mA ≤ IL ≤ 1.5 A
VDIFF = 3.3 V,
2,3
1
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40V,
10 mA ≤ IL ≤ 300 mA
VDIFF = 40 V,
2,3
1
10 mA ≤ IL ≤ 195 mA
VIN = 14.6 V, IL = 1.5 A,
PD = 20 watts, t = 20 ms,
TA = +25°C
Thermal regulation
VRTH
01
mV
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
66
Cases M, N, T, U, Y, Z - Continued.
Ripple rejection
RN
4,5,6
01
01
dB
f = 120 Hz, CADJ = 10 µF,
OUT = VREF 2/
V
Adjustment pin current
IADJ
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
100
100
100
±5
µA
Adjustment pin current
change
VDIFF = 3 V,
01
∆IADJ
µA
10 mA ≤ IL ≤ 1.5 A
VDIFF = 3.3 V,
2,3
1
±5
±5
±5
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
10 mA ≤ IL ≤ 300 mA
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 195 mA
3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 40 V
VDIFF = 3.0 V,
1
2,3
1
±5
±5
5
Minimum load current
ILMIN
01
mA
V
OUT = 1.4 V (forced)
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
OUT = 1.4 V (forced)
2,3
5
5
V
1,2,3
V
Current limit 2/
ICL
VDIFF = 15 V
1,2,3
1
01
02
1.50
0.18
3.50
1.5
A
V
VDIFF = 40 V
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
VDIFF = 60 V
1
1.20
1.20
1.20
1.20
1.30
1.30
1.30
1.30
2,3
1,2,3
1,2,3
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
8
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Min Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Cases X, 2, 5, and 6 - Continued.
Line regulation 3/ RLINE
VOUT = VREF
3.0 V ≤ VDIFF ≤ 40 V
VOUT = VREF
3.3 V ≤ VDIFF ≤ 40 V
VOUT = VREF
,
1
02
02
mV
±9
,
2,3
±23
,
1
2,3
1
±5
40 V ≤ VDIFF ≤ 60 V
VDIFF = 3 V,
±10
±15
Load regulation 1/
RLOAD
mV
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
±15
±15
±15
±15
±3.1
10 mA ≤ IL ≤ 500 mA
VDIFF = 40V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
1,2,3
1
10 mA ≤ IL ≤ 100 mA
VDIFF = 60 V,
10 mA ≤ IL ≤ 20 mA
VIN = 14.6 V,
Thermal regulation
Ripple rejection 2/
Adjustment pin current
VRTH
02
02
02
mV
dB
µA
IL = 300 mA, t = 20 ms,
PD = 4 W, TA = +25°C
RN
4,5,6
66
f = 120 Hz, CADJ = 10 µF,
V
OUT = VREF
,
I
OUT = 100 mA
IADJ
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
VDIFF = 60 V
1
100
100
100
100
2,3
1,2,3
1,2,3
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
9
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Case X, 2, 5, and 6 - Continued.
Adjustment pin current
change
VDIFF = 3 V,
1
02
∆IADJ
±5
±5
±5
±5
µA
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
10 mA ≤ IL ≤ 500 mA
VDIFF = 40 V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 100 mA
3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 60 V
VDIFF = 3.0 V,
1
2,3
1,2,3
1
±5
±5
±5
5
Minimum load current
ILMIN
02
mA
V
OUT = 1.4 V (forced)
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
OUT = 1.4 V (forced)
VDIFF = 60 V,
OUT = 1.4 V (forced)
2,3
5
5
7
V
1,2,3
1,2,3
V
V
Current limit 2/
ICL
VDIFF = 5 V
VDIFF = 40 V
VDIFF = 60 V
1,2,3
02
02
0.5
1.65
0.65
0.28
A
V
1
1
0.15
0.02
Cases M, N, T, U, Y, Z 4/ 5/
Reference voltage
VREF
VDIFF = 3.0 V
1
1.20
1.30
M,D,P,L,R
1
1.20
1.20
1.30
1.30
VDIFF = 3.3 V
VDIFF = 40 V
2,3
1,2,3
1.20
1.30
M,D,P,L,R
M,D,P,L,R
1
1.20
1.20
1.30
1.30
VDIFF = 60 V
1,2,3
1
1.20
1.30
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
10
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Min Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Cases M, N, T, U, Y, Z - Continued. 4/ 5/
Line regulation 3/
RLINE
VOUT = VREF
3.0 V ≤ VDIFF ≤ 40 V
M,D,P,L,R
,
1
02
mV
±9
1
±9
VOUT = VREF
3.3 V ≤ VDIFF ≤ 40 V
VOUT = VREF
40 V ≤ VDIFF ≤ 60 V
M,D,P,L,R
,
2,3
±23
,
1
2,3
1
±5
±10
±5
Load regulation 1/
RLOAD
VDIFF = 3 V,
1
02
mV
±15
10 mA ≤ IL ≤ 1.5 A
M,D,P,L,R
1
±15
±15
VDIFF = 3.3 V,
2,3
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40V,
1
±15
10 mA ≤ IL ≤ 300 mA
M,D,P,L,R
1
±15
±15
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 195 mA
VDIFF = 60 V,
1,2,3
±15
10 mA ≤ IL ≤ 30 mA
M,D,P,L,R
1
1
±15
±16
Thermal regulation
VRTH
VIN = 14.6 V, IL = 1.5 A,
02
mV
PD = 20 watts, t = 20 ms,
TA = +25°C
M,D,P,L,R
1
±16
Ripple rejection 2/
RN
4,5,6
02
02
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF, IOUT = 100 mA
Adjustment pin current
IADJ
VDIFF = 3.0 V
1
100
µA
M,D,P,L,R
1
100
100
VDIFF = 3.3 V
VDIFF = 40 V
2,3
1,2,3
100
M,D,P,L,R
M,D,P,L,R
1
100
100
VDIFF = 60 V
1,2,3
1
100
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
11
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases M, N, T, U, Y, Z - Continued. 4/ 5/
Adjustment pin current
change
VDIFF = 3 V,
1
02
∆IADJ
±5
µA
10 mA ≤ IL ≤ 1.5 A
M,D,P,L,R
1
±5
±5
VDIFF = 3.3 V,
2,3
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
1
±5
10 mA ≤ IL ≤ 300 mA
M,D,P,L,R
1
±5
±5
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 195 mA
3 V ≤ VDIFF ≤ 40 V
M,D,P,L,R
1
1
±5
±5
±5
±5
±5
5
2,3
1,2,3
1
3.3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 60 V
M,D,P,L,R
Minimum load current
ILMIN
VDIFF = 3.0 V,
1
02
mA
VOUT = 1.4 V (forced)
M,D,P,L,R
1
5
5
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
2,3
V
1,2,3
5
VOUT = 1.4 V (forced)
M,D,P,L,R
1
5
7
VDIFF = 60 V,
1,2,3
VOUT = 1.4 V (forced)
M,D,P,L,R
M,D,P,L,R
M,D,P,L,R
M,D,P,L,R
1
7
Current limit 2/
ICL
VDIFF = 5 V
1,2,3
02
1.5
3.5
A
1
1
1.5
0.3
3.5
1.5
VDIFF = 40 V
VDIFF = 60 V
1
1
0.3
1.5
0.05
0.50
1
0.05
0.50
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
12
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
1
2,3
1
03
-1.275
-1.30
-1.225
-1.20
-1.225
-1.20
±9
V
VDIFF = 40 V
-1.275
-1.30
2,3
1
Line regulation
RLINE
03
03
mV
mV
3.0 V ≤ VDIFF ≤ 40 V
2,3
1,2,3
±23
Load regulation 1/
RLOAD
VDIFF = 5 V,
±25
8 mA ≤ IL ≤ 200 mA
VDIFF = 15 V,
1,2,3
1
±25
±25
±25
±2
8 mA ≤ IL ≤ 200 mA
VDIFF = 40V,
8 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
1
8 mA ≤ IL ≤ 50 mA
VIN = -16.25 V,
Thermal regulation
VRTH
03
mV
IL = 330 mA, TA = +25°C
PD = 5 watts, t = 10 ms,
Ripple rejection 2/
RN
4,5,6
03
03
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ
VDIFF = 3.0 V
1,2,3
1,2,3
1,2,3
100
100
±5
µA
VDIFF = 40 V
Adjustment pin current
change
03
03
∆IADJ
(line)
3.0 V ≤ VDIFF ≤ 40 V
µA
VDIFF = 5.0 V,
1,2,3
1,2,3
1,2,3
1,2,3
∆IADJ
(load)
ILMIN
±5
3
8 mA ≤ IL ≤ 500 mA
Minimum load current
VDIFF = 3.0 V,
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
3
V
5
VOUT = -1.4 V (forced)
Current limit 2/
ICL
1
1
03
0.5
1.8
A
V
DIFF = 5 V, TA = +25°C
0.15
0.65
VDIFF = 40 V, TA = +25°C
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
13
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
VDIFF = 3.0 V
Min
Max
Cases M, N, T, U, Y, Z
Reference voltage
VREF
1
03
-1.275
-1.30
-1.225
-1.20
V
2,3
1
VDIFF = 40 V
-1.275
-1.30
-1.225
-1.20
2,3
Line regulation
RLINE
1
03
03
mV
mV
3.0 V ≤ VDIFF ≤ 40 V
±9
2,3
±23
±25
Load regulation 1/
RLOAD
VDIFF = 5 V,
1,2,3
8 mA ≤ IL ≤ 1.5 A
VDIFF = 12 V,
1
1
±25
±25
±25
±5
8 mA ≤ IL ≤ 1.5 A
VDIFF = 40V,
8 mA ≤ IL ≤ 200 mA
VDIFF = 40 V,
2,3
1
8 mA ≤ IL ≤ 100 mA
VIN = -14.6 V,
IL = 1.5 A,
Thermal regulation
VRTH
03
mV
PD = 20 watts, t = 10 ms,
TA = +25°C
Ripple rejection 2/
RN
4,5,6
03
03
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ
VDIFF = 3.0 V
1,2,3
1,2,3
1,2,3
100
100
±5
µA
VDIFF = 40 V
Adjustment pin current
change
03
∆IADJ
(line)
3.0 V ≤ VDIFF ≤ 40 V
µA
VDIFF = 5.0 V,
1,2,3
∆IADJ
±5
(load)
8 mA ≤ IL ≤ 1.5 A
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
14
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases M, N, T, U, Y, Z - Continued.
Minimum load current
ILMIN
VDIFF = 3.0 V,
1,2,3
1,2,3
1,2,3
03
3
3
5
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
OUT = -1.4 V (forced)
V
V
Current limit 2/
ICL
VDIFF = 5 V
1,2,3
1
03
04
1.5
3.5
1.2
A
VDIFF = 40 V
0.24
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
1
2,3
1
-1.275
-1.300
-1.275
-1.300
-1.275
-1.300
-1.225
-1.200
-1.225
-1.200
-1.225
-1.200
V
VDIFF = 40 V
2,3
1
VDIFF = 50 V
2,3
Line regulation
RLINE
1
2,3
1
04
04
mV
mV
3.0 V ≤ VDIFF ≤ 50 V
±10
±25
±25
Load regulation 1/
RLOAD
VDIFF = 50 V,
8 mA ≤ IL ≤ 100 mA
VDIFF = 5.0 V,
1
2,3
1
±31
±50
±2
8 mA ≤ IL ≤ 500 mA
VIN = -16.25 V,
IL = 330 mA,
Thermal regulation
VRTH
04
04
mV
dB
PD = 5 watts, t = 10 ms, TA
= +25°C
Ripple rejection 2/
RN
4,5,6
66
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
15
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases X, 2, 5, and 6 - Continued.
Adjustment pin current
IADJ-1
VDIFF = 3.0 V
VDIFF = 40 V
VDIFF = 50 V
1,2,3
1,2,3
1,2,3
1,2,3
04
04
100
100
100
±5
µA
IADJ-2
IADJ-3
∆IADJ
Adjustment pin current
change
VDIFF = 5.0 V,
µA
8 mA ≤ IOUT ≤ 200 mA
IL = 8 mA,
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
±6
3
3.0 V ≤ VDIFF ≤ 50 V
VDIFF = 3.0 V,
Minimum load current
ILMIN
04
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
OUT = -1.4 V (forced)
VDIFF = 50 V,
OUT = -1.4 V (forced)
3
V
5
V
5
V
Current limit 2/
ICL
VDIFF = 5 V
1,2,3
1
04
04
0.5
0.1
1.8
A
V
VDIFF = 50 V
0.65
Cases M, N, T, U, Y, Z
Reference voltage
VREF
VDIFF = 3.0 V
1
-1.275 -1.225
-1.300 -1.200
-1.275 -1.225
-1.300 -1.200
2,3
1
VDIFF = 50 V
2,3
Line regulation
RLINE
1
2,3
1
04
04
mV
mV
3.0 V ≤ VDIFF ≤ 50 V
±10
±25
±25
Load regulation 1/
RLOAD
VDIFF = 50 V,
8 mA ≤ IL ≤ 110 mA
VDIFF = 5.0 V,
1
±25
±45
2,3
8 mA ≤ IL ≤ 1.5 A
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
16
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Case M, N, T, U, Y, Z - Continued.
Thermal regulation
VRTH
VIN = -14.6 V,
1
04
mV
±5
IL = 1.5 A,
PD = 20 watts, t = 10 ms,
TA = +25°C
Ripple rejection 2/
RN
4,5,6
04
04
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ-1
IADJ-2
IADJ-3
∆IADJ
VDIFF = 3.0 V
VDIFF = 40 V
VDIFF = 50 V
1,2,3
1,2,3
1,2,3
1,2,3
100
100
100
±5
µA
Adjustment pin current
change
VDIFF = 5.0 V,
04
04
µA
8 mA ≤ IOUT ≤ 1.5 A
IL = 8 mA,
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
±6
3
3.0 V ≤ VDIFF ≤ 50 V
VDIFF = 3.0 V,
Minimum load current
ILMIN
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
OUT = -1.4 V (forced)
VDIFF = 50 V,
OUT = -1.4 V (forced)
3
V
5
V
5
V
Current limit 2/
ICL
VDIFF = 5 V
1,2,3
1
04
05
1.5
0.2
3.5
1.0
A
V
VDIFF = 50 V
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
1.238
1.225
1.225
1.262
1.270
1.270
2,3
1,2,3
See footnotes at the end table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
17
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Min Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Cases X, 2, 5, and 6 - Continued.
Line regulation
RLINE
VOUT = VREF
3.0 V ≤ VDIFF ≤ 40 V
VOUT = VREF
,
1
2,3
1
05
05
mV
±4.5
±9
,
3.3 V ≤ VDIFF ≤ 40 V
VDIFF = 3 V,
Load regulation 1/
RLOAD
mV
±15
±15
±15
±15
±2
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
10 mA ≤ IL ≤ 500 mA
VDIFF = 40 V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
1
10 mA ≤ IL ≤ 100 mA
VIN = +14.6 V,
Thermal regulation
VRTH
05
mV
IL = 300 mA,
PD = 4 watts, t = 20 ms,
TA = +25°C
Ripple rejection 2/
RN
4,5,6
05
05
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
100
100
100
±5
µA
Adjustment pin current
change
VDIFF = 3 V,
05
∆IADJ
µA
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
±5
±5
±5
10 mA ≤ IL ≤ 500 mA
VDIFF = 40 V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 100 mA
3.0 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 40 V
1
±5
±5
2,3
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
18
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases X, 2, 5, and 6 - Continued.
Minimum load current ILMIN
VDIFF = 3.0 V,
1
05
5
5
5
mA
V
OUT = 1.4 V (forced)
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
OUT = 1.4 V (forced)
2,3
V
1,2,3
V
Current limit 2/
ICL
VDIFF = 15 V
1,2,3
1
05
05
0.5
1.65
0.65
A
V
VDIFF = 40 V
0.15
Cases M, N, T, U, Y, Z
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
1.238
1.225
1.225
1.262
1.270
1.270
±4.5
Line regulation
RLINE
VOUT = VREF
3.0 V ≤ VDIFF ≤ 40 V
VOUT = VREF
,
05
05
mV
mV
,
2,3
1
±9
3.3 V ≤ VDIFF ≤ 40 V
VDIFF = 3 V,
Load regulation 1/
RLOAD
±15
±15
±15
±15
±5
10 mA ≤ IL ≤ 1.5 A
VDIFF = 3.3 V,
2,3
1
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
10 mA ≤ IL ≤ 300 mA
VDIFF = 40 V,
2,3
1
10 mA ≤ IL ≤ 195 mA
VIN = +14.6 V,
Thermal regulation
VRTH
05
mV
IL = 1.5 A,
PD = 20 watts, t = 20 ms,
TA = +25°C
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
19
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
66
Max
Cases M, N, T, U, Y, Z - Continued.
Ripple rejection 2/
RN
4,5,6
05
05
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
1
2,3
1,2,3
1
100
100
100
±5
µA
µA
Adjustment pin current
change
VDIFF = 3 V,
05
∆IADJ
10 mA ≤ IL ≤ 1.5 A
VDIFF = 3.3 V,
2,3
1
±5
±5
±5
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
10 mA ≤ IL ≤ 300 mA
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 195 mA
3.0 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 40 V
VDIFF = 3.0 V,
1
2,3
1
±5
±5
5
Minimum load current
ILMIN
05
mA
V
OUT = 1.4 V (forced)
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
OUT = 1.4 V (forced)
2,3
5
5
V
1,2,3
V
Current limit 2/
ICL
VDIFF = 15 V
1,2,3
1
05
06
1.50
0.18
3.50
1.5
A
V
VDIFF = 40 V
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 40 V
1
-1.262 -1.238
-1.280 -1.220
-1.280 -1.220
2,3
1,2,3
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
20
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Min Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Cases X, 2, 5, and 6 - Continued.
Line regulation
RLINE
1
06
06
mV
3.0 V ≤ VDIFF ≤ 40 V
±4.5
±13.8
±25
2,3
Load regulation 1/
RLOAD
VDIFF = 5 V,
1,2,3
mV
8 mA ≤ IL ≤ 200 mA
VDIFF = 15 V,
1,2,3
1
±25
±25
±50
±2
8 mA ≤ IL ≤ 200 mA
VDIFF = 40 V,
8 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
1
8 mA ≤ IL ≤ 50 mA
VIN = -16.25 V,
Thermal regulation
VRTH
06
mV
IL = 330 mA, TA = +25°C
PD = 5 watts, t = 10 ms
Ripple rejection 2/
RN
4,5,6
06
06
06
66
dB
µA
µA
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ
VDIFF = 3.0 V
1,2,3,
1,2,3
1,2,3
100
100
±5
VDIFF = 40 V
Adjustment pin current
change
∆IADJ
(line)
3.0 V ≤ VDIFF ≤ 40 V
V
DIFF = 5.0 V,
1,2,3
1,2,3
1,2,3
1,2,3
∆IADJ
(load)
ILMIN
±5
3
8 mA ≤ IL ≤ 500 mA
Minimum load current
VDIFF = 3.0 V,
06
06
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
3
V
5
VOUT = -1.4 V (forced)
Current limit 2/
ICL
1
1
0.5
1.8
A
VDIFF = 5 V, TA = +25°C
0.15
0.65
VDIFF = 40 V, TA = +25°C
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
21
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
VDIFF = 3.0 V
Min
Max
Cases M, N, T, U, Y, Z
Reference voltage
VREF
1
06
-1.262
-1.280
-1.280
-1.238
-1.220
-1.220
V
2,3
VDIFF = 40 V
1,2,3
Line regulation
RLINE
1
06
06
mV
mV
3.0 V ≤ VDIFF ≤ 40 V
±4.5
±13.8
±25
2,3
Load regulation 1/
RLOAD
VDIFF = 5 V,
1,2,3
8 mA ≤ IL ≤ 1.5 A
VDIFF = 12 V,
1
1
±25
±25
±50
±5
8 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
8 mA ≤ IL ≤ 200 mA
VDIFF = 40 V,
2,3
1
8 mA ≤ IL ≤ 100 mA
VIH = -14.6 V,
Thermal regulation
VRTH
06
mV
IL = 1.5 A,
PD = 20 watts, t = 10 ms,
TA = +25°C
Ripple rejection 2/
RN
4,5,6
06
06
06
66
dB
µA
µA
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ
VDIFF = 3.0 V
1,2,3,
1,2,3
1,2,3
100
100
±5
VDIFF = 40 V
Adjustment pin current
change
∆IADJ
(line)
3.0 V ≤ VDIFF ≤ 40 V
V
DIFF = 5.0 V,
1,2,3
1,2,3
1,2,3
1,2,3
∆IADJ
(load)
ILMIN
±5
3
8 mA ≤ IL ≤ 1.5 A
Minimum load current
VDIFF = 3.0 V,
06
06
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
OUT = -1.4 V (forced)
VDIFF = 5 V
3
V
5
V
Current limit 2/
ICL
1,2,3
1
1.5
3.5
1.2
A
0.24
VDIFF = 40 V, TA = +25°C
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
22
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
VDIFF = 60 V
1
07
07
07
1.238
1.225
1.225
1.225
1.262
1.27
1.27
1.27
±4.5
V
2,3
1,2,3
1,2,3
1
Line regulation 3/
RLINE
VOUT = VREF
mV
mV
3.0 V ≤ VDIFF ≤ 40 V
VOUT = VREF
2,3
±9
3.3 V ≤ VDIFF ≤ 40 V
VOUT = VREF
1
2,3
1
±2.5
±4.0
±15
40 V ≤ VDIFF ≤ 60 V
VDIFF = 3 V,
Load regulation 1/
RLOAD
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
±15
±15
±15
±15
±2
10 mA ≤ IL ≤ 500 mA
VDIFF = 40 V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
1,2,3
1
10 mA ≤ IL ≤ 100 mA
VDIFF = 60 V,
10 mA ≤ IL ≤ 20 mA
VIN = 14.6 V,
Thermal regulation
VRTH
07
mV
IL = 300 mA,
PD = 4 watts, t = 20 ms,
TA = +25°C
Ripple rejection 2/
RN
4,5,6
07
07
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF,
IOUT = 100 mA
VDIFF = 3.0 V
VDIFF = 3.3 V
VDIFF = 40 V
VDIFF = 60 V
Adjustment pin current
IADJ
1
100
100
100
100
µA
2,3
1,2,3
1,2,3
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
23
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases X, 2, 5, and 6 - Continued.
Adjustment pin current
change
V
DIFF = 3 V,
1
07
∆IADJ
±5
±5
±5
±5
µA
10 mA ≤ IL ≤ 500 mA
VDIFF = 3.3 V,
2,3
1
10 mA ≤ IL ≤ 500 mA
VDIFF = 40 V,
10 mA ≤ IL ≤ 150 mA
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 100 mA
3.0 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 60 V
VDIFF = 3.0 V,
1
2,3
1,2,3
1
±5
±5
±5
5
Minimum load current
ILMIN
07
mA
V
OUT = 1.4 V (forced)
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
OUT = 1.4 V (forced)
VDIFF = 60 V,
OUT = 1.4 V (forced)
2,3
5
5
7
V
1,2,3
1,2,3
V
V
Current limit 2/
ICL
VDIFF = 5 V
VDIFF = 40 V
VDIFF = 60 V
1,2,3
07
07
0.50
0.15
0.02
1.65
0.65
0.28
A
V
1
1
Cases M, N, T, U, Y, Z, 4 4/ 5/
Reference voltage
VREF
VDIFF = 3.0 V
1
1.238
1.262
M,D,P,L,R
1
1.238
1.225
1.262
1.27
VDIFF = 3.3 V
VDIFF = 40 V
2,3
1,2,3
1.225
1.27
M,D,P,L,R
M,D,P,L,R
1
1.225
1.225
1.27
1.27
VDIFF = 60 V
1,2,3
1
1.225
1.27
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
24
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Min Max
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Cases M, N, T, U, Y, Z, 4 – Continued 4/ 5/
Line regulation 3/
RLINE
VOUT = VREF
1
07
mV
±4.5
3.0 V ≤ VDIFF ≤ 40 V
M,D,P,L,R
1
±4.5
±9
VOUT = VREF
2,3
3.3 V ≤ VDIFF ≤ 40 V
VOUT = VREF
1
2,3
1
±5
±10
±5
40 V ≤ VDIFF ≤ 60 V
M,D,P,L,R
Load regulation 1/
RLOAD
VDIFF = 3 V,
1
07
mV
±15
10 mA ≤ IL ≤ 1.5 A
M,D,P,L,R
1
±15
±15
VDIFF = 3.3 V,
2,3
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
1
±15
10 mA ≤ IL ≤ 300 mA
M,D,P,L,R
1
±15
±15
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 195 mA
VDIFF = 60 V,
1,2,3
±15
10 mA ≤ IL ≤ 30 mA
M,D,P,L,R
1
1
±15
±5
Thermal regulation
VRTH
VIN = 14.6 V,
IL = 1.5 A,
07
mV
PD = 20 watts, t = 20 ms,
TA = +25°C
M,D,P,L,R
1
±5
Ripple rejection 2/
RN
4,5,6
07
07
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF,
IOUT = 100 mA
VDIFF = 3.0 V
Adjustment pin current
IADJ
1
1
100
100
100
100
100
100
100
µA
M,D,P,L,R
VDIFF = 3.3 V
VDIFF = 40 V
2,3
1,2,3
1
M,D,P,L,R
M,D,P,L,R
VDIFF = 60 V
1,2,3
1
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
25
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases M, N, T, U, Y, Z, 4 – Continued 4/ 5/
Adjustment pin current
change
V
DIFF = 3 V,
1
07
∆IADJ
±5
µA
10 mA ≤ IL ≤ 1.5 A
M,D,P,L,R
1
±5
±5
VDIFF = 3.3 V,
2,3
10 mA ≤ IL ≤ 1.5 A
VDIFF = 40 V,
1
±5
10 mA ≤ IL ≤ 300 mA
M,D,P,L,R
1
±5
±5
VDIFF = 40 V,
2,3
10 mA ≤ IL ≤ 195 mA
3.0 V ≤ VDIFF ≤ 40 V
1
1
±5
±5
±5
±5
±5
5
M,D,P,L,R
2,3
1,2,3
1
3.3 V ≤ VDIFF ≤ 40 V
3.3 V ≤ VDIFF ≤ 60 V
M,D,P,L,R
Minimum load current
ILMIN
VDIFF = 3.0 V,
OUT = 1.4 V (forced)
M,D,P,L,R
1
07
mA
V
1
5
5
VDIFF = 3.3 V,
OUT = 1.4 V (forced)
VDIFF = 40 V,
2,3
V
1,2,3
5
VOUT = 1.4 V (forced)
M,D,P,L,R
1
5
7
VDIFF = 60 V,
1,2,3
VOUT = 1.4 V (forced)
M,D,P,L,R
M,D,P,L,R
M,D,P,L,R
M,D,P,L,R
1
7
Current limit 2/
ICL
VDIFF = 5 V
VDIFF = 40 V
VDIFF = 60 V
1,2,3
07
1.50
1.50
0.3
3.5
A
1
1
1
1
1
3.5
1.5
0.3
1.5
0.50
0.50
0.05
0.05
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
26
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases X, 2, 5, and 6
Reference voltage
VREF
VDIFF = 3.0 V
1
2,3
1
08
-1.262
-1.28
-1.28
-1.28
-1.28
-1.28
-1.235
-1.22
-1.22
-1.22
-1.22
-1.22
±10
V
VDIFF = 40 V
2,3
1
VDIFF = 50 V
2,3
1
Line regulation
RLINE
08
08
mV
mV
3.0 V ≤ VDIFF ≤ 50 V
2,3
1
±25
Load regulation 1/
RLOAD
VDIFF = 50 V,
±25
8 mA ≤ IL ≤ 100 mA
VDIFF = 5.0 V,
1
2,3
1
±31
±50
±2
8 mA ≤ IL ≤ 500 mA
VIN = -16.25 V,
Thermal regulation
VRTH
08
mV
IL = 330 mA, TA = +25°C,
PD = 5 watts, t = 10 ms
Ripple rejection 2/
RN
4,5,6
08
08
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ-1
IADJ-2
IADJ-3
∆IADJ
VDIFF = 3.0 V
VDIFF = 40 V
VDIFF = 50 V
1,2,3
1,2,3
1,2,3
1,2,3
100
100
100
±5
µA
Adjustment pin current
change
VDIFF = 5 V,
08
08
µA
8 mA ≤ IOUT ≤ 200 mA
IL = 8 mA,
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
±6
3
3.0 V ≤ VDIFF ≤ 50 V
VDIFF = 3.0 V,
Minimum load current
ILMIN
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
OUT = -1.4 V (forced)
VDIFF = 50 V,
OUT = -1.4 V (forced)
3
V
5
V
5
V
Current limit 2/
ICL
VDIFF = 5 V
1,2,3
1
08
0.5
0.1
1.8
A
VDIFF = 50 V
0.65
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
27
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Conditions
-55°C ≤ TA ≤ +125°C
Group A
subgroups
Device
type
Limits
Unit
Test
Symbol
IL = 8 mA
unless otherwise specified
Min
Max
Cases M, N, T, U, Y, Z
Reference voltage
VREF
VDIFF = 3.0 V
1
2,3
1
08
-1.262
-1.28
-1.28
-1.28
-1.238
-1.22
-1.22
-1.22
±6
V
VDIFF = 50 V
2,3
1
Line regulation
RLINE
08
08
mV
mV
3.0 V ≤ VDIFF ≤ 50 V
2,3
1
±20
Load regulation 1/
RLOAD
VDIFF = 50 V,
±25
8 mA ≤ IL ≤ 110 mA
VDIFF = 5.0 V,
1
2,3
1
±25
±50
±5
8 mA ≤ IL ≤ 1.5 A
VIN = -14.6 V,
Thermal regulation
VRTH
08
mV
IL = 1.5 A,
PD = 20 watts, t = 10 ms,
TA = +25°C
Ripple rejection 2/
RN
4,5,6
08
08
66
dB
f = 120 Hz, CADJ = 10 µF,
VOUT = VREF
Adjustment pin current
IADJ-1
IADJ-2
IADJ-3
∆IADJ
VDIFF = 3.0 V
VDIFF = 40 V
VDIFF = 50 V
1,2,3
1,2,3
1,2,3
1,2,3
100
100
100
±5
µA
Adjustment pin current
change
VDIFF = 5 V,
08
08
µA
8 mA ≤ IOUT ≤ 1.5 A
IL = 8 mA,
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
±6
3
3.0 V ≤ VDIFF ≤ 50 V
VDIFF = 3.0 V,
Minimum load current
ILMIN
mA
V
OUT = -1.4 V (forced)
VDIFF = 10 V,
OUT = -1.4 V (forced)
VDIFF = 40 V,
OUT = -1.4 V (forced)
VDIFF = 50 V,
OUT = -1.4 V (forced)
3
V
5
V
5
V
Current limit 2/
ICL
VDIFF = 5 V
1,2,3
1
08
1.5
0.2
3.5
1.0
A
VDIFF = 50 V
See footnotes at end of table.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
28
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
1/ Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in
output voltage due to heating effects are covered under the specification for thermal regulation. With exception of
cases U, 2, and 4, all output measurements are referenced to the case. Measurements taken at the output lead must be
adjusted for lead resistance.
2/ If not tested, shall be guaranteed to the specified limits in table herein.
3/ To determine the line regulation limits for 3.0 V < V
< 60 V (or 3.3 V ≤ V
≤ 60 V) add the limits for
DIFF
DIFF
3.0 V < V
< 40 V (or 3.3 V ≤ V
≤ 40 V) to the limits for 40 V < V
< 60 V.
DIFF
DIFF
DIFF
4/ Device types 02 and 07 with case outline U supplied to this drawing have been characterized through all levels M, D, P, L,
and R of irradiation. However, these devices are only tested at the ‘R’ level. Pre and post irradiation values are identical
unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level,
T
= +25°C.
A
5/ These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019 condition A.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
29
DSCC FORM 2234
APR 97
Case outline M
Device types
Terminal number
All
Terminal symbol
VOUT
1
2
3
ADJUST
VIN
CASE
ISOLATED
Symbol
Inches
Millimeters
Min
.160
.080
Max
---
---
Min
4.06
2.03
Max
---
---
A
A2
b
---
.035
---
0.89
C
D
E
.020
---
---
---
.425
.425
0.51
---
---
---
10.8
10.8
e
.200 BSC
5.08 BSC
2.54 BSC
e1
L
L1
.100 BSC
.350
---
---
.135
8.89
---
---
3.43
NOTES:
1. Dimensions shall be measured in inches.
2. Metric equivalents are given for general information only.
3. Three leads.
FIGURE 1. Case outlines and terminal connections.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
X
30
DSCC FORM 2234
APR 97
Case outline N
Device types
01, 02, 05, 07
03, 04, 06, 08
Case outline
N
Terminal number
Terminal symbol
ADJUST
INPUT
1
2
3
ADJUST
OUTPUT
INPUT
OUTPUT
Symbol
Min
Inches
Millimeters
Max
Min
3.30
0.25
9.40
10.41
3.43
3.86
15.75
11.30
0.76
1.14
0.89
Max
3.81
0.51
9.65
10.67
3.68
4.11
16.00
11.55
---
A
A1
B
.130
.010
.370
.410
.135
.152
.620
.445
.030
.045
.035
.150
.020
.380
.420
.145
.162
.630
.455
---
B1
B2
B3
D
E
e
S
S1
.055
.045
1.40
1.14
NOTE:
The U.S. government preferred system of measurement is the metric SI system. However, since this item was
originally designed using inch-pound units of measurement, in the event of conflict between the metric and
inch-pound units, the inch-pound units shall take precedence.
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
31
DSCC FORM 2234
APR 97
Case outlines T and U
Device types
Case outlines
01, 02, 05, 07
01, 02, 05, 07
U
03, 04, 06, 08
T
T
U
Terminal number
Terminal symbol
1
2
3
4
ADJUST
VOUT
VIN
VOUT
ADJUST
VOUT
VIN
ADJUST
VIN
VOUT
VIN
ADJUST
VIN
VOUT
NC
NC
FIGURE 1. Case outlines and terminal connections - Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
32
DSCC FORM 2234
APR 97
Case outlines T and U
Symbol
Inches
Max
.200
.045
.120 BSC
.035
Millimeters
3.05 BSC
Min
.190
.035
Min
4.83
0.89
Max
5.08
1.14
A
A1
A2
φb
D
D1
D3
e
E
L
O
φP
.025
.645
.410
.000
0.64
16.38
10.41
0.00
0.89
16.89
10.92
1.65
.665
.430
.065
.100 BSC
.422
2.54 BSC
.410
.500
.527
.140
10.41
12.70
13.39
3.56
10.71
19.05
13.64
3.81
.750
.537
.150
NOTES:
1. Dimensions shall be measured in inches.
2. Metric equivalents are given for general information only.
3. For case outlines T and U only, CAGE 34333, the ceramic seal that protrudes from the seating plane is not to be
considered in overall package dimensions. The ceramic seal protrusion is considered uncontrolled within an
area 30 mils from the seating plane.
FIGURE 1. Case outlines and terminal connections - Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
33
DSCC FORM 2234
APR 97
Case outline X
Device types 01, 02, 05, and 07
Device types 03, 04, 06, and 08
Bottom view
Bottom view
FIGURE 1. Case outlines and terminal connections - Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
34
DSCC FORM 2234
APR 97
Case outline X
Symbol
Inches
Millimeters
Notes
Min
.165
.100
.016
.016
.335
.305
Max
.195
---
.019
.021
.370
.335
Min
4.19
2.54
0.41
0.41
8.51
7.75
Max
4.95
---
0.48
0.53
9.40
8.51
A
A1
φb
φb1
φD
φD1
e
e1
F
k
k1
k2
L
L1
L2
α
7
3
3
.200 BSC
.100 BSC
5.08 BSC
2.54 BSC
5
5
---
.050
.034
.045
.041
---
---
0.71
0.74
0.23
12.70
---
1.27
0.86
1.14
1.04
---
.028
.029
.009
.500
---
4
5
.050
---
1.27
---
.250
6.35
45° T.P.
45° T.P.
NOTES:
1. Dimensions shall be measured in inches.
2. Metric equivalents are given for general information only.
3. φb applies between L1 and beyond .500 inch (12.70 mm) from the seating plane (two
leads). Diameter is uncontrolled in L1 and beyond .500 inch (12.70 mm) from the seating
plane.
4. Two leads.
5. Two holes.
6. Two holes located at true position within diameter .010 inch (0.25 mm).
7. Leads having a maximum diameter of .043 inch (1.09 mm) measured in gauging plane .054
inch (1.37 mm) ± .001 (0.03 mm) .000 inch (0.00 mm) below the seating plane shall be
located at true position within diameter .014 inch (0.36 mm).
8. The mounting surface of the header shall be flat to convex within .003 inch (0.08 mm) inside
a .930 inch (23.62 mm) diameter circle on the center of the header and flat to convex within
.006 inch (0.15 mm) overall.
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
77034
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
35
DSCC FORM 2234
APR 97
Case outline Y
Device types 01, 02, 05, and 07
Device types 03, 04, 06, and 08
Bottom view
Bottom view
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
36
DSCC FORM 2234
APR 97
Case outline Z
Device types 03, 04, 06, and 08
Device types 01, 02, 05, and 07
Bottom view
Bottom view
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
37
DSCC FORM 2234
APR 97
Case outline 4
Device type
07
Terminal symbol
ADJUST
VOUT
Terminal number
1
2
3
VIN
Symbol
Inches
Millimeters
Min
.190
---
.410
.580
---
Max
.210
.030
.430
.610
.100
.200
.420
.110
.125
Min
4.83
---
10.41
14.73
---
Max
5.33
0.76
10.92
15.49
2.54
5.08
10.67
2.79
3.18
A
b
D
D1
e
e1
E
L1
L
N
---
---
.410
.090
.115
3
10.41
2.29
2.92
3
NOTE:
The U.S. government preferred system of measurement is the metric SI system. However, since this item was
originally designed using inch-pound units of measurement, in the event of conflict between the metric and
inch-pound units, the inch-pound units shall take precedence.
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
38
DSCC FORM 2234
APR 97
Case outline 5
Device types 01, 02, 05, 07
NOTES:
1. Dimensions are in inches. Metric equivalents are given for information only.
2. Pins 4, 5 - Adjust
Pins 6, 7, 8, 9, 10, 11, 12, 13 - VIN
Pins 1, 2, 15, 16, 17, 18 - VOUT
Pins 3, 14 - no connect
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
77034
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
39
DSCC FORM 2234
APR 97
Case outline 6
Device types 03, 04, 06, 08
NOTES:
1. Dimensions are in inches. Metric equivalents are given for information only.
2. Pins 4, 5 - Adjust
Pins 6, 7, 8, 9, 10, 11, 12, 13 - VOUT
Pins 1, 2, 15, 16, 17, 18 - VIN
Pins 3, 14 - no connect
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
77034
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
40
DSCC FORM 2234
APR 97
Case outlines 5 and 6
Symbol
Inches
Millimeters
Min
.095
.020
.280
Max
.115
.030
.295
Min
Max
2.92
0.76
7.49
A
B
2.42
0.51
7.12
D
D1
E
.025 BSC
.345 .360
0.635 BSC
8.77
9.14
E1
e
.008 BSC
.050 BSC
0.203 BSC
1.27 BSC
1.02
L1
L2
Q1
Q2
Q3
S1
S2
.040
.055
.065
.080
.130
.055
1.39
1.65
2.03
3.30
1.39
.055
.070
.120
.045
1.40
1.78
3.05
1.15
.105 REF
.120 REF
2.67 REF
3.05 REF
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
41
DSCC FORM 2234
APR 97
Device types
01, 05
02, 07
03, 06
04, 08
Case outline
2
Terminal number
Terminal symbol
NC
NC
1
2
VOUT SENSE (see note)
NC
VOUT
VOUT SENSE
(see note)
NC
VIN
NC
3
4
NC
NC
NC
NC
NC
NC
NC
5
VIN
NC
NC
NC
6
NC
NC
NC
NC
7
NC
NC
NC
NC
8
NC
NC
NC
NC
9
NC
ADJUST
NC
NC
NC
VIN
VOUT
NC
NC
VIN
NC
NC
NC
NC
ADJUST
NC
10
11
12
13
14
15
16
17
18
19
20
NC
NC
NC
NC
NC
NC
NC
NC
NC
VOUT
VOUT
NC
NC
NC
NC
NC
NC
VIN
VOUT
VOUT SENSE (see note)
NC
NC
NC
ADJUST
NC
ADJUST
NC
NC
NC
NC
VOUT
VIN
NOTE: For normal operation, the VOUT SENSE pin must be connected externally to the load.
FIGURE 1. Case outlines and terminal connections – Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
77034
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
42
DSCC FORM 2234
APR 97
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device
class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for
device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a. Tests shall be as specified in table IIA herein.
b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
43
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requirements.
Test requirements
Subgroups
Subgroups
(in accordance with
(in accordance with
MIL-STD-883,
MIL-PRF-38535, table III)
method 5005, table I)
Device
class M
Device
class Q
Device
class V
Interim electrical
parameters (see 4.2)
---
---
---
1,2,3,4,5,6 1/ 2/
1,2,3
Final electrical
parameters (see 4.2)
1,2,3,4,5,6 1/ 2/
1,2,3,4,5,6 1/ 2/
Group A test
1,2,3
1,2,3
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
1
1
1
1
1
1
1,2,3 3/
1,2,3
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
1
1/ PDA applies to subgroup 1.
2/ Subgroups 4, 5, and 6, if not tested, shall be guaranteed to the limits specified in table I.
3/ Delta limits as specified in table IIB shall be required where specified and the delta limits shall
be computed with reference to the previous end-point electrical parameter
TABLE IIB. Group C delta limits at +25°C.
Test
Device type
Case outline
Limit
Unit
Min
Max
03,04
03,04
03
X, Y
X, Y
X, Y
X, Y
V
±0.01
V
REF
mV
±4
R
LINE
±10
±10
µA
I
ADJ
04
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b. TA = +125°C, minimum.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-
STD-883.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
44
DSCC FORM 2234
APR 97
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness
assured (see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-PRF-38535. End-point
parameters shall be as specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019, condition A and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)
692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
SIZE
STANDARD
77034
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
X
SHEET
45
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 06-01-30
Approved sources of supply for SMD 77034 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
21845
69210
21845
69210
U3158
21845
69210
34333
U3158
21845
3/
34333
69210
U3158
3/
34333
3/
Vendor
similar
PIN 2/
Reference
military specification
PIN
7703401MA
SDP117MMD
OM1320SMM
SDP117NMD
OM1320NMM
IP117G-DESC
SDP117TMD
OM1320NTM
SG117G/883B
IP117IG-DESC
SDP117UMD
FM117S7/883
SG117IG/883B
OM1320STM
IP117MH-DESC
LM117H/883B
SG117T/883B
LM117H/883B
SDP117XMD
IP117K-DESC
LM117K/883
7703401NA
7703401TA
7703401UA
7703401XA
7703401YA
M38510/11703BXX
M38510/11704BYX
21845
U3158
3/
34333
3/
SG117K/883B
LM117K/883B
OM1320NKM
SDP117YMD
IP117R-DESC
SG117R/883B
UC117L/883BC
SDP1172MD
SG117L/883B
OM1320N2M
IP117E
SDP117HVMMD
OM1321SMM
SDP117HVNMD
OM1321NMM
IP117HVG-DESC
SDP117HVTMD
OM1321STM
IP117HVIG-DESC
SDP117HVUMD
FM117HVS7/883
OM1321NTM
IP117MHVH-DESC
LM117HVH/883B
OM1321NHM
SDP117HVXMD
69210
21845
U3158
34333
3/
7703401ZA
77034012A
21845
34333
69210
U3158
21845
69210
21845
69210
U3158
21845
69210
U3158
21845
3/
77034015A
7703402MA
7703402NA
7703402TA
7703402UA
7703402XA
69210
U3158
3/
69210
21845
See footnotes at end of table.
1 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
U3158
3/
Vendor
similar
PIN 2/
Reference
military specification
PIN
7703402YA
IP117HVK-DESC
LM117HVK/883
LM117HVK/883B
OM1321NKM
SDP117HVYMD
IP117HVR-DESC
SDP117HV2MD
OM1321N2M
IP117HVE
3/
69210
21845
U3158
21845
69210
U3158
21845
69210
21845
69210
U3158
21845
69210
U3158
21845
3/
7703402ZA
77034022A
77034025A
7703403MA
SDP137MMD
OM1322SMM
SDP137NMD
OM1322NMM
IP137G-DESC
SDP137TMD
OM1322NTM
IP137IG-DESC
SDP137UMD
FM137S7/883
SG137IG/883B
OM1322STM
IP137MH-DESC
LM137H/883B
SG137T/883B
LM137H/883B
SDP137XMD
IP137K-DESC
LM137K/883B
SG137K/883B
LM137K-883B
OM1322NKM
SDP137YMD
IP137R-DESC
SG137R/883B
SDP1372MD
7703403NA
7703403TA
7703403UA
7703403XA
7703403YA
3/
69210
U3158
27014
34333
3/
21845
U3158
27014
3/
M38510/11803BXX
M38510/11804BYX
3/
69210
21845
U3158
3/
7703403ZA
77034032A
21845
34333
69210
U3158
21845
69210
21845
69210
U3158
21845
69210
U3158
21845
3/
69210
U3158
27014
3/
21845
U3158
27014
3/
SG137L/883B
OM1322N2M
IP137E
77034036A
7703404MA
SDP137HVMMD
OM1323SMM
SDP137HVNMD
OM1323NMM
IP137HVG-DESC
SDP137HVTMD
OM1323NTM
IP137HVIG-DESC
SDP137HVUMD
FM137HV/883
OM1323STM
IP137HVH-DESC
LM137HVH/883
LM137HVH/883
SDP137HVXMD
IP137HVK-DESC
LM137HVK/883
LM137HVK/883B
OM1323NKM
SDP137HVYMD
7703404NA
7703404TA
7703404UA
7703404XA
7703404YA
69210
21845
See footnotes at end of table.
2 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
U3158
21845
69210
U3158
3/
69210
3/
69210
U3158
3/
Vendor
similar
PIN 2/
Reference
military specification
PIN
7703404ZA
77034042A
IP137HVR-DESC
SDP137HV2MD
OM1323N2M
IP137HVE
77034046A
7703405MA
SDP117AMMD
OM1324SMM
SDP117ANMD
OM1324NMM
IP117AG-DESC
SDP117ATMD
OM1324NTM
SG117AG/883B
IP117AIG-DESC
SDP117AUMD
FM117AS7
7703405NA
7703405TA
69210
34333
U3158
3/
7703405UA
3/
34333
69210
U3158
34333
3/
SG117AIG/883B
OM1324STM
IP117MAH-DESC
SG117AT/883B
LT117AH/883B
SDP117AXMD
IP117AK-DESC
SG117AK/883B
LT117AK/883B
OM1324NKM
SDP117AYMD
IP117AR-DESC
SG117AR/883B
UC117AL/883BC
SDP117A2MD
SG117AL/883B
OM1324N2M
IP117AE
SDP137AMMD
OM1325SMM
SDP137ANMD
OM1325NMM
IP137AG-DESC
SDP137ATMD
OM1325NTM
IP137AIG-DESC
SDP137AUMD
FM137AS7
7703405XA
7703405YA
3/
U3158
34333
3/
69210
3/
U3158
34333
3/
7703405ZA
77034052A
3/
34333
69210
U3158
21845
69210
21845
69210
U3158
21845
69210
U3158
21845
3/
77034055A
7703406MA
7703406NA
7703406TA
7703406UA
3/
SG137AIG/883B
OM1325STM
IP137AH-DESC
SG137AT/883B
LT137AH/883B
SDP137AXMD
IP137AK-DESC
SG137AK/883B
LT137AK/883B
OM1325NKM
SDP137AYMD
69210
U3158
34333
3/
21845
U3158
3/
3/
69210
21845
7703406XA
7703406YA
See footnotes at end of table.
3 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
U3158
3/
21845
34333
69210
U3158
3/
69210
3/
69210
U3158
3/
Vendor
similar
PIN 2/
Reference
military specification
PIN
7703406ZA
IP137AR-DESC
SG137AR/883B
SDP137A2MD
SG137AL/883B
OM1325N2M
IP137AE
SDP117AHVMMD
OM1326SMM
SDP117AHVNMD
OM1326NMM
IP117AHVG-DESC
SDP117AHVTMD
OM1326NTM
IP117AHVIG-DESC
SDP117AHVUMD
FM117AHVS7
77034062A
77034066A
7703407MA
7703407NA
7703407TA
69210
U3158
3/
7703407UA
7703407XA
7703407YA
3/
69210
U3158
3/
69210
3/
U3158
3/
69210
3/
U3158
3/
69210
69210
U3158
3/
69210
3/
69210
U3158
3/
OM1326STM
IP117MAHVH-DESC
LT117AHVH/883B
OM1326NHM
SDP117AHVXMD
IP117AHVK-DESC
LT117AHVK/883B
OM1326NKM
SDP117AHVYMD
IP117AHVR-DESC
SDP117AHV2MD
OM1326N2M
OM1326SRM
IP117AHVE
SDP137AHVMMD
OM1327SMM
SDP137AHVNMD
OM1327NMM
IP137AHVG-DESC
SDP137AHVTMD
OM1327NTM
IP137AHVIG-DESC
SDP137AHVUMD
FM137AHV/883
OM1327STM
IP137AHVH-DESC
LT137AHVH/883B
SDP137AHVXMD
IP137AHVK-DESC
LT137AHVK/883B
OM1327NKM
SDP137AHVYMD
IP137AHVR-DESC
SDP137AHV2MD
OM1327N2M
7703407ZA
77034072A
77034074A
77034075A
7703408MA
7703408NA
7703408TA
69210
U3158
3/
7703408UA
3/
69210
U3158
3/
3/
U3158
3/
69210
3/
U3158
3/
69210
U3158
7703408XA
7703408YA
7703408ZA
77034082A
77034086A
IP137AHVE
See footnotes at end of table.
4 of 5
STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued
Standard
microcircuit drawing
PIN 1/
5962-7703404VXA
5962-7703404VYA
5962R7703402MUA
5962R7703407MUA
Vendor
CAGE
number
3/
Vendor
similar
PIN 2/
Reference
military specification
PIN
LM137HVH-QMLV
LM137HVK-QMLV
OMR1321STM/883B
OMR1326STM/883B
3/
3/
3/
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available
from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
U3158
SEMELAB PLC
Coventry Road, Lutterworth,
Leicestershire LE174JB
United Kingdom
21845
27014
Solitron Devices, Incorporated
3301 Electronics Way
West Palm Beach, FL 33407-4697
National Semiconductor
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
34333
69210
Microsemi Integrated Products
11861 Western Avenue
Garden Grove, CA 92841-2119
International Rectifier
205 Crawford Street
Leominster, MA 01453-2353
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
5 of 5
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