BSO303SPNTMA1

更新时间:2024-09-18 18:02:32
品牌:INFINEON
描述:Power Field-Effect Transistor, 8.9A I(D), 30V, 0.021ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SO-8

BSO303SPNTMA1 概述

Power Field-Effect Transistor, 8.9A I(D), 30V, 0.021ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, SO-8 功率场效应晶体管

BSO303SPNTMA1 规格参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.72其他特性:AVALANCHE RATED,LOGIC LEVEL COMPATIBLE
雪崩能效等级(Eas):97 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):8.9 A
最大漏源导通电阻:0.021 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G8元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大脉冲漏极电流 (IDM):35.6 A
表面贴装:YES端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

BSO303SPNTMA1 数据手册

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Preliminary data  
BSO303SP  
OptiMOS -P Small-Signal-Transistor  
Product Summary  
Feature  
V
-30  
21  
V
DS  
P-Channel  
R
mΩ  
A
DS(on)  
Enhancement mode  
Logic Level  
I
-8.9  
D
150°C operating temperature  
Avalanche rated  
dv/dt rated  
1
2
3
4
8
7
6
5
S
S
S
G
D
D
D
D
Top View  
SIS00062  
Type  
Package  
Ordering Code  
BSO303SP  
SO 8  
Q67042-S4129  
Maximum Ratings,at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
T =25°C  
-8.9  
-7.1  
A
T =70°C  
A
-35.6  
Pulsed drain current  
I
D puls  
T =25°C  
A
97  
-6  
mJ  
Avalanche energy, single pulse  
E
AS  
I =-8.9 A , V =-25V, R =25Ω  
D
DD  
GS  
kV/µs  
Reverse diode dv/dt  
dv/dt  
I =-8.9A, V =-24V, di/dt=200A/µs, T  
DS jmax  
=150°C  
S
V
Gate source voltage  
Power dissipation  
V
P
±20  
GS  
tot  
2.35  
W
T =25°C  
A
°C  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T , T  
-55... +150  
55/150/56  
j
stg  
Page 1  
2002-01-08  
Preliminary data  
BSO303SP  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
-
35  
K/W  
Thermal resistance, junction - soldering point  
SMD version, device on PCB:  
@ min footprint, t < 10s  
R
thJS  
R
thJA  
-
-
-
-
110  
53  
2
@ 6 cm cooling area 1)  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
-30  
-1  
typ. max.  
Static Characteristics  
-
-
V
Drain-source breakdown voltage  
V
V
(BR)DSS  
GS(th)  
V
=0, I =-250µA  
D
GS  
-1.5  
-2  
Gate threshold voltage, V = V  
GS  
DS  
I =-100µA  
D
µA  
Zero gate voltage drain current  
I
DSS  
V
=-30V, V =0, T =25°C  
GS  
-
-
-
-0.1  
-10  
-10  
-1  
DS  
j
V
=-30V, V =0, T =150°C  
GS  
-100  
DS  
j
-100 nA  
Gate-source leakage current  
I
GSS  
V
=-20V, V =0  
DS  
GS  
-
-
24  
15  
31  
21  
Drain-source on-state resistance  
R
mΩ  
DS(on)  
V
=-4.5V, I =-7.3A  
D
GS  
Drain-source on-state resistance  
R
DS(on)  
V
=-10V, I =-8.9A  
D
GS  
1
2
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air; t10 sec.  
Page 2  
2002-01-08  
Preliminary data  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
BSO303SP  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
çV ç2*çI ç*R  
DS(on)max  
12  
24  
-
S
Transconductance  
g
DS  
D
fs  
I =-7.1A  
D
V
=0, V =-25V,  
DS  
-
-
-
-
-
-
-
1754  
465  
389  
10.3  
12.5  
53  
-
-
-
pF  
Input capacitance  
Output capacitance  
C
GS  
f=1MHz  
iss  
C
oss  
rss  
Reverse transfer capacitance C  
V
=-15V, V =-10V,  
GS  
15.5 ns  
19  
Turn-on delay time  
Rise time  
t
d(on)  
DD  
I =-1A, R =6Ω  
t
D
G
r
80  
Turn-off delay time  
Fall time  
t
d(off)  
40.3  
60.5  
t
f
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
V
=-24V, I =-8.9A  
-
-
-
-4.1  
-15.8  
-46  
-6.2 nC  
-26  
Q
Q
Q
DD  
D
gs  
gd  
g
V
=-24V, I =-8.9A,  
-69  
Gate charge total  
DD  
D
V
=0 to -10V  
GS  
V
=-24V, I =-8.9A  
-
-2.4  
-
V
A
Gate plateau voltage  
V
DD  
D
(plateau)  
Reverse Diode  
T =25°C  
-
-
-
-
-3.5  
Inverse diode continuous  
forward current  
I
S
A
-35.6  
Inverse diode direct current,  
pulsed  
I
SM  
V
=0, |I | = |I |  
-
-
-
-0.87 -1.09 V  
Inverse diode forward voltage V  
GS  
F
D
SD  
V =-15V, |I | = |l |,  
R
25  
37  
ns  
Reverse recovery time  
t
rr  
F
D
di /dt=100A/µs  
11.7  
17.6 nC  
Reverse recovery charge  
Q
rr  
F
Page 3  
2002-01-08  
Preliminary data  
BSO303SP  
1 Power dissipation  
= f (T )  
2 Drain current  
I = f (T )  
P
tot  
A
D
A
parameter: |V |10 V  
GS  
BSO303SP  
BSO303SP  
-10  
2.6  
W
A
2.2  
2
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
1.8  
1.6  
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
0
20  
40  
60  
80 100 120  
160  
0
20  
40  
60  
80 100 120  
160  
°C  
°C  
T
T
A
A
3 Safe operating area  
I = f ( V  
4 Transient thermal impedance  
= f (t )  
)
DS  
Z
D
thJS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
A
p
-10 2  
BSO303SP  
BSO303SP  
10 2  
K/W  
t
= 76.0µs  
100 µs  
p
A
10 1  
-10 1  
1 ms  
10 0  
10 -1  
10 -2  
10 ms  
-10 0  
-10 -1  
-10 -2  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
DC  
10 -3  
0.01  
single pulse  
10 -4  
-10 -1  
-10 0  
-10 1  
-10 2  
V
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
s
V
DS  
t
p
Page 4  
2002-01-08  
Preliminary data  
BSO303SP  
5 Typ. output characteristic  
I = f (V ); T =25°C  
6 Typ. drain-source on resistance  
= f (I )  
R
D
DS  
j
DS(on)  
D
parameter: t = 80 µs  
parameter: V  
p
GS  
0.1  
30  
Vgs = - 3V  
Vgs = - 3.5V  
Vgs = - 4V  
Vgs = - 4.5V  
Vgs= - 5V  
Vgs = - 5.5V  
Vgs = - 6V  
Vgs = - 8V  
Vgs = - 10V  
Vgs= - 3.5V  
A
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
Vgs= - 4V  
Vgs= - 4.5V  
Vgs= - 5V  
Vgs= - 6V  
Vgs= - 10V  
20  
15  
10  
5
Vgs= -3V  
Vgs= -2.5V  
0
0
1
2
3
4
5
6
7.5  
0
2
4
6
8
10 12 14 16  
20  
V
A
- V  
- I  
D
DS  
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
g = f(I ); T =25°C  
I = f ( V ); |V |2 x |I | x R  
D
GS  
DS  
D
DS(on)max  
fs  
D
j
parameter: t = 80 µs  
parameter: t = 80 µs  
p
p
40  
40  
A
S
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
0
0
0
0.5  
1
1.5  
2
2.5  
3
4
0
5
10  
15  
20  
25  
30  
40  
V
A
- V  
- I  
D
GS  
Page 5  
2002-01-08  
Preliminary data  
BSO303SP  
9 Drain-source on-resistance  
= f(T )  
10 Typ. gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter: I = -8.9 A, V = -10 V  
parameter: V = V  
GS DS  
D
GS  
2.5  
30  
mΩ  
max  
typ  
98%  
25  
22.5  
20  
1.5  
1
typ.  
min  
17.5  
15  
0.5  
0
12.5  
10  
°C  
-60  
-20  
20  
60  
100  
160  
-60  
-20  
20  
60  
100  
160  
T
j
11 Typ. capacitances  
C = f (V )  
12 Forward character. of reverse diode  
I = f (V )  
DS  
F
SD  
parameter: V =0, f=1 MHz  
parameter: T , tp = 80 µs  
GS  
j
10 4  
-10 2  
BSO303SP  
A
pF  
C
iss  
-10 1  
10 3  
C
C
oss  
rss  
-10 0  
Tj = 25 °C typ  
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
10 2  
-10 -1  
V
0
5
10  
15  
20  
30  
0
-0.4 -0.8 -1.2 -1.6  
-2  
-2.4  
-3  
V
- V  
V
DS  
SD  
Page 6  
2002-01-08  
Preliminary data  
BSO303SP  
13 Typ. avalanche energy  
14 Typ. gate charge  
= f (Q  
E
V
= f (T ), par.: I = -8.9 A  
V
)
Gate  
AS  
DD  
j
D
GS  
= -25 V, R = 25 Ω  
parameter: I = -8.9 A pulsed  
GS  
D
BSO303SP  
100  
-16  
mJ  
V
80  
70  
60  
50  
40  
30  
20  
10  
0
-12  
-10  
-8  
-6  
-4  
-2  
0
0.2 VDS max  
0.5 VDS max  
0.8 VDS max  
nC  
25  
50  
75  
100  
150  
0
10  
20  
30  
40  
50  
70  
°C  
T
|Q  
|
j
Gate  
15 Drain-source breakdown voltage  
V
= f (T )  
(BR)DSS  
j
BSO303SP  
-36  
V
-34  
-33  
-32  
-31  
-30  
-29  
-28  
-27  
-60  
-20  
20  
60  
100  
180  
°C  
T
j
Page 7  
2002-01-08  
Preliminary data  
BSO303SP  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Page 8  
2002-01-08  

BSO303SPNTMA1 替代型号

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