BSP123L6327
更新时间:2024-09-18 14:22:32
品牌:INFINEON
描述:Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4
BSP123L6327 概述
Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4 MOS管 功率场效应晶体管
BSP123L6327 规格参数
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | GREEN, PLASTIC PACKAGE-4 | 针数: | 4 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8541.29.00.75 | 风险等级: | 5.13 |
Is Samacsys: | N | 其他特性: | LOGIC LEVEL COMPATIBLE |
外壳连接: | DRAIN | 配置: | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压: | 100 V | 最大漏极电流 (Abs) (ID): | 0.37 A |
最大漏极电流 (ID): | 0.37 A | 最大漏源导通电阻: | 6 Ω |
FET 技术: | METAL-OXIDE SEMICONDUCTOR | JESD-30 代码: | R-PDSO-G4 |
JESD-609代码: | e3 | 湿度敏感等级: | 1 |
元件数量: | 1 | 端子数量: | 4 |
工作模式: | ENHANCEMENT MODE | 最高工作温度: | 150 °C |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 1.79 W | 最大脉冲漏极电流 (IDM): | 1.48 A |
认证状态: | Not Qualified | 子类别: | FET General Purpose Power |
表面贴装: | YES | 端子面层: | MATTE TIN |
端子形式: | GULL WING | 端子位置: | DUAL |
晶体管元件材料: | SILICON | Base Number Matches: | 1 |
BSP123L6327 数据手册
通过下载BSP123L6327数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Rev. 1.5
BSP123
Ò
SIPMOS Small-Signal-Transistor
Feature
Product Summary
V
100
6
V
DS
· N-Channel
· Enhancement mode
· Logic Level
· dv/dt rated
R
W
A
DS(on)
I
0.37
D
PG-SOT223
Pb-free lead plating; RoHS compliant
•
• Qualified according to AEC Q101
Type
Package
Tape and Reel Information
L6433: 4000 pcs/reel
L6327: 1000 pcs/reel
Marking Packaging
PG-SOT223
PG-SOT223
Non dry
Non dry
BSP123
BSP123
BSP123
BSP123
Maximum Ratings, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Value
Unit
A
Continuous drain current
I
D
T =25°C
0.37
0.3
A
T =70°C
A
1.48
Pulsed drain current
I
D puls
T =25°C
A
6
kV/µs
V
Reverse diode dv/dt
dv/dt
I =0.37A, V =80V, di/dt=200A/µs, T =150°C
jmax
S
DS
Gate source voltage
V
P
±20
GS
tot
ESD Class JESD22-A114-HBM
Power dissipation
0 (<250V)
1.79
W
T =25°C
A
°C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
T , T
j
-55... +150
55/150/56
stg
Page 1
2010-06-22
Rev. 1.5
BSP123
Thermal Characteristics
Parameter
Symbol
Values
typ. max.
Unit
min.
Characteristics
-
15
25
K/W
Thermal resistance, junction - soldering point
(Pin 4)
R
R
thJS
thJA
SMD version, device on PCB:
@ min. footprint
-
-
100
51
115
70
2
1)
@ 6 cm cooling area
Electrical Characteristics, at T = 25 °C, unless otherwise specified
j
Parameter
Symbol
Values
Unit
min.
100
0.8
typ. max.
Static Characteristics
-
-
V
Drain-source breakdown voltage
V
V
(BR)DSS
V
=0, I =250µA
D
GS
1.4
1.8
Gate threshold voltage, V = V
GS
DS
GS(th)
I =50µA
D
µA
Zero gate voltage drain current
I
DSS
V
V
=100V, V =0, T =25°C
-
-
-
-
0.01
5
DS
DS
GS
j
=100V, V =0, T =150°C
GS
j
-
-
-
-
-
10
30
10
6
nA
Gate-source leakage current
I
GSS
V
=20V, V =0
DS
GS
Drain-source on-state resistance
R
14
4.8
3.5
W
DS(on)
DS(on)
DS(on)
V
=2.8V, I =15mA
D
GS
Drain-source on-state resistance
R
R
V
=4.5V, I =0.3A
D
GS
Drain-source on-state resistance
V
=10V, I =0.37A
D
GS
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (single layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2010-06-22
Rev. 1.5
Electrical Characteristics, at T = 25 °C, unless otherwise specified
BSP123
j
Parameter
Symbol
Conditions
Values
typ. max.
Unit
min.
Dynamic Characteristics
V
³ 2*I *R ,
DS(on)max
0.13
0.27
-
S
Transconductance
g
DS
D
fs
I =0.3A
D
V
=0, V =25V,
-
-
-
-
-
-
-
56
9
70
11.3
4.4
5
pF
Input capacitance
Output capacitance
C
GS
DS
iss
f=1MHz
C
oss
rss
3.5
3.3
3.2
8.7
9.4
Reverse transfer capacitance C
V
=50V, V =10V,
ns
Turn-on delay time
Rise time
t
d(on)
DD
GS
I =0.37A, R =6W
4.8
13
t
D
G
r
Turn-off delay time
Fall time
t
d(off)
14
t
f
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
Gate charge total
V
=80V, I =0.37A
-
-
-
0.09
0.8
0.13 nC
1.2
Q
Q
Q
DD
D
gs
gd
g
V
=80V, I =0.37A,
1.6
2.4
DD
D
V
=0 to 10V
GS
V
=80V, I = 0.37 A
-
-
3.61
-
-
V
Gate plateau voltage
V
DD
D
(plateau)
Reverse Diode
T =25°C
0.37 A
1.48
Inverse diode continuous
forward current
I
S
A
-
-
-
-
-
Inv. diode direct current, pulsedI
SM
V
=0, I = I
S
0.9
1.2
79
27
V
Inverse diode forward voltage V
GS
F
SD
V =50V, I =l ,
52.7
17.8
ns
nC
Reverse recovery time
t
rr
R
F S
di /dt=100A/µs
Reverse recovery charge
Q
rr
F
Page 3
2010-06-22
Rev. 1.5
BSP123
1 Power dissipation
2 Drain current
I = f (T )
P
= f (T )
tot
A
D
A
parameter: V ³ 10 V
GS
BSP123
BSP123
0.4
1.9
W
A
1.6
1.4
1.2
1
0.32
0.28
0.24
0.2
0.8
0.6
0.4
0.2
0
0.16
0.12
0.08
0.04
0
0
20
40
60
80 100 120
160
0
20
40
60
80 100 120
160
°C
°C
T
T
A
A
3 Safe operating area
I = f ( V
4 Transient thermal impedance
Z = f (t )
thJA
)
D
DS
p
parameter : D = 0 , T = 25 °C
parameter : D = t /T
A
p
10 1
BSP123
BSP123
10 3
K/W
A
10 2
t
= 21.0ms
p
10 0
10 -1
10 -2
10 1
10 0
10 -1
D = 0.50
0.20
0.10
0.05
0.02
10 -2
0.01
single pulse
DC
10 -3
10 0
10 1
10 2
10 3
10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1
10 3
V
s
V
t
p
DS
Page 4
2010-06-2
Rev. 1.5
BSP123
5 Typ. output characteristic
I = f (V )
6 Typ. drain-source on resistance
= f (I )
R
D
DS
DS(on)
D
parameter: T = 25 °C, V
parameter: Tj = 25 °C, V
GS
j
GS
20
0.7
A
10V
5V
2.3V
2.9V
3.1V
3.5V
3.7V
3.9V
4.1V
4.5V
5.0V
10V
W
4.5V
4.1V
0.55 3.9V
3.7V
0.6
16
14
12
10
8
0.5
3.5V
3.1V
2.9V
2.3V
0.45
0.4
0.35
0.3
0.25
0.2
6
0.15
0.1
4
2
0.05
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
5
0
0.1
0.2
0.3
0.4
0.5
0.7
V
A
V
I
D
DS
7 Typ. transfer characteristics
8 Typ. forward transconductance
g = f(I )
I = f ( V ); V ³ 2 x I x R
D
GS
DS
D
DS(on)max
fs
D
parameter: Tj = 25 °C
parameter: Tj = 25 °C
0.7
0.4
S
A
0.3
0.25
0.2
0.5
0.4
0.3
0.2
0.1
0
0.15
0.1
0.05
0
0
0.5
1
1.5
2
2.5
3
3.5
4
5
0
0.1
0.2
0.3
0.4
0.5
0.7
V
A
V
I
D
GS
Page 5
2010-06-22
Rev. 1.5
BSP123
9 Drain-source on-state resistance
= f (T )
10 Typ. gate threshold voltage
V = f (T )
GS(th)
R
DS(on)
j
j
parameter : I = 0.37 A, V = 10 V
parameter: V = V ; I =50µA
GS DS D
D
GS
BSP123
24
2.2
W
V
98%
typ.
2%
20
18
16
14
12
10
8
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
98%
6
4
typ
2
0
°C
-60
-20
20
60
100
180
-60
-20
20
60
100
160
°C
T
T
j
j
11 Typ. capacitances
C = f (V )
12 Forward character. of reverse diode
I = f (V )
DS
F
SD
parameter: V =0, f=1 MHz, Tj = 25 °C
parameter: T
GS
j
10 3
10 1
BSP123
pF
A
10 2
10 0
C
iss
C
oss
10 1
10 -1
Tj = 25 °C typ
C
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
rss
10 0
10 -2
0
4
8
12 16 20 24 28
36
0
0.4
0.8
1.2
1.6
2
2.4
3
V
V
V
V
SD
DS
Page 6
2010-06-22
Rev. 1.5
14 Drain-source breakdown voltage
BSP123
13 Typ. gate charge
= f (Q ); parameter: V
V
,
V
= f (T )
GS
G
DS
(BR)DSS
j
I = 0.37 A pulsed, T = 25 °C
D
j
BSP123
BSP123
16
V
120
V
114
112
110
108
106
104
102
100
98
12
10
8
0.2 VDS max
0.5 VDS max
0.8 VDS max
6
4
96
94
2
92
0
90
nC
0
0.4
0.8
1.2
1.6
2
2.8
-60
-20
20
60
100
180
°C
Q
T
j
G
Page 7
2010-06-22
Rev. 1.5
BSP123
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of
conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please
contact the nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Page 8
2010-06-22
BSP123L6327 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
BSP123 | INFINEON | SIPMOS Small-Signal Transistor (N channel Enhancement mode Logic Level) | 功能相似 | |
BSP123E6327 | INFINEON | Power Field-Effect Transistor, 0.38A I(D), 100V, 10ohm, 1-Element, N-Channel, Silicon, Met | 功能相似 |
BSP123L6327 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
BSP123L6327HTSA1 | INFINEON | Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4 | 获取价格 | |
BSP123L6327XT | INFINEON | Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4 | 获取价格 | |
BSP123L6433 | INFINEON | Power Field-Effect Transistor, 0.37A I(D), 100V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-4 | 获取价格 | |
BSP123_10 | INFINEON | SIPMOS Small-Signal-Transistor | 获取价格 | |
BSP124 | NXP | TRANSISTOR 0.25 A, 250 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET, FET General Purpose Power | 获取价格 | |
BSP124 | PHILIPS | Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET, | 获取价格 | |
BSP124-T | NXP | TRANSISTOR 0.25 A, 250 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET, FET General Purpose Power | 获取价格 | |
BSP124-TAPE-13 | NXP | TRANSISTOR 0.25 A, 250 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET, FET General Purpose Power | 获取价格 | |
BSP124-TAPE-7 | NXP | TRANSISTOR 0.25 A, 250 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET, FET General Purpose Power | 获取价格 | |
BSP124/T1 | NXP | TRANSISTOR 0.25 A, 250 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET, SOT-223, 4 PIN, FET General Purpose Power | 获取价格 |
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