AUIRFR48ZTRR [INFINEON]

Power Field-Effect Transistor, 42A I(D), 55V, 0.011ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3;
AUIRFR48ZTRR
型号: AUIRFR48ZTRR
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 42A I(D), 55V, 0.011ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3

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PD - 97586  
AUTOMOTIVE GRADE  
AUIRFR48Z  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
D
V(BR)DSS  
55V  
11m  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
RDS(on) max.  
ID (Silicon Limited)  
ID (Package Limited)  
G
62A  
42A  
S
Automotive Qualified *  
D
Description  
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low on-  
resistance per silicon area. Additional features of this  
design are a 175°C junction operating temperature,  
fast switching speed and improved repetitive ava-  
lanche rating . These features combine to make this  
design an extremely efficient and reliable device for  
use in Automotive applications and a wide variety of  
other applications.  
S
G
D-Pak  
AUIRFR48Z  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Max.  
62  
Units  
(Silicon Limited)  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
44  
A
(Package Limited)  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
@ T = 25°C  
C
42  
250  
91  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
0.61  
± 20  
W/°C  
V
V
GS  
EAS  
74  
110  
mJ  
Single Pulse Avalanche Energy (Thermally Limited)  
EAS (tested )  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
300  
T
STG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.64  
40  
Units  
Junction-to-Case  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
RθJC  
RθJA  
RθJA  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/9/2010  
AUIRFR48Z  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
55 ––– –––  
Conditions  
VGS = 0V, ID = 250µA  
V(BR)DSS  
V(BR)DSS/TJ  
RDS(on)  
V
Breakdown Voltage Temp. Coefficient ––– 0.054 ––– V/°C Reference to 25°C, ID = 1mA  
mΩ  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
2.0  
8.86  
–––  
–––  
–––  
–––  
–––  
11  
4.0  
–––  
20  
VGS = 10V, ID = 37A  
VGS(th)  
V
S
VDS = VGS, ID = 50µA  
VDS = 25V, ID = 37A  
gfs  
IDSS  
Forward Transconductance  
120  
–––  
–––  
–––  
–––  
Drain-to-Source Leakage Current  
µA VDS = 55V, VGS = 0V  
250  
200  
V
DS = 55V, VGS = 0V, TJ = 125°C  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA VGS = 20V  
VGS = -20V  
––– -200  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter Min. Typ. Max. Units Conditions  
Total Gate Charge  
Qg  
Qgs  
Qgd  
td(on)  
tr  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
40  
11  
15  
15  
61  
40  
35  
4.5  
60  
ID = 37A  
VDS = 44V  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
nC  
VGS = 10V  
VDD = 28V  
ID = 37A  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
ns  
R
G = 12  
VGS = 10V  
Between lead,  
D
S
LD  
Internal Drain Inductance  
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
VGS = 0V  
DS = 25V  
pF ƒ = 1.0MHz  
Ciss  
Input Capacitance  
––– 1720 –––  
Coss  
Crss  
Coss  
Coss  
Output Capacitance  
–––  
–––  
290  
160  
–––  
–––  
V
Reverse Transfer Capacitance  
Output Capacitance  
––– 1000 –––  
V
V
V
GS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
GS = 0V, VDS = 44V, ƒ = 1.0MHz  
GS = 0V, VDS = 0V to 44V  
Output Capacitance  
–––  
–––  
230  
360  
–––  
–––  
Coss eff.  
Effective Output Capacitance  
Diode Characteristics  
Parameter  
Min. Typ. Max. Units  
Conditions  
I
I
Continuous Source Current  
–––  
–––  
37  
MOSFET symbol  
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
–––  
–––  
250  
SM  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
20  
1.3  
40  
28  
V
T = 25°C, I = 37A, V = 0V  
SD  
J
S
GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns T = 25°C, I = 37A, VDD = 28V  
J F  
rr  
di/dt = 100A/µs  
Q
t
14  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical  
repetitive avalanche performance.  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 0.11mH  
RG = 25, IAS = 37A, VGS =10V. Part not  
† This value determined from sample failure population,  
starting TJ = 25°C, L = 0.11mH, RG = 25,  
IAS = 37A, VGS =10V.  
recommended for use above this value.  
ƒ Pulse width 1.0ms; duty cycle 2%.  
„ Coss eff. is a fixed capacitance that gives the same  
charging time as Coss while VDS is rising from 0 to  
‡ When mounted on 1" square PCB (FR-4 or G-10 Material) .  
For recommended footprint and soldering techniques  
refer to application note #AN-994.  
ˆ Rθ is measured at TJ approximately 90°C.  
80% VDSS  
.
2
www.irf.com  
AUIRFR48Z  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification.  
IR’s Industrial and Consumer qualification level is granted by  
extension of the higher Automotive level.  
Moisture Sensitivity Level  
D-PAK  
MSL1  
Class M4 (425V)  
Machine Model  
AEC-Q101-002  
Class H1B (1000V)  
AEC-Q101-001  
Class C5 (1125V)  
AEC-Q101-005  
Yes  
Human Body Model  
ESD  
Charged Device  
Model  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
www.irf.com  
3
AUIRFR48Z  
1000  
1000  
100  
10  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
VGS  
15V  
TOP  
TOP  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
100  
10  
1
BOTTOM  
BOTTOM  
4.5V  
4.5V  
60µs PULSE WIDTH  
60µs PULSE WIDTH  
Tj = 175°C  
Tj = 25°C  
1
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
60  
50  
40  
30  
20  
10  
0
T
= 25°C  
J
100  
10  
1
T
= 175°C  
J
T
= 175°C  
J
T
= 25°C  
J
V
= 10V  
V
= 25V  
DS  
380µs PULSE WIDTH  
DS  
60µs PULSE WIDTH  
10 12  
, Gate-to-Source Voltage (V)  
0.1  
2
4
6
8
0
20  
40  
60  
80  
I ,Drain-to-Source Current (A)  
D
V
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRFR48Z  
10000  
1000  
100  
20  
16  
12  
8
V
= 0V,  
= C  
f = 1 MHZ  
I
= 37A  
GS  
D
C
C
C
+ C , C  
SHORTED  
iss  
gs  
gd  
ds  
V
= 44V  
DS  
= C  
rss  
oss  
gd  
= C + C  
VDS= 28V  
VDS= 11V  
ds  
gd  
C
iss  
C
oss  
C
4
rss  
0
0
10  
20  
30  
40  
50  
60  
1
10  
100  
Q
Total Gate Charge (nC)  
G
V
, Drain-to-Source Voltage (V)  
DS  
Fig 6. Typical Gate Charge vs.  
Fig 5. Typical Capacitance vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
1000.00  
100.00  
10.00  
1.00  
1000  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
100  
10  
1
T
= 175°C  
100µsec  
J
1msec  
10msec  
T
= 25°C  
J
Tc = 25°C  
Tj = 175°C  
Single Pulse  
DC  
V
= 0V  
GS  
0.1  
0.10  
1
10  
, Drain-toSource Voltage (V)  
100  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8  
, Source-to-Drain Voltage (V)  
V
V
DS  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
nce  
Forward Voltage  
www.irf.com  
5
AUIRFR48Z  
2.5  
2.0  
1.5  
1.0  
0.5  
70  
I
= 37A  
LIMITED BY PACKAGE  
D
V
= 10V  
60  
50  
40  
30  
20  
10  
0
GS  
25  
50  
75  
100  
125  
150  
175  
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
T
, Case Temperature (°C)  
C
T
, Junction Temperature (°C)  
J
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current vs.  
vs.Temperature  
CaseTemperature  
10  
1
D = 0.50  
0.20  
0.10  
0.05  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W) τi (sec)  
0.1  
0.01  
τ
J τJ  
τ
τ
Cτ  
0.7206  
0.6009  
0.3175  
0.000326  
0.001810  
0.014886  
0.02  
0.01  
τ
1τ1  
τ
2 τ2  
3τ3  
Ci= τi/Ri  
/
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRFR48Z  
15V  
300  
250  
200  
150  
100  
50  
I
D
TOP  
4.3A  
6.3A  
37A  
DRIVER  
+
L
V
DS  
BOTTOM  
D.U.T  
AS  
R
G
V
DD  
-
I
A
V
20V  
GS  
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
0
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
vs. Drain Current  
Q
G
10 V  
Q
Q
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
GS  
GD  
V
G
Charge  
I
I
I
I
I
= 1.0A  
D
D
D
D
D
Fig 13a. Basic Gate Charge Waveform  
= 50µA  
= 150µA  
= 250µA  
= 1.0mA  
L
VCC  
-75 -50 -25  
0
25 50 75 100 125 150 175  
DUT  
0
T , Temperature ( °C )  
1K  
J
Fig 14. Threshold Voltage vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRFR48Z  
1000  
Duty Cycle = Single Pulse  
100  
10  
1
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming Tj = 25°C due to  
avalanche losses  
0.01  
0.05  
0.10  
0.1  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
80  
60  
40  
20  
0
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
TOP  
BOTTOM 1% Duty Cycle  
= 37A  
Single Pulse  
I
D
7. T = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
25  
50  
75  
100  
125  
150  
175  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
8
www.irf.com  
AUIRFR48Z  
Driver Gate Drive  
P.W.  
P.W.  
D =  
Period  
D.U.T  
Period  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRFR48Z  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak Part Marking Information  
PartNumber  
AUIRFR48Z  
DateCode  
Y= Year  
WW= Work Week  
A=Automotive,LeadFree  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
10  
www.irf.com  
AUIRFR48Z  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
www.irf.com  
11  
AUIRFR48Z  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Tube  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
Quantity  
75  
2000  
3000  
3000  
AUIRFR48Z  
Dpak  
AUIRFR48Z  
AUIRFR48ZTR  
AUIRFR48ZTRL  
AUIRFR48ZTRR  
12  
www.irf.com  
AUIRFR48Z  
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IR products are neither designed nor intended for use in automotive applications or environments unless the specific  
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designation “AU”. Buyers acknowledge and agree that, if they use any non-designated products in automotive  
applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
233 Kansas St., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
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相关型号:

AUIRFR5305

AUTOMOTIVE MOSFET
INFINEON

AUIRFR5305TR

AUTOMOTIVE MOSFET
INFINEON

AUIRFR540Z

Automatic Voltage Regulator
INFINEON

AUIRFR540ZTR

Automatic Voltage Regulator
INFINEON

AUIRFR540ZTRL

Automatic Voltage Regulator
INFINEON

AUIRFR540ZTRR

Automatic Voltage Regulator
INFINEON

AUIRFR5410

AUTOMOTIVE GRADE
KERSEMI

AUIRFR5410

Power Field-Effect Transistor, 13A I(D), 100V, 0.205ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3
INFINEON

AUIRFR5410TR

Advanced Planar Technology
INFINEON

AUIRFR5410TRL

Power Field-Effect Transistor, 13A I(D), 100V, 0.205ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3
INFINEON

AUIRFR5410TRR

Advanced Planar Technology
INFINEON

AUIRFR5505

Power Field-Effect Transistor, 18A I(D), 55V, 0.11ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, ROHS COMPLIANT, PLASTIC, DPAK-3
INFINEON