HFA60MB60CPBF [INFINEON]
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| 型号： | HFA60MB60CPBF |
| 厂家： | 
Infineon |
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PD -2.462 rev. A 03/99
HFA60MB60C
Ultrafast, Soft Recovery Diode
VR = 600V
HEXFREDTM
(ISOLATED BASE)
Features
Reduced RFI and EMI
Reduced Snubbing
VF(typ.) = 1.1V
IF(AV) = 60A
Extensive Characterization of
Recovery Parameters
Qrr (typ.) = 200nC
IRRM(typ.)= 6A
(4-6)
(1-3)
(7-9)
trr(typ.) = 30ns
ANODE COMMON ANODE
CATHODE
1
2
di(rec)M/dt (typ.) = 170A/µs
Description
HEXFREDTM diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
A
D-60
(MODIFIED T0-249AA)
Absolute Maximum Ratings (per Leg)
Parameter
Max.
Units
VR
Cathode-to-Anode Voltage
600
V
IF @ TC = 25°C
IF @ TC = 100°C
IFSM
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current
Non-Repetitive Avalanche Energy
Maximum Power Dissipation
50
24
A
200
220
125
EAS
µJ
W
PD @ TC = 25°C
PD @ TC = 100°C
Maximum Power Dissipation
Operating Junction and
50
TJ
-55 to +150
TSTG
Storage Temperature Range
Soldering Temperature, for 10 sec.
°C
300 (0.063 in. (1.6mm) from case)
Thermal - Mechanical Characteristics
Parameter
Min.
Typ.
Max.
1.0
Units
RθJC
Junction-to-Case, Single Leg Conducting
Junction-to-Case, Both Legs Conducting
Case-to-Sink, Flat, Greased Surface
Weight
°C/W
K/W
0.50
RθCS
Wt
0.10
58 (2.0)
g (oz)
lbfin
(Nm)
Mounting Torque
35 (4.0)
50 (5.7)
Note: Limited by junction temperature
L = 100µH, duty cycle limited by max TJ
125°C
1
HFA60MB60C
PD-2.462 rev. A 03/99
Electrical Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Test Conditions
VBR
VFM
Cathode Anode Breakdown Voltage
600
1.3 1.5
1.4 1.7
1.1 1.3
V
IR = 100µA
Max Forward Voltage
IF = 30A
See Fig. 1
V
IF = 60A
IF = 30A, TJ = 125°C
IRM
Max Reverse Leakage Current
2.0
10
µA VR = VR Rated
mA TJ = 125°C, VR = 480V
See Fig. 2
See Fig. 3
0.50 2.0
68 100
9.2
CT
LS
Junction Capacitance
Series Inductance
pF
VR = 200V
nH
Lead to lead 5mm from package body
Dynamic Recovery Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Test Conditions
trr
Reverse Recovery Time
30
IF = 1.0A, di /dt = 200A/µs, VR = 30V
f
trr1
trr2
67 100
112 170
6.0 11
9.0 16
200 550
500 1400
250
170
ns TJ = 25°C
See
TJ = 125°C Fig. 5
TJ = 25°C See
TJ = 125°C Fig. 6
TJ = 25°C See
TJ = 125°C Fig. 7 di /dt = 200A/µs
IF = 50A
IRRM1
IRRM2
Qrr1
Qrr2
Peak Recovery Current
A
VR = 200V
Reverse Recovery Charge
nC
f
di(rec)M/dt1 Peak Rate of Fall of Recovery Current
di(rec)M/dt2 During tb
TJ = 25°C
TJ = 125°C Fig. 8
See
A/µs
4.95 (0.195)
DIA.
50.80 (2.000)
REF.
6.60 (0.260)
6.10 (0.240)
4.45 (0.175)
(4 PLCS.)
25.65 (1.010)
25.15 (0.990)
12.70 (0.500)
REF.
LEAD ASSIGNMENTS
1-3 ANODE
1
9
4-6 CATHODE
7-9 ANODE
BASE (ISOLATED)
1.14 (0.045)
0.76 (0.030)
13.21 (0.520)
12.70 (0.500)
3.93 (0.155)
3.68 (0.145)
(8 PLCS.)
1.14 (0.045)
0.89 (0.035)
(9 PLCS.)
A
*
*
Outline D-60 (Modfied JEDEC TO - 249AA)
Dimensions in millimeters and inches
PRE-SOLDER DIP DIMENSIONS
38.35 (1.510)
37.85 (1.490)
*
1.14 (0.045)
0.89 (0.035)
10.16 (0.400)
8.38 (0.330)
1.27 (0.050)
REF.
6.60 (0.260)
6.10 (0.240)
3.30 (0.130)
3.05 (0.120)
61.21 (2.410)
60.71 (2.390)
2
HFA60MB60C
PD-2.462 rev. A 03/99
10000
1000
100
10
1000
100
10
T = 150°C
J
T = 125°C
J
1
0.1
T = 25°C
J
0.01
T = 150°C
0
200
400
600
J
Reverse Voltage - V (V)
R
T = 125°C
J
Fig. 2 - Typical Reverse Current vs. Reverse
T = 25°C
Voltage, (per Leg)
J
A
1000
T = 25°C
J
100
1
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Forward Voltage Drop - V
(V)
FM
10
Fig. 1 - Maximum Forward Voltage Drop
vs. Instantaneous Forward Current,
(per Leg)
1
10
100
1000
Reverse Voltage - V (V)
R
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage, (per Leg)
10
1
D = 0.50
D = 0.33
D = 0.25
D = 0.17
P
DM
0.1
D = 0.08
t
1
t
2
Notes:
1. Duty factor D = t / t
0.01
Single Pulse
(Thermal Resistance)
1
2
2. Peak T = P
DM
x Z
+ T
thJC C
J
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
t1, Rectangular Pulse Duration (Seconds)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics, (per Leg)
3
HFA60MB60C
PD-2.462 rev. A 03/99
150
40
30
20
10
0
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
120
I
= 70A
F
I
= 30A
I
= 70A
F
F
90
I
= 15A
F
I
= 30A
F
I
= 15A
F
60
30
100
1000
100
1000
di /dt - (A/µs)
f
di /dt - (A/µs)
f
Fig. 5 - Typical Reverse Recovery vs. dif/dt,
Fig. 6 - Typical Recovery Current vs. dif/dt,
(per Leg)
(per Leg)
10000
1600
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
1200
I
= 15A
F
1000
100
10
I
= 70A
F
I
= 30A
F
I
= 30A
F
I
= 70A
F
800
400
0
I
= 15A
F
100
1000
100
1000
di /dt - (A/µs)
di /dt - (A/µs)
f
f
Fig. 7 - Typical Stored Charge vs. dif/dt,
Fig. 8 - Typical di(rec)M/dt vs. dif/dt,
(per Leg)
(per Leg)
4
HFA60MB60C
PD-2.462 rev. A 03/99
3
t
rr
I
F
t
t
a
b
0
REVERSE RECOVERY CIRCUIT
4
Q
rr
V
= 200V
2
R
I
0.5 I
RRM
RRM
5
di(rec)M/dt
Ω
0.01
0.75 I
RRM
L = 70µH
1
di /dt
f
D.U.T.
4. Qrr - Area under curve defined by trr
1. dif/dt - Rate of change of current
through zero crossing
D
and IRRM
dif/dt
trr X IRRM
ADJUST
IRFP250
G
Q
=
2. IRRM - Peak reverse recovery current
rr
2
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
S
5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and
Fig. 9 - Reverse Recovery Parameter Test
Definitions
Circuit
I
L = 100µH
L(PK)
HIGH-SPEED
SWITCH
DUT
FREE-WHEEL
DIODE
Rg = 25 ohm
+
CURRENT
MONITOR
DECAY
TIME
Vd = 50V
V
(AVAL)
V
R(RATED)
Fig. 11 - Avalanche Test Circuit and Waveforms
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Data and specifications subject to change without notice.
5
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