BC818K-16W [INFINEON]

NPN Silicon AF Transistor; NPN硅晶体管自动对焦
BC818K-16W
型号: BC818K-16W
厂家: Infineon    Infineon
描述:

NPN Silicon AF Transistor
NPN硅晶体管自动对焦

晶体 晶体管
文件: 总11页 (文件大小:860K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BC817.../BC818...  
NPN Silicon AF Transistor  
For general AF applications  
High collector current  
High current gain  
Low collector-emitter saturation voltage  
Complementary types:  
BC807.../W, BC808.../W (PNP)  
1)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
Type  
BC817-16  
Marking  
6As  
6As  
6Bs  
6Bs  
6Bs  
6Bs  
6Cs  
6Cs  
6Cs  
6Cs  
6Es  
6Es  
6Fs  
Pin Configuration  
Package  
1 = B 2 = E 3 = C -  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SOT23  
SOT23  
SOT23  
SOT23  
SOT323  
SOT323  
SOT23  
SOT23  
SOT323  
SOT323  
SOT323  
SOT323  
SOT23  
SOT23  
SOT23  
SOT23  
BC817K-16*  
BC817-25  
BC817K-25*  
BC817-25W  
BC817K-25W*  
BC817-40  
BC817K-40*  
BC817-40W  
BC817K-40W*  
BC818-16W  
BC818K-16W*  
BC818-25  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
1 = B 2 = E 3 = C -  
BC818K-25*  
BC818-40  
BC818K-40*  
6Fs  
6Gs  
6Gs  
* Shrinked chip version  
1Pb-containing package may be available upon special request  
2008-04-11  
1
BC817.../BC818...  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
BC817...  
BC818...  
V
V
V
CEO  
CBO  
EBO  
45  
25  
Collector-base voltage  
BC817...  
BC818...  
50  
30  
5
500  
1000  
100  
200  
Emitter-base voltage  
Collector current  
Peak collector current  
Base current  
Peak base current  
Total power dissipation-  
mA  
mW  
°C  
I
C
I
CM  
I
B
I
BM  
P
tot  
T 79 °C, BC817, BC818  
330  
500  
250  
S
T 115 °C, BC817K, BC818K  
S
T 130 °C, BC817W/KW, BC818...W/KW  
S
150  
Junction temperature  
Storage temperature  
T
j
T
-65 ... 150  
stg  
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
Value  
Unit  
K/W  
1)  
R
thJS  
BC817, BC818  
BC817K, BC818K  
BC817W/KW, BC818W/KW  
1
215  
70  
80  
For calculation of R  
please refer to Application Note Thermal Resistance  
thJA  
2008-04-11  
2
BC817.../BC818...  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC Characteristics  
Collector-emitter breakdown voltage  
V
V
V
V
(BR)CEO  
(BR)CBO  
I = 10 mA, I = 0 , BC817...  
45  
25  
-
-
-
-
C
B
I = 10 mA, I = 0 , BC818...  
C
B
Collector-base breakdown voltage  
I = 10 µA, I = 0 , BC817...  
-
50  
30  
-
-
-
-
C
E
I = 10 µA, I = 0 , BC818...  
C
E
Emitter-base breakdown voltage  
I = 10 µA, I = 0  
5
-
-
V
(BR)EBO  
CBO  
E
C
Collector-base cutoff current  
I
I
µA  
V
V
= 25 V, I = 0  
-
-
-
-
-
-
0.1  
50  
CB  
CB  
E
= 25 V, I = 0 , T = 150 °C  
E
A
100 nA  
Emitter-base cutoff current  
EBO  
V
= 4 V, I = 0  
EB  
C
1)  
-
DC current gain  
h
FE  
I = 100 mA, V = 1 V, h -grp.16  
100  
160  
250  
60  
100  
170  
40  
160  
250  
350  
-
-
-
-
250  
400  
630  
-
-
-
-
C
CE  
FE  
I = 100 mA, V = 1 V, h -grp.25  
C
CE  
FE  
I = 100 mA, V = 1 V, h -grp.40  
C
CE  
FE  
2)  
2)  
2)  
I = 300 mA, V = 1 V, h -grp.16  
C
CE  
FE  
I = 300 mA, V = 1 V, h -grp.25  
C
CE  
FE  
I = 300 mA, V = 1 V, h -grp.40  
C
CE  
FE  
3)  
I = 500 mA, V = 1 V, all h -grps.  
C
CE  
FE  
1)  
Collector-emitter saturation voltage  
I = 500 mA, I = 50 mA  
V
V
-
-
0.7  
V
CEsat  
BEsat  
C
B
1)  
Base emitter saturation voltage  
I = 500 mA, I = 50 mA  
-
-
1.2  
C
B
1
Pulse test: t < 300µs; D < 2%  
2
3
For all BC817 and BC818 subtypes  
For all BC817K and BC818K subtypes  
2008-04-11  
3
BC817.../BC818...  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
AC Characteristics  
-
170  
-
MHz  
pF  
Transition frequency  
f
T
I = 50 mA, V = 5 V, f = 100 MHz  
C
CE  
Collector-base capacitance  
C
C
cb  
eb  
1)  
V
V
= 10 V, f = 1 MHz  
= 10 V, f = 1 MHz  
-
-
6
3
-
-
CB  
CB  
2)  
Emitter-base capacitance  
1)  
V
V
1
= 0.5 V, f = 1 MHz  
= 0.5 V, f = 1 MHz  
-
-
60  
40  
-
-
EB  
EB  
2)  
For all BC817 and BC818 subtypes  
For all BC817K and BC818K subtypes  
2
2008-04-11  
4
BC817.../BC818...  
DC current gain h = ƒ(I )  
DC current gain h = ƒ(I )  
FE  
C
FE  
C
V
= 1 V  
V
= 1 V  
CE  
CE  
h -grp.16  
h -grp.25  
FE  
FE  
10 3  
10 3  
10 2  
10 2  
105 °C  
85 °C  
65 °C  
25 °C  
-40 °C  
105 °C  
85 °C  
65 °C  
25 °C  
-40 °C  
10 1  
10 1  
10 -5  
10 -4  
10 -3  
10 -2  
10 -1  
10 0  
10 -5  
10 -4  
10 -3  
10 -2  
10 -1  
10 0  
A
C
A
I
I
C
DC current gain h = ƒ(I )  
Collector-emitter saturation voltage  
I = ƒ(V ), h = 10  
FE  
C
V
= 1 V  
CE  
C
CEsat  
FE  
h -grp.40  
FE  
10 3  
BC 817/818  
EHP00223  
103  
mA  
Ι C  
150 ˚C  
25 ˚C  
102  
5
-50 ˚C  
10 2  
101  
5
105 °C  
85 °C  
65 °C  
25 °C  
-40 °C  
100  
5
10 1  
10-1  
10 -5  
10 -4  
10 -3  
10 -2  
10 -1  
10 0  
0
0.2  
0.4  
0.6  
V
0.8  
A
C
I
VCEsat  
2008-04-11  
5
BC817.../BC818...  
Base-emitter saturation voltage  
Collector cutoff current I  
= ƒ(T )  
CBO A  
I = ƒ(V  
), h = 10  
V
= 25 V  
C
BEsat  
FE  
CBO  
BC 817/818  
EHP00221  
BC 817/818  
EHP00222  
105  
103  
mA  
nA  
Ι CBO  
Ι C  
150 ˚C  
25 ˚C  
-50 ˚C  
104  
102  
5
max  
103  
102  
101  
5
typ  
100  
5
101  
100  
10-1  
0
1.0  
2.0  
3.0  
V
4.0  
0
50  
100  
150  
˚C  
TA  
VBEsat  
Transition frequency f = ƒ(I )  
Collector-base capacitance C = ƒ(V )  
cb CB  
T
C
V
= parameter in V, f = 2 GHz  
Emitter-base capacitance C = ƒ(V )  
BC817, BC818: - - - , BC817K, BC818K:  
CE  
eb EB  
___  
BC 817/818  
EHP00218  
103  
75  
pF  
MHz  
5
f T  
60  
CEB: BC817/BC818  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
CEB: BC817K/BC818K  
CCB: BC817/BC818  
CCB: BC817K/BC818K  
102  
5
101  
0
100  
101  
102  
mA 103  
V
0
2
4
6
8
10 12 14 16  
20  
V
/V  
Ι C  
CB EB  
2008-04-11  
6
BC817.../BC818...  
Total power dissipation P = ƒ(T )  
BC817, BC818: - - - , BC817K, BC818K:  
Total power dissipation P = ƒ(T )  
tot S  
BC817W/KW, BC818W/KW  
tot  
S
___  
550  
mW  
550  
mW  
450  
450  
400  
350  
300  
250  
200  
150  
100  
50  
BC817K, BC818K  
BC817, BC818  
400  
350  
300  
250  
200  
150  
100  
50  
0
0
°C  
°C  
0
15 30 45 60 75 90 105 120  
150  
0
15 30 45 60 75 90 105 120  
150  
T
T
S
S
Permissible Pulse Load R  
= ƒ(t )  
Permissible Pulse Load  
thJS  
p
BC817, BC818  
P
/P  
= ƒ(t )  
totmax totDC p  
BC817, BC818  
10 3  
10 2  
10 1  
10 0  
10 -1  
10 4  
-
10 3  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 2  
10 1  
10 0  
D = 0,5  
0,2  
0,1  
0.2  
0,05  
0,02  
0,01  
0,005  
0
0.5  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
2008-04-11  
7
BC817.../BC818...  
Permissible Pulse Load R  
BC817/K, BC818/K  
= ƒ(t )  
Permissible Pulse Load  
P /P = ƒ(t )  
totmax totDC  
thJS  
p
p
BC817K, BC818K  
10 2  
10 1  
10 0  
10 -1  
10 3  
-
10 2  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
D = 0,5  
0,2  
0,1  
0,05  
0,02  
0,01  
0.2  
10 1  
0.5  
0,005  
0
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
T
T
P
P
Permissible Puls Load R  
BC817W/KW, BC818W/KW  
= ƒ (t )  
Permissible Pulse Load  
P /P = ƒ(t )  
totmax totDC  
thJS  
p
p
BC817W/KW, BC818W/KW  
10 3  
K/W  
10 3  
-
10 2  
D = 0  
10 2  
10 1  
10 0  
0.005  
0.01  
0.02  
0.05  
0.1  
10 1  
0.5  
0.2  
0.2  
0.5  
0.1  
0.05  
0.02  
0.01  
0.005  
D = 0  
10 0  
10 -1  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
10 -6  
10 -5  
10 -4  
10 -3  
10 -2  
10 0  
s
s
t
t
p
p
2008-04-11  
8
Package SOT23  
BC817.../BC818...  
Package Outline  
0.1  
1
0.1 MAX.  
0.1  
2.9  
B
3
1
2
1)  
+0.1  
0.4  
A
-0.05  
0.08...0.15  
0...8˚  
C
0.95  
1.9  
0.25 B C  
1) Lead width can be 0.6 max. in dambar area  
M
M
0.2  
A
Foot Print  
0.8  
0.8  
1.2  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
EH  
s
Pin 1  
BCW66  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
1.15  
3.15  
Pin 1  
2008-04-11  
9
Package SOT323  
BC817.../BC818...  
Package Outline  
0.1  
0.9  
0.2  
2
0.1 MAX.  
0.1  
+0.1  
3x  
0.3  
-0.05  
M
0.1  
A
3
1
2
+0.1  
0.15  
-0.05  
0.65 0.65  
M
0.2  
A
Foot Print  
0.6  
0.65  
0.65  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
BCR108W  
Type code  
Pin 1  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
0.2  
4
Pin 1  
2.15  
1.1  
2008-04-11  
10  
BC817.../BC818...  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2007.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2008-04-11  
11  

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