FF400R07A01E3_S6_技术文档

DoubleꢀSideꢀCooledꢀModule

FF400R07A01E3_S6

FinalꢀDataꢀSheet

V3.4,ꢀ2020-04-15

AutomotiveꢀHighꢀPower

FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

1ꢀꢀꢀꢀꢀFeaturesꢀ/ꢀDescription

V_CES= 700 V

I_C= 400 A

TypicalꢀApplications

Description

• AutomotiveꢀApplications

• HybridꢀElectricalꢀVehiclesꢀ(H)EV

The HybridPACK^TMDSC S1 is a very compact

half-bridge module targeting hybrid and electric

vehicles.

The module is based on Infineon’s long-term

experience developing IGBT power modules and

Trench-Field-Stop IGBTs including matching diodes

with enhanced softness. Additionally, on-die

integrated current sensor and temperature sensor

allow precise monitoring of IGBT state. These

features enable enhanced protection and intelligent

control of the system.

ElectricalꢀFeatures

• IncreasedꢀBlockingꢀVoltageꢀCapabilityꢀtoꢀ700V

• IntegratedꢀCurrentꢀSensor

• IntegratedꢀTemperatureꢀSensor

• LowꢀInductiveꢀDesign

• LowꢀSwitchingꢀLosses

• T_vjꢀopꢀ=ꢀ150°C

The innovative and small package is designed for

Double Sided Cooling (DSC) with superior thermal

performance. The low stray inductance and

increased blocking voltage support the design of

systems with a very high efficiency. Furthermore,

new material combinations and assembly

technologies enable best thermal and electrical

performance at highest reliability and mechanical

robustness.

• Short-time extended Operation Temperature

T_vjꢀopꢀ=ꢀ175°C

MechanicalꢀFeatures

• 2.5kVꢀACꢀ1minꢀInsulation

• Doubleꢀsidedꢀcooling

• Compactꢀdesign

• RoHSꢀcompliant

ProductꢀName

OrderingꢀCode

SP001661226

FF400R07A01E3_S6

Final Data Sheet

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

2ꢀꢀꢀꢀꢀIGBT,Inverter

2.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues

Parameter

Conditions

Symbol

V_CES

I_{C nom}

I_CRM

Value

700

Unit

V

Collector-emitterꢀvoltage

T_vj= 25°C

ContinuousꢀDCꢀcollectorꢀcurrent

Repetitiveꢀpeakꢀcollectorꢀcurrent

Totalꢀpowerꢀdissipation

T_C= 75°C, T_{vj max}= 175°C

t_P= 1 ms

400

A

800

A

T_C= 25°C, T_{vj max}= 175°C

P_tot

1500

+/-20

W

V

Gate-emitterꢀpeakꢀvoltage

V_GES

2.2ꢀꢀꢀꢀCharacteristicꢀValues

min. typ. max.

Collector-emitterꢀsaturationꢀvoltage

I_C= 400 A, V_GE= 15 V

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

1.65 2.30

1.90

2.00

V_{CE sat}

V

Gateꢀthresholdꢀvoltage

Gateꢀcharge

I_C= 4.85 mA, V_CE= V_GE

V_GE= -15 V ... 15 V

T_vj= 25°C

V_GEth

Q_G

5.00 5.80 6.50

V

µC

Ω

2.90

0.0

Internalꢀgateꢀresistor

T_vj= 25°C

R_Gint

C_ies

C_res

I_CES

I_GES

Inputꢀcapacitance

f = 1 MHz, V_CE= 25 V, V_GE= 0 V

V_CE= 450 V, V_GE= 0 V

18.0

0.50

0.1

nF

mA

nA

Reverseꢀtransferꢀcapacitance

Collector-emitterꢀcut-offꢀcurrent

Gate-emitterꢀleakageꢀcurrent

Turn-onꢀdelayꢀtime,ꢀinductiveꢀload

V_CE= 0 V, V_GE= 20 V

400

I_C= 400 A, V_CE= 300 V

V_GE= -8/+15 V

R_Gon= 3.6 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.06

t_{d on}

µs

Riseꢀtime,ꢀinductiveꢀload

I_C= 400 A, V_CE= 300 V

V_GE= -8/+15 V

R_Gon= 3.6 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.08

t_r

Turn-offꢀdelayꢀtime,ꢀinductiveꢀload

Fallꢀtime,ꢀinductiveꢀload

I_C= 400 A, V_CE= 300 V

V_GE= -8/+15 V

R_Goff= 3.6 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.43

0.44

0.48

t_{d off}

I_C= 400 A, V_CE= 300 V

V_GE= -8/+15 V

R_Goff= 3.6 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.04

0.05

t_f

Turn-onꢀenergyꢀlossꢀperꢀpulse

I_C= 400 A, V_CE= 300 V, L_S= 25 nH

V_GE= -8/+15 V

R_Gon= 3.6 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

5.70

7.40

7.90

E_on

mJ

di/dt = 5.1 kA/µs (Tvj = 150°C)

Turn-offꢀenergyꢀlossꢀperꢀpulse

SCꢀdata

I_C= 400 A, V_CE= 300 V, L_S= 25 nH

V_GE= -8/+15 V

R_Goff= 3.6 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

14.5

16.5

18.0

E_off

mJ

A

du/dt = 3.0 kV/µs (Tvj = 150°C)

V_GE≤ 15 V, V_CC= 360 V

V_CEmax= V_CES-L_sCE·di/dt

I_SC

t_P≤ 6 µs, T_vj= 150°C

1900

Thermalꢀresistance,ꢀjunctionꢀtoꢀcase

Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink

perꢀIGBT

R_thJC

0.100¹⁾K/W

perꢀIGBT

0.140¹⁾

λ

_Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλ_greaseꢀ=ꢀ1ꢀW/(m·K)

R_thCH

K/W

ClampingꢀForceꢀFꢀ=ꢀ700N

Temperatureꢀunderꢀswitchingꢀconditions

t_opcontinuous

-40

150

°C

for 18s within a period of 600s, occurrence maximum 200

times over lifetime

T_{vj op}

175

¹⁾with double sided cooling, evaluation according to HybridPack^TMDSC application note

Final Data Sheet

3

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

3ꢀꢀꢀꢀꢀDiode,ꢀInverter

3.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues

Parameter

Conditions

Symbol

V_RRM

I_F

Value

700

Unit

V

Repetitiveꢀpeakꢀreverseꢀvoltage

ContinuousꢀDCꢀforwardꢀcurrent

Repetitiveꢀpeakꢀforwardꢀcurrent

I²tꢀ-ꢀvalue

T_vj= 25°C

400

A

t_P= 1 ms

I_FRM

I²t

800

A

V_R= 0 V, t_P= 10 ms, T_vj= 125°C

9000

A²s

3.2ꢀꢀꢀꢀCharacteristicꢀValues

min. typ. max.

Forwardꢀvoltage

I_F= 400 A, V_GE= 0 V

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

1.95 2.55

1.84

1.80

V_F

I_RM

Q_r

V

A

Peakꢀreverseꢀrecoveryꢀcurrent

Recoveredꢀcharge

I_F= 400 A, - di_F/dt = 5000 A/µs (T_vj= 150°C) T_vj= 25°C

V_R= 300 V

V_GE= -8 V

135

210

220

T_vj= 125°C

T_vj= 150°C

I_F= 400 A, - di_F/dt = 5000 A/µs (T_vj= 150°C) T_vj= 25°C

V_R= 300 V

V_GE= -8 V

12.0

23.0

27.0

T_vj= 125°C

T_vj= 150°C

µC

mJ

Reverseꢀrecoveryꢀenergy

I_F= 400 A, - di_F/dt = 5000 A/µs (T_vj= 150°C) T_vj= 25°C

2.80

5.80

6.60

V_R= 300 V

V_GE= -8 V

T_vj= 125°C

T_vj= 150°C

E_rec

R_thJC

R_thCH

Thermalꢀresistance,ꢀjunctionꢀtoꢀcase

Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink

perꢀdiode

0.150¹⁾K/W

K/W

perꢀdiode

0.200¹⁾

λ

_Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλ_greaseꢀ=ꢀ1ꢀW/(m·K)

ClampingꢀForceꢀFꢀ=ꢀ700N

Temperatureꢀunderꢀswitchingꢀconditions

t_opcontinuous

-40

150

°C

for 18s within a period of 600s, occurrence maximum 200

times over lifetime

T_{vj op}

175

4ꢀꢀꢀꢀꢀModule

Parameter

Conditions

Symbol

Value

2.5

Unit

Isolationꢀtestꢀvoltage

Materialꢀofꢀmoduleꢀbaseplate

Internalꢀisolation

RMS, f = 50 Hz, t = 1 min.

V_ISOL

ꢀ

ꢀ kV

Cu

ꢀ

basicꢀinsulationꢀ(classꢀ1,ꢀIECꢀ61140)

Al₂O₃

Creepageꢀdistance

terminalꢀtoꢀheatsink

terminalꢀtoꢀterminal

d_Creep

ꢀ

ꢀ mm

3.5

Clearance

terminalꢀtoꢀheatsink

terminalꢀtoꢀterminal

d_Clear

CTI

ꢀ

ꢀ mm

3.5

Comperativeꢀtrackingꢀindex

> 600

ꢀ

min. typ. max.

15

Strayꢀinductanceꢀmodule

Storageꢀtemperature

Terminalꢀconnectionꢀtorque

Mounting force per clamp

Weight

L_sCE

T_stg

M

nH

-40

125 °C

Nm

ScrewꢀM5

-

F

900

N

g

G

30

5ꢀꢀꢀꢀꢀTemperatureꢀSensor

Parameter

Conditions

Symbol Min Typ Max Unit

Forwardꢀvoltage

I_TS= 1.00 mA, T_vj= 150°C

I_TS= 1.00 mA, T_vj= 25°C

2.120

2.910

V_TS

V

¹⁾with double sided cooling, evaluation according to HybridPack^TMDSC application note

Final Data Sheet

4

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

6ꢀꢀꢀꢀꢀCurrentꢀSensor

Parameter

Conditions

Symbol Min Typ Max Unit

Outputꢀvoltage

V_CE= 2.35 V, I_C= 800 A

R_sense= 1.60 Ω, T_vj= 25°C

VGE = 15 V

V_sense

0.64

V

Final Data Sheet

5

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

7ꢀꢀꢀꢀꢀCharacteristicsꢀDiagrams

outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)

I_Cꢀ=ꢀfꢀ(V_CE

)

V_GEꢀ=ꢀ15ꢀV

T_vjꢀ=ꢀ150°C

800

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

V_GE= 19V

V_GE= 17V

V_GE= 15V

V_GE= 13V

V_GE= 11V

V_GE= 9V

700

600

500

400

300

200

100

0

700

600

500

400

300

200

100

0

0,0 0,3 0,6 0,9 1,2 1,5 1,8 2,1 2,4 2,7 3,0

0,0

0,5

1,0

1,5

2,0

V_CE[V]

2,5

3,0

3,5

4,0

V_CE[V]

transferꢀcharacteristicꢀIGBT,Inverterꢀ(typical)

switchingꢀlossesꢀIGBT,Inverterꢀ(typical)

I_Cꢀ=ꢀfꢀ(V_GE

)

E_onꢀ=ꢀfꢀ(I_C),ꢀE_offꢀ=ꢀfꢀ(I_C)

V_CEꢀ=ꢀ20ꢀV

V_GEꢀ=ꢀ-8ꢀ/ꢀ+15ꢀV,ꢀR_Gonꢀ=ꢀ3.6ꢀΩ,ꢀR_Goffꢀ=ꢀ3.6ꢀΩ,ꢀV_CEꢀ=ꢀ300ꢀV

800

50

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

E_on, T_vj= 125°C

E_off, T_vj= 125°C

E_on, T_vj= 150°C

E_off, T_vj= 150°C

45

700

600

500

400

300

200

100

40

35

30

25

20

15

10

5

0

5

0

6

7

8

9

10

11

12

13

0

100

200

300

400

I_C[A]

500

600

700

800

V_GE[V]

Final Data Sheet

6

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

switchingꢀlossesꢀIGBT,Inverterꢀ(typical)

E_onꢀ=ꢀfꢀ(R_G),ꢀE_offꢀ=ꢀfꢀ(R_G)

transientꢀthermalꢀimpedanceꢀIGBT,Inverterꢀ

Z_thJHꢀ=ꢀfꢀ(t)

V_GEꢀ=ꢀ-8ꢀ/ꢀ+15ꢀV,ꢀI_Cꢀ=ꢀ400ꢀA,ꢀV_CEꢀ=ꢀ300ꢀV

35

1

E_on, T_vj= 125°C

E_off, T_vj= 125°C

E_on, T_vj= 150°C

Z_thJH: IGBT

30

E_off, T_vj= 150°C

25

20

15

10

5

0,1

i:

1

2

3

4

r_i[K/W]: 0,0158 0,0348 0,132 0,0531

τ_i[s]:

0,001 0,0214 0,1799 0,7798

0

0,01

3

4

5

6

7

8

9

10

11

12

0,1

1

10

R_G[Ω]

t [s]

reverseꢀbiasꢀsafeꢀoperatingꢀareaꢀIGBT,Inverterꢀ(RBSOA)

I_Cꢀ=ꢀfꢀ(V_CE

forwardꢀcharacteristicꢀofꢀDiode,ꢀInverterꢀ(typical)

I_Fꢀ=ꢀfꢀ(V_F)

)

V_GEꢀ=ꢀ±15ꢀV,ꢀR_Goffꢀ=ꢀ3.6ꢀΩ,ꢀT_vjꢀ=ꢀ150°C

900

800

Ic, Modul

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

800

700

600

500

400

300

200

100

0

700

600

500

400

300

200

100

0

100

200

300

400

500

0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4 2,6

V_CE[V]

V_F[V]

Final Data Sheet

7

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)

E_recꢀ=ꢀfꢀ(I_F)

switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)

E_recꢀ=ꢀfꢀ(R_G)

R_Gonꢀ=ꢀ3.6ꢀΩ,ꢀV_CEꢀ=ꢀ300ꢀV

I_Fꢀ=ꢀ400ꢀA,ꢀV_CEꢀ=ꢀ300ꢀV

10

7

6

5

4

3

2

1

0

E_rec, T_vj= 125°C

E_rec, T_vj= 150°C

E_rec, T_vj= 125°C

E_rec, T_vj= 150°C

9

8

7

6

5

4

3

2

1

0

100

200

300

400

I_F[A]

500

600

700

800

0

1

2

3

4

5

6

7

8

9

10 11 12

R_G[Ω]

transientꢀthermalꢀimpedanceꢀDiode,ꢀInverterꢀ

Z_thJHꢀ=ꢀfꢀ(t)

1

Z_thJH: Diode

0,1

0,01

i:

r_i[K/W]: 0,0525 0,0217 0,1714 0,0983

τ_i[s]: 0,0186 0,0525 0,135 0,5303

1

2

3

4

0,001

0,01

0,1

t [s]

1

10

Final Data Sheet

8

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

8ꢀꢀꢀꢀꢀCircuitꢀdiagram

P in Numbe r

S ymbol

P

I/O

Function

1

DC Supply (+)

DC Supply (-)

AC Output

Input

Positive Supply

2

N

Negative Supply

3

U

U Phase Output

4

T+L

T-L

EL

Temperature Sensor Plus Low Side

Temperature Sensor Minus Low Side

IGBT Emitter Output Low Side

IGBT Current Sensor Output Low Side

Gate Input Low Side

5

Output

Input

6

7

CSL

GL

8

9

T+H

T-H

EH

Input

Temperature Sensor Plus High Side

Temperature Sensor Minus High Side

IGBT Emitter Output High Side

IGBT Current Sensor output High Side

Gate Input High Side

10

11

12

13

14

Output

Input

CSH

GH

PS

Output

P-Terminal Voltage Sensing / IGBT Collector Output

Final Data Sheet

9

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

9ꢀꢀꢀꢀꢀPackageꢀoutlines

Final Data Sheet

10

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

RevisionꢀHistory

Major changes since previous revision

Revision History

Reference

V1.0

Date

Description

2015-03-26

2015-04-07

2016-02-02

2016-11-07

2016-11-08

2016-12-13

2017-07-28

2020-04-15

Initial Version

V1.1

Extension of target data

Update of target data

Final Datasheet

V2.0

V3.0

V3.1

Change of product name in description

Changes in description

Update mechanical drawing

Correction of package outlines

V3.2

V3.3

V3.4

Final Data Sheet

11

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FF400R07A01E3_S6

DoubleꢀSideꢀCooledꢀModule

Termsꢀ&ꢀConditionsꢀofꢀusage

ꢀ

Editionꢀ2018-08-01

Publishedꢀby

InfineonꢀTechnologiesꢀAG

81726ꢀMunich,ꢀGermany

AllꢀRightsꢀReserved.

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Warnings

Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,ꢀpleaseꢀcontactꢀthe

nearestꢀInfineonꢀTechnologiesꢀOffice.

Theseꢀcomponentsꢀareꢀnotꢀdesignedꢀforꢀ“specialꢀapplications”ꢀthatꢀdemandꢀextremelyꢀhighꢀreliabilityꢀorꢀsafetyꢀsuchꢀasꢀaerospace,ꢀdefenseꢀorꢀlife

supportꢀdevicesꢀorꢀsystemsꢀ(ClassꢀIIIꢀmedicalꢀdevices).ꢀIfꢀyouꢀintendꢀtoꢀuseꢀtheꢀcomponentsꢀinꢀanyꢀofꢀtheseꢀspecialꢀapplications,ꢀpleaseꢀcontact

yourꢀlocalꢀrepresentativeꢀatꢀInternationalꢀRectifierꢀHiRelꢀProducts,ꢀInc.ꢀorꢀtheꢀInfineonꢀsupportꢀ(https://www.infineon.com/support)ꢀtoꢀreview

productꢀrequirementsꢀandꢀreliabilityꢀtesting.

InfineonꢀTechnologiesꢀcomponentsꢀmayꢀbeꢀusedꢀinꢀspecialꢀapplicationsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineonꢀTechnologies.ꢀClass

IIIꢀmedicalꢀdevicesꢀareꢀintendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀtoꢀsupportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀthey

fail,ꢀitꢀisꢀreasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersonsꢀmayꢀbeꢀendangered.

Trademarks

ꢀ

TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG

AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCIPURSE™,ꢀEconoPACK™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,

DI-POL™,ꢀEasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPIM™,ꢀEconoPACK™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,

HybridPACK™,ꢀI²RF™,ꢀISOFACE™,ꢀIsoPACK™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,

PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPRO-SIL™,ꢀPROFET™,ꢀRASIC™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSINDRION™,

SIPMOS™,ꢀSmartLEWIS™,ꢀSOLIDꢀFLASH™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.

OtherꢀTrademarks

AdvanceꢀDesignꢀSystem™ꢀ(ADS)ꢀofꢀAgilentꢀTechnologies,ꢀAMBA™,ꢀARM™,ꢀMULTI-ICE™,ꢀKEIL™,ꢀPRIMECELL™,ꢀREALVIEW™,ꢀTHUMB™,

µVision™ꢀofꢀARMꢀLimited,ꢀUK.ꢀAUTOSAR™ꢀisꢀlicensedꢀbyꢀAUTOSARꢀdevelopmentꢀpartnership.ꢀBluetooth™ꢀofꢀBluetoothꢀSIGꢀInc.ꢀCAT-iq™ꢀof

DECTꢀForum.ꢀCOLOSSUS™,ꢀFirstGPS™ꢀofꢀTrimbleꢀNavigationꢀLtd.ꢀEMV™ꢀofꢀEMVCo,ꢀLLCꢀ(VisaꢀHoldingsꢀInc.).ꢀEPCOS™ꢀofꢀEpcosꢀAG.

FLEXGO™ꢀofꢀMicrosoftꢀCorporation.ꢀFlexRay™ꢀisꢀlicensedꢀbyꢀFlexRayꢀConsortium.ꢀHYPERTERMINAL™ꢀofꢀHilgraeveꢀIncorporated.ꢀIEC™ꢀof

CommissionꢀElectrotechniqueꢀInternationale.ꢀIrDA™ꢀofꢀInfraredꢀDataꢀAssociationꢀCorporation.ꢀISO™ꢀofꢀINTERNATIONALꢀORGANIZATION

FORꢀSTANDARDIZATION.ꢀMATLAB™ꢀofꢀMathWorks,ꢀInc.ꢀMAXIM™ꢀofꢀMaximꢀIntegratedꢀProducts,ꢀInc.ꢀMICROTEC™,ꢀNUCLEUS™ꢀofꢀMentor

GraphicsꢀCorporation.ꢀMIPI™ꢀofꢀMIPIꢀAlliance,ꢀInc.ꢀMIPS™ꢀofꢀMIPSꢀTechnologies,ꢀInc.,ꢀUSA.ꢀmuRata™ꢀofꢀMURATAꢀMANUFACTURINGꢀCO.,

MICROWAVEꢀOFFICE™ꢀ(MWO)ꢀofꢀAppliedꢀWaveꢀResearchꢀInc.,ꢀOmniVision™ꢀofꢀOmniVisionꢀTechnologies,ꢀInc.ꢀOpenwave™ꢀOpenwave

SystemsꢀInc.ꢀREDꢀHAT™ꢀRedꢀHat,ꢀInc.ꢀRFMD™ꢀRFꢀMicroꢀDevices,ꢀInc.ꢀSIRIUS™ꢀofꢀSiriusꢀSatelliteꢀRadioꢀInc.ꢀSOLARIS™ꢀofꢀSun

Microsystems,ꢀInc.ꢀSPANSION™ꢀofꢀSpansionꢀLLCꢀLtd.ꢀSymbian™ꢀofꢀSymbianꢀSoftwareꢀLimited.ꢀTAIYOꢀYUDEN™ꢀofꢀTaiyoꢀYudenꢀCo.

TEAKLITE™ꢀofꢀCEVA,ꢀInc.ꢀTEKTRONIX™ꢀofꢀTektronixꢀInc.ꢀTOKO™ꢀofꢀTOKOꢀKABUSHIKIꢀKAISHAꢀTA.ꢀUNIX™ꢀofꢀX/OpenꢀCompanyꢀLimited.

VERILOG™,ꢀPALLADIUM™ꢀofꢀCadenceꢀDesignꢀSystems,ꢀInc.ꢀVLYNQ™ꢀofꢀTexasꢀInstrumentsꢀIncorporated.ꢀVXWORKS™,ꢀWINDꢀRIVER™ꢀof

WINDꢀRIVERꢀSYSTEMS,ꢀINC.ꢀZETEX™ꢀofꢀDiodesꢀZetexꢀLimited.

Last update

2011-11-11

Final Data Sheet

12

V3.4,ꢀꢀ2020-04-15

wꢀwꢀwꢀ.ꢀiꢀnꢀfꢀiꢀnꢀeꢀoꢀnꢀ.ꢀcꢀoꢀm

PublishedꢀbyꢀInfineonꢀTechnologiesꢀAG


型号：	FF400R07A01E3_S6
厂家：	Infineon
描述：	Double Side Cooled
文件：	总13页 (文件大小：729K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FF400R07A01E3_S6 [INFINEON]

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