FS05MR12A6MA1B [INFINEON]

PinFin Base Plate;
FS05MR12A6MA1B
型号: FS05MR12A6MA1B
厂家: Infineon    Infineon
描述:

PinFin Base Plate

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中文:  中文翻译
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FS05MR12A6MA1B  
HybridPACK Drive module  
HybridPACK Drive module with CoolSiC Automotive MOSFET  
Features  
• Electrical features  
- VDSS = 1200 V  
- ID,nom = 200 A  
- New semiconductor material - silicon carbide  
- Blocking voltage 1200 V  
- Low RDS,on  
- Low switching losses  
- Low Qg and Crss  
- Tvj,op = 150°C  
- Low inductive design <10 nH  
• Mechanical features  
- 4.2 kV DC 1 second insulation  
- High creepage and clearance distances  
- Compact design  
- High power density  
- Direct-cooled PinFin base plate  
- High-performance Si3N4 ceramic  
- Guiding elements for PCB and cooler assembly  
- Integrated NTC temperature sensor  
- PressFIT contact technology  
- RoHS compliant  
- UL 94 V0 module frame  
Potential applications  
• Automotive applications  
• (Hybrid) electrical vehicles (H)EV  
• Motor drives  
• Commercial agriculture vehicles  
Product validation  
• Qualified according to AQG 324, release no.: 03.1/2021  
Description  
T
T
T
Datasheet  
www.infineon.com  
Please read the sections "Important notice" and "Warnings" at the end of this document  
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
Table of contents  
Table of contents  
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Body diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
NTC-Thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6  
Characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Circuit diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
Module label code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
1
2
3
4
5
6
7
8
Datasheet  
2
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
1 Package  
1
Package  
Table 1  
Insulation coordination  
Symbol Note or test condition  
Parameter  
Values  
4.20  
Unit  
Isolation test voltage  
VISOL  
RMS, f = 0 Hz, t = 1 sec  
kV  
Material of module  
baseplate  
Cu+Ni1)  
Internal isolation  
Creepage distance  
Creepage distance  
Clearance  
basic insulation (class 1, IEC 61140)  
Si3N4  
9.0  
dcreep terminal to heatsink  
dcreep terminal to terminal  
mm  
mm  
mm  
mm  
9.0  
dclear  
dclear  
CTI  
terminal to heatsink  
terminal to terminal  
4.5  
Clearance  
4.5  
Comparative tracking  
index  
> 200  
1)  
Ni plated Cu baseplate.  
Table 2  
Maximum rated values  
Symbol Note or test condition  
Parameter  
Values  
Unit  
Maximum RMS module  
terminal current  
It,rms  
Tterminal = 105 °C, Tf = 75 °C  
550  
A
Table 3  
Characteristic values  
Parameter  
Symbol Note or test condition  
Values  
Typ.  
Unit  
Min.  
Max.  
Pressure drop in cooling  
circuit  
Δp  
ΔV/Δt = 10 dm³/min, 50% water/ 50%  
641)  
mbar  
bar  
ethylenglycol, Tf = 60 °C  
Maximum pressure in  
cooling circuit  
p
Tbaseplate < 40 °C (relative pressure)  
Tbaseplate ≥ 40 °C (relative pressure)  
2.5  
2.0  
Stray inductance module  
Ls,DS  
8.5  
nH  
Module lead resistance,  
terminals - chip  
RDD'+SS' Tf = 25 °C, per switch  
0.75  
mΩ  
Storage temperature  
Tstg  
-40  
1.8  
125  
2.2  
°C  
Mounting torque for  
module mounting  
M
Screw M4 baseplate to heatsink  
2.0  
Nm  
Weight  
G
720  
g
1)  
Cooler design and flow direction according to application note AN-HPD-ASSEMBLY.  
Datasheet  
3
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
2 MOSFET  
2
MOSFET  
Table 4  
Maximum rated values  
Symbol Note or test condition  
Parameter  
Values  
1200  
200  
Unit  
Drain-source voltage  
DC drain current  
VDSS  
Tvj = 25 °C  
V
A
A
V
ID,nom VGS = 15 V, Tf = 60 °C  
Tvj,max = 175 °C  
Pulsed drain current  
Gate-source voltage  
ID,pulse verified by design, tp limited by Tvjmax  
400  
VGSS  
-10/20  
Table 5  
Characteristic values  
Parameter  
Symbol Note or test condition  
Values  
Typ.  
5.50  
Unit  
Min.  
Max.  
Drain-source on-resistance  
Gate threshold voltage  
RDS,on ID = 200 A, VGS = 15 V  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 150 °C  
Tvj = 25 °C  
7.35  
mΩ  
8.00  
9.10  
VGS,th ID = 120 mA, VGS = VDS  
,
3.25  
4.50  
5.55  
V
(tested afte 1ms pulse  
at VGS = +20 V)  
Total gate charge  
Internal gate resistor  
Input capacitance  
QG  
RG,int  
Ciss  
VDS = 600 V, VGS = -5/15 V  
0.66  
0.45  
21.3  
µC  
Tvj = 25 °C  
Tvj = 25 °C  
f = 1 MHz, VDS = 600 V,  
VGS = 0 V  
nF  
Output capacitance  
Coss  
Crss  
f = 1 MHz, VDS = 600 V,  
VGS = 0 V  
Tvj = 25 °C  
Tvj = 25 °C  
0.93  
0.09  
219  
nF  
nF  
Reverse transfer  
capacitance  
f = 1 MHz, VDS = 600 V,  
VGS = 0 V  
COSS stored energy  
Eoss  
IDSX  
VDS = 600 V, VGS = -5/15 V Tvj = 25 °C  
VGS = -5 V, VDSS = 1200 V Tvj = 25 °C  
µJ  
µA  
Drain-source leakage  
current  
100  
400  
Gate-source leakage  
current  
IGSS  
VGS = 20 V, VDS = 0 V  
Tvj = 25 °C  
nA  
ns  
Turn-on delay time,  
inductive load  
td,on  
ID = 200 A, RG,on = 5.1 Ω, Tvj = 25 °C  
VGS = -5/15 V, VDS = 600 V  
52  
45  
44  
44  
40  
39  
Tvj = 125 °C  
Tvj = 150 °C  
Rise time (inductive load)  
tr  
ID = 200 A, RG,on = 5.1 Ω, Tvj = 25 °C  
VGS = -5/15 V, VDS = 600 V  
ns  
Tvj = 125 °C  
Tvj = 150 °C  
(table continues...)  
Datasheet  
4
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
3 Body diode  
Table 5  
(continued) Characteristic values  
Symbol Note or test condition  
Parameter  
Values  
Typ.  
142  
153  
156  
52  
Unit  
Min.  
Max.  
Tuen-off delay time,  
td,off  
ID = 200 A, RG,off = 5.1 Ω, Tvj = 25 °C  
ns  
inductive load  
VGS = -5/15 V, VDS = 600 V  
Tvj = 125 °C  
Tvj = 150 °C  
Fall time (inductive load)  
tf  
ID = 200 A, RG,off = 5.1 Ω, Tvj = 25 °C  
ns  
VGS = -5/15 V, VDS = 600 V  
Tvj = 125 °C  
53  
Tvj = 150 °C  
53  
Turn-on energy loss per  
pulse  
Eon  
ID = 200 A, RG,on = 5.1 Ω, Tvj = 25 °C  
6.04  
6.66  
6.83  
mJ  
VGS = -5/15 V, VDS = 600 V,  
Tvj = 125 °C  
Lσ = 20 nH  
Tvj = 150 °C,  
di/dt = 4.5 kA/µs  
Tuen-off energy loss per  
Eoff  
ID = 200 A, RG,off = 5.1 Ω, Tvj = 25 °C  
4.27  
4.41  
4.51  
mJ  
A
pulse  
VGS = -5/15 V, VDS = 600 V,  
Tvj = 125 °C  
Lσ = 20 nH  
Tvj = 150 °C,  
du/dt = 12.4 kV/µs  
Short circuit data  
ISC  
VDD = 800 V, VGS = -5/15 V, tSC ≤ 3 µs,  
2730  
2480  
0.15  
RG,on = 5.1 Ω,  
RG,off = 5.1 Ω, VDSmax  
VDSS-LsDSdi/dt  
Tvj = 25 °C  
=
tSC ≤ 3 µs,  
Tvj = 150 °C  
Thermal resistance,  
junction to cooling fluid  
Rth,j-f  
Tvj,op  
per MOSFET, Tf = 60 °C, ΔV/Δt = 10 dm³/min,  
50% water/ 50% ethylenglycol  
0.181) K/W  
Temperature under  
switching conditions  
-40  
150  
°C  
1)  
EoL criteria see AQG324, verified by characterization with 4.5 sigma. Cooler design and flow direction according to application note  
AN-HPDPERF-ASSEMBLY  
3
Body diode  
Table 6  
Maximum rated values  
Symbol Note or test condition  
Parameter  
Values  
Unit  
DC body diode forward  
current  
IF,S  
Tvj,max = 175 °C,  
VGS = -5 V  
Tf = 60 °C  
110  
A
Pulsed body diode current IF,S,pulse verified by design, tp limited by Tvjmax  
400  
A
Datasheet  
5
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
4 NTC-Thermistor  
Table 7  
Characteristic values  
Symbol Note or test condition  
Parameter  
Values  
Typ.  
4.42  
4.22  
4.16  
87  
Unit  
Min.  
Max.  
Forward voltage  
VF,SD  
Irrm  
Qrr  
IF,S = 200 A, VGS = -5 V  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 150 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 150 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 150 °C  
6.15  
V
Peak reverse recovery  
current  
IF,S = 200 A, VGS = -5 V,  
VR,DS = 600 V  
A
165  
187  
Recovered charge  
IF,S = 200 A, VGS = -5 V,  
VR,DS = 600 V  
3.67  
6.81  
8.28  
0.5  
µC  
mJ  
Reverse recovery energy  
Erec  
IF,S = 200 A, VGS = -5 V,  
VR,DS = 600 V  
Tvj = 25 °C,  
-di/dt = 1.0 kA/µs  
Tvj = 125 °C,  
1.1  
1.4  
-di/dt = 1.0 kA/µs  
Tvj = 150 °C,  
-di/dt = 1.0 kA/µs  
4
NTC-Thermistor  
Table 8  
Characteristic values  
Symbol Note or test condition  
Parameter  
Values  
Typ.  
5
Unit  
Min.  
Max.  
Rated resistance  
Deviation of R100  
Power dissipation  
B-value  
R25  
ΔR/R  
P25  
TNTC = 25 °C  
kΩ  
%
TNTC = 100 °C, R100 = 493 Ω  
TNTC = 25 °C  
-5  
5
20  
mW  
K
B25/50 R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]  
B25/80 R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]  
B25/100 R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]  
3375  
3411  
3433  
B-value  
K
B-value  
K
Datasheet  
6
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
5 Characteristics diagrams  
5
Characteristics diagrams  
Pressure drop in cooling circuit, Package  
Δp = f(ΔV/Δt)  
Output characteristic (typical), MOSFET  
ID = f(VDS  
)
Tf = 60 °C, fluid = 50% water/ 50% ethylenglycol  
VGS = 15 V  
120  
100  
80  
60  
40  
20  
0
400  
300  
200  
100  
0
-100  
-200  
-300  
-400  
-4.0 -3.0 -2.0 -1.0 0.0  
1.0  
2.0  
3.0  
4.0  
4
5
6
7
8
9
10 11 12 13 14  
Output characteristic (typical), MOSFET  
ID = f(VDS  
Transfer characteristic (typical), MOSFET  
ID = f(VGS  
)
)
Tvj = 125 °C  
VDS = 20 V  
400  
400  
300  
200  
100  
0
300  
200  
100  
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
4
5
6
7
8
9
10  
11  
Datasheet  
7
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
5 Characteristics diagrams  
Drain-source on-resistance (typical), MOSFET  
Drain-source on-resistance (typical), MOSFET  
RDS,on = f(Tvj)  
RDS,on = f(ID)  
VGS = 15 V  
VGS = 15 V  
10  
8
12  
10  
8
6
6
4
4
2
2
0
0
25  
50  
75  
100  
125  
150  
0
50  
100 150 200 250 300 350 400  
Maximum allowed drain-source voltage, MOSFET  
VDSS = f(Tvj)  
Capacity characteristic (typical), MOSFET  
Ciss = f(VDS), Crss = f(VDS), Coss = f(VDS  
)
verified by characterization / design not by test  
Tvj = 25 °C, f = 1 MHz, VGS = -5/15 V  
1250  
1225  
1200  
1175  
1150  
1125  
1100  
100  
10  
1
0.1  
0.01  
-50 -25  
0
25 50 75 100 125 150 175  
0
100  
200  
300  
400  
500  
600  
Datasheet  
8
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
5 Characteristics diagrams  
Switching losses (typical), MOSFET  
Eoff = f(ID), Eon = f(ID)  
Switching losses (typical), MOSFET  
Eoff = f(RG), Eon = f(RG)  
VDS = 600 V, RG,off = 5.1 Ω, RG,on = 5.1 Ω, VGS = 15 V  
ID = 200 A, VDS = 600 V, VGS = -5/15 V  
15  
12  
9
30  
25  
20  
15  
10  
5
6
3
0
0
0
50  
100 150 200 250 300 350 400  
5
10  
15  
20  
25  
30  
Reverse bias safe operating area (RBSOA), MOSFET  
ID = f(VDS  
Transient thermal impedance , MOSFET  
Zth = f(t)  
)
VGS = 15 V, Tc = 60 °C  
500  
1
400  
300  
200  
100  
0
0.1  
0.01  
0.001  
0
200  
400  
600  
800 1000 1200 1400  
0.001  
0.01  
0.1  
1
10  
Datasheet  
9
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
5 Characteristics diagrams  
Thermal impedance , MOSFET  
Rth,j-f = f(dv/dt)  
Forward characteristic body diode (typical), MOSFET  
IF,S = f(VSD  
)
fluid = 50% water/ 50% ethylenglycol , Tf = 60 °C  
Tvj = 25 °C  
0.170  
0.160  
0.150  
0.140  
400  
300  
200  
100  
0
0
1
2
3
4
5
6
4
6
8
10  
12  
14  
Temperature characteristic (typical), NTC-Thermistor  
R = f(TNTC  
)
100000  
10000  
1000  
100  
0
20  
40  
60  
80 100 120 140 160  
Datasheet  
10  
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
6 Circuit diagram  
6
Circuit diagram  
P1  
P2  
P3  
D1.2  
D1.1  
D3.2  
D5.2  
D5.1  
T1  
D3.1  
T
T
T
T2  
T3  
G1  
S1  
G3  
S3  
G5  
S5  
U
V
W
D2  
D4  
D6  
T4  
T5  
G2  
G4  
G6  
S2.1  
S2.2  
S4.1  
S4.2  
S6.1  
S6.2  
T6  
N1  
N2  
N3  
Figure 1  
Datasheet  
11  
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
7 Package outlines  
7
Package outlines  
5,300,15  
B
0,6 FG  
A
1,2 DE  
6x(N1-N3;P1-P3)  
F
G
6x  
14,000,2  
5,500,1  
6x  
6x  
6x  
16,000,2  
D
1,000,15  
22,250,4  
16,25  
0,5 DE  
1,6 BC  
8x  
A
9,750,4  
Y
B
P1  
N2  
P2  
N1  
N3  
P3  
5,000,4  
0,00  
X
0,00  
0,00  
G4  
G6  
G2  
D2  
D4  
D6  
15,500,5  
D3.2 S4.2  
D5.2 S6.2  
S6.1  
D1.2 S2.2  
S4.1  
S2.1  
4,000,3  
T1  
T3  
T4  
T5  
T6  
6,350,5  
T2  
G1  
G5 S5  
D5.1  
S1  
G3S3  
D3.1  
66,500,5  
D1.1  
A
82,00  
C
(82,00)  
87,000,4  
90,750,4  
98,25  
U
V
W
C
1,000,15  
3x  
E
104,250,4  
3x  
5,500,1  
3x  
14,000,2  
H
0,6 H I  
A
1,2 DE  
I 3x(U;V;W)  
B
S
D2  
D3  
D4  
X-Y ( 1 : 1 )  
8x  
8x  
L
Y
N2  
P2  
N3  
N1  
P1  
P3  
0,8 LM  
A
D1  
9,300,2  
0,00  
8,00  
1,6 B C  
A
M
0,3 CZ  
X
G2  
G4  
G6  
D2  
D4  
D6  
6x common  
zones  
D1-D2  
18,85  
dimensioned for  
EJOT Delta PT  
WN545130 x 10  
origin axis generated by  
D1.2,S2.2,G2,S2.1,D2,D3.2,S4.2,G4,  
S4.1,D4,D5.2,S6.2,G6,S6.1,D6  
D1.2 S2.2  
D3.2  
D5.2  
S4.2  
S6.2  
S2.1  
S4.1  
S6.1  
Z
J
K
D2-D3  
D3-D4  
D8-D7  
D7-D6  
D6-D5  
R
51,85  
59,35  
T1  
T3  
T4  
T5  
T6  
T
T2  
G1  
G3S3  
D3.1  
G5 S5  
S1  
67,15  
69,85  
74,10  
82,00  
D1.1  
D5.1  
3,940,5  
refers  
to local CZ  
C
U
V
W
D8  
D7  
D6  
D5  
Areas R,S or T  
(19,75)  
Z ( 1,5 : 1 )  
Drawing: D00112361 Rev05  
general  
edges  
surface  
tolerances  
1. DIN  
** KJ  
A
** BC  
DIN EN ISO  
1302  
G2  
S2.2 S2.1  
DIN ISO 13715  
16742-TG4  
2. DIN ISO  
2768-mK  
30x  
D1.2  
** Pin positions  
checked with pin gauge  
according to  
All dimensions refer to module in  
delivery condition  
Application Note  
AN-HPD_ASSEMBLY  
Figure 2  
Datasheet  
12  
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
8 Module label code  
8
Module label code  
Module label code  
Code format  
Encoding  
Data Matrix  
ASCII text  
Barcode Code128  
Code Set A  
23 digits  
Symbol size  
Standard  
16x16  
IEC24720 and IEC16022  
IEC8859-1  
Code content  
Content  
Digit  
1 – 5  
6 - 11  
12 - 19  
20 – 21  
22 – 23  
Example  
71549  
142846  
55054991  
15  
Module serial number  
Module material number  
Production order number  
Date code (production year)  
Date code (production week)  
30  
Example  
71549142846550549911530  
71549142846550549911530  
Packing label code  
Code format  
Encoding  
Barcode Code128  
Code Set A  
Symbol size  
Standard  
34 digits  
IEC8859-1  
Code content  
Content  
Identifier  
X
1T  
S
9D  
Q
Digit  
2 – 9  
12 – 19  
21 – 25  
28 – 31  
33 – 34  
Example  
Module serial number  
Module material number  
Production order number  
Date code (production year)  
Date code (production week)  
95056609  
2X0003E0  
754389  
1139  
15  
Example  
X950566091T2X0003E0S754389D1139Q15  
Figure 3  
Datasheet  
13  
Revision 1.10  
2022-07-19  
FS05MR12A6MA1B  
HybridPACK Drive module  
Revision history  
Revision history  
Document revision  
Date of release Description of changes  
V1.0  
V2.0  
V3.0  
V3.1  
n/a  
2019-09-13  
2020-04-02  
2020-06-26  
2020-09-17  
2020-10-05  
Target Datasheet  
Preliminary Data Sheet  
Final datasheet, correction of module weight  
Datasheet migrated to a new system with a new layout and new revision  
number schema: target or preliminary datasheet = 0.xy; final datasheet =  
1.xy  
1.10  
2022-07-19  
Adaption of product identification  
Adding electrical feature diagram  
Correction of typos  
Datasheet  
14  
Revision 1.10  
2022-07-19  
Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
Edition 2022-07-19  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
Important notice  
Warnings  
The information given in this document shall in no  
event be regarded as a guarantee of conditions or  
characteristics (“Btschafftnhtiꢀsgaeanꢀit”).  
With respect to any examples, hints or any typical  
values stated herein and/or any information regarding  
the application of the product, Infineon Technologies  
hereby disclaims any and all warranties and liabilities  
of any kind, including without limitation warranties of  
non-infringement of intellectual property rights of any  
third party.  
In addition, any information given in this document is  
subject to customer’s compliance with its obligations  
stated in this document and any applicable legal  
requirements, norms and standards concerning  
customer’s products and any use of the product of  
Infineon Technologies in customer’s applications.  
Due to technical requirements products may contain  
dangerous substances. For information on the types  
in question please contact your nearest Infineon  
Technologies offict.  
Except as otherwise explicitly approved by Infineon  
Technologies in  
authorized representatives of Infineon Technologies,  
Infineon Technologies’ products may not be used in  
any applications where a failure of the product or  
any consequences of the use thereof can reasonably  
be expected to result in personal injury.  
a written document signed by  
©
2022 Infineon Technologies AG  
All Rights Reserved.  
Do you have a question about any  
aspect of this document?  
Email: erratum@infineon.com  
Document reference  
IFX-AAD287-005  
The data contained in this document is exclusively  
intended for technically trained sꢀaff. It is the  
responsibility of customer’s technical departments to  
evaluate the suitability of the product for the intended  
application and the completeness of the product  
information given in this document with respect to such  
application.  

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