FS03MR12A6MA1LB [INFINEON]
Long Tabs;
| 型号： | FS03MR12A6MA1LB |
| 厂家： | 
Infineon |
| 描述： | Long Tabs |
| 文件： | 总16页 (文件大小：1764K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FS03MR12A6MA1LB
™
HybridPACK Drive module
™
™
HybridPACK Drive module with CoolSiC Automotive MOSFET
Features
• Electrical features
- VDSS = 1200 V
- ID,nom = 400 A
- New semiconductor material - silicon carbide
- Low RDS,on
- Low switching losses
- Low Qg and Crss
- Low inductive design <10 nH
- Tvj,op = 150°C
• Mechanical features
- 4.2 kV DC 1 second insulation
- High creepage and clearance distances
- Compact design
- High power density
- Direct-cooled PinFin base plate
- High-performance Si3N4 ceramic
- Guiding elements for PCB and cooler assembly
- Integrated NTC temperature sensor
- PressFIT contact technology
- RoHS compliant
- UL 94 V0 module frame
Potential applications
• Automotive applications
• (Hybrid) electrical vehicles (H)EV
• Motor drives
• Commercial agriculture vehicles
Product validation
• Qualified according to AQG 324, release no.: 03.1/2021
Description
T
T
T
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Body diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
NTC-Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
1
2
3
4
5
6
7
8
Datasheet
2
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
1 Package
1
Package
Table 1
Insulation coordination
Symbol Note or test condition
Parameter
Values
4.20
Unit
Isolation test voltage
VISOL
RMS, f = 0 Hz, t = 1 sec
kV
Material of module
baseplate
Ni+Cu1)
Internal isolation
Creepage distance
Creepage distance
Clearance
basic insulation (class 1, IEC 61140)
Si3N4
9.0
dcreep terminal to heatsink
dcreep terminal to terminal
mm
mm
mm
mm
9.0
dclear
dclear
CTI
terminal to heatsink
terminal to terminal
4.5
Clearance
4.5
Comparative tracking
index
> 200
1)
Ni plated Cu baseplate
Table 2
Maximum rated values
Symbol Note or test condition
Parameter
Values
Unit
Maximum RMS module
terminal current
It,rms
Tterminal = 105 °C, Tf = 75 °C
500
A
Table 3
Characteristic values
Parameter
Symbol Note or test condition
Values
Typ.
Unit
Min.
Max.
Pressure drop in cooling
circuit
Δp
ΔV/Δt = 10 dm³/min, 50% water / 50%
641)
mbar
bar
ethylenglycol, Tf = 60 °C
Maximum pressure in
cooling circuit
p
Tbaseplate < 40°C (relative pressure)
Tbaseplate ≥ 40°C (relative pressure)
2.5
2.0
Stray inductance module
Ls,DS
8.5
nH
Module lead resistance,
terminals - chip
RDD'+SS' Tf = 25 °C, per switch
0.75
mΩ
Storage temperature
Tstg
-40
1.8
125
2.2
°C
Mounting torque for
module mounting
M
Screw M4 baseplate to heatsink
2.0
Nm
Weight
G
729
g
1)
Cooler design and flow direction according to application note AN-HPDPERF-ASSEMBLY
Datasheet
3
Revision 1.10
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FS03MR12A6MA1LB
™
HybridPACK Drive module
2 MOSFET
2
MOSFET
Table 4
Maximum rated values
Symbol Note or test condition
Parameter
Values
1200
400
Unit
Drain-source voltage
DC drain current
VDSS
Tvj = 25 °C
V
A
A
V
ID,nom VGS = 15 V, Tf = 60 °C
Tvj,max = 175 °C
Pulsed drain current
Gate-source voltage
ID,pulse verified by design, tp limited by Tvjmax
800
VGSS
-10/20
Table 5
Characteristic values
Parameter
Symbol Note or test condition
Values
Typ.
2.75
Unit
Min.
Max.
Drain-source on-resistance
Gate threshold voltage
RDS,on ID = 400 A, VGS = 15 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
3.70
mΩ
4.00
4.55
VGS,th ID = 240 mA, VGS = VDS
,
3.25
4.40
5.55
V
(tested afte 1ms pulse
at VGS = +20 V)
Total gate charge
Internal gate resistor
Input capacitance
QG
RG,int
Ciss
VDS = 600 V, VGS = -5/15 V
1.32
0.23
42.6
µC
Ω
Tvj = 25 °C
Tvj = 25 °C
f = 1 MHz, VDS = 600 V,
VGS = 0 V
nF
Output capacitance
Coss
Crss
f = 1 MHz, VDS = 600 V,
VGS = 0 V
Tvj = 25 °C
Tvj = 25 °C
1.86
0.17
438
nF
nF
Reverse transfer
capacitance
f = 1 MHz, VDS = 600 V,
VGS = 0 V
COSS stored energy
Eoss
IDSX
VDS = 600 V, VGS = -5/15 V Tvj = 25 °C
VGS = -5 V, VDSS = 1200 V Tvj = 25 °C
µJ
µA
Drain-source leakage
current
100
400
Gate-source leakage
current
IGSS
VGS = 20 V, VDS = 0 V
Tvj = 25 °C
nA
ns
Turn-on delay time,
inductive load
td,on
ID = 400 A, RG,on = 5.1 Ω, Tvj = 25 °C
VGS = -5/15 V, VDS = 600 V
77
62
59
79
70
69
Tvj = 125 °C
Tvj = 150 °C
Rise time (inductive load)
tr
ID = 400 A, RG,on = 5.1 Ω, Tvj = 25 °C
VGS = -5/15 V, VDS = 600 V
ns
Tvj = 125 °C
Tvj = 150 °C
(table continues...)
Datasheet
4
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
3 Body diode
Table 5
(continued) Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
263
287
294
64
Unit
Min.
Max.
Tuen-off delay time,
td,off
ID = 400 A, RG,off = 5.1 Ω, Tvj = 25 °C
ns
inductive load
VGS = -5/15 V, VDS = 600 V
Tvj = 125 °C
Tvj = 150 °C
Fall time (inductive load)
tf
ID = 400 A, RG,off = 5.1 Ω, Tvj = 25 °C
ns
VGS = -5/15 V, VDS = 600 V
Tvj = 125 °C
64
Tvj = 150 °C
65
Turn-on energy loss per
pulse
Eon
ID = 400 A, RG,on = 5.1 Ω, Tvj = 25 °C,
19.48
mJ
VGS = -5/15 V, VDS = 600 V, di/dt = 4 kA/µs
Lσ = 20 nH
Tvj = 125 °C,
19.85
20.16
17.61
17.95
18.21
5300
4800
0.1
di/dt = 4.6 kA/µs
Tvj = 150 °C,
di/dt = 4.6 kA/µs
Tuen-off energy loss per
pulse
Eoff
ID = 400 A, RG,off = 5.1 Ω, Tvj = 25 °C,
VGS = -5/15 V, VDS = 600 V, du/dt = 7.3 kV/µs
mJ
Lσ = 20 nH
Tvj = 125 °C,
du/dt = 7.2 kV/µs
Tvj = 150 °C,
du/dt = 7.1 kV/µs
Short circuit data
ISC
VDD = 800 V, VGS = -5/15 V, tSC = 3 µs,
A
RG,on = 5.1 Ω,
RG,off = 5.1 Ω, VDSmax
VDSS-LsDS⋅di/dt
Tvj = 25 °C
=
tSC = 3 µs,
Tvj = 150 °C
Thermal resistance,
junction to cooling fluid
Rth,j-f
Tvj,op
per MOSFET, Tf = 60 °C, ΔV/Δt = 10 dm³/min,
50% water / 50% ethylenglycol
0.1081) K/W
Temperature under
switching conditions
-40
150
°C
1)
EoL criteria see AQG324, verified by characterization with 4.5 sigma. Cooler design and flow direction according to application note
AN-HPDPERF-ASSEMBLY
3
Body diode
Table 6
Maximum rated values
Symbol Note or test condition
Parameter
Values
Unit
DC body diode forward
current
IF,S
Tvj,max = 175 °C,
VGS = -5 V
Tf = 60 °C
210
A
Pulsed body diode current IF,S,pulse verified by design, tp limited by Tvjmax
800
A
Datasheet
5
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
4 NTC-Thermistor
Table 7
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
4.42
4.22
4.16
165
Unit
Min.
Max.
Forward voltage
VF,SD
Irrm
Qrr
IF,S = 400 A, VGS = -5 V
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
Tvj = 25 °C
Tvj = 125 °C
Tvj = 150 °C
6.15
V
Peak reverse recovery
current
IF,S = 400 A, VGS = -5 V,
VR,DS = 600 V
A
287
309
Recovered charge
IF,S = 400 A, VGS = -5 V,
VR,DS = 600 V
11.20
18.10
19.30
1.4
µC
mJ
Reverse recovery energy
Erec
IF,S = 400 A, VGS = -5 V,
VR,DS = 600 V
Tvj = 25 °C,
-di/dt = 5.9 kA/µs
Tvj = 125 °C,
4.0
4.7
-di/dt = 6.9 kA/µs
Tvj = 150 °C,
-di/dt = 6.9 kA/µs
4
NTC-Thermistor
Table 8
Characteristic values
Symbol Note or test condition
Parameter
Values
Typ.
5
Unit
Min.
Max.
Rated resistance
Deviation of R100
Power dissipation
B-value
R25
ΔR/R
P25
TNTC = 25 °C
kΩ
%
TNTC = 100 °C, R100 = 493 Ω
TNTC = 25 °C
-5
5
20
mW
K
B25/50 R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]
B25/80 R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]
B25/100 R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]
3375
3411
3433
B-value
K
B-value
K
Datasheet
6
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
5 Characteristics diagrams
5
Characteristics diagrams
Pressure drop in cooling circuit, Package
Δp = f(ΔV/Δt)
Output characteristic (typical), MOSFET
ID = f(VDS
)
Tf = 60 °C, fluid = 50% water/50% ethylenglycol
VGS = 15 V
120
96
72
48
24
0
800
600
400
200
0
-200
-400
-600
-800
-4.0 -3.0 -2.0 -1.0 0.0
1.0
2.0
3.0
4.0
4
6
8
10
12
14
Output characteristic (typical), MOSFET
ID = f(VDS
Transfer characteristic (typical), MOSFET
ID = f(VGS
)
)
Tvj = 125 °C
VDS = 20 V
800
800
600
400
200
0
600
400
200
0
0.0
1.0
2.0
3.0
4.0
5.0
2
4
6
8
10
12
Datasheet
7
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
5 Characteristics diagrams
Drain-source on-resistance (typical), MOSFET
RDS,on = f(ID)
Drain-source on-resistance (typical), MOSFET
RDS,on = f(Tvj)
VGS = 15 V
ID = 400 A, VGS = 15 V
6
5
4
3
2
1
0
5
4
3
2
1
0
25
50
75
100
125
150
0
200
400
600
800
Maximum allowed drain-source voltage, MOSFET
VDSS = f(Tvj)
Capacity characteristic (typical), MOSFET
C = f(VDS
)
Tvj = 25 °C, f = 1 MHz, VGS = 0 V
1250
1225
1200
1175
1150
1125
1100
100
10
1
0.1
-50 -25
0
25 50 75 100 125 150 175
0
120
240
360
480
600
Datasheet
8
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
5 Characteristics diagrams
Switching losses (typical), MOSFET
E = f(RG)
Switching losses (typical), MOSFET
E = f(ID)
ID = 400 A, VDS = 600 V, VGS = -5/15 V
VDS = 600 V, RG,off = 5.1 Ω, RG,on = 5.1 Ω, VGS = -5/15 V
120
100
80
60
40
20
0
50
40
30
20
10
0
5
10
15
20
25
30
0
200
400
600
800
Reverse bias safe operating area (RBSOA), MOSFET
ID = f(VDS
Thermal impedance , MOSFET
Rth,j-f = f(dv/dt)
)
RG,off = 5.1 Ω, VGS = +15/-5 V, Tvj = 150 °C
fluid = 50% water/50% ethylenglycol , Tf = 60 °C
1000
0.120
800
600
400
200
0
0.114
0.108
0.102
0.096
0.090
0
200
400
600
800 1000 1200 1400
4
6
8
10
12
14
Datasheet
9
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
5 Characteristics diagrams
Transient thermal impedance , MOSFET
Zth = f(t)
Forward characteristic body diode (typical), MOSFET
IF,S = f(VSD
)
ΔV/Δt = 10 dm³/min, fluid = 50% water/50%
ethylenglycol , Tf = 60 °C
Tvj = 25 °C
1
800
640
480
320
160
0
0.1
0.01
0.001
0
1
2
4
5
6
0.001
0.01
0.1
1
10
Switching losses body diode (typical), MOSFET
Erec = f(ISD
Switching losses body diode (typical), MOSFET
Erec = f(RG)
)
Vr = 600 V, RG,on = 5.1 Ω, VGS = -5/15 V
Vr = 600 V, IF,S = 400 A, VGS = -5/15 V
10
10
8
6
4
2
0
8
6
4
2
0
0
200
400
600
800
5
10
15
20
25
30
Datasheet
10
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
5 Characteristics diagrams
Temperature characteristic (typical), NTC-Thermistor
R = f(TNTC
)
100000
10000
1000
100
0
20
40
60
80 100 120 140 160
Datasheet
11
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
6 Circuit diagram
6
Circuit diagram
P1
P2
P3
D1.2
D1.1
D3.2
D5.2
D5.1
T1
D3.1
T
T
T
T2
T3
G1
S1
G3
S3
G5
S5
U
V
W
D2
D4
D6
T4
T5
G2
G4
G6
S2.1
S2.2
S4.1
S4.2
S6.1
S6.2
T6
N1
N2
N3
Figure 1
Datasheet
12
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
7 Package outlines
7
Package outlines
n5,3±0,15{
B
n0,6 FG
A
j
n1,2 DE
6x(N1-N3;P1-P3)
G
F
6x
14±0,2
N2
n5,5±0,1
6x
D
6x
16±0,2
1±0,15
6x
22,25±0,4
16,25
n0,5 DE
A
j
9,75±0,4
5±0,4
0
Y
n1,6 BC
B
P2
N1
P1
N3
P3
8x
X
0
0
G4
G6
G2
D4
D6
15,5±0,5
D2
D3.2 S4.2
D5.2 S6.2
S6.1
D1.2 S2.2
S4.1
S2.1
4±0,3
+0
6
-0,2
6,35±0,5
T1
T3
T4
T5
T6
T2
G1 S1
G3
G5 S5
S3
66,5±0,5
D1.1
D3.1
D5.1
A
82
87±0,4
90,75±0,4
82
C
V
U
W
C
1±0,15
E
3x
114,25
120,25±0,4
3x
n5,5±0,1
14±0,2
H
3x
n0,6 H I
A
j
n1,2 DE
3x(U;V;W)
I
B
S
X-Y ( 1 : 1 )
D2
D3
D4
8x
L
8x
N2
P2
N3
N1
P1
P3
9,3±0,2
D1
Ø0,8 LM
Ø1,6 B C
Y
A
0
8
j
A
c 0,3 CZ
M
G2
G4
G6
D2
D4
D6
X
6x common
18,85
dimensioned for
EJOT Delta PT
WN5451 30 x 10
origin axis generated by
D1.2,S2.2,G2,S2.1,D2,D3.2,S4.2,
G4,S4.1,D4,D5.2,S6.2,G6,S6.1,D6
D1.2 S2.2
D3.2 S4.2
D5.2 S6.2
S2.1
S4.1
S6.1
zones
D1-D2
D2-D3
D3-D4
D8-D7
D7-D6
D6-D5
J
K
Z
R
51,85
59,35
67,15
69,85
74,1
82
T1
T3
T4
T5
T6
T2
T
G1 S1
G3S3
D3.1
G5 S5
D5.1
D1.1
3,94±0,5
refers
to local CZ
U
V
W
C
D8
D7
D6
D5
Z ( 1.5 : 1 )
Areas R,S or T
**
**
KJ
BC
A
j
30x
G2
S2.1
(19,75)
Drawing: W00153129 Rev.06
general
D1.2
S2.2
edges
surface
tolerances
1. DIN
DIN EN ISO
1302
DIN ISO 13715
** Pin positions
checked with pin gauge
according to Application Note
AN-HPD_ASSEMBLY
16742-TG4
2. DIN ISO
2768-mK
All dimensions refer to module in
delivery condition
Figure 2
Datasheet
13
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
8 Module label code
8
Module label code
Module label code
Code format
Encoding
Data Matrix
ASCII text
Barcode Code128
Code Set A
23 digits
Symbol size
Standard
16x16
IEC24720 and IEC16022
IEC8859-1
Code content
Content
Digit
1 – 5
6 - 11
12 - 19
20 – 21
22 – 23
Example
71549
142846
55054991
15
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
30
Example
71549142846550549911530
71549142846550549911530
Packing label code
Code format
Encoding
Barcode Code128
Code Set A
Symbol size
Standard
34 digits
IEC8859-1
Code content
Content
Identifier
X
1T
S
9D
Q
Digit
2 – 9
12 – 19
21 – 25
28 – 31
33 – 34
Example
Module serial number
Module material number
Production order number
Date code (production year)
Date code (production week)
95056609
2X0003E0
754389
1139
15
Example
X950566091T2X0003E0S754389D1139Q15
Figure 3
Datasheet
14
Revision 1.10
2022-07-19
FS03MR12A6MA1LB
™
HybridPACK Drive module
Revision history
Revision history
Document revision
Date of release Description of changes
V1.0
V2.0
n/a
2019-09-03
2021-01-26
2020-10-05
Target datasheet
Preliminary datasheet
Datasheet migrated to a new system with a new layout and new revision
number schema: target or preliminary datasheet = 0.xy; final datasheet =
1.xy
1.00
1.10
2021-03-23
2022-07-19
Final datasheet
Adaption of product identification
Adding electrical feature diagram
Correction of typos
Datasheet
15
Revision 1.10
2022-07-19
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-07-19
Published by
Infineon Technologies AG
81726 Munich, Germany
Important notice
Warnings
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event be regarded as a guarantee of conditions or
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values stated herein and/or any information regarding
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hereby disclaims any and all warranties and liabilities
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2022 Infineon Technologies AG
All Rights Reserved.
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Document reference
IFX-AAD288-004
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evaluate the suitability of the product for the intended
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