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BGF113

更新时间：2024-09-18 08:16:35
品牌：INFINEON
描述：Differential Microphone Filter and ESD Protection

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BGF113 概述

Differential Microphone Filter and ESD Protection 差分麦克风滤波器和ESD保护 瞬态抑制器

BGF113 规格参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT PACKAGE-8
针数：8Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.83配置：SINGLE
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：S-PBGA-B8元件数量：1
端子数量：8封装主体材料：PLASTIC/EPOXY
封装形状：SQUARE封装形式：GRID ARRAY
峰值回流温度（摄氏度）：NOT SPECIFIED极性：UNIDIRECTIONAL
认证状态：Not Qualified表面贴装：YES
技术：AVALANCHE端子形式：BALL
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED

BGF113 数据手册

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Data Sheet, V3.1, January 2009  
BGF113  
Differential Microphone Filter and ESD Protection  
Small Signal Discretes  
Edition 2009-01-29  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2009.  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of conditions or  
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values  
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby  
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types in  
question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express written  
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure  
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support  
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may  
be endangered.  
BGF113  
Differential Microphone Filter and ESD Protection  
BGF113  
Revision History: 2009-01-29, V3.1  
Previous Version: 2008-09-24, V3.0  
Page  
6
Subjects (major changes since last revision)  
Figure 2 and Figure 3 updated  
Data Sheet  
3
V3.1, 2009-01-29  
BGF113  
Differential Microphone Filter and ESD Protection  
BGF113  
BGF113  
Features  
•
•
Differential microphone filter  
Integrated ESD protection up to 15 kV contact discharge according to  
IEC61000-4-2  
•
•
•
•
More than 40 dB stopband attenuation at 1 GHz  
Wafer Level Package with SnAgCu solder balls  
RoHS and WEEE compliant package  
400 µm solder ball pitch  
WLP-8-6-3D  
Description  
BGF113 is a differential microphone filter with low pass characteristic offering a high stop band attenuation up to  
6 GHz. External pins are protected against 15 kV contact discharge according to IEC61000-4-2. The wafer level  
package is a green leadfree package with a size of 1.16 mm x 1.16 mm and a total height of 0.60 mm.  
Type  
Package  
Marking  
Chip  
BGF113  
WLP-8-6  
GF113  
N0728  
A2  
A3  
R1  
2 kΩ  
External IOs  
B1  
R5  
25 Ω  
B3  
R3  
2.2 kΩ  
C3  
C1  
D1  
800pF  
1250pF  
B2 (GND)  
C2 (GND)  
C2  
R2  
C4  
D2  
800pF  
1 kΩ  
1250pF  
C1  
C3  
R4  
2.2 kΩ  
Figure 1  
Schematic  
Data Sheet  
4
V3.1, 2009-01-29  
BGF113  
Differential Microphone Filter and ESD Protection  
BGF113  
Table 1  
Maximum Ratings  
Parameter  
Symbol  
Values  
Typ.  
–
–
–
–
Unit  
Note /  
Test Condition  
Min.  
0
-40  
-65  
–
Max.  
4
85  
150  
60  
Voltage at all pins to GND  
Operating temperature range  
Storage temperature range  
Input power at all pins  
VP  
V
–
–
–
TOP  
TSTG  
PIN  
°C  
°C  
mW  
@ +70 °C  
Electrostatic Discharge According to IEC61000-4-2  
Contact discharge from pin B1 or C1 to GND VEXT  
-15  
-2  
–
–
15  
2
kV  
kV  
–
–
Contact discharge between all other pins  
VINT  
Table 2  
Electrical Characteristics1)  
Parameter  
Symbol  
Values  
Typ.  
Unit  
Note /  
Test Condition  
Min.  
Max.  
Resistor R1  
Resistor R2  
Resistors R3, R4  
Resistors R5  
Capacitors C1, C2  
Capacitors C3, C4  
R1  
R2  
R3,4  
R5  
C1,2  
C3,4  
IR  
1900 2000 2100  
800 1000 1200  
1760 2200 2640  
Ω
–
–
–
–
–
–
Ω
Ω
20  
25  
30  
Ω
640  
800  
960  
pF  
1000 1250 1500 pF  
Leakage currents  
–
0.1  
0.1  
100  
100  
nA  
µA  
dB  
V = 3 V  
ESD diodes to GND  
V = 14 V  
Insertion loss2)  
IL  
20  
f = 0.1 ... 6 GHz  
Pins B1 to B3 or C1 to C3  
1) at TA = 25 °C  
ZS = ZL = 50 Ω  
2) Insertion loss (see also Figure 2) strongly depends upon source and load impedance and GND connection on the circuit  
board. For RF test purposes a 50 Ω environment is used.  
Data Sheet  
5
V3.1, 2009-01-29  
BGF113  
Differential Microphone Filter and ESD Protection  
BGF113  
BGF113 insertion loss  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
0.1  
1
10  
100  
1000  
10000  
MHz  
Figure 2  
Insertion loss B1 - B3 or C1 - C3, ZS = ZL = 50 Ω  
BGF113 cross talk  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
-90  
-100  
-110  
-120  
0.1  
1
10  
100  
1000  
10000  
MHz  
Figure 3  
Cross talk B1 - C3 or C1 - B3, ZS = ZL = 50 Ω  
Data Sheet  
6
V3.1, 2009-01-29  
BGF113  
Differential Microphone Filter and ESD Protection  
BGF113  
Package outlines  
Solder balls face down  
Solder balls face up  
0.0ꢀ  
0.0ꢀ  
1.16  
0.6  
B
0.4  
0.0ꢀ  
0.2  
STANDOFF  
0.1  
C
0.0ꢀ  
0.0ꢀ  
(0.18  
)
(0.18  
)
Pin A1  
Corner Index Area 2)  
A
A3  
B3  
A2  
B2  
B1  
C1  
C3  
C2  
C
2 x 0.4 = 0.8  
8x  
1)  
0.08  
C
0.04  
0.2ꢀ  
M
ø0.0ꢀ  
A B  
8x  
COPLANARITY  
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C  
2) A1 corner identified by marking  
3) Primary datum C and seating plane are defined by the domed crowns of the balls  
WLP-8-6-N-PO V01  
Figure 4  
WLP-8-6 (dimensions in mm)  
Tape and reel specification  
0.2ꢀ  
4
1.33  
0.7ꢀ  
Pin 1  
Corner Index Area  
WLP-8-6-TP V01  
Figure 5  
Tape for WLP-8-6 (dimensions in mm)  
You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”:  
http://www.infineon.com/products.  
Data Sheet  
7
V3.1, 2009-01-29  

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