BBY5102WE6327XTSA1 [INFINEON]
Variable Capacitance Diode, 5.4pF C(T), 7V, Silicon, Hyperabrupt, SCD-80, 2 PIN;
| 型号： | BBY5102WE6327XTSA1 |
| 厂家： | 
Infineon |
| 描述： | Variable Capacitance Diode, 5.4pF C(T), 7V, Silicon, Hyperabrupt, SCD-80, 2 PIN CD 光电二极管 变容二极管 |
| 文件： | 总9页 (文件大小：610K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BBY51...
Silicon Tuning Diode
• High Q hyperabrupt tuning diode
• Designed for low tuning voltage operation
• For VCO's in mobile communications equipment
BBY51
BBY51-02L
BBY51-02W
BBY51-03W
3
D
2
1
2
D
1
1
2
Type
Package
Configuration
common cathode
single, leadless
single
L (nH) Marking
S
2
BBY51
SOT23
S3s
II
BBY51-02L*
BBY51-02W
BBY51-03W
TSLP-2-1
SCD80
SOD323
0.4
0.6
1.8
II
single
H
* Preliminary
Maximum Ratings at T = 25°C, unless otherwise specified
A
Parameter
Diode reverse voltage
Forward current
Operating temperature range
Storage temperature
Symbol
Value
7
20
Unit
V
mA
°C
V
R
I
F
T
T
-55 ... 125
-55 ... 150
op
stg
Dec-15-2003
1
BBY51...
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
typ. max.
Unit
min.
DC Characteristics
Reverse current
I
nA
pF
R
V = 6 V
-
-
-
-
10
200
R
V = 6 V, T = 85 °C
R
A
AC Characteristics
Diode capacitance
C
T
V = 1 V, f = 1 MHz
5.05
3.4
2.7
2.5
5.4
4.2
3.5
3.1
5.75
5.2
4.6
3.7
R
V = 2 V, f = 1 MHz
R
V = 3 V, f = 1 MHz
R
V = 4 V, f = 1 MHz
R
1.55
1.4
0.3
-
1.75
1.78
0.5
2.2
Capacitance ratio
C /C
T1 T4
V = 1 V, V = 4 V, f = 1 MHz
R
R
2.2 pF
0.7
Capacitance difference
V = 1 V, f = 1 MHz, V = 4 V
C -C
1V 3V
R
R
Capacitance difference
C -C
3V 4V
V = 3 V, f = 1 MHz, V = 4 V
R
R
Series resistance
r
0.37
-
Ω
S
V = 1 V, f = 1 GHz
R
Dec-15-2003
2
BBY51...
Diode capacitance C = ƒ (V )
Temperature coefficient of the diode
T
R
f = 1MHz
capacitance T = ƒ (V )
Cc
R
10 -3
EHD07128
10
CT pF
1/°C
8
6
4
2
10 -4
10 -5
0
0
V
1
2
3
4
5
6
8
2
4
V
6
V
VR
R
Dec-15-2003
3
Package SCD80
Package Outline
M
0.2
A
±0.1
0.13+0.05
0.8
-0.03
A
2
1
0.3
Cathode
marking
±0.05
±0.1
0.7
Foot Print
0.35
Marking Layout
Date code
2003, July
Type code
BAR63-02W
Laser marking
Cathode marking
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
0.2
4
0.7
Cathode
marking
0.4
0.9
Package SCD80
Data Code marking for discrete packages with
one digit (SCD80, SC79) CES-Code
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013
2014
01
02
03
04
05
06
07
08
09
10
11
12
a
b
c
d
e
f
p
q
r
A
B
C
D
E
F
G
H
J
P
Q
R
S
T
U
V
X
Y
Z
4
a
b
c
d
e
f
p
q
r
A
B
C
D
E
F
G
H
J
P
Q
R
S
T
U
V
X
Y
Z
4
a
b
c
d
e
f
p
q
r
A
B
C
D
E
F
G
H
J
P
Q
R
S
T
U
V
X
Y
Z
4
s
t
s
t
s
t
u
v
x
y
z
2
3
u
v
x
y
z
2
3
u
v
x
y
z
2
3
g
h
j
g
h
j
g
h
j
k
l
K
L
k
l
K
L
k
l
K
L
n
N
5
n
N
5
n
N
5
62
Package SOD323
Package Outline
+0.2
-0.1
0.9
+0.2
-0.1
1.25
±0.05
0
A
2
+0.15
acc. to
DIN 6784
Cathode
marking
1
+0.1
+0.05
0.3
-0.2
0.3
-0.05
+0.1
0.15
-0.06
M
0.25
A
Foot Print
0.6
Marking Layout
Type code
BAR63-03W
Laser marking
Cathode marking
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
0.2
4
0.65
1.35
Cathode
marking
1
Package SOT23
Package Outline
1.1 MAX.
0.1 MAX.
±0.1
2.9
1
B
A
3
+0.2
acc. to
DIN 6784
2
+0.1
-0.05
0.4
C
0.95
1.9
M
M
A
0.25
B
C
0.20
Foot Print
0.8
1.2
0.8
Marking Layout
Manufacturer
Date code (Year/Month)
Type code
2003, July
BCW66
Pin 1
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
0.9
3.15
1.15
Pin 1
Package TSLP-2-1
Package Outline
Top view
Bottom view
0.4+0.05
0.6
A
1)
±0.035
S
0.5
2x
0.05 MAX.
0.03 S
M
0.1 A B
0.05
0.05 2x
2
1
2
1
M
0.1 A B
B
Cathode
marking
1)
±0.035
0.5
M
0.1 A B
M
0.1 A B
1) Dimension applies to plated terminals
Foot Print
0.6
0.45
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
BAS16-02L
Laser marking
Cathode marking
Example
Packing
Code E6327: Reel ø180 mm = 15.000 Pieces/Reel
0.5
4
Cathode
marking
0.76
Impressum
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
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