BCX42E6327BTSA1 [INFINEON]

Small Signal Bipolar Transistor, 0.8A I(C), 125V V(BR)CEO, 1-Element, PNP, Silicon,;
BCX42E6327BTSA1
型号: BCX42E6327BTSA1
厂家: Infineon    Infineon
描述:

Small Signal Bipolar Transistor, 0.8A I(C), 125V V(BR)CEO, 1-Element, PNP, Silicon,

开关 光电二极管 晶体管
文件: 总7页 (文件大小:526K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BCX42  
PNP Silicon AF and Switching Transistor  
For general AF applications  
High breakdown voltage  
Low collector-emitter saturation voltage  
Complementary type: BCX41 (NPN)  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
2
3
1
Type  
BCX42  
Marking  
DKs  
Pin Configuration  
Package  
SOT23  
1 = B  
2 = E  
3 = C  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
125  
125  
5
800  
1
V
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
V
V
V
CEO  
CBO  
EBO  
mA  
A
I
C
Peak collector current, t 10 ms  
I
p
CM  
100  
200  
330  
mA  
Base current  
Peak base current  
Total power dissipation  
I
B
I
BM  
mW  
°C  
P
tot  
T 79 °C  
S
150  
Junction temperature  
Storage temperature  
T
j
T
-65 ... 150  
stg  
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
Value  
215  
Unit  
K/W  
1)  
R
thJS  
1
For calculation of R  
please refer to Application Note AN077 (Thermal Resistance Calculation)  
thJA  
2011-10-04  
1
BCX42  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
Collector-emitter breakdown voltage  
125  
-
-
-
-
-
-
V
V
V
V
(BR)CEO  
(BR)CBO  
(BR)EBO  
I = 10 mA, I = 0  
C
B
Collector-base breakdown voltage  
I = 100 µA, I = 0  
125  
5
C
E
Emitter-base breakdown voltage  
I = 10 µA, I = 0  
E
C
Collector-base cutoff current  
I
µA  
CBO  
V
V
= 100 V, I = 0  
-
-
-
-
0.1  
20  
CB  
CB  
E
= 100 V, I = 0 , T = 150 °C  
E
A
Collector-emitter cutoff current  
I
CEO  
V
V
= 100 V, T = 85 °C  
-
-
-
-
-
-
10  
75  
100 nA  
CE  
CE  
A
= 100 V, T = 125 °C  
A
Emitter-base cutoff current  
I
EBO  
V
= 4 V, I = 0  
EB  
C
1)  
-
DC current gain  
h
FE  
I = 100 µA, V = 1 V  
25  
63  
40  
-
-
-
-
-
-
C
CE  
I = 100 mA, V = 1 V  
C
CE  
I = 200 mA, V = 1 V  
C
CE  
1)  
Collector-emitter saturation voltage  
I = 300 mA, I = 30 mA  
V
-
-
0.9  
V
CEsat  
C
B
1)  
Base emitter saturation voltage  
I = 300 mA, I = 30 mA  
V
-
-
1.4  
BEsat  
C
B
AC Characteristics  
Transition frequency  
-
-
150  
12  
-
-
MHz  
pF  
f
T
I = 20 mA, V = 5 V, f = 20 MHz  
C
CE  
Collector-base capacitance  
= 10 V, f = 1 MHz  
C
cb  
V
CB  
1Pulse test: t < 300µs; D < 2%  
2011-10-04  
2
BCX42  
DC current gain h = ƒ(I )  
Collector-emitter saturation voltage  
I = ƒ(V ), h = 10  
FE  
C
V
= 1 V  
CE  
C
CEsat  
FE  
BCX 42/BSS 63  
EHP00435  
BCX 42/BSS 63  
EHP00433  
103  
mA  
103  
˚C  
˚C  
˚C  
5
150  
25  
-50  
hFE  
Ι C  
102  
5
150 ˚C  
25 ˚C  
-50 ˚C  
101  
5
102  
5
100  
5
10-1  
101  
10-1  
5 10 0  
5 10 1  
5 102  
Ι C  
10 3  
mA  
0
200  
400  
600 mV 800  
VCE sat  
Base-emitter saturation voltage  
I = ƒ(V ), h = 10  
Collector current I = ƒ(V )  
C
BE  
V = 1V  
C
BEsat  
FE  
CE  
BCX 42/BSS 63  
EHP00432  
BCX 42/BSS 63  
EHP00429  
103  
mA  
103  
mA  
Ι C  
Ι C  
102  
5
102  
5
˚C  
150  
˚C  
˚C  
TA 150  
=
˚C  
˚C  
25  
25  
-50  
˚C  
-50  
101  
5
101  
5
100  
5
100  
5
10-1  
10-1  
0
1
2
3
0
3
1
2
V
V
VBE sat  
VBE  
2011-10-04  
3
BCX42  
Collector cutoff current I  
= ƒ(T )  
Transition frequency f = ƒ(I )  
T C  
CBO  
A
V
= 100 V  
V
= parameter in V, f = 2 GHz  
CBO  
CE  
BCX 42/BSS 63  
EHP00434  
BCX 42/BSS 63  
EHP00431  
104  
nA  
103  
MHz  
5
max  
ΙCB0  
f T  
103  
5
102  
5
102  
typ  
101  
5
5
100  
5
10 -1  
101  
100  
5
10 1  
5
102  
10 3  
0
50  
100  
150  
˚C  
TA  
mA  
Ι C  
Collector-base capacitance C = ƒ(V )  
Total power dissipation P = ƒ(T )  
tot S  
cb  
CB  
Emitter-base capacitance C = ƒ(V )  
eb  
EB  
400  
90  
pF  
mW  
70  
60  
50  
40  
30  
20  
10  
0
300  
250  
200  
150  
100  
50  
CEB  
CCB  
0
V
0
4
8
12  
16  
22  
0
15 30 45 60 75 90 105 120  
150  
°C  
S
V
(V  
T
CB EB  
2011-10-04  
4
BCX42  
Total power dissipation P = ƒ(T )  
tot  
S
BCX 42/BSS 63  
EHP00430  
103  
5
Ptotmax  
PtotDC  
t p  
t p  
T
D
=
T
102  
5
D
0
=
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.5  
101  
5
100  
10-6 10-5 10-4 10-3 10-2  
s
100  
t p  
2011-10-04  
5
Package SOT23  
BCX42  
Package Outline  
0.1  
1
0.1 MAX.  
0.1  
2.9  
B
3
1
2
1)  
+0.1  
0.4  
A
-0.05  
0.08...0.15  
0...8˚  
C
0.95  
1.9  
0.25 B C  
1) Lead width can be 0.6 max. in dambar area  
M
M
0.2  
A
Foot Print  
0.8  
0.8  
1.2  
Marking Layout (Example)  
Manufacturer  
2005, June  
Date code (YM)  
EH  
s
Pin 1  
BCW66  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
4
0.2  
0.9  
1.15  
3.15  
Pin 1  
2011-10-04  
6
BCX42  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (<www.infineon.com>).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
2011-10-04  
7

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