FS400R07A1E3_S7_技术文档

HybridPACK™ꢀ1ꢀModule

FS400R07A1E3_S7

FinalꢀDataꢀSheet

V3.2,ꢀ2017-09-28

AutomotiveꢀHighꢀPower

FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

1ꢀꢀꢀꢀꢀFeaturesꢀ/ꢀDescription

HybridPACK™ꢀ1ꢀmoduleꢀwithꢀTrench/FieldstopꢀIGBT3ꢀandꢀEmitterꢀControlledꢀ3ꢀdiodeꢀandꢀNTC

V_CES= 700V

I_{C nom}= 400A

TypicalꢀApplications

• HybridꢀElectricalꢀVehiclesꢀ(H)EV

• MotorꢀDrives

Description

Infineon^®’s HybridPACK^TM1 is an automotive

qualified power module designed for electric vehicle

applications for a power range up to 20–30kW.

Designed for a 150°C junction operation

• Optimized for automotive applications with DC link

voltagesꢀupꢀtoꢀ420ꢀV

temperature, the module accommodates a 3-phase

Six-Pack configuration of Trench-Field-Stop IGBT3

and matching emitter controlled diodes.

ElectricalꢀFeatures

The HybridPACK^TM1 power module is built on

Infineon’s long time experience in the development

of IGBT power modules, intense research efforts of

new material combinations and assembly

• Increasedꢀblockingꢀvoltageꢀcapabilityꢀtoꢀ705V

• V_CEsatꢀꢀwithꢀpositiveꢀTemperatureꢀCoefficient

• LowꢀV_CEsat

• LowꢀSwitchingꢀLosses

technologies. HybridPACK^TM1 is suitable for air or

liquid cooling. The copper base plate combined with

high-performance ceramic substrate and Infineon’s

enhanced wire-bonding process provides

• T_vjꢀopꢀ=ꢀ150°C

• Short-time extended Operation Temperature

T_vjꢀopꢀ=ꢀ175°C

unparalleled thermal and power cycling capability

and highest reliability for mild hybrid inverter or

generator applications. For a compact design the

driver stage PCB can easily be soldered on top of

the module. All power connections are realized with

screw terminals.

MechanicalꢀFeatures

• 2.5kVꢀACꢀ1minꢀInsulation

• Al₂O₃ꢀSubstrateꢀwithꢀLowꢀThermalꢀResistance

• CopperꢀBaseꢀPlate

• IntegratedꢀNTCꢀtemperatureꢀsensor

• Highꢀmechanicalꢀrobustness

• RoHSꢀcompliant

ProductꢀName

OrderingꢀCode

SP001290884

FS400R07A1E3_S7

Final Data Sheet

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FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

2ꢀꢀꢀꢀꢀIGBT,Inverter

2.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues

Parameter

Conditions

Symbol

Value

Unit

Collector-emitterꢀvoltage

T_vj= 25°C

V_CES

705

V

ContinuousꢀDCꢀcollectorꢀcurrent

T_C= 65°C, T_{vj max}= 175°C

T_C= 25°C, T_{vj max}= 175°C

I_{C nom}

I_C

400¹⁾

500¹⁾

A

Repetitiveꢀpeakꢀcollectorꢀcurrent

Totalꢀpowerꢀdissipation

t_P= 1 ms

I_CRM

P_tot

800

1250

+/-20

A

W

V

T_C= 25°C, T_{vj max}= 175°C

Gate-emitterꢀpeakꢀvoltage

V_GES

2.2ꢀꢀꢀꢀCharacteristicꢀValues

min. typ. max.

Collector-emitterꢀsaturationꢀvoltage

I_C= 400 A, V_GE= 15 V

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

1.45 1.70

1.60

1.70

V_{CE sat}

V

Gateꢀthresholdꢀvoltage

Gateꢀcharge

I_C= 6.40 mA, V_CE= V_GE

V_GE= -15 V ... 15 V

T_vj= 25°C

V_GEth

Q_G

4.90 5.80 6.50

V

µC

Ω

4.30

1.0

Internalꢀgateꢀresistor

T_vj= 25°C

R_Gint

C_ies

C_res

I_CES

I_GES

Inputꢀcapacitance

f = 1 MHz, V_CE= 25 V, V_GE= 0 V

V_CE= 450 V, V_GE= 0 V

26.0

0.76

0.1

nF

mA

nA

Reverseꢀtransferꢀcapacitance

Collector-emitterꢀcut-offꢀcurrent

Gate-emitterꢀleakageꢀcurrent

Turn-onꢀdelayꢀtime,ꢀinductiveꢀload

V_CE= 0 V, V_GE= 20 V

400

I_C= 400 A, V_CE= 300 V

V_GE= ±15 V

R_Gon= 1.8 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.10

0.12

t_{d on}

µs

mJ

Riseꢀtime,ꢀinductiveꢀload

Turn-offꢀdelayꢀtime,ꢀinductiveꢀload

Fallꢀtime,ꢀinductiveꢀload

Turn-onꢀenergyꢀlossꢀperꢀpulse

Turn-offꢀenergyꢀlossꢀperꢀpulse

SCꢀdata

I_C= 400 A, V_CE= 300 V

V_GE= ±15 V

R_Gon= 1.8 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.09

0.10

t_r

I_C= 400 A, V_CE= 300 V

V_GE= ±15 V

R_Goff= 1.8 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.44

0.47

0.48

t_{d off}

I_C= 400 A, V_CE= 300 V

V_GE= ±15 V

R_Goff= 1.8 Ω

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

0.04

0.06

t_f

I_C= 400 A, V_CE= 300 V, L_S= 25 nH

V_GE= ±15 V, di/dt = 4200 A/µs (T_vj= 150°C) T_vj= 125°C

R_Gon= 1.8 Ω

T_vj= 25°C

5.30

6.90

7.50

E_on

E_off

T_vj= 150°C

I_C= 400 A, V_CE= 300 V, L_S= 25 nH

V_GE= ±15 V, du/dt = 3000 V/µs (T_vj= 150°C) T_vj= 125°C

R_Goff= 1.8 Ω

T_vj= 25°C

14.0

17.0

17.5

mJ

A

T_vj= 150°C

V_GE≤ 15 V, V_CC= 360 V

V_CEmax= V_CES-L_sCE·di/dt

t_P≤ 8 µs, T_vj= 25°C

t_P≤ 6 µs, T_vj= 150°C

2800

2000

I_SC

Thermalꢀresistance,ꢀjunctionꢀtoꢀcase

Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink

perꢀIGBT

R_thJC

R_thCH

0.120 K/W

K/W

0.080

λ

_Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλ_greaseꢀ=ꢀ1ꢀW/(m·K)

Temperatureꢀunderꢀswitchingꢀconditions

t_opcontinuous

t_{op max}30h over life time, for 10s within period of 10min

-40

150

°C

T_{vj op}

175

¹⁾DC-collector current limited by power terminals.

Final Data Sheet

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HybridPACKªꢀ1ꢀModule

3ꢀꢀꢀꢀꢀDiode,ꢀInverter

3.1ꢀꢀꢀꢀMaximumꢀRatedꢀValues

Parameter

Conditions

Symbol

V_RRM

I_F

Value

705

Unit

V

Repetitiveꢀpeakꢀreverseꢀvoltage

ContinuousꢀDCꢀforwardꢀcurrent

Repetitiveꢀpeakꢀforwardꢀcurrent

I²tꢀ-ꢀvalue

T_vj= 25°C

400¹⁾

A

t_P= 1 ms

I_FRM

800

A

V_R= 0 V, t_P= 10 ms, T_vj= 125°C

V_R= 0 V, t_P= 10 ms, T_vj= 150°C

8800

8500

A²s

I²t

3.2ꢀꢀꢀꢀCharacteristicꢀValues

min. typ. max.

Forwardꢀvoltage

I_F= 400 A, V_GE= 0 V

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

1.55 1.95

1.50

1.45

V_F

I_RM

Q_r

V

A

Peakꢀreverseꢀrecoveryꢀcurrent

Recoveredꢀcharge

I_F= 400 A, - di_F/dt = 4200 A/µs (T_vj= 150°C) T_vj= 25°C

V_R= 300 V

V_GE= -15 V

155

230

245

T_vj= 125°C

T_vj= 150°C

I_F= 400 A, - di_F/dt = 4200 A/µs (T_vj= 150°C) T_vj= 25°C

V_R= 300 V

V_GE= -15 V

12.5

26.5

31.0

T_vj= 125°C

T_vj= 150°C

µC

mJ

Reverseꢀrecoveryꢀenergy

I_F= 400 A, - di_F/dt = 4200 A/µs (T_vj= 150°C) T_vj= 25°C

3.40

7.10

8.30

V_R= 300 V

V_GE= -15 V

T_vj= 125°C

T_vj= 150°C

E_rec

Thermalꢀresistance,ꢀjunctionꢀtoꢀcase

Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink

perꢀdiode

R_thJC

R_thCH

0.200 K/W

K/W

perꢀdiode

0.085

λ

_Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλ_greaseꢀ=ꢀ1ꢀW/(m·K)

Temperatureꢀunderꢀswitchingꢀconditions

t_opcontinuous

t_{op max}30h over life time, for 10s within period of 10min

-40

150

°C

T_{vj op}

175

4ꢀꢀꢀꢀꢀNTC-Thermistor

Parameter

min. typ. max.

Conditions

Symbol

R₂₅

Value

Unit

kΩ

%

Ratedꢀresistance

DeviationꢀofꢀR100

Powerꢀdissipation

B-value

T_C= 25°C

5.00

T_C= 100°C, R₁₀₀= 493 Ω

T_C= 25°C

∆R/R

P₂₅

5

20.0 mW

R₂= R₂₅exp [B_25/50(1/T₂- 1/(298,15 K))]

R₂= R₂₅exp [B_25/80(1/T₂- 1/(298,15 K))]

R₂= R₂₅exp [B_25/100(1/T₂- 1/(298,15 K))]

B_25/50

B_25/80

B_25/100

3375

3411

3433

K

B-value

Specificationꢀaccordingꢀtoꢀtheꢀvalidꢀapplicationꢀnote.

¹⁾Diode forward current limited by power terminals.

Final Data Sheet

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HybridPACKªꢀ1ꢀModule

5ꢀꢀꢀꢀꢀModule

Parameter

Conditions

Symbol

Value

2.5

Unit

Isolationꢀtestꢀvoltage

Materialꢀofꢀmoduleꢀbaseplate

Internalꢀisolation

RMS, f = 50 Hz, t = 1 min.

V_ISOL

ꢀ

ꢀ kV

Cu

ꢀ

basicꢀinsulationꢀ(classꢀ1,ꢀIECꢀ61140)

Al₂O₃

Creepageꢀdistance

terminalꢀtoꢀheatsink

terminalꢀtoꢀterminal

12.0

6.1

d_Creep

ꢀ

ꢀ mm

Clearance

terminalꢀtoꢀheatsink

terminalꢀtoꢀterminal

12.0

6.1

d_Clear

CTI

ꢀ

ꢀ mm

Comperativeꢀtrackingꢀindex

> 200

ꢀ

min. typ. max.

Strayꢀinductanceꢀmodule

Moduleꢀleadꢀresistance,ꢀterminalsꢀ-ꢀchip

Storageꢀtemperature

L_sCE

R_CC'+EE'

T_stg

M

30

nH

mΩ

°C

T_Cꢀ=ꢀ25ꢀ°C,ꢀperꢀswitch

1.00

-40

3.00¹⁾

3.0¹⁾

125

Mountingꢀtorqueꢀforꢀmodulꢀmounting

Terminalꢀconnectionꢀtorque

Weight

ScrewꢀM5ꢀbaseplateꢀtoꢀheatsink

ScrewꢀM6

6.00¹⁾Nm

6.0¹⁾Nm

g

M

-

G

485

¹⁾Mounting according to valid application note AN 2010-08 Mounting Instruction HybridPACK 1.

Final Data Sheet

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HybridPACKªꢀ1ꢀModule

6ꢀꢀꢀꢀꢀCharacteristicsꢀDiagrams

outputꢀcharacteristicꢀIGBT,Inverterꢀ(typical)

I_Cꢀ=ꢀfꢀ(V_CE

)

V_GEꢀ=ꢀ15ꢀV

T_vjꢀ=ꢀ150°C

800

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

V_GE= 19V

V_GE= 17V

V_GE= 15V

V_GE= 13V

V_GE= 11V

V_GE= 9V

700

600

500

400

300

200

100

0

700

600

500

400

300

200

100

0

0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2 2,4 2,6

0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0

V_CE[V]

transferꢀcharacteristicꢀIGBT,Inverterꢀ(typical)

switchingꢀlossesꢀIGBT,Inverterꢀ(typical)

E_onꢀ=ꢀfꢀ(I_C),ꢀE_offꢀ=ꢀfꢀ(I_C)

I_Cꢀ=ꢀfꢀ(V_GE

)

V_CEꢀ=ꢀ20ꢀV

V_GEꢀ=ꢀ±15ꢀV,ꢀR_Gonꢀ=ꢀ1.8ꢀΩ,ꢀR_Goffꢀ=ꢀ1.8ꢀΩ,ꢀV_CEꢀ=ꢀ300ꢀV

800

30

T_vj= 25°C

T_vj= 125°C

T_vj= 150°C

E_on, T_vj= 125°C

E_off, T_vj= 125°C

E_on, T_vj= 150°C

700

600

500

400

300

200

100

E_off, T_vj= 150°C

25

20

15

10

5

0

5

0

6

7

8

9

10

11

12

0

100

200

300

I_C[A]

400

500

600

V_GE[V]

Final Data Sheet

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FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

switchingꢀlossesꢀIGBT,Inverterꢀ(typical)

E_onꢀ=ꢀfꢀ(R_G),ꢀE_offꢀ=ꢀfꢀ(R_G)

transientꢀthermalꢀimpedanceꢀIGBT,Inverterꢀ

Z_thJCꢀ=ꢀfꢀ(t)

V_GEꢀ=ꢀ±15ꢀV,ꢀI_Cꢀ=ꢀ400ꢀA,ꢀV_CEꢀ=ꢀ300ꢀV

80

1

E_on, T_vj= 125°C

E_off, T_vj= 125°C

Z_thJC: IGBT

E_on, T_vj= 150°C

E_off, T_vj= 150°C

70

60

50

40

30

20

10

0

0,1

0,01

i:

1

2

3

4

r_i[K/W]: 0,01419 0,06479 0,0335 0,00743

τ_i[s]: 0,00036 0,01937 0,03762 0,98695

0,001

0

2

4

6

8

10

12

14

16

18

0,001

0,01

0,1

t [s]

1

10

R_G[Ω]

reverseꢀbiasꢀsafeꢀoperatingꢀareaꢀIGBT,Inverterꢀ(RBSOA)

I_Cꢀ=ꢀfꢀ(V_CE

forwardꢀcharacteristicꢀofꢀDiode,ꢀInverterꢀ(typical)

I_Fꢀ=ꢀfꢀ(V_F)

)

V_GEꢀ=ꢀ±15ꢀV,ꢀR_Goffꢀ=ꢀ1.8ꢀΩ,ꢀT_vjꢀ=ꢀ150°C

900

800

I_C, Modul

T_vj= 25°C

I_C, Chip

T_vj= 125°C

T_vj= 150°C

800

700

600

500

400

300

200

100

0

700

600

500

400

300

200

100

0

100

200

300

400

V_CE[V]

500

600

700

800

0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0

V_F[V]

Final Data Sheet

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FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)

E_recꢀ=ꢀfꢀ(I_F)

switchingꢀlossesꢀDiode,ꢀInverterꢀ(typical)

E_recꢀ=ꢀfꢀ(R_G)

R_Gonꢀ=ꢀ1.8ꢀΩ,ꢀV_CEꢀ=ꢀ300ꢀV

I_Fꢀ=ꢀ400ꢀA,ꢀV_CEꢀ=ꢀ300ꢀV

12

E_rec, T_vj= 125°C

E_rec, T_vj= 150°C

E_rec, T_vj= 125°C

E_rec, T_vj= 150°C

10

8

10

8

6

4

2

0

100

200

300

I_F[A]

400

500

600

0

2

4

6

8

10

12

14

16

18

R_G[Ω]

transientꢀthermalꢀimpedanceꢀDiode,ꢀInverterꢀ

NTC-Thermistor-temperatureꢀcharacteristicꢀ(typical)

Z_thJCꢀ=ꢀfꢀ(t)

Rꢀ=ꢀfꢀ(T)

1

100000

Z_thJC: Diode

R_typ

0,1

10000

1000

100

0,01

i:

1

2

3

4

r_i[K/W]: 0,02989 0,12491 0,03869 0,00643

τ_i[s]: 0,00051 0,01769 0,04823 1,81616

0,001

0,01

0,1

t [s]

1

10

0

20

40

60

80

T_C[°C]

100

120

140

160

Final Data Sheet

8

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HybridPACKªꢀ1ꢀModule

7ꢀꢀꢀꢀꢀCircuitꢀdiagram

J

Final Data Sheet

9

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FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

8ꢀꢀꢀꢀꢀPackageꢀoutlines

Final Data Sheet

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FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

9ꢀꢀꢀꢀꢀLabelꢀCodes

9.1ꢀꢀꢀꢀModuleꢀCode

CodeꢀFormat

Data Matrix

Encoding

ASCII Text

SymbolꢀSize

Standard

16x16

IEC24720 and IEC16022

CodeꢀContent

Content

Digit

Exampleꢀ(below)

Module Serial Number

Module Material Number

Production Order Number

Datecode (Production Year)

Datecode (Production Week)

1 - 5

71549

142846

55054991

15

6 - 11

12 - 19

20 - 21

22 - 23

30

Example

71549142846550549911530

9.2ꢀꢀꢀꢀPackingꢀCode

CodeꢀFormat

Code128

Code Set A

34 digits

Encoding

SymbolꢀSize

Standard

IEC8859-1

CodeꢀContent

Content

Identifier

Digit

Exampleꢀ(below)

Backend Construction Number

Production Lot Number

Serial Number

Date Code

Box Quantity

X

1T

S

9D

Q

2 - 9

95056609

2X0003E0

754389

1139

12 - 19

21 - 25

28 - 31

33 - 34

15

Example

X950566091T2X0003E0S754389D1139Q15

Final Data Sheet

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HybridPACKªꢀ1ꢀModule

RevisionꢀHistory

Major changes since previous revision

Revision History

Reference

V1.0

Date

Description

2014-12-03

2014-12-16

2015-03-30

2016-11-08

2017-09-28

Initial Version

V2.0

preliminary data

V3.0

final datasheet

V3.1

optimization of datasheet format

V3.2

Remove the UL approved (E83335) from "Features / Description"

Final Data Sheet

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FS400R07A1E3_S7

HybridPACKªꢀ1ꢀModule

Termsꢀ&ꢀConditionsꢀofꢀusage

ꢀ

Editionꢀ2014-05-30

Publishedꢀby

InfineonꢀTechnologiesꢀAG

81726ꢀMunich,ꢀGermany

AllꢀRightsꢀReserved.

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Warnings

Dueꢀtoꢀtechnicalꢀrequirements,ꢀcomponentsꢀmayꢀcontainꢀdangerousꢀsubstances.ꢀForꢀinformationꢀonꢀtheꢀtypesꢀinꢀquestion,ꢀpleaseꢀcontactꢀthe

nearestꢀInfineonꢀTechnologiesꢀOffice.

InfineonꢀTechnologiesꢀcomponentsꢀmayꢀbeꢀusedꢀinꢀlife-supportꢀdevicesꢀorꢀsystemsꢀonlyꢀwithꢀtheꢀexpressꢀwrittenꢀapprovalꢀofꢀInfineon

Technologies,ꢀifꢀaꢀfailureꢀofꢀsuchꢀcomponentsꢀcanꢀreasonablyꢀbeꢀexpectedꢀtoꢀcauseꢀtheꢀfailureꢀofꢀthatꢀlife-supportꢀdeviceꢀorꢀsystemꢀorꢀtoꢀaffect

theꢀsafetyꢀorꢀeffectivenessꢀofꢀthatꢀdeviceꢀorꢀsystem.ꢀLifeꢀsupportꢀdevicesꢀorꢀsystemsꢀareꢀintendedꢀtoꢀbeꢀimplantedꢀinꢀtheꢀhumanꢀbodyꢀorꢀto

supportꢀand/orꢀmaintainꢀandꢀsustainꢀand/orꢀprotectꢀhumanꢀlife.ꢀIfꢀtheyꢀfail,ꢀitꢀisꢀreasonableꢀtoꢀassumeꢀthatꢀtheꢀhealthꢀofꢀtheꢀuserꢀorꢀotherꢀpersons

mayꢀbeꢀendangered.

Trademarks

ꢀ

TrademarksꢀofꢀInfineonꢀTechnologiesꢀAG

AURIX™,ꢀC166™,ꢀCanPAK™,ꢀCIPOS™,ꢀCIPURSE™,ꢀEconoPACK™,ꢀCoolMOS™,ꢀCoolSET™,ꢀCORECONTROL™,ꢀCROSSAVE™,ꢀDAVE™,

DI-POL™,ꢀEasyPIM™,ꢀEconoBRIDGE™,ꢀEconoDUAL™,ꢀEconoPIM™,ꢀEconoPACK™,ꢀEiceDRIVER™,ꢀeupec™,ꢀFCOS™,ꢀHITFET™,

HybridPACK™,ꢀI²RF™,ꢀISOFACE™,ꢀIsoPACK™,ꢀMIPAQ™,ꢀModSTACK™,ꢀmy-d™,ꢀNovalithIC™,ꢀOptiMOS™,ꢀORIGA™,ꢀPOWERCODE™,

PRIMARION™,ꢀPrimePACK™,ꢀPrimeSTACK™,ꢀPRO-SIL™,ꢀPROFET™,ꢀRASIC™,ꢀReverSave™,ꢀSatRIC™,ꢀSIEGET™,ꢀSINDRION™,

SIPMOS™,ꢀSmartLEWIS™,ꢀSOLIDꢀFLASH™,ꢀTEMPFET™,ꢀthinQꢁ™,ꢀTRENCHSTOP™,ꢀTriCore™.

OtherꢀTrademarks

AdvanceꢀDesignꢀSystem™ꢀ(ADS)ꢀofꢀAgilentꢀTechnologies,ꢀAMBA™,ꢀARM™,ꢀMULTI-ICE™,ꢀKEIL™,ꢀPRIMECELL™,ꢀREALVIEW™,ꢀTHUMB™,

µVision™ꢀofꢀARMꢀLimited,ꢀUK.ꢀAUTOSAR™ꢀisꢀlicensedꢀbyꢀAUTOSARꢀdevelopmentꢀpartnership.ꢀBluetooth™ꢀofꢀBluetoothꢀSIGꢀInc.ꢀCAT-iq™ꢀof

DECTꢀForum.ꢀCOLOSSUS™,ꢀFirstGPS™ꢀofꢀTrimbleꢀNavigationꢀLtd.ꢀEMV™ꢀofꢀEMVCo,ꢀLLCꢀ(VisaꢀHoldingsꢀInc.).ꢀEPCOS™ꢀofꢀEpcosꢀAG.

FLEXGO™ꢀofꢀMicrosoftꢀCorporation.ꢀFlexRay™ꢀisꢀlicensedꢀbyꢀFlexRayꢀConsortium.ꢀHYPERTERMINAL™ꢀofꢀHilgraeveꢀIncorporated.ꢀIEC™ꢀof

CommissionꢀElectrotechniqueꢀInternationale.ꢀIrDA™ꢀofꢀInfraredꢀDataꢀAssociationꢀCorporation.ꢀISO™ꢀofꢀINTERNATIONALꢀORGANIZATION

FORꢀSTANDARDIZATION.ꢀMATLAB™ꢀofꢀMathWorks,ꢀInc.ꢀMAXIM™ꢀofꢀMaximꢀIntegratedꢀProducts,ꢀInc.ꢀMICROTEC™,ꢀNUCLEUS™ꢀofꢀMentor

GraphicsꢀCorporation.ꢀMIPI™ꢀofꢀMIPIꢀAlliance,ꢀInc.ꢀMIPS™ꢀofꢀMIPSꢀTechnologies,ꢀInc.,ꢀUSA.ꢀmuRata™ꢀofꢀMURATAꢀMANUFACTURINGꢀCO.,

MICROWAVEꢀOFFICE™ꢀ(MWO)ꢀofꢀAppliedꢀWaveꢀResearchꢀInc.,ꢀOmniVision™ꢀofꢀOmniVisionꢀTechnologies,ꢀInc.ꢀOpenwave™ꢀOpenwave

SystemsꢀInc.ꢀREDꢀHAT™ꢀRedꢀHat,ꢀInc.ꢀRFMD™ꢀRFꢀMicroꢀDevices,ꢀInc.ꢀSIRIUS™ꢀofꢀSiriusꢀSatelliteꢀRadioꢀInc.ꢀSOLARIS™ꢀofꢀSun

Microsystems,ꢀInc.ꢀSPANSION™ꢀofꢀSpansionꢀLLCꢀLtd.ꢀSymbian™ꢀofꢀSymbianꢀSoftwareꢀLimited.ꢀTAIYOꢀYUDEN™ꢀofꢀTaiyoꢀYudenꢀCo.

TEAKLITE™ꢀofꢀCEVA,ꢀInc.ꢀTEKTRONIX™ꢀofꢀTektronixꢀInc.ꢀTOKO™ꢀofꢀTOKOꢀKABUSHIKIꢀKAISHAꢀTA.ꢀUNIX™ꢀofꢀX/OpenꢀCompanyꢀLimited.

VERILOG™,ꢀPALLADIUM™ꢀofꢀCadenceꢀDesignꢀSystems,ꢀInc.ꢀVLYNQ™ꢀofꢀTexasꢀInstrumentsꢀIncorporated.ꢀVXWORKS™,ꢀWINDꢀRIVER™ꢀof

WINDꢀRIVERꢀSYSTEMS,ꢀINC.ꢀZETEX™ꢀofꢀDiodesꢀZetexꢀLimited.

Last update

2011-11-11

Final Data Sheet

13

V3.2,ꢀꢀ2017-09-28

wꢀwꢀwꢀ.ꢀiꢀnꢀfꢀiꢀnꢀeꢀoꢀnꢀ.ꢀcꢀoꢀm

PublishedꢀbyꢀInfineonꢀTechnologiesꢀAG


型号：	FS400R07A1E3_S7
厂家：	Infineon
描述：	Flat Baseplate
文件：	总14页 (文件大小：920K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

FS400R07A1E3_S7 [INFINEON]

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