BSPP80N06S2L-11 [INFINEON]

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,;
BSPP80N06S2L-11
型号: BSPP80N06S2L-11
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,

文件: 总8页 (文件大小:201K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SPP80N06S2L-11  
SPB80N06S2L-11  
OptiMOS Power-Transistor  
Product Summary  
Feature  
V
55  
11  
80  
V
DS  
N-Channel  
R
mΩ  
A
DS(on)  
Enhancement mode  
Logic Level  
I
D
P- TO263 -3-2  
P- TO220 -3-1  
Avalanche rated  
dv/dt rated  
Type  
Package  
Ordering Code  
Marking  
2N06L11  
2N06L11  
SPP80N06S2L-11 P- TO220 -3-1 Q67060-S6035  
SPB80N06S2L-11 P- TO263 -3-2 Q67060-S6036  
Maximum Ratings, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Value  
Unit  
A
Continuous drain current  
I
D
1)  
T =25°C,  
C
80  
58  
320  
Pulsed drain current  
I
D puls  
T =25°C  
C
280  
mJ  
Avalanche energy, single pulse  
E
AS  
I =80 A , V =25V, R =25Ω  
D
DD  
GS  
2)  
E
16  
6
Repetitive avalanche energy, limited by T  
Reverse diode dv/dt  
AR  
jmax  
dv/dt  
kV/µs  
I =80A, V =44V, di/dt=200A/µs, T =175°C  
jmax  
S
DS  
Gate source voltage  
Power dissipation  
V
V
±20  
158  
GS  
P
W
tot  
T =25°C  
C
°C  
Operating and storage temperature  
IEC climatic category; DIN IEC 68-1  
T , T  
-55... +175  
55/175/56  
j
stg  
Page 1  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
Thermal Characteristics  
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
Characteristics  
R
-
-
0.63  
-
0.95 K/W  
62  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient, leaded  
SMD version, device on PCB:  
@ min. footprint  
thJC  
R
thJA  
R
thJA  
-
-
-
-
62  
40  
2
3)  
@ 6 cm cooling area  
Electrical Characteristics, at T = 25 °C, unless otherwise specified  
j
Parameter  
Symbol  
Values  
Unit  
min.  
55  
typ. max.  
Static Characteristics  
V
-
-
V
Drain-source breakdown voltage  
(BR)DSS  
V
=0V, I =1mA  
GS  
D
1.2  
1.6  
2
Gate threshold voltage, V = V  
V
GS(th)  
GS  
DS  
I =93µA  
D
µA  
Zero gate voltage drain current  
I
DSS  
V
V
=55V, V =0V, T =25°C  
GS  
-
-
0.01  
1
1
DS  
j
=55V, V =0V, T =125°C  
GS  
100  
DS  
j
-
-
-
1
100 nA  
Gate-source leakage current  
I
GSS  
V
=20V, V =0V  
GS DS  
10.6  
8.3  
14.7  
11  
Drain-source on-state resistance  
R
mΩ  
DS(on)  
DS(on)  
V
=4.5V, I =40A  
GS  
D
Drain-source on-state resistance  
R
V
=10V, I =40A  
GS  
D
1
Current limited by bondwire ; with an R  
= 0.95K/W the chip is able to carry I = 83A at 25°C, for detailed  
D
thJC  
information see app.-note ANPS071E available at www.infineon.com/optimos  
2
Defined by design. Not subject to production test.  
3
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical without blown air.  
Page 2  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
Electrical Characteristics  
Parameter  
Symbol  
Conditions  
Values  
Unit  
min. typ. max.  
Dynamic Characteristics  
Transconductance  
g
V
2*I *R ,  
DS(on)max  
38  
76  
-
S
fs  
DS  
D
I =58A  
D
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C
V
=0V, V =25V,  
-
-
-
-
-
-
-
1990 2650 pF  
iss  
GS  
DS  
C
C
f=1MHz  
466  
133  
8.4  
19  
620  
200  
13 ns  
29  
oss  
rss  
t
V
=30V, V =10V,  
d(on)  
DD GS  
I =80A,  
t
r
D
R =3Ω  
G
Turn-off delay time  
Fall time  
t
45  
68  
d(off)  
t
18  
27  
f
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Q
V
=44V, I =80A  
-
-
-
7
9
nC  
gs  
DD  
D
Q
20  
60  
30  
80  
gd  
V
DD  
=44V, I =80A,  
Gate charge total  
Q
g
D
V
=0 to 10V  
GS  
V
=44V, I =80A  
-
-
3.6  
-
-
V
A
Gate plateau voltage  
V
I
DD  
D
(plateau)  
Reverse Diode  
T =25°C  
80  
Inverse diode continuous  
forward current  
C
S
I
-
-
-
-
-
320  
1.3  
Inv. diode direct current, pulsed  
Inverse diode forward voltage  
Reverse recovery time  
SM  
V
=0V, I =80A  
1
V
V
GS  
F
SD  
t
rr  
V =30V, I =l ,  
R
54  
61  
67 ns  
76 nC  
F S  
di /dt=100A/µs  
Reverse recovery charge  
Q
rr  
F
Page 3  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
1 Power dissipation  
= f (T )  
2 Drain current  
I = f (T )  
P
tot  
D
C
C
parameter: V 4 V  
parameter: V 10 V  
GS  
SPP80N06S2L-11  
GS  
SPP80N06S2L-11  
90  
170  
W
A
140  
120  
100  
80  
70  
60  
50  
40  
30  
20  
10  
0
60  
40  
20  
0
°C  
0
20 40 60 80 100 120 140 160  
190  
0
20 40 60 80 100 120 140 160 °C 190  
T
T
C
C
3 Safe operating area  
4 Max. transient thermal impedance  
Z = f (t )  
thJC  
I = f ( V  
)
D
DS  
p
parameter : D = 0 , T = 25 °C  
parameter : D = t /T  
p
C
3 SPP80N06S2L-11  
SPP80N06S2L-11  
1
10  
10  
K/W  
t
= 13.0µs  
A
p
0
10  
10  
10  
10  
10  
10  
2
-1  
-2  
-3  
-4  
-5  
10  
100 µs  
D = 0.50  
0.20  
1
10  
0.10  
1 ms  
0.05  
single pulse  
0.02  
0.01  
0
10  
10 -1  
10 0  
10 1  
10 2  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
V
s
t
V
p
DS  
Page 4  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
5 Typ. output characteristic  
I = f (V ); T =25°C  
6 Typ. drain-source on resistance  
= f (I )  
R
D
DS(on)  
D
DS  
j
parameter: t = 80 µs  
parameter: V  
GS  
p
SPP80N06S2L-11  
SPP80N06S2L-11  
190  
36  
Ptot = 158W  
A
c
d
e
f
g
h
i
V
[V]  
GS  
160  
a
b
c
d
e
f
2.4  
2.8  
3.0  
3.3  
3.5  
3.8  
4.0  
4.5  
10.0  
28  
24  
20  
16  
12  
8
h
140  
120  
100  
80  
g
h
i
g
e
f
60  
i
40  
d
b
V
GS  
c
[V] =  
d
3.0 3.3 3.5 3.8  
c
a
4
20  
e
f
g
h
i
4.0 4.5 10.0  
0
0
V
A
0
2
4
6
8
11  
0
20  
40  
60  
80 100 120  
160  
I
V
DS  
D
7 Typ. transfer characteristics  
8 Typ. forward transconductance  
I = f ( V ); V 2 x I x R  
g = f(I ); T =25°C  
D
GS  
DS  
D
DS(on)max  
D
fs  
j
parameter: t = 80 µs  
parameter: g  
p
fs  
90  
160  
S
A
70  
60  
50  
40  
30  
20  
10  
0
120  
100  
80  
60  
40  
20  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V
5
0
10  
20  
30  
40  
50  
60  
A
80  
I
V
D
GS  
Page 5  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
9 Drain-source on-state resistance  
= f (T )  
10 Typ. gate threshold voltage  
V = f (T )  
GS(th)  
R
DS(on)  
j
j
parameter : I = 40 A, V = 10 V  
parameter: V = V  
DS  
D
GS  
GS  
SPP80N06S2L-11  
2
36  
465 µA  
V
28  
24  
20  
16  
12  
8
93 µA  
1.2  
0.8  
0.4  
0
98%  
typ  
4
0
-60  
°C  
-20  
20  
60  
100  
140  
200  
-60  
-20  
20  
60  
100  
°C  
180  
T
T
j
j
11 Typ. capacitances  
12 Forward character. of reverse diode  
I = f (V )  
C = f (V )  
F
SD  
DS  
parameter: V =0V, f=1 MHz  
parameter: T , tp = 80 µs  
GS  
j
4
3 SPP80N06S2L-11  
10  
10  
A
pF  
C
C
iss  
2
10  
3
10  
oss  
1
10  
Tj = 25 °C typ  
Tj = 175 °C typ  
Tj = 25 °C (98%)  
Tj = 175 °C (98%)  
C
rss  
2
0
10  
10  
V
0
5
10  
15  
20  
30  
0
0.4  
0.8  
1.2  
1.6  
2
2.4  
3
V
V
V
DS  
SD  
Page 6  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
13 Typ. avalanche energy  
= f (T )  
14 Typ. gate charge  
= f (Q  
E
V
)
Gate  
AS  
j
GS  
par.: I = 80 A , V = 25 V, R = 25 Ω  
parameter: I = 80 A pulsed  
D
D
DD  
GS  
SPP80N06S2L-11  
16  
300  
mJ  
V
240  
220  
200  
180  
160  
140  
120  
100  
80  
12  
10  
0,2 VDS max  
0,8 VDS max  
8
6
4
2
0
60  
40  
20  
0
25  
45  
65  
85  
105 125 145 °C 185  
0
10 20 30 40 50 60 70 80  
100  
nC  
T
Q
j
Gate  
15 Drain-source breakdown voltage  
= f (T )  
V
(BR)DSS  
j
parameter: I =10 mA  
D
SPP80N06S2L-11  
66  
V
62  
60  
58  
56  
54  
52  
50  
°C  
-60  
-20  
20  
60  
100  
140  
200  
T
j
Page 7  
2003-05-09  
SPP80N06S2L-11  
SPB80N06S2L-11  
Published by  
Infineon Technologies AG,  
Bereichs Kommunikation  
St.-Martin-Strasse 53,  
D-81541 München  
© Infineon Technologies AG 1999  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device  
or system Life support devices or systems are intended to be implanted in the human body, or to support  
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health  
of the user or other persons may be endangered.  
Further information  
Please notice that the part number is BSPP80N06S2L-11 and BSPB80N06S2L-11, for simplicity the device is referred  
to by the term SPP80N06S2L-11 and SPB80N06S2L-11 throughout this documentation.  
Page 8  
2003-05-09  

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