FS820R08A6P2LB [INFINEON]
PinFin Baseplate, Long Tabs;型号: | FS820R08A6P2LB |
厂家: | Infineon |
描述: | PinFin Baseplate, Long Tabs |
文件: | 总16页 (文件大小:7718K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HybridPACK™ꢀDriveꢀModule
FS820R08A6P2LB
FinalꢀDataꢀSheet
V3.4,ꢀ2019-10-09
AutomotiveꢀHighꢀPower
FS820R08A6P2LB
HybridPACK™ꢀDriveꢀModule
1ꢀꢀꢀꢀꢀFeaturesꢀ/ꢀDescription
HybridPACK™ꢀDriveꢀmoduleꢀwithꢀEDT2ꢀIGBTꢀandꢀDiode
T
T
T
VCES = 750 V
IC = 820 A
Typical Applications
Description
• Automotive Applications
• Hybrid Electrical Vehicles (H)EV
• Motor Drives
The HybridPACKTM Drive is a very compact
six-pack module (750V/820A) optimized for hybrid
and electric vehicles. The power module
implements the new EDT2 IGBT generation, which
is an automotive Micro-Pattern Trench-Field-Stop
cell design optimized for electric drive train
applications. The chipset has benchmark current
density combined with short circuit ruggedness and
increased blocking voltage for reliable inverter
operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load
power losses, which helps to improve system
efficiency over a real driving cycle. The EDT2 IGBT
was optimized for applications with switching
frequencies in the range of 10 kHz.
• Commercial Agriculture Vehicles
Electrical Features
• Blocking voltage 750V
• Low VCEsat
• Low Switching Losses
• Low Qg and Crss
• Low Inductive Design
• Tvj op = 150°C
• Short-time extended Operation Temperature
Tvj op = 175°C
The new HybridPACKTM Drive power module family
comes with mechanical guiding elements
supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
solder processes, which provides cost savings on
system level and increases system reliability. The
direct cooled baseplate with PinFin structure in the
FS820R08A6P2LB product best utilizes the
implemented chipset and shows superior thermal
characteristics. Due to the high clearance &
creepage distances, the module family is also well
suited for increased system working voltages and
supports modular inverter approaches.
Mechanical Features
• 4.2kV DC 1sec Insulation
• High Creepage and Clearance Distances
• Compact design
• High Power Density
• Direct Cooled PinFin Base Plate
• Guiding elements for PCB and cooler assembly
• Integrated NTC temperature sensor
• PressFIT Contact Technology
• RoHS compliant
• UL 94 V0 module frame
Product Name
Ordering Code
SP001611366
FS820R08A6P2LB
Final Data Sheet
2
V3.4,ꢀꢀ2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
2
IGBT,Inverter
2.1 Maximum Rated Values
Parameter
Conditions
Symbol
VCES
ICN
Value
750
Unit
V
Collector-emitter voltage
Tvj = 25°C
Implemented collector current
Continuous DC collector current
Repetitive peak collector current
Total power dissipation
820
A
TF = 80°C, Tvj max = 175°C
tP = 1 ms
IC nom
ICRM
4501)
1640
7141)
+/-20
A
A
TF = 75°C, Tvj max = 175°C
Ptot
W
V
Gate-emitter peak voltage
VGES
2.2 Characteristic Values
min. typ. max.
Collector-emitter saturation voltage
IC = 450 A, VGE = 15 V
IC = 450 A, VGE = 15 V
IC = 450 A, VGE = 15 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1.10 1.35
1.15
1.15
VCE sat
V
V
IC = 820 A, VGE = 15 V
IC = 820 A, VGE = 15 V
Tvj = 25°C
Tvj = 175°C
1.30
1.50
Gate threshold voltage
IC = 9.60 mA, VCE = VGE
Tvj = 25°C
Tvj = 175°C
4.90 5.80 6.50
4,10
VGEth
Gate charge
VGE = -8 V ... 15 V, VCE = 400V
QG
RGint
Cies
Coes
Cres
4.40
0.7
µC
Ω
Internal gate resistor
Input capacitance
Tvj = 25°C
Tvj = 25°C
Tvj = 25°C
Tvj = 25°C
f = 1 MHz, VCE = 50 V, VGE = 0 V
f = 1 MHz, VCE = 50 V, VGE = 0 V
f = 1 MHz, VCE = 50 V, VGE = 0 V
80.0
1.00
0.30
nF
nF
nF
Output capacitance
Reverse transfer capacitance
Collector-emitter cut-off current
VCE = 750 V, VGE = 0 V
VCE = 750 V, VGE = 0 V
Tvj = 25°C
Tvj = 175°C
1.0
5
ICES
IGES
td on
mA
nA
Gate-emitter leakage current
VCE = 0 V, VGE = 20 V
Tvj = 25°C
400
Turn-on delay time, inductive load
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGon = 2.4 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.28
0.29
0.30
µs
µs
µs
µs
Rise time, inductive load
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGon = 2.4 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.07
0.08
0.08
tr
Turn-off delay time, inductive load
Fall time, inductive load
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGoff = 5.1 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.94
1.05
1.05
td off
IC = 450 A, VCE = 400 V
VGE = -8 V / +15 V
RGoff = 5.1 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
0.04
0.05
0.06
tf
Turn-on energy loss per pulse
IC = 450 A, VCE = 400 V, LS = 20 nH
VGE = -8 V / +15 V
RGon = 2.4 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
13.5
17.5
18.0
Eon
mJ
di/dt (Tvj 25°C) = 5500 A/µs
di/dt (Tvj 150°C) = 5000 A/µs
Turn-off energy loss per pulse
IC = 450 A, VCE = 400 V, LS = 20 nH
VGE = -8 V / +15 V
RGoff = 5.1 Ω
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
23.5
29.0
30.0
Eoff
mJ
A
dv/dt (Tvj 25°C) = 3100 V/µs
dv/dt (Tvj 150°C) = 2500 V/µs
SC data
VGE ≤ 15 V, VCC = 400 V
VCEmax = VCES -LsCE ·di/dt
tP ≤ 6 µs, Tvj = 25°C
tP ≤ 3 µs, Tvj = 175°C
4800
3900
ISC
Thermal resistance, junction to cooling fluid per IGBT; ∆V/∆t = 10 dm³/min, TF = 75°C
RthJF
0.1202) 0.1402) K/W
Temperature under switching conditions
top continuous
-40
150
1503)
175
for 10s within a period of 30s, occurence maximum 3000
times over lifetime
Tvj op
°C
1) Verified by characterization / design not by test.
2) Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
3) For Tvjop > 150°C: Baseplate temperature has to be limited to 125°C.
Final Data Sheet
3
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
3
Diode, Inverter
3.1 Maximum Rated Values
Parameter
Conditions
Symbol
VRRM
IFN
Value
750
Unit
V
Repetitive peak reverse voltage
Implemented forward current
Continuous DC forward current
Repetitive peak forward current
I²t - value
Tvj = 25°C
820
A
IF
4501)
A
tP = 1 ms
IFRM
1640
A
VR = 0 V, tP = 10 ms, Tvj = 150°C
VR = 0 V, tP = 10 ms, Tvj = 175°C
19000
16000
A²s
A²s
I²t
3.2 Characteristic Values
min. typ. max.
Forward voltage
IF = 450 A, VGE = 0 V
IF = 450 A, VGE = 0 V
IF = 450 A, VGE = 0 V
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
1.45 1.65
1.30
1.25
VF
V
IF = 820 A, VGE = 0 V
IF = 820 A, VGE = 0 V
Tvj = 25°C
Tvj = 175°C
1.70
1.60
Peak reverse recovery current
Recovered charge
IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C) Tvj = 25°C
250
350
370
VR = 400 V
VGE = -8 V
Tvj = 150°C
Tvj = 175°C
IRM
A
IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C) Tvj = 25°C
20.0
40.0
45.0
VR = 400 V
VGE = -8 V
Tvj = 150°C
Tvj = 175°C
Qr
µC
mJ
Reverse recovery energy
IF = 450 A, - diF/dt = 5000 A/µs (Tvj = 150°C) Tvj = 25°C
7.00
13.0
15.0
VR = 400 V
VGE = -8 V
Tvj = 150°C
Tvj = 175°C
Erec
RthJF
Tvj op
Thermal resistance, junction to cooling fluid per diode; ∆V/∆t = 10 dm³/min, TF = 75°C
Temperature under switching conditions top continuous
0.1752) 0.2002) K/W
1503)
-40
150
for 10s within a period of 30s, occurence maximum 3000
times over lifetime
175
°C
4
NTC-Thermistor
min. typ. max.
Parameter
Conditions
Symbol
R25
Value
Unit
kΩ
%
Rated resistance
Deviation of R100
Power dissipation
B-value
TC = 25°C
5.00
TC = 100°C, R100 = 493 Ω
TC = 25°C
∆R/R
P25
-5
5
20.0 mW
R2 = R25 exp [B25/50(1/T2 - 1/(298,15 K))]
R2 = R25 exp [B25/80(1/T2 - 1/(298,15 K))]
R2 = R25 exp [B25/100(1/T2 - 1/(298,15 K))]
B25/50
B25/80
B25/100
3375
3411
3433
K
K
K
B-value
B-value
Specification according to the valid application note.
1) Verified by characterization / design not by test.
2) Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
3) For Tvjop > 150°C: Baseplate temperature has to be limited to 125°C.
Final Data Sheet
4
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
5
Module
Parameter
Conditions
Symbol
VISOL
Value
4.2
Unit
kV
A
Isolation test voltage
RMS, f = 0 Hz, t = 1 sec
TF = 75°C, TCt = 105°C
Maximum RMS module terminal current
Material of module baseplate
Internal isolation
ItRMS
5001)
Cu+Ni2)
3)
basic insulation (class 1, IEC 61140)
Al2O3
Creepage distance
terminal to heatsink
terminal to terminal
9.0
9.0
dCreep
mm
mm
Clearance
terminal to heatsink
terminal to terminal
4.5
4.5
dClear
CTI
Comperative tracking index
> 200
min. typ. max.
Pressure drop in cooling circuit
∆V/∆t = 10.0 dm³/min; TF = 75°C
∆p
644)
mbar
bar
Maximum pressure in cooling circuit
Tbaseplate < 40°C
Tbaseplate > 40°C
(relative pressure)
2.5
2.0
p
Stray inductance module
LsCE
RCC'+EE'
Tstg
8.0
nH
mΩ
°C
Module lead resistance, terminals - chip
Storage temperature
TF = 25 °C, per switch
0.75
-40
125
Mounting torque for modul mounting
Screw M4 baseplate to heatsink
Screw EJOT Delta PCB to frame
1.80 2.00 2.20
0.45 0.50 0.555)
M
G
Nm
g
Weight
730
1) Continous, steady state. Verified by characterization / design not by test.
2) Ni plated Cu baseplate.
3) Improved Al2O3 ceramic.
4) Cooler design and flow direction according to application note AN-HPD-ASSEMBLY. Cooling fluid 50% water / 50% ethylenglycol.
5) EJOT Delta PT WN 5451 30x10. Effective mounting torque according to application note AN-HPD-ASSEMBLY
Final Data Sheet
5
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
6
Characteristics Diagrams
output characteristic IGBT,Inverter (typical)
IC = f (VCE
output characteristic IGBT,Inverter (typical)
IC = f (VCE
)
)
VGE = 15 V
1600
1500
1400
1300
1200
1100
1000
900
Tvj = 150°C
1600
1500
1400
1300
1200
1100
1000
900
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
VGE = 19V
VGE = 17V
VGE = 15V
VGE = 13V
VGE = 11V
VGE = 9V
800
800
700
700
600
600
500
500
400
400
300
300
200
200
100
100
0
0
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2
0,0 0,4 0,8 1,2 1,6 2,0 2,4 2,8 3,2 3,6 4,0
VCE [V]
VCE [V]
transfer characteristic IGBT,Inverter (typical)
switching losses IGBT,Inverter (typical)
Eon = f (IC), Eoff = f (IC),
IC = f (VGE
)
VCE = 20 V
1600
1500
1400
1300
1200
1100
1000
900
VGE = +15 V / -8 V, RGon = 2.4 Ω, RGoff = 5.1 Ω, VCE = 400 V
70
Tvj = 25°C
Tvj = 150°C
Tvj = 175°C
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
60
50
40
30
20
10
0
Eoff, Tvj = 175°C
800
700
600
500
400
300
200
100
0
5
6
7
8
9
10
11
12
0
100 200 300 400 500 600 700 800 900
VGE [V]
IC [A]
Final Data Sheet
6
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
switching losses IGBT,Inverter (typical)
Eon = f (RG), Eoff = f (RG),
transient thermal impedance IGBT,Inverter
ZthJF = f (t), cooler design according to AN-HPD-ASSEMBLY
VGE = +15V / -8V, IC = 450 A, VCE = 400 V
∆V/∆t = 10 dm³/min; Tf = 75°C; 50% water / 50% ethylenglycol
140
1
Eon, Tvj = 150°C
Eoff, Tvj = 150°C
Eon, Tvj = 175°C
ZthJF : IGBT
120
100
80
60
40
20
0
Eoff, Tvj = 175°C
0,1
0,01
i:
1
2
3
4
ri[K/W]: 0,005 0,05 0,065 0,02
τi[s]:
0,001 0,03 0,25 1,5
0,001
0,001
0
2
4
6
8
10 12 14 16 18 20 22 24
0,01
0,1
t [s]
1
10
RG [Ω]
reverse bias safe operating area IGBT,Inverter (RBSOA)
IC = f (VCE
thermal impedance IGBT,Inverter
RthJF = f (∆V/∆t), cooler design according to AN-HPD-Assembly
)
VGE = +15V / -8V, RGoff = 5,1 Ω, Tvj = 175°C
Tf = 75°C; 50% water / 50% ethylenglycol
1700
1600
1500
1400
1300
1200
1100
1000
900
0,152
RthJF: IGBT
0,150
0,148
0,146
0,144
0,142
0,140
0,138
0,136
0,134
800
700
600
500
400
300
200
100
0
IC, Modul
IC, Chip
0
100
200
300
400
VCE [V]
500
600
700
800
4
5
6
7
8
9
10
11
12
13
14
∆V/∆t [dm³/min]
Final Data Sheet
7
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
capacity characteristic IGBT,Inverter (typical)
C = f(VCE
gate charge characteristic IGBT,Inverter (typical)
VGE = f(QG)
)
VGE = 0 V, Tvj = 25°C, f = 1MHz
VCE = 400 V, IC = 450 A, Tvj = 25°C
100
15
QG
Cies
Coes
Cres
12
9
10
6
3
0
1
-3
-6
-9
0,1
0
100
200
300
400
500
0
1
2
3
4
5
VCE [V]
QG [µC]
maximum allowed collector-emitter voltage
VCES = f(Tvj), verified by characterization / design not by test
forward characteristic of Diode, Inverter (typical)
IF = f (VF)
ICES = 1 mA for Tvj ≤ 25°C; ICES = 30 mA for Tvj > 25°C
800
1600
VCES
Tvj = 25°C
Tvj = 150°C
1500
Tvj = 175°C
1400
775
750
725
700
675
650
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
-50 -25
0
25
50
75 100 125 150 175 200
Tvj [°C]
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 2,2
VF [V]
Final Data Sheet
8
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
switching losses Diode, Inverter (typical)
Erec = f (IF),
switching losses Diode, Inverter (typical)
Erec = f (RG),
RGon = 2.4 Ω, VCE = 400 V
IF = 450 A, VCE = 400 V
22
20
18
16
14
12
10
8
Erec, Tvj = 150°C
Erec, Tvj = 175°C
Erec, Tvj = 150°C
Erec, Tvj = 175°C
20
18
16
14
12
10
8
6
6
4
4
2
2
0
0
0
100 200 300 400 500 600 700 800 900
IF [A]
0
2
4
6
8
10 12 14 16 18 20 22 24
RG [Ω]
transient thermal impedance Diode, Inverter
thermal impedance Diode, Inverter
ZthJF = f (t), cooler design according to AN-HPD-ASSEMBLY
∆V/∆t = 10 dm³/min; Tf = 75°C; 50% water / 50% ethylenglycol
RthJF = f (∆V/∆t), cooler design according to AN-HPD-ASSEMBLY
Tf = 75°C; 50% water / 50% ethylenglycol
1
0,214
ZthJC : Diode
RthJF: Diode
0,212
0,210
0,208
0,206
0,204
0,202
0,200
0,198
0,196
0,194
0,1
0,01
i:
1
2
3
4
ri[K/W]: 0,015 0,1 0,065 0,02
τi[s]:
0,001 0,03 0,25 1,5
0,001
0,001
0,01
0,1
t [s]
1
10
4
5
6
7
8
9
10
11
12
13
14
∆V/∆t [dm³/min]
Final Data Sheet
9
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
NTC-Thermistor-temperature characteristic (typical)
R = f (T)
pressure drop in cooling circuit
∆p = f (∆V/∆t), cooler design according to AN-HPD-ASSEMBLY
Tf = 75°C; 50% water / 50% ethylenglycol
100000
120
Rtyp
∆p: Modul
100
80
60
40
20
0
10000
1000
100
0
20
40
60
80
TC [°C]
100
120
140
160
4
5
6
7
8
9
10
11
12
13
14
∆V/∆t [dm³/min]
Final Data Sheet
10
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
7
Circuit diagram
P1
P2
P3
T1
T
C1
C3
C5
T2
G1
E1
G3
E3
G5
E5
T3
U
V
W
T
C2
C4
C6
T4
T5
G2
E2
G4
E4
G6
E6
T
T6
N1
N2
N3
Final Data Sheet
11
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
8
Package outlines
o5,3c0,15~
q0,6 FG
q1,6 BC
6x(N1-N3;P1-P3)
B
A
m
F
G
14c0,2
6x
q5,5c0,1
D
6x
16c0,2
6x
1c0,15
22,25c0,4
16,25
9,75c0,4
6x
q0,5 DE
q1,6 BC
A
m
Y
B
N2
P2
P1
N1
N3
P3
5c0,4
8x
X
0
15,5c0,5
0
0
D
E4 G4
C4
E2 G2
C2
E6 G6
C6
4c0,3
+
-
0
0,2
6
T3
T4
T1
T5
T6
6,35c0,5
T2
G5
E5
G1E1
G3 E3
66,5c0,5
C1
C3
C5
A
82
87c0,4
90,75c0,4
82
U
W
V
C
C
E
1c0,15
3x
3x
114,25
120,25c0,4
q5,5c0,1
0,6 H I
1,6 BC
14c0,2
3x
A
m
H
3x(U;V;W)
I
B
D2
D3
D4
X-Y ( 1 : 1 )
8x
9,3c0,2
L
8x
Y
N2
P2
N3
N1
P1
P3
q0,8 LM
A
D1
m
0
q1,6 BC
A
M
8
f 0,3 CZ
X
6x common zones
D1-D2
D2-D3
18,85
E4
E2 G2
C4
G4
G6
C2
C6
E6
dimensioned for
EJOT Delta PT
WN5451 30 x
K
J
Z
D3-D4
D8-D7
D7-D6
D6-D5
origin axis generated by
C2;E2;G2;C4;E4;G4;C6;E6;G6
51,85
59,35
T1
T3
T4
T5
T6
T2
G1 E1
G3 E3
G5
E5
67,15
69,85
74,1
82
C1
C3
C5
+
0,4
3,94
-
0,5
refers
to lokal CZ
U
V
W
C
D5
D7
D8
D6
(19,75)
Z ( 1,5 : 1 )
Drawing: D00099554_03
q ** KJ
A
edges
general toler
1. DIN
surface
DIN EN ISO
1302
m
q ** BC
DIN ISO 13715
16742-TG4
2. DIN ISO
2768-mK
24x
C2
E2G2
** Pin position
checked with pin gauge
according to Application
Note AN-HPD_ASSEMBLY
All dimensions refer to module in
delivery condition
Final Data Sheet
12
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
9
Label Codes
9.1 Module Code
Code Format
Data Matrix
Encoding
ASCII Text
Symbol Size
Standard
16x16
IEC24720 and IEC16022
Code Content
Content
Digit
1 - 5
6 - 11
12 - 19
20 - 21
22 - 23
Example (below)
71549
142846
55054991
15
Module Serial Number
Module Material Number
Production Order Number
Datecode (Production Year)
Datecode (Production Week)
30
Example
71549142846550549911530
9.2 Packing Code
Code Format
Code128
Code Set A
34 digits
Encoding
Symbol Size
Standard
IEC8859-1
Code Content
Content
Identifier
X
1T
S
9D
Q
Digit
2 - 9
12 - 19
21 - 25
28 - 31
33 - 34
Example (below)
95056609
2X0003E0
754389
1139
15
Backend Construction Number
Production Lot Number
Serial Number
Date Code
Box Quantity
Example
X950566091T2X0003E0S754389D1139Q15
Final Data Sheet
13
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
Revision History
Major changes since previous revision
Revision History
Reference
V3.0
Date
Description
2017-03-23
2019-06-18
2019-06-26
2019-07-10
2019-10-09
Final datasheet
V3.1
Adjustment of package outlines
Adjustment of package outlines
V3.2
V3.3
Adjustment of package outlines; Correction of typing errors.
Adjustment of package outlines. Correction of typing errors.
V3.4
Final Data Sheet
14
V3.4, 2019-10-09
FS820R08A6P2LB
HybridPACK™ Drive Module
Terms & Conditions of usage
Edition 2018-08-01
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2018 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any
examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon
Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office
(http://www.infineon.com)
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the
nearest Infineon Technologies Office.
These components are not designed for “special applications” that demand extremely high reliability or safety such as aerospace, defense or life
support devices or systems (Class III medical devices). If you intend to use the components in any of these special applications, please contact
your local representative at International Rectifier HiRel Products, Inc. or the Infineon support (https://www.infineon.com/support) to review
product requirements and reliability testing.
Infineon Technologies components may be used in special applications only with the express written approval of Infineon Technologies. Class
III medical devices are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they
fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Trademarks
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™,
DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™,
HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, POWERCODE™,
PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™,
SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™,
µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of
DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of
Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION
FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor
Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO.,
MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave
Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun
Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited.
VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of
WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Last update
2011-11-11
Final Data Sheet
15
V3.4, 2019-10-09
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
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