BCR139T-E6327 [INFINEON]
Small Signal Bipolar Transistor, 0.1A I(C), 1-Element, NPN, Silicon;
| 型号： | BCR139T-E6327 |
| 厂家： | 
Infineon |
| 描述： | Small Signal Bipolar Transistor, 0.1A I(C), 1-Element, NPN, Silicon |
| 文件： | 总10页 (文件大小：555K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BCR139...
NPN Silicon Digital Transistor
• Switching circuit, inverter, interface circuit,
driver circuit
• Built in bias resistor (R =22 kΩ)
1
BCR139F/L3
BCR139T
C
3
R1
1
2
B
E
EHA07264
Type
Marking
WYs
WY
Pin Configuration
Package
TSFP-3
TSLP-3-4
SC75
BCR139F
BCR139L3
BCR139T
1=B 2=E 3=C
1=B 2=E 3=C
1=B 2=E 3=C
-
-
-
-
-
-
-
-
-
WYs
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-base voltage
Emitter-base voltage
Input on voltage
Symbol
Value
50
50
Unit
V
V
V
V
V
CEO
CBO
EBO
i(on)
5
30
100
mA
Collector current
I
C
mW
Total power dissipation-
P
tot
BCR139F, T ≤ 128°C
250
250
250
S
BCR139L3, T ≤ 135°C
S
BCR139T, T ≤ 109°C
S
150
°C
Junction temperature
Storage temperature
T
j
T
-65 ... 150
Mar-03-2005
1
BCR139...
Thermal Resistance
Parameter
Junction - soldering point
Symbol
Value
Unit
K/W
1)
R
thJS
BCR139F
BCR139L3
BCR139T
≤ 90
≤ 60
≤ 165
Electrical Characteristics at T = 25°C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ. max.
DC Characteristics
Collector-emitter breakdown voltage
50
-
-
-
-
V
V
V
V
(BR)CEO
(BR)CBO
(BR)EBO
CBO
I = 100 µA, I = 0
C
B
Collector-base breakdown voltage
I = 10 µA, I = 0
50
5
-
-
-
-
C
E
Emitter-base breakdown voltage
I = 10 µA, I = 0
E
C
Collector-base cutoff current
I
-
100 nA
V
= 40 V, I = 0
CB
E
2)
120
630
0.3
0.8
1.1
29
-
-
DC current gain
h
FE
I = 5 mA, V = 5 V
C
CE
2)
Collector-emitter saturation voltage
I = 10 mA, I = 0.5 mA
V
V
V
-
0.4
0.5
15
-
-
-
V
CEsat
i(off)
C
B
Input off voltage
I = 100 µA, V = 5 V
C
CE
Input on voltage
I = 2 mA, V = 0.3 V
-
i(on)
C
CE
Input resistor
R
22
150
3
kΩ
1
AC Characteristics
Transition frequency
MHz
pF
f
T
I = 10 mA, V = 5 V, f = 100 MHz
C
CE
-
-
Collector-base capacitance
= 10 V, f = 1 MHz
C
cb
V
CB
1
2
For calculation of R
please refer to Application Note Thermal Resistance
thJA
Pulse test: t < 300µs; D < 2%
Mar-03-2005
2
BCR139...
DC current gain h = ƒ(I )
Collector-emitter saturation voltage
FE
C
V
= 5V (common emitter configuration)
V
= ƒ(I ), h = 20
CE
CEsat C FE
10 3
10 -1
A
10 -2
10 -3
10 -4
10 2
10 1
10 -4
10 -3
10 -2
10 -1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
1
A
V
I
V
CEsat
C
Input on Voltage Vi
= ƒ(I )
Input off voltage V
= ƒ(I )
i(off) C
(on)
C
V
= 0.3V (common emitter configuration)
V
= 5V (common emitter configuration)
CE
CE
10 -2
10 -1
A
A
10 -3
10 -4
10 -5
10 -6
10 -2
10 -3
10 -4
10 -1
10 0
10 1
10 2
0
0.5
1
1.5
2
3
V
V
V
V
i(off)
i(on)
Mar-03-2005
3
BCR139...
Total power dissipation P = ƒ(T )
Total power dissipation P = ƒ(T )
tot S
tot
S
BCR139F
BCR139L3
300
mW
300
mW
200
150
100
50
200
150
100
50
0
0
0
0
°C
°C
20
40
60
80
100 120
150
20
40
60
80
100 120
150
T
T
S
S
Total power dissipation P = ƒ(T )
tot
S
BCR139T
300
mW
200
150
100
50
0
0
°C
20
40
60
80
100 120
150
T
S
Mar-03-2005
4
BCR139...
Permissible Puls Load R
BCR139F
= ƒ (t )
Permissible Pulse Load
P /P = ƒ(t )
totmax totDC
thJS
p
p
BCR139F
10 2
K/W
10 3
D=0.5
0.2
10 1
10 0
10 -1
10 2
D=0
0.005
0.01
0.02
0.05
0.1
0.1
0.05
0.02
0.01
0.005
0
0.2
0.5
10 1
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
s
s
t
t
p
p
Permissible Puls Load R
BCR139L3
= ƒ (t )
Permissible Pulse Load
P /P = ƒ(t )
totmax totDC
thJS
p
p
BCR139L3
10 2
10 1
10 0
10 -1
10 3
D = 0
0.005
0.01
0.02
0.05
0.1
10 2
10 1
10 0
0.5
0.2
0.2
0.1
0.5
0.05
0.02
0.01
0.005
D = 0
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2
10 0
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2
10 0
s
s
t
t
p
p
Mar-03-2005
5
BCR139...
Permissible Puls Load R
BCR139T
= ƒ (t )
Permissible Pulse Load
P /P = ƒ(t )
totmax totDC
thJS
p
p
BCR139T
10 3
K/W
10 3
10 2
D=0
0.005
0.01
0.02
0.05
0.1
10 2
10 1
D=0.5
0.2
0.2
0.5
0.1
10 1
0.05
0.02
0.01
0.005
0
10 0
10 -1
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
s
s
t
t
p
p
Mar-03-2005
6
Package SC75
Package Outline
±0.2
1.6
0.2
+0.1
±0.1
-0.05
0.1 MAX. 0.7
A
+0.2
acc. to
DIN 6784
3
1
2
+0.1
0.2
±0.1
0.15
-0.05
0.5
0.5
M
M
0.10
0.20
A
Foot Print
0.4
0.4
0.5 0.5
Marking Layout
Manufacturer
Pin 1
Type code
BCR108T
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
4
0.2 MAX.
0.45
Pin 1
1.75
0.9
Package TSFP-3
Package Outline
±0.05
±0.05
1.2
0.2
0.55-0.05
A
3
1
2
±0.05
±0.05
0.15
0.2
M
0.4 0.4
3x
0.1
A
M
0.1
Foot Print
0.4
0.4
0.4
Marking Layout
Manufacturer
Pin 1
Type code
BCR847BF
Example
Packing
Code E6327: Reel ø180 mm = 3.000 Pieces/Reel
Code E6433: Reel ø330 mm = 10.000 Pieces/Reel
4
0.2
0.3
Pin 1
1.35
0.7
Package TSLP-3-4
Package Outline
Top view
Bottom view
±0.05
0.4
0.6
S
A
1)
0.05 MAX.
±0.035
0.5
M
0.1 A B
0.03
2x
0.05
0.05 2x
S
3
2
3
1
1
2
0.35
B
Orientation
marking
1)
±0.035
0.15
M
M
0.1 A B
2x
0.1 A B
M
0.1 A B 2x
1) Dimension applies to plated terminals
Foot Print
0.6
0.5
R0.19
R0.1
0.2
0.225
0.225
0.15
0.2
0.17
Copper
Solder mask
Stencil apertures
Marking Layout
Type code
Laser marking
Packing
Code E6327: Reel ø180 mm = 15.000 Pieces/Reel
4
0.5
0.76
Orientation
marking
Impressum
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
81669 München
© Infineon Technologies AG 2005.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be
considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of
non-infringement, regarding circuits, descriptions and charts stated herein.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.Infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon
Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body, or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be endangered.
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