AUIRF3808STRL [INFINEON]

HEXFET Power MOSFET; HEXFET功率MOSFET
AUIRF3808STRL
型号: AUIRF3808STRL
厂家: Infineon    Infineon
描述:

HEXFET Power MOSFET
HEXFET功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总13页 (文件大小:225K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97698A  
AUTOMOTIVE GRADE  
AUIRF3808S  
HEXFET® Power MOSFET  
Features  
Advanced Planar Technology  
D
Low On-Resistance  
Dynamic dV/dT Rating  
175°C Operating Temperature  
Fast Switching  
Fully Avalanche Rated  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
VDSS  
75V  
RDS(on) typ.  
5.9m  
7.0m  
G
max.  
S
ID  
106A  
Description  
SpecificallydesignedforAutomotiveapplications,  
this Stripe Planar design of HEXFET® Power  
MOSFETs utilizes the latest processing tech-  
niques to achieve low on-resistance per silicon  
area. This benefit combined with the fast switch-  
ing speed and ruggedized device design that  
HEXFET power MOSFETs are well known for,  
provides the designer with an extremely efficient  
and reliable device for use in Automotive and a  
wide variety of other applications.  
S
D
G
D2Pak  
AUIRF3808S  
G
Gate  
D
S
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are  
stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the  
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
106  
Units  
75  
A
550  
PD @TC = 25°C  
200  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
1.3  
VGS  
EAS  
IAR  
± 20  
Gate-to-Source Voltage  
430  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
mJ  
A
82  
See Fig. 12a, 12b, 15, 16  
5.5  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery  
mJ  
V/ns  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
300  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.75  
40  
Units  
°C/W  
RJC  
Junction-to-Case  
R  
Junction-to-Ambient (PCB Mounted, steady-state)  
–––  
JA  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/29/11  
AUIRF3808S  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Symbol  
V(BR)DSS  
Parameter  
Min. Typ. Max. Units  
Conditions  
VGS = 0V, ID = 250μA  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
75  
–––  
–––  
V
Reference to 25°C, ID = 1.0mA  
VGS = 10V, ID = 82A  
V(BR)DSS/TJ  
RDS(on)  
––– 0.086 ––– V/°C  
–––  
2.0  
5.9  
–––  
–––  
–––  
–––  
–––  
7.0  
4.0  
–––  
20  
m  
V
VDS = VGS, ID = 250μA  
VDS = 25V, ID = 82A  
VGS(th)  
gfs  
IDSS  
Forward Transconductance  
100  
–––  
–––  
–––  
–––  
S
VDS = 75V, VGS = 0V  
VDS = 60V, VGS = 0V, TJ = 150°C  
VGS = 20V  
Drain-to-Source Leakage Current  
μA  
250  
200  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA  
VGS = -20V  
––– -200  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Symbol Parameter Min. Typ. Max. Units  
Qg  
Conditions  
ID = 82A  
Total Gate Charge  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
150  
31  
220  
47  
nC  
VDS = 60V  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
VGS = 10V  
50  
76  
VDD = 38V  
ID = 82A  
16  
–––  
–––  
–––  
–––  
–––  
ns  
140  
68  
td(off)  
tf  
RG = 2.5  
VGS = 10V  
Turn-Off Delay Time  
Fall Time  
120  
4.5  
D
S
LD  
Internal Drain Inductance  
nH Between lead,  
6mm (0.25in.)  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
from package  
and center of die contact  
VGS = 0V  
Ciss  
Input Capacitance  
––– 5310 –––  
pF  
V
DS = 25V  
ƒ = 1.0 MHz, See Fig. 5  
VGS = 0V, VDS = 1.0V, = 1.0MHz  
Coss  
Output Capacitance  
Reverse Transfer Capacitance  
Output Capacitance  
Output Capacitance  
–––  
–––  
890  
130  
–––  
–––  
Crss  
ƒ
Coss  
––– 6010 –––  
––– 570 –––  
V
GS = 0V, VDS = 60V, ƒ = 1.0MHz  
Coss  
VGS = 0V, VDS = 0V to 60V  
Coss eff.  
Effective Output Capacitance (Time Related) ––– 1140 –––  
Diode Characteristics  
Symbol Parameter  
Conditions  
MOSFET symbol  
showing the  
Min. Typ. Max. Units  
D
S
IS  
Continuous Source Current  
–––  
–––  
106  
A
A
V
(Body Diode)  
G
ISM  
integral reverse  
Pulsed Source Current  
(Body Diode)  
–––  
–––  
550  
p-n junction diode.  
TJ = 25°C, IS = 82A, VGS = 0V  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
–––  
–––  
–––  
–––  
93  
1.3  
140  
510  
ns TJ = 25°C, IF = 82A  
di/dt = 100A/μs  
Qrr  
ton  
340  
nC  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
Notes:  
Coss eff. is a fixed capacitance that gives the same charging time  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Starting TJ = 25°C, L = 0.130mH  
RG = 25, IAS = 82A. (See Figure 12).  
ƒ ISD 82A, di/dt 310A/μs, VDD V(BR)DSS  
TJ 175°C  
as Coss while VDS is rising from 0 to 80% VDSS  
.
† Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive  
avalanche performance.  
‡ When mounted on 1" square PCB ( FR-4 or G-10 Material ).  
For recommended footprint and soldering techniques refer to  
application note #AN-994.  
,
„ Pulse width 400μs; duty cycle 2%.  
ˆ Ris measured at TJ approximately 90°C.  
2
www.irf.com  
AUIRF3808S  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive  
qualification. IR’s Industrial and Consumer qualification level  
is granted by extension of the higher Automotive level.  
D2Pak  
MSL1  
Moisture Sensitivity Level  
Class M4 (+/- 800V) †††  
Machine Model  
AEC-Q101-002  
Class H2 (+/- 4000V) †††  
AEC-Q101-001  
Human Body Model  
ESD  
Class C5 (+/- 2000V) †††  
AEC-Q101-005  
Charged Device Model  
Yes  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report.  
††† Highest passing voltage.  
www.irf.com  
3
AUIRF3808S  
1000  
100  
10  
1000  
VGS  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
TOP  
TOP  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
BOTTOM  
BOTTOM  
100  
10  
1
4.5V  
4.5V  
20μs PULSE WIDTH  
20μs PULSE WIDTH  
°
°
T = 25  
J
C
T = 175  
J
C
1
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
3.0  
1000.00  
100.00  
10.00  
137A  
=
I
D
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
T = 175°C  
J
T = 25°C  
J
V
= 15V  
DS  
20μs PULSE WIDTH  
V
= 10V  
GS  
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
°
1.0  
3.0  
5.0  
7.0  
9.0  
11.0  
13.0  
15.0  
T , Junction Temperature  
( C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
4
www.irf.com  
AUIRF3808S  
12  
10  
8
100000  
10000  
1000  
D
I
= 82A  
V
C
= 0V,  
f = 1 MHZ  
V
V
V
= 60V  
= 37V  
= 15V  
GS  
DS  
DS  
DS  
= C + C  
,
C
SHORTED  
iss  
gs  
gd  
ds  
C
= C  
rss  
gd  
C
= C + C  
oss  
ds gd  
Ciss  
6
4
Coss  
2
Crss  
0
100  
0
40  
80  
120  
160  
1
10  
100  
Q
, Total Gate Charge (nC)  
G
V
, Drain-to-Source Voltage (V)  
DS  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
1000.00  
100.00  
10.00  
1.00  
10000  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
T
= 175°C  
J
100μsec  
T
= 25°C  
J
1msec  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
V
= 0V  
10msec  
100  
GS  
1
0.10  
1
10  
1000  
0.0  
0.5  
1.0  
1.5  
2.0  
V
, Drain-toSource Voltage (V)  
V
, Source-toDrain Voltage (V)  
DS  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
www.irf.com  
5
AUIRF3808S  
RD  
VDS  
120  
100  
80  
60  
40  
20  
0
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
Pulse Width µs  
Duty Factor   
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
25  
50  
75  
100  
125  
150  
175  
T
, Case Temperature (°C)  
C
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 9. Maximum Drain Current Vs.  
Case Temperature  
Fig 10b. Switching Time Waveforms  
1
D = 0.50  
0.20  
0.1  
0.10  
0.05  
P
DM  
t
1
0.02  
t
2
SINGLE PULSE  
0.01  
(THERMAL RESPONSE)  
Notes:  
1. Duty factor D =  
t / t  
1
2
2. Peak T  
= P  
x Z  
+ T  
J
DM  
thJC  
C
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRF3808S  
15V  
800  
640  
480  
320  
160  
0
I
D
TOP  
34A  
58A  
82A  
DRIVER  
+
L
V
DS  
BOTTOM  
D.U.T  
AS  
R
G
V
DD  
-
I
A
20V  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
°
( C)  
Starting Tj, Junction Temperature  
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
Vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
3.5  
V
G
3.0  
2.5  
2.0  
1.5  
1.0  
Charge  
I
= 250μA  
D
Fig 13a. Basic Gate Charge Waveform  
Current Regulator  
Same Type as D.U.T.  
50K  
.2F  
12V  
.3F  
+
V
DS  
D.U.T.  
-
-75 -50 -25  
0
25 50 75 100 125 150 175 200  
T , Temperature ( °C )  
V
GS  
J
3mA  
I
I
D
G
Current Sampling Resistors  
Fig 14. Threshold Voltage Vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRF3808S  
10000  
1000  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
Duty Cycle = Single Pulse  
assuming  
Tj = 25°C due to  
100  
avalanche losses. Note: In no  
case should Tj be allowed to  
exceed Tjmax  
0.01  
0.05  
0.10  
10  
1
0.1  
1.0E-07  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current Vs.Pulsewidth  
500  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
TOP  
BOTTOM 10% Duty Cycle  
= 140A  
Single Pulse  
I
400  
300  
200  
100  
0
D
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
175  
25  
50  
75  
100  
125  
150  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
Vs. Temperature  
8
www.irf.com  
AUIRF3808S  
Peak Diode Recovery dv/dt Test Circuit  
D.U.T  
+
ƒ
-
Circuit Layout Considerations  
 Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
+
‚
„
-
+
-

RG  
+
-
dv/dt controlled by RG  
VDD  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Driver Gate Drive  
P.W.  
P.W.  
Period  
Period  
D =  
V
=10V  
*
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. For N-channel HEXFET® power MOSFETs  
www.irf.com  
9
AUIRF3808S  
D2Pak (TO-263AB) Package Outline  
Dimensions are shown in millimeters (inches)  
D2Pak (TO-263AB) Part Marking Information  
Part Number  
AUIRF3808S  
Date Code  
Y= Year  
WW= Work Week  
A= Automotive, LeadFree  
IR Logo  
YWWA  
XX or XX  
Lot Code  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRF3808S  
D2Pak (TO-263AB) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TRR  
1.60 (.063)  
1.50 (.059)  
1.60 (.063)  
1.50 (.059)  
4.10 (.161)  
3.90 (.153)  
0.368 (.0145)  
0.342 (.0135)  
FEED DIRECTION  
TRL  
11.60 (.457)  
11.40 (.449)  
1.85 (.073)  
1.65 (.065)  
24.30 (.957)  
23.90 (.941)  
15.42 (.609)  
15.22 (.601)  
1.75 (.069)  
1.25 (.049)  
10.90 (.429)  
10.70 (.421)  
4.72 (.136)  
4.52 (.178)  
16.10 (.634)  
15.90 (.626)  
FEED DIRECTION  
13.50 (.532)  
12.80 (.504)  
27.40 (1.079)  
23.90 (.941)  
4
330.00  
(14.173)  
MAX.  
60.00 (2.362)  
MIN.  
30.40 (1.197)  
MAX.  
NOTES :  
1. COMFORMS TO EIA-418.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION MEASURED @ HUB.  
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.  
26.40 (1.039)  
24.40 (.961)  
4
3
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRF3808S  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Tube  
Tape and Reel Left  
Tape and Reel Right  
Quantity  
50  
AUIRF3808S  
D2Pak  
AUIRF3808S  
AUIRF3808STRL  
AUIRF3808STRR  
800  
800  
12  
www.irf.com  
AUIRF3808S  
IMPORTANT NOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsid-  
iaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other  
changes to its products and services at any time and to discontinue any product or services without notice.  
Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific  
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accordance with IR’s standard warranty. Testing and other quality control techniques are used to the extent  
IR deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
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such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless the  
specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part  
number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
13  

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