概述
数据手册HYB39T256800TCL-5 概述
MEMORY SPECTRUM MEMORY谱
HYB39T256800TCL-5 数据手册
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PDF下载Product Information 2004
M E M O R Y S P E C T R U M
w w w. i n f i n e o n . c o m / m e m o r y
w w w. i n f i n e o n . c o m / m e m o r y / f l a s h
N e v e r s t o p t h i n k i n g .
I n t r o d u c t i o n
A P R I L 2 0 0 4 . Th isedition of Memory Spectrum has been developed
to enable you to easily view the entire range of Infineon’s memory products.
For more related product information and the latest datasheets, please visit
our websites: www.infineon.com/memory and www.infineon.com/memory/flash.
DDR400 Components and DIMMs (PC3200)
2 GB DDR2 Unbuffered DIMM
4 GB DDR2 Registered DIMM
16 Mb and 32 Mb CellularRAM
512 Mb Mobile-RAM
Technology and Trends
As a leading memory products
supplier, Infineon continues to
expand its portfolio with the
recent introduction of:
“Green**”, DRAM Components and Modules
512 Mb and 1 Gb TwinNAND Components
SD Cards/MultiMediaCards
** Lead & Halogen-Free
DRAM Components
Double Data Rate (DDR / DDR2)
and Single Data Rate (SDR).
Synchronous Dynamic Random
Access Memory.
16 Mb
32 Mb
128 Mb
256 Mb
512 Mb
1 Gb
DDR DRAMs
DDR2 DRAMs
SDR DRAMs
Reduced Latency (RLDRAM )
Graphics RAM
+
+
+
+
+
+
+
+
+
+
+
+
™
+
+
Mobile-RAM
+
™
CellularRAM
+
+
64 MB 128 MB 256 MB 512 MB
1 GB
+
2 GB
4 GB
DRAM Modules
Double Data Rate (DDR / DDR2),
Dual Inline Memory Modules
(DIMMs).
Unbuffered DDR
Registered DDR
Registered DDR Reduced Height
SO-DIMM DDR
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
+
DDR2
DDR2
Unbuffered
Registered
+
+
+
+
SO-DIMM DDR2
64 MB 128 MB 256 MB 512 MB
1 GB
2 GB
4 GB
Single Data Rate (SDR), Dual Inline
Memory Modules (DIMMs).
Unbuffered SDR
Registered SDR
SO-DIMM SDR
+
+
+
+
+
+
+
+
+
+
64 Mb 128 Mb 256 Mb 512 Mb
1 Gb
2 Gb
2 GB
4 Gb
4 GB
Flash Components
™
Thin Small Outline Package (TSOP).
TwinFlash
+
+
64 MB 128 MB 256 MB 512 MB
1 GB
Flash Cards
MultiMediaCards
SD Cards
+
+
+
+
+
+
MultiMediaCards and SD Cards.
™
RLDRAM™ and CellularRAM™ are registered trademarks of Infineon Technologies AG. TwinFlash is
a trademark of Infineon Technologies AG, based on Saifun NROM technology.
2
C o n t e n t
4 – 8
5 – 6
DRAM Components
DDR Components
DDR2 Components
SDR Components
7
8
9 – 20
DRAM Modules
DDR Modules
10 – 14
DDR2 Modules
SDR Modules
15 – 17
18 – 20
21 – 24
25 – 26
Specialty DRAMs
Flash
3
D R A M C o m p o n e n t s
Nomenclature DRAM Components
HYB 25
D
128
80
0
C
T
- 6
(Example)
Speed/Performance
3
3.7
5
6
7
7F
7.5
8
=
=
=
=
=
=
=
=
DDR2-667 4-4-4
DDR2-533 4-4-4
(DDR2)
(DDR2)
DDR2-400 3-3-3/DDR400B 3-3-3
DDR333 2.5-3-3/PC166 3-3-3
DDR266A 2-3-3/PC133 2-2-2
DDR266 2-2-2
DDR266B 2.5-3-3/PC133 3-3-3
DDR200 2-2-2/PC100 2-2-2
(DDR2/DDR)
(DDR/SDR)
(DDR/SDR)
(DDR)
(DDR/SDR)
(DDR/SDR)
Power
none =
Standard Power
L
=
Low-Power Product
Package
C
T
E
F
=
=
=
=
=
FBGA
Contains Lead
Contains Lead
Lead and Halogen-Free (ROHS*-compliant)
Lead and Halogen-Free (ROHS*-compliant)
Lead and Halogen-Free (ROHS*-compliant)
TSOP 400 mil
TSOP 400 mil
FBGA
G
TSOP stack
Product Revision
Product Variation
Organization
Die Revision
0
=
Standard Product
40
80
16
=
=
=
x 4
x 8
x 16
Memory Density
128
256
512
1G
=
=
=
=
128 Mb
256 Mb
512 Mb
1024 Mb
Memory Type
Supply Voltage
Prefix
S
D
T
=
=
=
SDR
DDR
DDR2
Single Data Rate SDRAM
Double Data Rate SDRAM
Double Data Rate 2 SDRAM
39
25
18
=
=
=
3.3V
2.5V
1.8V
HYB
=
Memory Components
*ROHS = Restriction Of Hazardous Substances
4
DDR Components
Generation Organization
Package
Speed
Latency
2-3-3
Sales Description Speed No. Ordering Code
Prod.
Now
Green
XX
128 Mb
DDR266A
DDR333
DDR266A
DDR333
HYB25D128400AT-
HYB25D128400CE-
HYB25D128800AT-
HYB25D128800CE-
7
6
7
6
Q67100 Q4309
Q67100 Q1455
Q67100 Q4311
Q67100 Q1459
32 M x 4
16 M x 8
TSOP-66 (400 mil)
TSOP-66 (400 mil)
2.5-3-3
2-3-3
2Q04
Now
2.5-3-3
2Q04
XX
DDR266A
DDR333
DDR333
2-3-3
7
6
Q67100 Q4313
Q67100 Q5044
Q67100 Q1458
HYB25D128160AT-
HYB25D128160CE-
Now
8 M x 16
64 M x 4
TSOP-66 (400 mil)
TSOP-66 (400 mil)
2.5-3-3
2.5-3-3
6
2Q04
XX
XX
256 Mb
DDR266A
DDR266
DDR266A
DDR333
DDR400
DDR333
DDR333
DDR400
DDR266A
DDR333
2-3-3
2-2-2
7
7F
7
Q67100 Q4587
Q67100 Q4880
Q67100 Q5049
Q67100 Q4589
Q67100 Q4275
HYB25D256400BT-
HYB25D256400CE-
HYB25D256800BT-
Now
Now
Now
2-3-3
2.5-3-3
3-3-3
6
5
32 M x 8
TSOP-66 (400 mil)
2.5-3-3
2.5-3-3
3-3-3
HYB25D256800CE-
HYB25D256800CEL-
HYB25D256800CE-
6
6
5
7
6
Q67100 Q5051
Q67100 Q1753
Q67100 Q5180
Q67100 Q4593
Q67100 Q4592
Now
Now
Now
XX
XX
XX
2-3-3
2.5-3-3
HYB25D256160BT-
HYB25D256160CE-
Now
16 M x 16
TSOP-66 (400 mil)
DDR400
DDR333
DDR400
3-3-3
2.5-3-3
3-3-3
5
6
5
Q67100 Q4277
Q67100 Q5045
Q67100 Q5182
Now
Now
XX
XX
256 Mb
FBGA
DDR266A
DDR333
DDR400
DDR333
DDR400
2-3-3
2.5-3-3
3-3-3
7
6
5
6
5
Q67100 Q4615
Q67100 Q4614
Q67100 Q1071
Q67100 Q4764
Q67100 Q1418
HYB25D256400BC-
HYB25D256400CC-
Now
64 M x 4
FBGA 60 (8 x 12 mm)
2.5-3-3
3-3-3
2Q04
DDR266A
DDR333
DDR333
DDR333
DDR400
DDR266A
DDR333
2-3-3
2.5-3-3
2.5-3-3
2.5-3-3
3-3-3
7
6
6
6
5
7
6
Q67100 Q4596
Q67100 Q4595
Q67100 Q4443
Q67100 Q4767
Q67100 Q1419
Q67100 Q4599
Q67100 Q4598
HYB25D256800BC-
HYB25D256800CF-
HYB25D256800CC-
Now
2Q04
2Q04
32 M x 8
16 M x 16
FBGA 60 (8 x 12 mm)
FBGA 60 (8 x 12 mm)
XX
2-3-3
HYB25D256160BC-
HYB25D256160CC-
Now
2.5-3-3
DDR333
2.5-3-3
6
Q67100 Q4770
2Q04
XX = Lead and Halogen-Free
5
DDR Components
Generation Organization
Package
TSOP-66 (400 mil)
256 M x 4 TSOP stack (400 mil)
Speed
Latency
2-3-3
Sales Description Speed No. Ordering Code
Prod.
Now
Green
XX
512 Mb
HYB25D512400AT-
HYB25D512400BE-
7
7
Q67100 Q4413
Q67100 Q5202
DDR266A
128 M x 4
Now
Now
Now
DDR266A
DDR266A
DDR333
DDR333
DDR400
DDR266A
DDR333
DDR333
DDR400
2-3-3
2-3-3
HYB25D1G400BG-
HYB25D512800AT-
7
7
6
6
5
7
6
6
5
On request
Q67100 Q4412
Q67100 Q4415
Q67100 Q5205
Q67100 Q5204
Q67100 Q4411
Q67100 Q4416
Q67100 Q5209
Q67100 Q5208
2.5-3-3
2.5-3-3
3-3-3
64 M x 8
TSOP-66 (400 mil)
HYB25D512800BE-
XX
XX
2-3-3
HYB25D512160AT-
HYB25D512160AT-
Now
Now
2.5-3-3
2.5-3-3
3-3-3
32 M x 16
TSOP-66 (400 mil)
HYB25D512160BE-
HYB25D512400BC-
Now
Now
512 Mb
FBGA
DDR333
DDR400
DDR333
DDR333
DDR400
DDR400
DDR333
DDR400
2.5-3-3
3-3-3
6
5
6
6
5
5
6
5
Q67100 Q1661
Q67100 Q1693
Q67100 Q1663
Q67100 Q5215
Q67100 Q1451
Q67100 Q1452
Q67100 Q1453
Q67100 Q1454
128 M x 4 FBGA 60 (10x12 mm)
2.5-3-3
2.5-3-3
3-3-3
HYB25D512800BC-
HYB25D512800BF-
HYB25D512800BC-
HYB25D512800BF-
Now
Now
Now
Now
XX
XX
64 M x 8
FBGA 60 (10x12 mm)
3-3-3
2.5-3-3
3-3-3
32 M x 16 FBGA 60 (10x12 mm)
HYB25D512160BC-
Now
XX = Lead and Halogen-Free
6
DDR2 Components
Generation Organization
Package
Speed
Latency
3-3-3
4-4-4
3-3-3
4-4-4
3-3-3
4-4-4
Sales Description Speed No. Ordering Code
Production Green
256 Mb
DDR2 400
DDR2 533
DDR2 400
DDR2 533
DDR2 400
DDR2 533
5
3.7
5
Q67100 Q1314
Q67100 Q1311
Q67100 Q1322
Q67100 Q1320
Q67100 Q1301
Q67100 Q1293
64 M x 4
32 M x 8
16 M x 16
PTFBGA-60
PTFBGA-60
PTFBGA-84
HYB18T256400AC-
HYB18T256800AC-
HYB18T256160AC-
3Q04
3.7
5
3.7
512 Mb
DDR2 400
DDR2 533
DDR2 400
DDR2 533
DDR2 400
DDR2 533
3-3-3
4-4-4
3-3-3
4-4-4
3-3-3
4-4-4
5
3.7
5
Q67100 Q1350
Q67100 Q1349
Q67100 Q1354
Q67100 Q1352
Q67100 Q1347
Q67100 Q1346
128 M x 4
64 M x 8
32 M x 16
PTFBGA-60
PTFBGA-60
PTFBGA-84
HYB18T512400AC-
HYB18T512800AC-
HYB18T512160AC-
2Q04
3.7
5
3.7
1Gb
DDR2 400
DDR2 533
DDR2 400
DDR2 533
DDR2 400
DDR2 533
3-3-3
4-4-4
3-3-3
4-4-4
3-3-3
4-4-4
5
3.7
5
Q67100 Q1619
Q67100 Q1618
Q67100 Q1622
Q67100 Q1621
Q67100 Q1625
Q67100 Q1624
256 M x 4
128 M x 8
64 M x 16
PTFBGA-68
PTFBGA-68
PTFBGA-92
HYB18T1G400AC-
HYB18T1G800AC-
HYB18T1G160AC-
3Q04
3.7
5
3.7
7
SDR Components
Generation Organization
Package
Speed
PC133
PC133
PC133
Latency
2-2-2
2-2-2
2-2-2
Sales Description Speed No. Ordering Code
Production Green
Now
128 Mb
32 M x 4
16 M x 8
8 M x 16
TSOP-54 (400 mil)
TSOP-54 (400 mil)
TSOP-54 (400 mil)
HYB39S128400CT-
HYB39S128800CT-
HYB39S128160CT-
7
7
7
Q67100 Q4101
Q67100 Q4107
Q67100 Q4113
256 Mb
64 M x 4
32 M x 8
16 M x 16
TSOP-54 (400 mil)
TSOP-54 (400 mil)
TSOP-54 (400 mil)
PC133
PC133
PC133
2-2-2
2-2-2
2-2-2
HYB39S256400DT-
HYB39S256800DT-
HYB39S256160DT-
7
7
7
Q67100 Q4330
Q67100 Q4332
Q67100 Q4334
Now
Now
256 Mb
FBGA
64 M x 4
32 M x 8
16 M x 16
FBGA-54 (8x12 mm)
FBGA-54 (8x12 mm)
FBGA-54 (8x12 mm)
PC133
PC133
PC133
2-2-2
2-2-2
2-2-2
HYB39S256400DC-
HYB39S256800DC-
HYB39S256160DC-
7
7
7
Q67100 Q4772
Q67100 Q4774
Q67100 Q4808
512 Mb
128 M x 4
64 M x 8
32 M x 16
TSOP-54 (400 mil)
TSOP-54 (400 mil)
TSOP-54 (400 mil)
PC133
PC133
PC133
3-3-3
3-3-3
3-3-3
HYB39S512400AT-
HYB39S512800AT-
HYB39S512160AT-
7.5
7.5
7.5
Q67100 Q4404
Q67100 Q4403
Q67100 Q4402
Now
8
D R A M M o d u l e s
Nomenclature DDR/DDR2 Modules
Unbuffered DIMM, Registered DIMM (184-pin) and SO-DIMM (200-pin)
HYS 64
D
32
2
2
0
G
D
L
- 6 - A
(Example)
Part Number
Extension
Component Die Revision Indicator
Speed
8
7.5
7
7F
6
5
=
=
=
=
=
=
=
=
PC1600 2-2-2
PC2100 2.5-3-3
PC2100 2-3-3
DDR200
DDR266B
DDR266A
DDR266
DDR333
DDR400 / DDR2-400
DDR2-533
DDR2-667
PC2100 2-2-2
PC2700 2.5-3-3
PC3200 3-3-3 / PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-5300 4-4-4
3.7
3
Power
L
=
Low Power
none =
Standard Power
Module Family
U
R
D
BD
BR
=
=
=
=
=
Unbuffered DIMM TSOP-based for DDR / FBGA-based for DDR2
Registered DIMM TSOP-based for DDR / FBGA-based for DDR2
SO-DIMM
SO-DIMM
TSOP-based for DDR / FBGA-based for DDR2
FBGA-based
Registered DIMM FBGA-based
Package Type
Designator
G
H
E
=
=
=
Contains Lead
Lead-Free (ROHS*-compliant)
Lead and Halogen-Free available on request (ROHS*-compliant)
Product Variations
Number of
Memory Ranks
0
2
=
=
One Memory Module Rank
Two Memory Module Ranks
Designator
Data Sheet Defined
Memory Density
per DQ
16
32
64
128
256
=
=
=
=
=
16 Mb
32 Mb
64 Mb
128 Mb
256 Mb
Power Supply
D
T
=
=
2.5 V (DDR Modules)
1.8 V (DDR2 Modules)
Data
Width64
=
x 64
(Non-ECC)
72
=
=
x 72 (ECC)
Prefix
HYS
Standard Prefix for SDRAM-based Memory Modules
*ROHS = Restriction Of Hazardous Substances
9
DDR Modules
Unbuffered DDR DIMM – 184-pin
Compo.
Module
Density
Organi-
zation
Genera-
tion
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod. Green
Organization
Description
128 MB
PC2700
PC3200
PC2700
PC3200
6-B Q67100 Q4940
5-B Q67100 Q5136
6-C Q67100 Q1448
5-C Q67100 Q1754
Now
HYS64D16301GU-
16 M x 64 256 M 16 M x 16 TSOP
1
1
1.25"
1.25"
PC2700
PC3200
6-C Q67100 Q4995
5-C Q67100 Q5188
HYS64D16301HU-
Now
X
128MB ECC 16 M x 72 128 M
16 M x 8 TSOP
PC2100 HYS72D16000GU- 7-A Q67100 Q4367 Now
256 MB
PC2100 HYS64D32000GU- 7-B Q67100 Q4517 Now
PC2700
PC3200
PC2700
PC3200
PC2700
PC3200
6-B Q67100 Q4944
5-B Q67100 Q5081
6-C Q67100 Q5184
5-C Q67100 Q1755
6-C Q67100 Q4996
5-C Q67100 Q5189
HYS64D32300GU-
Now
32 M x 64 256 M 32 M x 8 TSOP
1
1.25"
Now
Now
X
HYS64D32300HU-
HYS72D32000GU-
PC2100
PC2100-222
PC2700
PC3200
PC2700
PC3200
PC2700
PC3200
7-B Q67100 Q4519
7F-B Q67100 Q5029
6-B Q67100 Q4946
5-B Q67100 Q4957
6-C Q67100 Q1768
5-C Q67100 Q1756
6-C Q67100 Q4998
5-C Q67100 Q5191
256MB ECC
32 M x 72 256 M 32 M x 8 TSOP
1
1.25"
HYS72D32300GU-
HYS72D32300HU-
Now
Now
X
X
X
512 MB
PC2100 HYS64D64020GU- 7-B Q67100 Q4521 Now
PC2700
PC3200
PC2700
PC3200
PC2700
PC3200
6-B Q67100 Q4948
5-B Q67100 Q5084
6-C Q67100 Q1449
5-C Q67100 Q1761
6-C Q67100 Q5001
5-C Q67100 Q5190
HYS64D64320GU-
Now
64 M x 64 256 M 32 M x 8 TSOP
2
1.25"
HYS64D64320HU-
HYS72D64020GU-
Now
Now
PC2100
7-B Q67100 Q4525
7F-B Q67100 Q5030
512MB ECC
PC2100-222
PC2700
PC3200
PC2700
PC3200
PC2700
PC3200
6-B Q67100 Q4950
5-B Q67100 Q4958
6-C Q67100 Q1757
5-C Q67100 Q1762
6-C Q67100 Q4997
5-C Q67100 Q5192
Now
Now
64 M x 72 256 M 32 M x 8 TSOP
2
1.25"
HYS72D64320GU-
HYS72D64320HU-
X = Lead-Free
10
Unbuffered DDR DIMM – 184-pin
Compo.
Module
Density
Organi-
zation
Genera-
tion
Compo. # of Ranks Module Module
Sales
Speed
No.
Ordering
Code
Prod. Green
Organization
Package on Module Height
Speed
Description
PC2100 HYS64D128020GU- 7-A Q67100 Q4656 Now
PC2700 6-A Q67100 Q4823
PC2700 HYS64D128320GU- 6-B Q67100 Q1779 Now
128Mx64512 M 6M4 x 8 TSOP
2
1.25"
PC3200
PC2700
PC3200
5-B Q67100 Q1780
6-B Q67100 Q1426
5-B Q67100 Q1427
Now
X
HYS64D128320HU-
PC2100 HYS72D128020GU- 7-A Q67100 Q4658 Now
PC2700 6-A Q67100 Q4935
PC2700 HYS72D128320GU- 6-B Q67100 Q1781 Now
128Mx72 512 M 64M x 8 TSOP
2
1.25"
PC3200
PC2700
PC3200
5-B Q67100 Q1782
6-B Q67100 Q1065
5-B Q67100 Q1064
Now
X
HYS72D128320HU-
X = Lead-Free
11
Registered DDR DIMM (Reduced Height) – 184-pin
Genera- Compo.
tion Organization
Module
Density
Organi-
zation
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod. Green
Now
Description
128 MB 16 M x 72 128 M 16 M x 8 TSOP
1
1.2"
PC2100
PC2100
HYS72D16500GR-
7-A
Q67100 Q4446
256 MB
HYS72D32501GR-
HYS72D32501HR-
HYS72D32500GR-
7-A
7-C
7-B
7-B
6-B
Q67100 Q4377
Q67100 Q1471
Q67100 Q4457
Q67100 Q4533
Q67100 Q4671
Q67100 Q1461
Q67100 Q1413
128M 32 M x 4 TSOP
1
1
1.2"
1.2"
3Q04
Now
X
256 M 32 M x 8 TSOP
PC2100
PC2100
PC2700
32 M x 72
256 M 32 M x 8 FBGA
1
1.125" PC3200 HYS72D32300GBR- 5-B
PC2700
PC3200
6-C
5-C
2Q04
Q67100 Q1673 3Q04
512 MB
PC2100
PC2100-222
PC2100
7-B
Q67100 Q4463
TSOP
1
1
1.2"
HYS72D64500GR-
7F-B Q67100 Q5007
7-B
6-B
Q67100 Q4673
Q67100 Q4686
Q67100 Q1462
Q67100 Q1415
Now
64 M x 4
FBGA
PC2700
1.125"
PC3200 HYS72D64300GBR- 5-B
PC2700
PC3200
PC2100
PC2700
6-C
5-C
7-B
6-B
2Q04
64 M x 72 256 M
Q67100 Q1685 3Q04
Q67100 Q4687
Q67100 Q4693
Q67100 Q1463
Q67100 Q1414
Now
32 M x 8
FBGA
2
2
1.125" PC3200 HYS72D64320GBR- 5-B
PC2700
PC3200
6-C
5-C
2Q04
Q67100 Q1684 3Q04
1 GB
PC2100
PC2100-222
PC2100
7-B
Q67100 Q4752
TSOP
stack
128 M x 4
1.2"
HYS72D128521GR-
7F-B Q67100 Q5008
Now
256 M
7-B
Q67100 Q4674
Q67100 Q4668
Q67100 Q1412
Q67100 Q4990
Q67100 Q1429
Q67100 Q1032
Q67100 Q1687
Q67100 Q1422
Q67100 Q1043
Q67100 Q1686
64 M x 4 FBGA
TSOP
2
1
1.2"
1.2"
PC2700 HYS72D128320GBR- 6-B
PC2700
PC2100
PC2100
6-C
HYS72D128500GR- 7-A
7-B
2Q04
Now
128Mx72
128 M x 4
FBGA
1
1.125" PC2700 HYS72D128300GBR- 6-B
Now
Now
512 M
PC3200
PC2100
5-B
7-B
64 M x 8 FBGA
2
1.125" PC2700 HYS72D128321GBR- 6-B
PC3200
5-B
2GB
TSOP
256Mx4
2
2
1.2"
1.2"
PC2100
PC2100
HYS72D256520GR- 7-A
7-B
Q67100 Q4661
Now
Now
stack
Q67100 Q1031
Q67100 Q1030
Q67100 Q1689
256Mx72 512M
128Mx4 FBGA
PC2700 HYS72D256320GBR- 6-B
PC3200 5-B
X = Lead-Free
12
Registered DDR DIMM – 184-pin
Compo.
Module
Density
Organi- Genera-
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod. Green
EOL
Organization
zation
tion
Description
128 MB
PC1600
PC2100
8-A Q67100 Q4372
7-A Q67100 Q4373
16Mx72 128M 16Mx8
TSOP
1
1.7"
HYS72D16000GR-
256 MB
PC1600
PC2100
8-A Q67100 Q4375
7-A Q67100 Q4378
128M 32Mx4 TSOP
256M 32Mx8 TSOP
1
1.7"
1.7"
HYS72D32001GR-
HYS72D32000GR-
EOL
32Mx72
PC1600
PC2100
8-B Q67100 Q4508
7-B Q67100 Q4509
1
512 MB
1 GB
PC1600
PC2100
8-B Q67100 Q4510
7-B Q67100 Q4511
64Mx72 256M 64Mx4 TSOP
1
1.7"
1.7"
HYS72D64000GR-
HYS72D128021GR-
EOL
EOL
PC1600
PC2100
8-B Q67100 Q4743
7-B Q67100 Q4694
TSOP
128Mx72 256M 128 M x 4
stack
2
EOL = End of Life
13
SO-DIMM DDR – 200-pin
Compo.
Prod.
Now
Module
Density
Organi-
zation
Genera-
tion
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Green
Organization
Description
128MB
PC2100
PC2700
PC2100
PC2700
PC2700
PC2700
7-B Q67100 Q5179
6-B Q67100 Q5187
7-B Q67100 Q4531
HYS64D16001GDL-
16Mx64 256M 16Mx16 TSOP
1
1,25"
HYS64D16000GDL- 6-B Q67100 Q4670
6-C Q67100 Q1763 2Q04
HYS64D16000HDL- 6-C Q67100 Q5078 2Q04
X
PC2100
PC2700
PC3200
PC2700
PC3200
PC2700
PC3200
7-B Q67100 Q4454
6-B Q67100 Q4667 Now
256MB
HYS64D32020GDL- 5-B Q67100 Q5227
32Mx64 256M 16Mx16 TSOP
2
1,25"
6-C Q67100 Q1767
2Q04
5-C Q67100 Q1769
6-C Q67100 Q4831
2Q04
X
HYS64D32020HDL-
5-C Q67100 Q1699
7-B Q67100 Q4680
PC2100
PC2700
PC3200
PC2700
PC3200
PC2700
PC2100
PC2700
PC2700
PC3200
PC2700
PC3200
PC2700
PC2700
PC3200
PC2700
PC3200
512MB
6-B Q67100 Q4681 Now
HYS64D64020GBDL- 5-B Q67100 Q1193
6-C Q67100 Q1450
2
256M 32Mx8 FBGA
1,25"
2Q04
5-C Q67100 Q1702
HYS64D64020HBDL- 6-C Q67100 Q4835 3Q04
7-A Q67100 Q4663
X
64Mx64
6-A Q67100 Q4744
HYS64D64020GDL-
Now
6-B Q67100 Q1774
5-B Q67100 Q1783
6-B Q67100 Q1423
5-B Q67100 Q1698
512M 32Mx16 TSOP
2
1,25"
HYS64D64020HDL-
Now
X
X
1GB
128Mx64 512M
64Mx8
FBGA
2
2
1,25"
1,25"
HYS64D128021GBDL- 6-B Q67100 Q1416 Now
6-B Q67100 Q1416
1GB
HYS64D128021GBDL-
Now
5-B Q67100 Q1694
6-B Q67100 Q1028
5-B Q67100 Q1695
128Mx64 512M 64Mx8 FBGA
HYS64D128021HBDL-
Now
X = Lead-Free
14
D D R 2 M o d u l e s
Nomenclature DDR/DDR2 Modules
Unbuffered DIMM, Registered DIMM (240-pin) and SO-DIMM (200-pin)
HYS 64
D
32
2
2
0
G
D
L
- 6 - A
(Example)
Part Number
Extension
Component Die Revision Indicator
Speed
8
7.5
7
7F
6
5
=
=
=
=
=
=
=
=
PC1600 2-2-2
PC2100 2.5-3-3
PC2100 2-3-3
DDR200
DDR266B
DDR266A
DDR266
DDR333
DDR400 / DDR2-400
DDR2-533
DDR2-667
PC2100 2-2-2
PC2700 2.5-3-3
PC3200 3-3-3 / PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-5300 4-4-4
3.7
3
Power
L
=
Low Power
none =
Standard Power
Module Family
U
R
D
BD
BR
=
=
=
=
=
Unbuffered DIMM TSOP-based for DDR / FBGA-based for DDR2
Registered DIMM TSOP-based for DDR / FBGA-based for DDR2
SO-DIMM
SO-DIMM
TSOP-based for DDR / FBGA-based for DDR2
FBGA-based
Registered DIMM FBGA-based
Package Type
Designator
G
H
E
=
=
=
Contains Lead
Lead-Free (ROHS*-compliant)
Lead and Halogen-Free available on request (ROHS*-compliant)
Product Variations
Number of
Memory Ranks
0
2
=
=
One Memory Module Rank
Two Memory Module Ranks
Designator
Data Sheet Defined
Memory Density
per DQ
16
32
64
128
256
=
=
=
=
=
16Mb
32Mb
64Mb
128Mb
256Mb
Power Supply
D
T
=
=
2.5V (DDR Modules)
1.8V (DDR2 Modules)
Data
Width64
=
x64
(Non-ECC)
72
=
=
x72 (ECC)
Prefix
HYS
Standard Prefix for SDRAM-based Memory Modules
*ROHS = Restriction Of Hazardous Substances
15
Unbuffered DDR2 DIMM – 240-pin
Prod.
Green
Module
Density
Organi- Genera- Compo.
Compo. # of Ranks Module
Module
Speed
Sales
Speed
No.
Ordering
Code
zation tion Organization Package on Module Height
Description
256MB
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1386
3.7-A Q67100 Q1387
32Mx64 512M 32Mx16 PTFBGA84
32Mx72 256M 32Mx8 PTFBGA60
1
1
30mm
30mm
HYS64T32000GU
HYS72T32000GU-
2Q04
3Q04
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1371
3.7-A Q67100 Q1370
256MB ECC
512MB
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1389
3.7-A Q67100 Q1390
64Mx64 512M 64Mx8 PTFBGA60
64Mx72 512M 64Mx8 PTFBGA60
1
1
30mm
30mm
2Q04
2Q04
HYS64T64000GU-
HYS72T64000GU-
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1392
3.7-A Q67100 Q1393
512MB ECC
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1395
3.7-A Q67100 Q1396
1GB
2Q04
2Q04
128Mx64 512M 64Mx8 PTFBGA60
128Mx72 512M 64Mx8 PTFBGA60
2
2
30mm
30mm
HYS64T128020GU-
HYS72T128020GU-
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1398
3.7-A Q67100 Q1399
1GB ECC
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1739
3.7-A Q67100 Q1740
2GB
3Q04
3Q04
256Mx64 1G 128Mx8 PTFBGA68
256Mx72 1G 128Mx8 PTFBGA68
2
2
30mm
30mm
HYS64T256020GU-
HYS72T256020GU-
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1741
3.7-A Q67100 Q1742
2GB ECC
Registered DDR2 DIMM – 240-pin
Compo.
Module
Density
Organi- Genera-
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod. Green
3Q04
Organization
zation
tion
Description
256MB
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1326
3.7-A Q67100 Q1330
32Mx72 256M 32Mx8 PTFBGA60
1
1
30mm
HYS72T32000GR-
512MB
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1715
3.7-A Q67100 Q1716
5-A Q67100 Q1367
3.7-A Q67100 Q1366
5-A Q67100 Q1378
3.7-A Q67100 Q1379
64Mx4 PTFBGA60
256M
30mm
HYS72T64001GR-
HYS72T64020GR-
HYS72T64000GR-
3Q04
2Q04
64Mx72
32Mx8 PTFBGA60
2
1
30mm
30mm
512M 64Mx8 PTFBGA60
1GB
2GB
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1380
3.7-A Q67100 Q1381
5-A Q67100 Q1382
3.7-A Q67100 Q1383
HYS72T128000GR-
HYS72T128020GR-
128Mx4 PTFBGA60
1
30mm
30mm
128Mx72 512M
2Q04
64Mx8 PTFBGA60
2
PC2-3200 3-3-3 HYS72T256220GR- 5-A Q67100 Q1891
PC2-4300 4-4-4 HYS72T256020GR- 3.7-A Q67100 Q1918
512M 128Mx4 PTFBGA60
1G 256Mx4 PTFBGA68
2
1
30mm
30mm
256Mx72
3Q04
1Q05
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1735
3.7-A Q67100 Q1736
HYS72T256000GR-
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1737
3.7-A Q67100 Q1738
4GB
512Mx72 1G 512Mx4 SDFBGA
2
30mm
HYS72T512022GR-
16
SO-DIMM DDR2 – 200-pin
Compo.
Module
Density
Organi- Genera-
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod.Green
3Q04
Organization
zation
tion
Description
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1401
3.7-A Q67100 Q1402
32 M x 64 512 M 32 M x 16 PTFBGA84
64 M x 64 512 M 32 M x 16 PTFBGA84
1
30 mm
HYS64T32000GDL-
HYS64T64020GDL-
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1404
3.7-A Q67100 Q1405
2
30 mm
3Q04
3Q04
4Q04
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1692
3.7-A Q67100 Q1691
5-A Q67100 Q1743
3.7-A Q67100 Q1744
HYS64T128022GDL-
HYS64T128020GDL-
512 M 128 M x 8 SDFBGA
128Mx64
2
2
30 mm
30 mm
1 G
64 M x 16 PTFBGA92
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1745
3.7-A Q67100 Q1746
HYS64T256022GDL-
256Mx64 1 G 256 M x 8 SDFBGA
2
30 mm
17
S D R M o d u l e s
Nomenclature SDR Modules
Unbuffered DIMM, Registered DIMM (168-pin) and SO-DIMM (144-pin)
HYS
64
V
32
2
2
0
GU
L
- 6
- A
(Example)
Part Number
Extension
Component Die Revision Indicator
Speed
6
7
7.5
8
=
=
=
=
166 MHz (PC166 3-3-3)
133 MHz (PC133 2-2-2)
133 MHz (PC133 3-3-3)
100 MHz (PC100 2-2-2)
Power
L
=
=
Low-Power Product
Standard-Power Product
none
Module Family
GU
GR
GBR
GD
GBD
=
=
=
=
=
Unbuffered 168-pin DIMM
Registered 168-pin DIMM
Registered 168-pin DIMM (FBGA-based)
144-pin Small Outline DIMM (SO-DIMM)
144-pin SO-DIMM (FBGA-based)
Designator
Product Variations
Number of
Memory Ranks
0
2
=
=
One Memory Module Rank
Two Memory Module Ranks
Designator
Data Sheet Defined
Memory Density
per DQ
8
16
32
64
128
256
=
=
=
=
=
=
8 Mb
16 Mb
32 Mb
64 Mb
128 Mb
256 Mb
Power Supply
Data
V
=
3.3 V (SDR Modules)
Width64
=
x 64
(Non-ECC)
72
=
=
x 72 (ECC)
Prefix
HYS
Standard Prefix for SDRAM-based Memory Modules
18
Unbuffered SDR DIMM – 168-pin
Compo.
Prod. Green
Module
Density
Organi-
zation
Genera-
tion
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Organization
Description
128 MB
PC133 3-3-3
PC133 2-2-2
PC133 3-3-3
PC133 2-2-2
7.5-C2 Q67100 Q4079
7-C2 Q67100 Q4080
7.5-D Q67100 Q4466
7-D Q67100 Q4442
128 M 16M x 8
TSOP
1
1.25"
1.15"
HYS64V16300GU-
HYS64V16302GU-
16M x 64
EOL
EOL
256M 16M x 16 TSOP
1
PC133 3-3-3
PC133 2-2-2
7.5-C2 Q67100 Q4085
7-C2 Q67100 Q4086
128 MB ECC
256 MB
16M x 72 128 M 16M x 8
TSOP
1
1.25"
HYS72V16300GU-
PC133 3-3-3
PC133 2-2-2
PC133 3-3-3
PC133 2-2-2
7.5-C2 Q67100 Q4082
7-C2 Q67100 Q4083
7.5-D Q67100 Q4359
7-D Q67100 Q4361
128 M 16M x 8
32 M x 64
TSOP
TSOP
2
1
1.25"
1.25"
HYS64V32220GU-
HYS64V32300GU-
EOL
EOL
256M 32 M x 8
PC133 3-3-3
PC133 2-2-2
PC133 3-3-3
PC133 2-2-2
7.5-C2 Q67100 Q4088
7-C2 Q67100 Q4089
7.5-D Q67100 Q4362
7-D Q67100 Q4360
256 MB ECC
128 M 16M x 8
32 M x 72
TSOP
TSOP
2
1
1.25"
1.25"
HYS72V32220GU-
HYS72V32300GU-
256M 32 M x 8
512 MB
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4390
7-D Q67100 Q4389
64 M x 64 256 M 32 M x 8
64 M x 72 256 M 32 M x 8
TSOP
TSOP
2
1.25"
1.25"
HYS64V64220GU-
HYS72V64220GU-
EOL
EOL
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4387
7-D Q67100 Q4388
512 MB ECC
2
EOL = End of Life
19
Registered SDR DIMM – 168-pin
Compo.
Module
Density
Organi-
zation
Genera-
tion
Compo. # of Ranks Module
Package on Module Height
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod. Green
EOL
Organization
Description
PC133 3-3-3
PC133 2-2-2
7.5-C2 Q67100 Q4091
7-C2 Q67100 Q4092
128 MB
16 M x 72 128 M 16 M x 8
TSOP
1
1.5"
HYS72V16301GR-
256 MB
128 M 32 M x 4
TSOP
TSOP
1
1
1.5" PC133 3-3-3 HYS72V32301GR- 7.5-C2 Q67100 Q4094
32 M x 72
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4479 EOL
256 M 32 M x 8
1.5"
HYS72V32300GR-
7-D Q67100 Q4440
512 MB
1 GB
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4474
7-D Q67100 Q4441
64 M x 72 256 M 64 M x 4
TSOP
1
1.5"
HYS72V64300GR-
EOL
EOL
PC133 3-3-3
PC133 2-2-2
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4725
7-D Q67100 Q4726
7.5-D Q67100 Q4475
7-D Q67100 Q4439
HYS72V128321GR-
HYS72V128320GR-
TSOP
stack
128 M x 72 256 M 128 M x 4
2
1.5"
EOL = End of Life
SO-DIMM SDR – 144-pin
Compo.
Module
Density
Organi-
zation
Genera-
tion
Compo. # of Ranks Module
Module
Speed
Sales
Speed
No.
Ordering
Code
Prod. Green
Package
Organization
on Module Height
Description
128 MB
128 M 8 M x 16
256 M 16 M x 16
TSOP
TSOP
2
1
1.00" PC133 3-3-3 HYS64V16220GDL- 7.5-C2 Q67100 Q4342
16 M x 64
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4478 EOL
1.00"
1.00"
1.15"
HYS64V16200GDL-
HYS64V32220GDL-
HYS64V64220GBDL-
7-D Q67100 Q4363
256 MB
512 MB
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4472
7-D Q67100 Q4444
32 M x 64 256 M 16 M x 16
64 M x 64 256 M 32 M x 8
TSOP
FBGA
2
2
EOL
EOL
PC133 3-3-3
PC133 2-2-2
7.5-D Q67100 Q4499
7-D Q67100 Q4501
EOL = End of Life
20
S p e c i a l t y D R A M s
Nomenclature Reduced Latency DRAM (RLDRAM™)
HYB
18
RL
256
32
A
C
- 4
(Example)
Speed
4
5
=
=
250 MHz
200 MHz
Package
C
=
FBGA
Product Revision
Organization
Die Revision
32
16
=
=
x 32
x 16
Memory Density
Memory Type
I/O Voltage
Prefix
256
RL
=
=
=
=
256 Mb
Reduced Latency DRAM (RLDRAM)
1.8 V (VDDQ)
18
HYB
Standard Prefix for Memory Components
Reduced Latency DRAM (RLDRAM™)
Density
Organization
Power Supply
Speed
Package
Prod.
Now
Green
Sales Description
Speed No.
Ordering Code
256 Mb
250 MHz
200 MHz
250 MHz
200 MHz
4
5
4
5
Q67100 Q4355
Q67100 Q4357
Q67100 Q4356
Q67100 Q4358
8 M x 32
HYB18RL25632AC-
2.5 V / 1.8 V VDDQ
T-FBGA-144
16 M x 16
HYB18RL25616AC-
21
Nomenclature Graphics RAM and Mobile-RAM
HYB
25
D
128
32
3
A
C
L
-3.3
(Example)
Speed
2.2
2.5
2.8
3.0
3.3
3.6
4.5
5
=
=
=
=
=
=
=
=
=
=
450 MHz
400 MHz
350 MHz
333 MHz
300 MHz
275 MHz
222 MHz
200 MHz
133 MHz
125 MHz
7.5
8
Power Down Current
Package
Low-Power Down Current
C
T
E
F
=
=
=
=
FBGA
TSOP
TSOP Lead and Halogen-Free
FBGA Lead and Halogen-Free
Product Revision
Interface
Die Revision
0
3
5
=
=
=
LV-TTL Interface
Matched Impedance 2.5 V VDDQ
Matched Impedance 1.8 V VDDQ
Organization
80
16
32
=
=
=
x 8
x 16
x 32
Memory Density
128
256
512
=
=
=
128 Mb
256 Mb
512 Mb
Memory Type
D
L
=
=
DDR SDRAM or Graphics RAM
Low-Power SDRAM (Mobile-RAM)
Supply Voltage
18
25
39
=
=
=
1.8 VVDD
2.5 VDD / 1.8 VVDD or 2.5 VDDQ
3.3 VDD / 3.3 VDDQ
Prefix
HYB
HYE
=
=
Standard Prefix for Memory Components
Prefix for Extended Temperature Version
(-25°C – +85°C)
22
Graphics RAM
Density
Organization Power Supply
Speed
Sales Description
Speed No.
Ordering Code
Package
Prod.
EOL
Green
128 Mb
333 MHz
300 MHz
3.0
3.3
3.6
3.6
4.5
4.5
Q67100 Q4866
Q67100 Q4121
Q67100 Q4348
Q67100 Q4930
Q67100 Q4123
Q67100 Q4786
HYB25D128323C-
4 M x 32
2.5 V
275 MHz
222 MHz
FBGA-144
HYB25D128323CL-
HYB25D128323C-
HYB25D128323CL-
256 Mb
166 MHz
200 MHz
200 MHz
250 MHz
500 MHz
450 MHz
400 MHz
6.0
5.0
5.0
4.0
20
Q67100 Q4592
Q67100 Q4277
Q67100 Q1408
Q67100 Q1409
Q67100 Q4868
Q67100 Q4869
Q67100 Q4870
HYB25D256160BT-
HYB25D256161CE-
Now
Now
M
16 x 16
2.5 V
1.8 V
TSOP-66
FBGA-144
XX
X
8 M x 32
HYB18T256321F-
22
3Q04
25
XX = Lead and Halogen-Free
X = Lead-Free
EOL = End of Life
Mobile-RAM
Density
Organization Power Supply Power Supply Speed Latency Sales Description
Speed No. Ordering Code
Package Prod. Green
Core
I/O
128 Mb
HYB25L128160AC-
7.5
Q67100 Q4542 FBGA-54
2.5V
2.5V/1.8V
HYE25L128160AC- 7.5 ETR Q67100 Q4544 FBGA-54
Now
HYB39L128160AT-
HYB39L128160AC-
HYB18L128160BF-
HYB18L128160BC-
7.5
7.5
7.5
7.5
Q67100 Q4624 TSOP-54
Q67100 Q4546 FBGA-54
3.3V
1.8V
3.3V
1.8V
133MHz 3-3-3
8Mx16
Q67100 Q1581 FBGA-54 2Q04 XX
Q67100 Q1588 FBGA-54 2Q04
256Mb
HYB25L256160AC-
7.5
Q67100 Q5145 FBGA-54
2.5V
3.3V
1.8V
2.5V/1.8V
3.3V
HYE25L256160AC- 7.5 ETR Q67100 Q5148 FBGA-54
Now
HYB39L256160AC-
HYB39L256160AT-
HYB18L256160BF-
HYB18L256160BC-
7.5
7.5
7.5
7.5
Q67100 Q5144 FBGA-54
Q67100 Q4627 TSOP-54
16Mx16
133MHz 3-3-3
Q67100 Q1295 FBGA-54 2Q04 XX
Q67100 Q1577 FBGA-54 2Q04
1.8V
512 Mb
HYB25L512160AC-
7.5
Q67100 Q4921 FBGA-54
Now
Dual
16Mx16
3.3V or
2.5V/1.8V
133MHz 3-3-3
3.3V or 2.5V
HYE25L512160AC- 7.5 ETR Q67100 Q4923 FBGA-54
23
= Halogen-Free
XX = Lead and Halogen-Free
ETR = Extended Temperature
™
Nomenclature CellularRAM
HYE
18
P
16
16
1
A
C
-60
(Example)
Speed
Package
C
W
=
=
Chip-size Package
Wafer / Known Good Die
Product Revision
Interface
Die Revision
0
1
=
=
Sync /Async / Page
Async / Page only
Organization
16
=
x 16
Memory Density
16
32
=
=
16 Mb
32 Mb
Memory Type
Supply Voltage
Prefix
P
=
=
=
CellularRAM (PSRAM)
18
1.8V VDD / 1.8 – 3.0V VDDQ
Extended Temperature
HYE
™
CellularRAM
Density
Organization
Interface
SRAM
Speed
85ns
70ns
70ns
Sales Description Speed No.
Ordering Code
Package
Prod.
Green
X
16Mb
85
HYE18P16161AC-
70
Q67100 Q5098
Q67100 Q5099
VFBGA-48
VFBGA-48
Async
1Mx16
2Q04
HYE18P16161AW-
70
Q67100 Q5101 Wafer/KGD
32Mb
Async
85ns
70ns
70ns
85
70
70
Q67100 Q5103
Q67100 Q5104
VFBGA-48
VFBGA-48
HYE18P32161AC-
HYE18P32161AW-
2Mx16
2Mx16
SRAM
2Q04
2Q04
X
X
Q67100 Q5106 Wafer/KGD
32Mb
Sync
80MHz/70ns
66MHz/85ns
12.5
15
Q67100 Q1802
Q67100 Q5108
VFBGA-54
VFBGA-54
HYE18P32160AC-
SRAM
/ Flash
66MHz/85ns HYE18P32160AW-
15
Q67100 Q5110 Wafer/KGD
X = Lead-Free
24
F l a s h
™
Nomenclature TwinFlash Components
HYF
33
DS
512
80
0
A
T
C
(Example)
Temperature Range
Package
C
T
=
=
Commercial (0°C – +70°C)
TSOP I 48-P-1220-0.5
Process Technology
Product Variation
A
B
=
=
170 nm Process Technology
170 nm Process Technology (Enhanced Write Speed)
0
2
=
=
Standard Product (Tape & Reel Packing)
Stacked Die (Tape & Reel Packing)
Organization
80
=
x 8
Memory Density
512
1G
=
=
512 Mb
1024 Mb
Memory Type
DS
=
Data SLC: TwinFlash Single-Level Cell (2 bit / cell)
Supply and
I/O Voltage
33
31
=
=
3.3V core and 3V I/O
3.3V core and 1.8V I/O
Prefix
HYF
=
Flash Memory Components
™
TwinFlash Components
Density
Organization
Page Size
Block Size
Core
I/O
Write
Sales
Ordering Code
Package
Voltage Voltage
Speed
Description
512 Mb
3 V
Normal
HYF33DS512800ATC
64 M x 8 512 + 16 Bytes 16 K + 512 Bytes 3 V
3 V
Enhanced HYF33DS512800BTC
On request P-TSOPI-48
On request P-TSOPI-48
1.8 V Enhanced HYF31DS512800BTC
3 V
3 V
Normal
HYF33DS1G802ATC
HYF33DS1G802BTC
HYF31DS1G802BTC
1 Gb
128 M x 8 512 + 16 Bytes 16 K + 512 Bytes 3 V
Enhanced
1.8 V Enhanced
25
™
Nomenclature TwinFlash Cards
HYC
3
N
256
0
NO
5
0
AA
1
A
A
(Example)
Package
A
B
C
D
=
=
=
=
SD (commercial)
MMC (commercial)
miniSD (commercial)
mini MMC (commercial)
Memory Revision
Controller Generation
Firmware
A
B
=
=
170 nm Process Technology
110 nm Process Technology
1
2
=
=
1st generation
2nd generation
AA
AB
=
=
1st firmware
2nd firmware
Content
0
1
=
=
No content
Content 1 rev. label
Label Size
0
1
=
=
=
=
=
=
=
=
No label
16 MB
2
3
4
5
6
7
32 MB
64 MB
128 MB
256 MB
512 MB
1 GB
Label Shortcut
Speed
NO
IF
=
=
No label
IFX label
0
1
=
=
Standard
Future use
Memory Capacity
64
=
=
=
=
=
64 MB
128
256
512
01G
128 MB
256 MB
512 MB
1024 MB
Technology
N
=
TWIN-NAND
Supply Voltage
3
1
=
=
3.3V Core
1.8V Core (Dual-Voltage)
Type
C
=
Flash Card
™
TwinFlash Cards
Card
Density
64 MB
Operating Voltage
2.7V – 3.6V
Sales Description
Ordering Code
HYC3N0640NO00AA1AB
HYC3N1280NO00AA1AB
HYC3N2560NO00AA1AB
Multi
Media
Cards
128 MB
256 MB
On request
SD
Cards
64 MB
128 MB
256 MB
HYC3N0640NO00AA1AA
HYC3N1280NO00AA1AA
HYC3N2560NO00AA1AA
2.7V – 3.6V
On request
26
More detailed Information on
Memory Products is available:
On our Internet websites:
www.infineon.com/memory and www.infineon.com/memory/flash
C
Datasheets
C
Simulation models
C
Memory Spectrum (PDF version)
C
Brochures (PDF version)
Please note
Warnings
Edition 2004 April
The information in this document is subject to change
without notice. The information herein describes certain
components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but
not limited to warranties of non-infringement regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Due to technical requirements, components may contain
dangerous substances. For information on the types
in question, please contact your nearest Infineon
Technologies office.
Published by
Infineon Technologies AG,
St.-Martin-Straße 53,
D-81669 München
Infineon Technologies components may only be used in
life-support devices or systems with the express written
approval of Infineon Technologies if a failure of such
components can reasonably be expected to cause the
failure of that life-support device or system, or to affect
the safety or effectiveness of that device or system.
Life-support devices or systems are intended to be
implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they
fail, it is reasonable to assume that the health of the
user or other persons may be endangered.
© Infineon Technologies AG 2004.
All Rights Reserved.
Information
For further information on technology, delivery terms and
conditions and prices, please contact your nearest
Infineon Technologies office in Germany or our Infineon
Technologies representatives worldwide.
(www.infineon.com).
27
*
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* and representative offices
Ordering No. B166-H8399-X-X-7600
Printed in Germany
WS 04045.
www.infineon.com
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