ESD5V3U4RRS [INFINEON]

Ultra-Low Capacitance ESD Diode Array; 超低电容ESD二极管阵列
ESD5V3U4RRS
型号: ESD5V3U4RRS
厂家: Infineon    Infineon
描述:

Ultra-Low Capacitance ESD Diode Array
超低电容ESD二极管阵列

ESD二极管
文件: 总7页 (文件大小:814K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ESD5V3U4RRS  
Ultra-Low Capacitance ESD Diode Array  
Rail-to-rail diodes with internal TVS diode  
ESD / transient protection of four I/O lines  
and one Vcc line exceeding:  
IEC61000-4-2 (ESD): 15 kV (contact)  
IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)  
IEC61000-4-5 (surge): 3 A (8/20 µs)  
Reverse working voltage data lines: 5.3 V max.  
Reverse working voltage Vcc: 6 V max.  
Very low capacitance: 0.4 pF typ.  
Very low reverse current < 10 nA typ.  
Very low clamping voltage:  
12 V typ. at positive transients  
4 V typ. at negative transients  
Pb-free (RoHS compliant) package  
Qualified according AEC Q101  
Applications  
USB 2.0 ports and future USB 3.0 ports  
Ethernet port: 10/100/1000 Mb/s  
IEEE 1394 FireWire ports  
Mobile communications e.g. high-speed  
SIM card protection  
Consumer products (STB, DVD, DSC, DVC...)  
Notebooks and desktop computers, peripherals  
ESD5V3U4RRS  
6
5
4
1
2
3
Type  
ESD5V3U4RRS  
Package  
SOT363  
Configuration  
6 pins, uni-directional  
Marking  
E8s  
2008-10-14  
1
ESD5V3U4RRS  
Maximum Ratings at T = 25°C, unless otherwise specified  
A
Parameter  
ESD contact discharge  
Peak pulse current (t = 8 / 20 µs)  
Peak pulse power (t = 8 / 20 µs)  
Operating temperature range  
Storage temperature  
Symbol  
V
ESD  
I
pp  
Value  
15  
3
50  
Unit  
kV  
A
W
°C  
1)  
2)  
p
2)  
P
T
T
p
pk  
-55...125  
-65...150  
op  
stg  
Electrical Characteristics at T = 25°C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
3)  
Characteristics  
V
Reverse working voltage  
I/O pin to pin 5  
pin 2 to pin 5  
V
V
RWM  
4)  
-
-
-
-
-
5.3  
6
6.3  
-
Breakdown voltage  
(BR)  
I
= 1 mA, any pin to pin 5  
(BR)  
-
< 10  
100 nA  
Reverse current  
I
R
V = 5.3 V, any pin to pin 5  
R
V
13  
15  
Clamping voltage  
V
V
CL  
FC  
2)  
I
= 1 A, t = 8/20 µs , any pin to pin 5  
-
-
10  
12  
PP  
p
2)  
I
= 3 A, t = 8/20 µs , any pin to pin 5  
PP  
p
Forward clamping voltage  
2)  
I
= 1 A, t = 8/20 µs , any pin to pin 5  
-
-
-
2
4
4
6
PP  
p
2)  
I
= 3 A, t = 8/20 µs , any pin to pin 5  
PP  
p
5)4)  
0.4  
0.6 pF  
Line capacitance  
C
T
V = 0 V, f = 1 MHz, any I/O pin to pin 5  
R
1V  
according to IEC61000-4-2  
ESD  
2I according to IEC61000-4-5  
pp  
3It is strongly recommended that pin 5 is connected to ground for propper functionality.  
4I/0 pins are pin 1, 3, 4, 6  
5Total capacitance line to ground  
2008-10-14  
2
ESD5V3U4RRS  
Power derating curve P = ƒ (T )  
Clamping voltage, V = ƒ(I )  
cl pp  
pk  
A
t = 8 / 20 µs  
p
15  
V
110  
%
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
13  
12  
11  
10  
9
8
7
6
0
°C  
A
0
25  
50  
75  
100  
150  
1
2
4
T
I
pp  
A
Forward clamping voltage V = ƒ(I )  
Reverse current I = ƒ(V )  
FC  
PP  
R
R
t = 8 / 20 µs  
T = Parameter  
p
A
10 -6  
A
6
V
10 -7  
10 -8  
150°C  
125°C  
4
3
2
1
10 -9  
85°C  
10 -10  
10 -11  
10 -12  
25°C  
0
0
A
V
1
2
3
5
0
1
2
3
4
6
I
V
R
pp  
2008-10-14  
3
ESD5V3U4RRS  
Diode capacitance C = ƒ (V )  
T
R
f = 1MHz  
0.6  
pF  
0.4  
0.3  
0.2  
0.1  
0
0
V
1
2
3
5
V
R
2008-10-14  
4
ESD5V3U4RRS  
Application example ESD5V3U4RRS  
4 data lines, uni-directional  
4 protected high-speed I/O data lines  
I/O  
I/O  
I/O  
I/O  
ESD sensitive  
device  
3
4
2
5
1
6
The protection diode should be placed  
very close to the location where the  
ESD or other transients can occur to  
keep loops and inductances as small  
as possible. It is strongly recommended  
that pin 5 is directly connected to a  
ground plane on the board for propper  
functionality. Pin 2 is not connected.  
Application example ESD5V3U4RRS  
4 data lines and 1 power supply line, uni-directional  
4 protected high-speed I/O data lines,  
1 protected power supply line (+Vcc)  
I/O  
I/O  
I/O  
I/O  
ESD sensitive  
device  
+Vcc  
3
4
2
5
1
6
Pin 2 is directly connected to the  
positive power supply line (+Vcc). It is  
strongly recommended that pin 5 is  
directly connected to a ground plane on  
the board for propper functionality.  
2008-10-14  
5
Package SOT363  
ESD5V3U4RRS  
Package Outline  
0.2  
2
0.1  
0.9  
+0.1  
-0.05  
6x  
0.2  
0.1 MAX.  
0.1  
M
0.1  
A
6
1
5
4
3
2
Pin 1  
marking  
+0.1  
0.15  
-0.05  
0.65 0.65  
M
0.2  
A
Foot Print  
0.3  
0.65  
0.65  
Marking Layout (Example)  
Small variations in positioning of  
Date code, Type code and Manufacture are possible.  
Manufacturer  
2005, June  
Date code (Year/Month)  
Pin 1 marking  
Laser marking  
BCR108S  
Type code  
Standard Packing  
Reel ø180 mm = 3.000 Pieces/Reel  
Reel ø330 mm = 10.000 Pieces/Reel  
For symmetric types no defined Pin 1 orientation in reel.  
4
0.2  
1.1  
2.15  
Pin 1  
marking  
2008-10-14  
6
ESD5V3U4RRS  
Edition 2006-02-01  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2007.  
All Rights Reserved.  
Attention please!  
The information given in this dokument shall in no event be regarded as a guarantee  
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any  
examples or hints given herein, any typical values stated herein and/or any information  
regarding the application of the device, Infineon Technologies hereby disclaims any  
and all warranties and liabilities of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest  
Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that  
device or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons  
may be endangered.  
2008-10-14  
7

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