EL7516IY-T13 [INFINEON]
600kHz/1.2MHz PWM Step-Up Regulator; 600kHz的/ 1.2MHz的PWM升压调节器
| 型号： | EL7516IY-T13 |
| 厂家： | 
Infineon |
| 描述： | 600kHz/1.2MHz PWM Step-Up Regulator |
| 文件： | 总11页 (文件大小：303K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
EL7516
®
Data Sheet
October 27, 2004
FN7333.3
600kHz/1.2MHz PWM Step-Up Regulator
Features
The EL7516 is a high frequency, high efficiency step-up
voltage regulator operated at constant frequency PWM
mode. With an internal 1.5A, 200mΩ MOSFET, it can deliver
up to 600mA output current at over 90% efficiency. The
selectable 600kHz and 1.2MHz allows smaller inductors and
faster transient response. An external compensation pin
gives the user greater flexibility in setting frequency
compensation allowing the use of low ESR Ceramic output
capacitors.
• > 90% efficiency
• 1.6A, 200mΩ power MOSFET
• V > 2.5V
IN
• 600kHz/1.2MHz switching frequency selection
• Adjustable soft-start
• Internal thermal protection
• 1.1mm max height 8-pin MSOP package
• Pb-free available (RoHS compliant)
When shut down, it draws < 10µA of current and can operate
down to 2.5V input supply. These features along with
1.2MHz switching frequency makes it an ideal device for
portable equipment and TFT-LCD displays.
Applications
• TFT-LCD displays
• DSL modems
The EL7516 is available in an 8-pin MSOP package with a
maximum height of 1.1mm. The device is specified for
operation over the full -40°C to +85°C temperature range.
• PCMCIA cards
• Digital cameras
• GSM/CDMA phones
• Portable equipment
• Handheld devices
Pinout
EL7516
(8-PIN MSOP)
TOP VIEW
COMP
FB
SS
1
2
3
4
8
7
6
5
Ordering Information
FSEL
VDD
LX
TAPE &
SHDN
GND
PART NUMBER
EL7516IY
PACKAGE
8-Pin MSOP
8-Pin MSOP
8-Pin MSOP
REEL
PKG. DWG. #
MDP0043
MDP0043
MDP0043
MDP0043
-
7”
13”
-
EL7516IY-T7
EL7516IY-T13
EL7516IYZ
(See Note)
8-Pin MSOP
(Pb-Free)
EL7516IYZ-T7
(See Note)
8-Pin MSOP
(Pb-Free)
7”
MDP0043
MDP0043
EL7516IYZ-T13
(See Note)
8-Pin MSOP
(Pb-Free)
13”
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020C.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
1
Copyright © Intersil Americas Inc. 2002-2004. All Rights Reserved. Elantec is a registered trademark of Elantec Semiconductor, Inc.
All other trademarks mentioned are the property of their respective owners.
EL7516
Absolute Maximum Ratings (T = 25°C)
A
LX to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18V
to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Ambient Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +135°C
V
DD
COMP, FB, SHDN, SS, FSEL to GND . . . . . . -0.3V to (V
+0.3V)
DD
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: T = T = T
J
C
A
Electrical Specifications
V
= 3.3V, V
= 12V, I
= 0mA, FSEL = GND, T = 25°C unless otherwise specified.
IN
OUT
OUT A
PARAMETER
DESCRIPTION
CONDITIONS
MIN
TYP
0.6
MAX
UNIT
µA
mA
mA
V
IQ1
IQ2
IQ3
Quiescent Current - Shut-down
Quiescent Current - Not Switching
Quiescent Current - Switching
Feedback Voltage
SHDN = 0V
SHDN = V , FB = 1.3V
10
0.7
DD
SHDN = V , FB = 1.0V
DD
1.3
2
V
1.272
1.294
0.01
1.309
0.5
FB
I
Feedback Input Bias Current
Start-Up Input Voltage Range
Maximum Duty Cycle
µA
V
B-FB
V
2.6
84
5.5
DD
D
-600kHz
FSEL = 0V
90
90
%
MAX
MAX
D
-1.2MHz Maximum Duty Cycle
Current Limit - Max Peak Input Current
FSEL = V
84
%
DD
I
I
1.3
1.5
A
LIM
SHDN
Shut-down Input Bias Current
Switch ON Resistance
Switch Leakage Current
Line Regulation
SHDN = 0V
= 2.7V, I = 1A
0.01
0.2
0.1
3
µA
Ω
R
V
DS-ON
DD
VSW = 18V
3V < V < 5.5V, V
LX
I
0.01
0.1
µA
%
LX-LEAK
∆V
∆V
/∆V
OUT IN
= 12V
IN
= 3.3V, V
OUT
/∆I
OUT OUT
Load Regulation
V
= 12V, I = 30mA to 200mA
6.7
mV/A
kHz
kHz
V
IN
OUT
O
F
F
Switching Frequency Accuracy
Switching Frequency Accuracy
SHDN, FSEL Input Low Level
SHDN, FSEL Input High Level
Error Amp Tranconductance
Voltage Gain
FSEL = 0V
500
620
1250
740
1500
0.5
OSC1
OSC2
FSEL = V
1000
DD
V
IL
V
2.7
90
V
IH
G
∆I = 5µA
130
350
2.51
2.30
6
170
1µ/Ω
V/V
V
M
A
V
V
V
V
V
UVLO On Threshold
UVLO Off Threshold
2.40
2.20
4
2.60
2.40
8
DD-ON
DD
DD
V
DD-OFF
I
Soft-start Charge Current
µA
V/A
°C
SS
R
Current Sense Transresistance
Over Temperature Protection
0.08
130
CS
OTP
FN7333.3
2
EL7516
Block Diagram
FSEL
SHDN
SS
SHUTDOWN &
START-UP
CONTROL
REFERENCE
GENERATOR
VDD
OSCILLATOR
LX
PWM LOGIC
CONTROLLER
FET
DRIVER
COMPARATOR
CURRENT
SENSE
GND
FB
GM
AMPLIFIER
COMP
Pin Descriptions
PIN NUMBER
PIN NAME
DESCRIPTION
1
2
COMP
FB
Compensation pin. Output of the internal error amplifier. Capacitor and resistor from COMP pin to ground.
Voltage feedback pin. Internal reference is 1.294V nominal. Connect a resistor divider from V
1.294V (1 + R / R ). See Typical Application Circuit.
. V
OUT OUT
=
1
2
3
4
5
6
7
SHDN
GND
LX
Shutdown control pin. Pull SHDN low to turn off the device.
Analog and power ground.
Power switch pin. Connected to the drain of the internal power MOSFET.
Analog power supply input pin.
VDD
FSEL
Frequency select pin. When FSEL is set low, switching frequency is set to 620kHz. When connected to
high or V , switching frequency is set to 1.25MHz.
DD
8
SS
Soft-start control pin. Connect a capacitor to control the converter start-up.
Typical Application Circuit
1
2
3
4
COMP
FB
SS
FSEL
VDD
LX
8
7
6
5
R
3
C
3
R
85.2kΩ
1
3.9kΩ
27nF
C
R
5
2
4.7nF
10kΩ
SHDN
GND
2.7V TO 5.5V
C
+
C
1
4
0.1µF 22µF
10µH
12V
+
C
2
D
1
22µF
FN7333.3
3
EL7516
Typical Performance Curves
95
90
85
80
75
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
100
200
(mA)
300
400
0
50
100
150
200
250
300
350
I
I
(mA)
OUT
OUT
FIGURE 1. EFFICIENCY - 3.3V V TO 12V V
IN
@ 1.3MHz
FIGURE 2. LOAD REGULATION - 3.3V V TO 12V V
IN
OUT
OUT
OUT
OUT
@ 1.3MHz
90
85
80
75
1
0.5
0
-0.5
-1
0
100
200
(mA)
300
400
0
50
100
150
200
250
300
350
I
I
(mA)
OUT
OUT
FIGURE 3. EFFICIENCY - 3.3V V TO 12V V
IN
@ 620kHz
FIGURE 4. LOAD REGULATION - 3.3V V TO 12V V
IN
OUT
@ 620kHz
95
90
85
80
75
70
1
0.5
0
-0.5
-1
0
100
200
300
(mA)
400
500
0
100
200
300
(mA)
400
500
I
I
OUT
OUT
FIGURE 5. EFFICIENCY - 3.3V V TO 9V V
IN
@ 1.2MHz
FIGURE 6. LOAD REGULATION - 3.3V V TO 9V V
IN
OUT
@ 1.2MHz
FN7333.3
4
EL7516
Typical Performance Curves (Continued)
90
85
80
75
1
0.6
0.2
-0.2
-0.6
-1
0
100
200
300
(mA)
400
500
0
100
200
300
(mA)
400
500
I
I
OUT
OUT
FIGURE 7. EFFICIENCY - 3.3V V TO 9V V
IN
@ 600kHz
FIGURE 8. LOAD REGULATION - 3.3V V TO 9V V
IN
OUT
OUT
@ 600kHz
95
90
85
80
75
0.8
0.6
0.4
0.2
1
-0.2
-0.4
-0.6
-0.8
-1
0
100
200
300
(mA)
400
500
600
0
100
200
300
(mA)
400
500
600
I
I
OUT
OUT
FIGURE 9. EFFICIENCY - 5V V TO 12V V
IN
@ 1.2MHz
FIGURE 10. LOAD REGULATION - 5V V TO 12V V
IN
OUT
OUT
@ 1.2MHz
92
90
88
86
84
0.8
0.6
0.4
0.2
1
-0.2
-0.4
-0.6
-0.8
-1
0
100
200
300
(mA)
400
500
600
0
100
200
300
(mA)
400
500
600
I
I
OUT
OUT
FIGURE 11. EFFICIENCY - 5V V TO 12V V
IN
@ 600kHz
FIGURE 12. LOAD REGULATION - 5V V TO 12V V
IN
OUT
OUT
@ 600kHz
FN7333.3
5
EL7516
Typical Performance Curves (Continued)
95
90
85
80
75
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
200
400
600
(mA)
800
1K
0
200
400
600
(mA)
800
1K
I
I
OUT
OUT
FIGURE 13. EFFICIENCY - 5V V TO 9V V
IN
@ 1.2MHz
FIGURE 14. LOAD REGULATION - 5V V TO 9V V
IN
OUT
OUT
@ 1.2MHz
0.2
0.1
V
=12V
=80mA
V
=8V
OUT
OUT
I
I
=80mA
OUT
OUT
0.1
0
0.05
0
1.2MHz
1.2MHz
600kHz
600kHz
-0.1
-0.2
-0.05
-0.1
2
3
4
5
6
2.5
3.5
4.5
(V)
5.5
6.5
V
(V)
V
IN
IN
FIGURE 15. LINE REGULATION
FIGURE 16. LINE REGULATION
95
90
85
80
75
70
0.5
0.3
1.2MHz
600kHz
1.2MHz
0.1
-0.1
-0.3
-0.5
600kHz
10
110
210
310
(mA)
410
510
610
0
100
200
300
(mA)
400
500
600
I
I
OUT
OUT
FIGURE 17. EFFICIENCY vs I
- 3.3V TO 8V
FIGURE 18. LOAD REGULATION - 3.3V TO 8V
OUT
FN7333.3
6
EL7516
Typical Performance Curves (Continued)
94
92
90
88
1.29
1.28
1.27
1.26
1.25
1.24
1.23
1.22
1.21
1.2
1.2MHz
86
84
82
80
78
76
600kHz
800
0
200
400
600
1K
1.2K
2.5
3
3.5
4
4.5
5
5.5
I
(mA)
V
(V)
OUT
IN
FIGURE 19. EFFICIENCY vs I
FIGURE 20. FREQUENCY (1.2MHz) vs V
IN
OUT
670
660
650
640
630
620
610
600
93
91
89
87
85
83
81
2.5
3
3.5
4
4.5
5
5.5
0
200
400
600
(mA)
800
1K
V
(V)
I
OUT
IN
FIGURE 21. FREQUENCY (600kHz) vs V
FIGURE 22. EFFICIENCY - 5V V TO 9V V
IN
@ 600kHz
OUT
IN
0.4
V
V
= 3.3V
= 12V
IN
OUT
= 50mA TO 300mA
I
OUT
0.2
0
200mV/DIV
-0.2
-0.4
0
200
400
600
(mA)
800
1K
0.1ms/DIV
I
OUT
FIGURE 23. LOAD REGULATION - 5V V TO 9V V
IN
FIGURE 24. TRANSIENT REPONSE - 600kHz
OUT
@ 600kHz
FN7333.3
7
EL7516
Typical Performance Curves (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
V
V
= 3.3V
= 12V
IN
OUT
= 50mA TO 300mA
870mW
I
OUT
200mV/DIV
0
25
50
75 85 100
125
0.1ms/DIV
AMBIENT TEMPERATURE (°C)
FIGURE 25. TRANSIENT RESPONSE - 1.2MHz
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
0.6
0.5
0.4
0.3
0.2
0.1
0
486mW
0
25
50
75 85 100
125
AMBIENT TEMPERATURE (°C)
FIGURE 27. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
the boost converter operates in two cycles. During the first
Applications Information
cycle, as shown in Figure 29, the internal power FET turns
on and the Schottky diode is reverse biased and cuts off the
current flow to the output. The output current is supplied
from the output capacitor. The voltage across the inductor is
The EL7516 is a high frequency, high efficiency boost
regulator operated at constant frequency PWM mode. The
boost converter stores energy from an input voltage source
and deliver it to a higher output voltage. The input voltage
range is 2.5V to 5.5V and output voltage range is 5V to 18V.
The switching frequency is selectable between 600KHz and
1.2MHz allowing smaller inductors and faster transient
response. An external compensation pin gives the user
greater flexibility in setting output transient response and
tighter load regulation. The converter soft-start characteristic
V
and the inductor current ramps up in a rate of V / L, L
IN
IN
is the inductance. The inductance is magnetized and energy
is stored in the inductor. The change in inductor current is:
V
IN
---------
∆I
= ∆T1 ×
L1
L
D
------------
∆T1 =
F
can also be controlled by external C capacitor. The SHDN
SW
SS
pin allows the user to completely shut-down the device.
D = Duty Cycle
Boost Converter Operations
I
OUT
---------------
∆V
=
× ∆T
Figure 28 shows a boost converter with all the key
components. In steady state operating and continuous
conduction mode where the inductor current is continuous,
O
1
C
OUT
FN7333.3
8
EL7516
During the second cycle, the power FET turns off and the
Schottky diode is forward biased, Figure 30. The energy
stored in the inductor is pumped to the output supplying
output current and charging the output capacitor. The
Schottky diode side of the inductor is clamp to a Schottky
diode above the output voltage. So the voltage drop across
L
D
V
V
OUT
IN
C
C
OUT
IN
EL7516
the inductor is V - V
. The change in inductor current
IN
OUT
during the second cycle is:
I
L
∆I
L2
V
– V
OUT
L
∆T
IN
2
-------------------------------
∆I = ∆T2 ×
L
∆V
O
1 – D
-------------
∆T2 =
F
SW
FIGURE 30. BOOST CONVERTER - CYCLE 2, POWER
SWITCH OPEN
For stable operation, the same amount of energy stored in
the inductor must be taken out. The change in inductor
current during the two cycles must be the same.
Output Voltage
An external feedback resistor divider is required to divide the
output voltage down to the nominal 1.294V reference
voltage. The current drawn by the resistor network should be
limited to maintain the overall converter efficiency. The
maximum value of the resistor network is limited by the
feedback input bias current and the potential for noise being
coupled into the feedback pin. A resistor network less than
100K is recommended. The boost converter output voltage
is determined by the relationship:
∆I1 + ∆I2 = 0
V
V
– V
IN OUT
D
1 – D
F
IN
------------ --------- ------------- -------------------------------
×
+
×
= 0
F
L
L
SW
SW
V
1
OUT
---------------
-------------
=
V
1 – D
IN
R
⎛
⎞
⎟
⎠
L
D
1
------
V
= V × 1 +
⎜
OUT
FB
R
2
V
V
OUT
⎝
IN
C
C
OUT
IN
The nominal VFB voltage is 1.294V.
EL7516
Inductor Selection
The inductor selection determines the output ripple voltage,
transient response, output current capability, and efficiency.
Its selection depends on the input voltage, output voltage,
switching frequency, and maximum output current. For most
applications, the inductance should be in the range of 2µH to
33µH. The inductor maximum DC current specification must
be greater than the peak inductor current required by the
regulator. The peak inductor current can be calculated:
FIGURE 28. BOOST CONVERTER
L
V
V
OUT
IN
C
C
OUT
IN
EL7516
I
× V
V
× (V
– V
)
IN
OUT
OUT
IN
OUT
-----------------------------------
----------------------------------------------------
I
=
+ 1 ⁄ 2 ×
L(PEAK)
V
L × V
× FREQ
OUT
IN
I
L
∆I
L1
Output Capacitor
∆T
1
Low ESR capacitors should be used to minimized the output
voltage ripple. Multilayer ceramic capacitors (X5R and X7R)
are preferred for the output capacitors because of their lower
ESR and small packages. Tantalum capacitors with higher
ESR can also be used. The output ripple can be calculated
as:
∆V
O
FIGURE 29. BOOST CONVERTER - CYCLE 1, POWER
SWITCH CLOSED
I
× D
OUT
---------------------------
∆V
=
+ I
× ESR
OUT
O
F
× C
O
SW
FN7333.3
9
EL7516
For noise sensitive application, a 0.1µF placed in parallel
with the larger output capacitor is recommended to reduce
the switching noise coupled from the LX switching node.
Shut-Down Control
When shut-down in is pulled low, the EL7516 is shut-down
reducing the supply current to <3µA.
Schottky Diode
Maximum Output Current
In selecting the Schottky diode, the reverse break down
voltage, forward current and forward voltage drop must be
considered for optimum converter performance. The diode
must be rated to handle 1.5A, the current limit of the
EL7516. The breakdown voltage must exceed the maximum
output voltage. Low forward voltage drop, low leakage
current, and fast reverse recovery will help the converter to
achieve the maximum efficiency.
The MOSFET current limit is nominally 1.5A and guaranteed
1.3A. This restricts the maximum output current I
based on the following formula:
OMAX
I
= I
+ (1 ⁄ 2 × ∆I )
L-AVG L
L
where:
I = MOSFET current limit
L
Input Capacitor
I
= average inductor current
L-AVG
The value of the input capacitor depends the input and
output voltages, the maximum output current, the inductor
value and the noise allowed to put back on the input line. For
most applications, a minimum 10µF is required. For
applications that run close to the maximum output current
limit, input capacitor in the range of 22µF to 47µF is
recommended.
∆I = inductor ripple current
L
V
× [(V + V
) – V
]
IN
IN
O
DIODE
------------------------------------------------------------------------------
=
∆I
L
L × (V + V
) × F
S
O
DIODE
V
= Schottky diode forward voltage, typically, 0.6V
DIODE
F
= switching frequency, 600KHz or 1.2MHz
S
The EL7516 is powered from the V . To. High frequency
IN
0.1µF by-pass cap is recommended to be close to the V
pin to reduce supply line noise and ensure stable operation.
I
IN
OUT
-------------
I
=
L-AVG
1 – D
Loop Compensation
D = MOSFET turn-on ratio:
The EL7516 incorporates an transconductance amplifier in
its feedback path to allow the user some adjustment on the
transient response and better regulation. The EL7516 uses
current mode control architecture which has a fast current
sense loop and a slow voltage feedback loop. The fast
current feedback loop does not require any compensation.
The slow voltage loop must be compensated for stable
operation. The compensation network is a series RC
network from COMP pin to ground. The resistor sets the high
frequency integrator gain for fast transient response and the
capacitor sets the integrator zero to ensure loop stability. For
most applications, the compensation resistor in the range of
2K to 7.5K and the compensation capacitor in the range of
3nF to 10nF.
V
IN
--------------------------------------------
OUT
D = 1 –
V
+ V
DIODE
The following table gives typical maximum Iout values for
1.2MHz switching frequency and 22µH inductor:
TABLE 1.
V
(V)
V
(V)
I
(mA)
IN
OUT
OMAX
2.5
5
570
2.5
2.5
3.3
3.3
3.3
5
9
12
5
325
250
750
435
330
650
490
Soft-Start
The soft-start is provided by an internal 6µA current source
9
charges the external C , the peak MOSFET current is
SS
12
9
limited by the voltage on the capacitor. This in turn controls
the rising rate of the output voltage. The regulator goes
through the start-up sequence as well after the SHDN pin is
pulled to HI.
5
12
Thermal Performance
The EL7516 uses a fused-lead package, which has a
Frequency Selection
The EL7516 switching frequency can be user selected to
operate at either at constant 620kHz or 1.25MHz.
reduced θ of 100°C/W on a four-layer board and 115°C/W
JA
on a two-layer board. Maximizing copper around the ground
pins will improve the thermal performance.
Connecting F
pin to ground sets the PWM switching
SEL
frequency to 620kHz. When connect F
high or V ,
DD
SEL
This device also has internal thermal shut-down set at
around 130°C to protect the component.
switching frequency is set to 1.25MHz.
FN7333.3
10
EL7516
Layout Considerations
To achieve highest efficiency, best regulation and most
stable operation, a good printed circuit board layout is
essential. It is strongly recommended that the demoboard
layout to be followed as closely as possible. Use the
following general guidelines when laying out the print circuit
board:
1. Place C as close to the V
DD
pin as possible. C is the
4
4
supply bypass capacitor of the device.
2. Keep the C ground, GND pin and C ground as close as
1
2
possible.
3. Keep the two high current paths a) from C through L , to
1
1
the LX pin and GND and b) from C through L , D , and
1
1
1
C as short as possible.
2
4. High current traces should be short and as wide as
possible.
5. Place feedback resistor close to the FB pin to avoid noise
pickup.
6. Place the compensation network close to the COMP pin.
The demo board is a good example of layout based on these
principles; it is available upon request.
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7333.3
11
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