BSP123L6327

更新时间:2024-09-18 14:22:32
品牌:INFINEON
描述:Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4

BSP123L6327 概述

Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4 MOS管 功率场效应晶体管

BSP123L6327 规格参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:GREEN, PLASTIC PACKAGE-4针数:4
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.75风险等级:5.13
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):0.37 A
最大漏极电流 (ID):0.37 A最大漏源导通电阻:6 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G4
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):1.79 W最大脉冲漏极电流 (IDM):1.48 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:DUAL
晶体管元件材料:SILICONBase Number Matches:1

BSP123L6327 数据手册

通过下载BSP123L6327数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

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Rev. 1.5  
BSP123  
Ò
SIPMOS Small-Signal-Transistor  
Feature  
Product Summary  
V
100  
6
V
DS  
· N-Channel  
· Enhancement mode  
· Logic Level  
· dv/dt rated  
R
W
A
DS(on)  
I
0.37  
D
PG-SOT223  
Pb-free lead plating; RoHS compliant  
Qualified according to AEC Q101  
Type  
Package  
Tape and Reel Information  
L6433: 4000 pcs/reel  
L6327: 1000 pcs/reel  
Marking Packaging  
PG-SOT223  
PG-SOT223  
Non dry  
Non dry  
BSP123  
BSP123  
BSP123  
BSP123  
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
T =25°C  
0.37  
0.3  
A
T =70°C  
A
1.48  
Pulsed drain current  
I
D puls  
T =25°C  
A
6
kV/µs  
V
Reverse diode dv/dt  
dv/dt  
I =0.37A, V =80V, di/dt=200A/µs, T =150°C  
jmax  
S
DS  
Gate source voltage  
V
P
±20  
GS  
tot  
ESD Class JESD22-A114-HBM  
Power dissipation  
0 (<250V)  
1.79  
W
T =25°C  
A
°C  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T , T  
j
-55... +150  
55/150/56  
stg  
Page 1  
2010-06-22  
Rev. 1.5  
BSP123  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
-
15  
25  
K/W  
Thermal resistance, junction - soldering point  
(Pin 4)  
R
R
thJS  
thJA  
SMD version, device on PCB:  
@ min. footprint  
-
-
100  
51  
115  
70  
2
1)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
100  
0.8  
typ. max.  
Static Characteristics  
-
-
V
Drain-source breakdown voltage  
V
V
(BR)DSS  
V
=0, I =250µA  
D
GS  
1.4  
1.8  
Gate threshold voltage, V = V  
GS  
DS  
GS(th)  
I =50µA  
D
µA  
Zero gate voltage drain current  
I
DSS  
V
V
=100V, V =0, T =25°C  
-
-
-
-
0.01  
5
DS  
DS  
GS  
j
=100V, V =0, T =150°C  
GS  
j
-
-
-
-
-
10  
30  
10  
6
nA  
Gate-source leakage current  
I
GSS  
V
=20V, V =0  
DS  
GS  
Drain-source on-state resistance  
R
14  
4.8  
3.5  
W
DS(on)  
DS(on)  
DS(on)  
V
=2.8V, I =15mA  
D
GS  
Drain-source on-state resistance  
R
R
V
=4.5V, I =0.3A  
D
GS  
Drain-source on-state resistance  
V
=10V, I =0.37A  
D
GS  
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (single layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
2010-06-22  
Rev. 1.5  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
BSP123  
j
Parameter  
Symbol  
Conditions  
Values  
typ. max.  
Unit  
min.  
Dynamic Characteristics  
V
³ 2*I *R ,  
DS(on)max  
0.13  
0.27  
-
S
Transconductance  
g
DS  
D
fs  
I =0.3A  
D
V
=0, V =25V,  
-
-
-
-
-
-
-
56  
9
70  
11.3  
4.4  
5
pF  
Input capacitance  
Output capacitance  
C
GS  
DS  
iss  
f=1MHz  
C
oss  
rss  
3.5  
3.3  
3.2  
8.7  
9.4  
Reverse transfer capacitance C  
V
=50V, V =10V,  
ns  
Turn-on delay time  
Rise time  
t
d(on)  
DD  
GS  
I =0.37A, R =6W  
4.8  
13  
t
D
G
r
Turn-off delay time  
Fall time  
t
d(off)  
14  
t
f
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Gate charge total  
V
=80V, I =0.37A  
-
-
-
0.09  
0.8  
0.13 nC  
1.2  
Q
Q
Q
DD  
D
gs  
gd  
g
V
=80V, I =0.37A,  
1.6  
2.4  
DD  
D
V
=0 to 10V  
GS  
V
=80V, I = 0.37 A  
-
-
3.61  
-
-
V
Gate plateau voltage  
V
DD  
D
(plateau)  
Reverse Diode  
T =25°C  
0.37 A  
1.48  
Inverse diode continuous  
forward current  
I
S
A
-
-
-
-
-
Inv. diode direct current, pulsedI  
SM  
V
=0, I = I  
S
0.9  
1.2  
79  
27  
V
Inverse diode forward voltage V  
GS  
F
SD  
V =50V, I =l ,  
52.7  
17.8  
ns  
nC  
Reverse recovery time  
t
rr  
R
F S  
di /dt=100A/µs  
Reverse recovery charge  
Q
rr  
F
Page 3  
2010-06-22  
Rev. 1.5  
BSP123  
1 Power dissipation  
2 Drain current  
I = f (T )  
P
= f (T )  
tot  
A
D
A
parameter: V ³ 10 V  
GS  
BSP123  
BSP123  
0.4  
1.9  
W
A
1.6  
1.4  
1.2  
1
0.32  
0.28  
0.24  
0.2  
0.8  
0.6  
0.4  
0.2  
0
0.16  
0.12  
0.08  
0.04  
0
0
20  
40  
60  
80 100 120  
160  
0
20  
40  
60  
80 100 120  
160  
°C  
°C  
T
T
A
A
3 Safe operating area  
I = f ( V  
4 Transient thermal impedance  
Z = f (t )  
thJA  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
A
p
10 1  
BSP123  
BSP123  
10 3  
K/W  
A
10 2  
t
= 21.0ms  
p
10 0  
10 -1  
10 -2  
10 1  
10 0  
10 -1  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
10 -2  
0.01  
single pulse  
DC  
10 -3  
10 0  
10 1  
10 2  
10 3  
10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1  
10 3  
V
s
V
t
p
DS  
Page 4  
2010-06-2  
Rev. 1.5  
BSP123  
5 Typ. output characteristic  
I = f (V )  
6 Typ. drain-source on resistance  
= f (I )  
R
D
DS  
DS(on)  
D
parameter: T = 25 °C, V  
parameter: Tj = 25 °C, V  
GS  
j
GS  
20  
0.7  
A
10V  
5V  
2.3V  
2.9V  
3.1V  
3.5V  
3.7V  
3.9V  
4.1V  
4.5V  
5.0V  
10V  
W
4.5V  
4.1V  
0.55 3.9V  
3.7V  
0.6  
16  
14  
12  
10  
8
0.5  
3.5V  
3.1V  
2.9V  
2.3V  
0.45  
0.4  
0.35  
0.3  
0.25  
0.2  
6
0.15  
0.1  
4
2
0.05  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
5
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.7  
V
A
V
I
D
DS  
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
g = f(I )  
I = f ( V ); V ³ 2 x I x R  
D
GS  
DS  
D
DS(on)max  
fs  
D
parameter: Tj = 25 °C  
parameter: Tj = 25 °C  
0.7  
0.4  
S
A
0.3  
0.25  
0.2  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.15  
0.1  
0.05  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
5
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.7  
V
A
V
I
D
GS  
Page 5  
2010-06-22  
Rev. 1.5  
BSP123  
9 Drain-source on-state resistance  
= f (T )  
10 Typ. gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter : I = 0.37 A, V = 10 V  
parameter: V = V ; I =50µA  
GS DS D  
D
GS  
BSP123  
24  
2.2  
W
V
98%  
typ.  
2%  
20  
18  
16  
14  
12  
10  
8
1.8  
1.6  
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
98%  
6
4
typ  
2
0
°C  
-60  
-20  
20  
60  
100  
180  
-60  
-20  
20  
60  
100  
160  
°C  
T
T
j
j
11 Typ. capacitances  
C = f (V )  
12 Forward character. of reverse diode  
I = f (V )  
DS  
F
SD  
parameter: V =0, f=1 MHz, Tj = 25 °C  
parameter: T  
GS  
j
10 3  
10 1  
BSP123  
pF  
A
10 2  
10 0  
C
iss  
C
oss  
10 1  
10 -1  
Tj = 25 °C typ  
C
Tj = 150 °C typ  
Tj = 25 °C (98%)  
Tj = 150 °C (98%)  
rss  
10 0  
10 -2  
0
4
8
12 16 20 24 28  
36  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
V
V
V
V
SD  
DS  
Page 6  
2010-06-22  
Rev. 1.5  
14 Drain-source breakdown voltage  
BSP123  
13 Typ. gate charge  
= f (Q ); parameter: V  
V
,
V
= f (T )  
GS  
G
DS  
(BR)DSS  
j
I = 0.37 A pulsed, T = 25 °C  
D
j
BSP123  
BSP123  
16  
V
120  
V
114  
112  
110  
108  
106  
104  
102  
100  
98  
12  
10  
8
0.2 VDS max  
0.5 VDS max  
0.8 VDS max  
6
4
96  
94  
2
92  
0
90  
nC  
0
0.4  
0.8  
1.2  
1.6  
2
2.8  
-60  
-20  
20  
60  
100  
180  
°C  
Q
T
j
G
Page 7  
2010-06-22  
Rev. 1.5  
BSP123  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© 2010 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee of  
conditions or characteristics. With respect to any examples or hints given herein, any typical  
values stated herein and/or any information regarding the application of the device,  
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,  
including without limitation, warranties of non-infringement of intellectual property rights  
of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices, please  
contact the nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements, components may contain dangerous substances. For information  
on the types in question, please contact the nearest Infineon Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems only with  
the express written approval of Infineon Technologies, if a failure of such components can  
reasonably be expected to cause the failure of that life-support device or system or to affect  
the safety or effectiveness of that device or system. Life support devices or systems are  
intended to be implanted in the human body or to support and/or maintain and sustain  
and/or protect human life. If they fail, it is reasonable to assume that the health of the user  
or other persons may be endangered.  
Page 8  
2010-06-22  

BSP123L6327 替代型号

型号 制造商 描述 替代类型 文档
BSP123 INFINEON SIPMOS Small-Signal Transistor (N channel Enhancement mode Logic Level) 功能相似
BSP123E6327 INFINEON Power Field-Effect Transistor, 0.38A I(D), 100V, 10ohm, 1-Element, N-Channel, Silicon, Met 功能相似

BSP123L6327 相关器件

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