BAS4007WH6327XTSA1 [INFINEON]
Rectifier Diode, Schottky, 2 Element, 0.12A, 40V V(RRM), Silicon, ROHS COMPLIANT PACKAGE-4;型号: | BAS4007WH6327XTSA1 |
厂家: | Infineon |
描述: | Rectifier Diode, Schottky, 2 Element, 0.12A, 40V V(RRM), Silicon, ROHS COMPLIANT PACKAGE-4 |
文件: | 总15页 (文件大小:984K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BAS40.../BAS140W
Silicon Schottky Diode
• General-purpose diode for high-speed switching
• Circuit protection
• Voltage clamping
• High-level detecting and mixing
• Pb-free (RoHS compliant) package
1)
• Qualified according AEC Q101
BAS140W
BAS40
BAS40-04
BAS40-05
BAS40-06
BAS40-02L
BAS40-05W
BAS40-06W
3
3
3
3
D
2
D
2
1
2
D
1
D
1
D
1
D
2
1
2
1
2
1
2
1
2
BAS40-07
BAS40-07W
4
3
D
1
D
2
1
2
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type
BAS140W
BAS40
Package
SOD323
SOT23
Configuration
single
single
Marking
white 4
43s
BAS40-02L*
BAS40-04
BAS40-05
BAS40-05W
BAS40-06
BAS40-06W
BAS40-07
BAS40-07W
TSLP-2-1
SOT23
SOT23
SOT323
SOT23
SOT323
SOT143
SOT343
single, leadless
series
FF
44s
45s
45s
46s
46s
47s
47s
common cathode
common cathode
common anode
common anode
parallel pair
parallel pair
1
* BAS40-02L is not qualified according AEC Q101
2013-01-11
1
BAS40.../BAS140W
Maximum Ratings at T = 25 °C, unless otherwise specified
A
Parameter
Diode reverse voltage
Forward current
Non-repetitive peak surge forward current
t ≤ 10ms
Symbol
V
R
Value
40
120
200
Unit
V
mA
I
F
I
FSM
Total power dissipation
P
mW
tot
BAS140W, T ≤ 113°C
250
250
250
250
250
250
250
250
S
BAS40, BAS40-07, T ≤ 81°C
S
BAS40-02L, T ≤ 127°C
S
BAS40-04, BAS40-06, T ≤ 56°C
S
BAS40-06W, T ≤ 106°C
S
BAS40-05, T ≤ 31°C
S
BAS40-05W, T ≤ 98°C
S
BAS40-07W, T ≤ 118°C
S
150
°C
Junction temperature
T
j
Operating temperature range
Storage temperature
T
T
-55 ...150
-55 ...150
op
stg
Thermal Resistance
Parameter
Junction - soldering point
Symbol
R
thJS
Value
Unit
K/W
1)
BAS140W
BAS40, BAS40-07
BAS40-02L
≤ 150
≤ 275
≤ 90
BAS40-04, BAS40-06
BAS40-06W
BAS40-05
BAS40-05W
BAS40-07W
≤ 375
≤ 175
≤ 475
≤ 205
≤ 125
1
For calculation of R
please refer to Application Note AN077 (Thermal Resistance Calculation)
thJA
2013-01-11
2
BAS40.../BAS140W
Electrical Characteristics at T = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ. max.
DC Characteristics
Breakdown voltage
40
-
-
-
V
V
(BR)
I
= 10 µA
(BR)
-
1
Reverse current
I
µA
R
V = 30 V
R
mV
Forward voltage
V
F
I = 1 mA
250
350
600
310
450
720
380
500
1000
F
I = 10 mA
F
I = 40 mA
F
1)
-
-
20
Forward voltage matching
∆ V
F
I = 10 mA
F
AC Characteristics
Diode capacitance
-
-
-
3
10
-
5
-
pF
C
R
τ
T
F
rr
V = 0 , f = 1 MHz
R
Differential forward resistance
Ω
I = 10 mA, f = 10 kHz
F
100 ps
Charge carrier life time
I = 25 mA
F
1
∆V is the difference between lowest and highest V in a multiple diode component.
F
F
2013-01-11
3
BAS40.../BAS140W
Diode capacitance C = ƒ (V )
Forward resistance r = ƒ (I )
f F
T
R
f = 1MHz
f = 10 kHz
BAS 40...
EHB00040
BAS 40...
EHB00041
10 3
5
pF
4
CT
rf
Ω
10 2
10 1
10 3
3
2
1
0
1
10
mA 100
0.1
0
10
20
V
30
VR
Ι F
Reverse current I = ƒ (T )
Reverse current I = ƒ(V )
R R
R
A
V = Parameter
T = Parameter
R
A
10 -4
A
BAS 40...
EHB00039
103
Ι R
µ A
TA = 150 C
102
101
100
10-1
10 -5
10 -6
10 -7
10 -8
85 C
VR = 40V
30V
20V
10V
25 C
10-2
0
°C
0
25
50
75
100
150
10
20
30
V
40
T
A
VR
2013-01-11
4
BAS40.../BAS140W
Forward Voltage V = ƒ (T )
Forward current I = ƒ (V )
F
A
F
F
I = Parameter
T = Parameter
F
A
BAS 40...
EHB00038
10 2
0.8
V
ΙF
mA
10 1
10 0
10-1
0.6
0.5
0.4
0.3
0.2
0.1
IF = 40 mA
10 mA
1 mA
0.1 mA
10 µA
TA = -40 ˚C
25 ˚C
1 µA
85 ˚C
150 ˚C
10-2
0.0
0
°C
-50 -25
0
25
50
75
100
150
0.5
1.0
V
1.5
T
A
VF
Forward current I = ƒ (T )
Forward current I = ƒ (T )
F S
F
S
BAS140W
BAS40, BAS40-07
140
mA
140
mA
100
80
60
40
20
0
100
80
60
40
20
0
°C
°C
0
15 30 45 60 75 90 105 120
150
0
15 30 45 60 75 90 105 120
150
T
T
S
S
2013-01-11
5
BAS40.../BAS140W
Forward current I = ƒ (T )
Forward current I = ƒ (T )
F
S
F
S
BAS40-02L
BAS40-04, BAS40-06
140
mA
140
mA
100
80
60
40
20
0
100
80
60
40
20
0
°C
°C
0
15 30 45 60 75 90 105 120
150
0
15 30 45 60 75 90 105 120
150
T
T
S
S
Forward current I = ƒ (T )
Forward current I = ƒ (T )
F S
F
S
BAS40-06W
BAS40-05
140
mA
140
mA
100
80
60
40
20
0
100
80
60
40
20
0
0
°C
°C
0
15 30 45 60 75 90 105 120
150
15 30 45 60 75 90 105 120
150
T
T
S
S
2013-01-11
6
BAS40.../BAS140W
Forward current I = ƒ (T )
Forward current I = ƒ (T )
F S
F
S
BAS40-05W
BAS40-07W
140
mA
140
mA
100
80
60
40
20
0
100
80
60
40
20
0
°C
°C
0
15 30 45 60 75 90 105 120
150
0
15 30 45 60 75 90 105 120
150
T
T
S
S
Permissible Puls Load R
= ƒ (t )
Permissible Pulse Load
thJS
p
BAS140W
I
/ I
= ƒ (t )
Fmax FDC p
BAS140W
BAS 140W
EHD07165
BAS 140W
EHD07166
10 2
5
K/W
Ι Fmax
Ι FDC
t p
RthJS
t p
T
D =
5
T
10 2
5
D =
0.5
0.2
D =
0
0.1
10 1
5
0.005
0.01
0.02
0.05
0.1
0.05
0.02
0.01
0.005
0
10 1
5
0.2
0.5
t p
t p
T
D =
T
10 0
10 0
10 -6 10 -5 10 -4 10 -3 10 -2
s
10 0
10 -6 10 -5 10 -4 10 -3 10 -2
s
10 0
t p
t p
2013-01-11
7
BAS40.../BAS140W
Permissible Puls Load R
= ƒ (t )
Permissible Pulse Load
thJS
p
BAS40-02L
I
/ I
= ƒ (t )
Fmax FDC
BAS40-02L
10 1
p
10 2
K/W
D = 0
0.005
0.01
0.02
0.05
0.1
0.5
-
10 1
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
0.2
0.5
10 0
10 0
10 -6 10 -5 10 -4 10 -3 10 -2 10 -1
10 1
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
s
s
t
t
p
p
Permissible Puls Load R
BAS40-06W
= ƒ (t )
Permissible Pulse Load
I / I = ƒ (t )
Fmax FDC
thJS
p
p
BAS40-06W
10 2
10 3
K/W
-
10 2
D = 0
0.005
0.01
0.02
0.05
0.1
10 1
0.5
0.2
0.2
10 1
0.1
0.5
0.05
0.02
0.01
0.005
D = 0
10 0
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
s
s
t
t
p
p
2013-01-11
8
BAS40.../BAS140W
Permissible Puls Load R
BAS40-05W
= ƒ (t )
Permissible Pulse Load
I / I = ƒ (t )
Fmax FDC
thJS
p
p
BAS40-05W
10 2
10 3
K/W
-
10 2
D = 0
0.005
0.01
0.02
0.05
0.1
10 1
0.5
0.2
0.2
10 1
0.5
0.1
0.05
0.02
0.01
0.005
D = 0
10 0
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
s
s
t
t
p
p
2013-01-11
9
Package SOD323
BAS40.../BAS140W
2013-01-11
10
Package SOT143
BAS40.../BAS140W
Package Outline
0.1
1
0.1
2.9
B
1.9
0.1 MAX.
4
3
1
2
A
0.2
0.08...0.1
5
+0.1
0.8
-0.05
0...8˚
+0.1
0.4
-0.05
M
M
0.2
0.25
B
A
1.7
Foot Print
0.8 1.2 0.8
1.2
0.8
0.8
Marking Layout (Example)
Manufacturer
2005, June
RF s
Date code (YM)
Pin 1
BFP181
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
4
3.15
1.15
Pin 1
2013-01-11
11
Package SOT23
BAS40.../BAS140W
Package Outline
0.1
1
0.1 MAX.
0.1
2.9
B
3
1
2
1)
+0.1
0.4
A
-0.05
0.08...0.15
0...8˚
C
0.95
1.9
0.25 B C
1) Lead width can be 0.6 max. in dambar area
M
M
0.2
A
Foot Print
0.8
0.8
1.2
Marking Layout (Example)
Manufacturer
2005, June
Date code (YM)
EH
s
Pin 1
BCW66
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
0.9
1.15
3.15
Pin 1
2013-01-11
12
Package SOT323
BAS40.../BAS140W
Package Outline
0.1
0.9
0.2
2
0.1 MAX.
0.1
+0.1
3x
0.3
-0.05
M
0.1
A
3
1
2
+0.1
0.15
-0.05
0.65 0.65
M
0.2
A
Foot Print
0.6
0.65
0.65
Marking Layout (Example)
Manufacturer
2005, June
Date code (YM)
BCR108W
Type code
Pin 1
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
4
Pin 1
2.15
1.1
2013-01-11
13
Package TSLP-2-1
BAS40.../BAS140W
2013-01-11
14
BAS40.../BAS140W
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
2013-01-11
15
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