IFX24401TEV50 [INFINEON]
Low Dropout Voltage Regulator; 低压差稳压器
| 型号： | IFX24401TEV50 |
| 厂家： | 
Infineon |
| 描述： | Low Dropout Voltage Regulator |
| 文件： | 总18页 (文件大小：1338K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IFX24401
Low Dropout Voltage Regulator
IFX24401TEV50
IFX24401ELV50
Data Sheet
Rev. 1.02, 2009-12-10
Standard Power
Low Dropout Voltage Regulator
IFX24401
1
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
Output voltage 5 V ±2%
Ultra low current consumption: 20 µA (typ.)
300 mA current capability
Enable input
Very low-drop voltage
Short circuit protection
Overtemperature protection
Low Dropout Voltage, 250mV (typ.)
High Input Voltage 45 V
PG-TO252-5
Temperature Range -40 °C ≤ Tj ≤ 125 °C
Green Product (RoHS compliant)
Applications
•
•
•
•
•
Battery powered devices (e.g. Handheld GPS)
Portable Radios
HDTV Televisions
Game Consoles
Network Routers
PG-SSOP-14
For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series.
Functional Description
The IFX24401 is a monolithic integrated low-drop voltage regulator for load currents up to 300 mA. The output
voltage is regulated to VQ,nom = 5.0 V with an accuracy of ±2%. A sophisticated design allows stable operation with
low ESR ceramic output capacitors down to 470 nF. The device is designed for the harsh environments. Therefore
it is protected against overload, short circuit and overtemperature conditions. Due to its ultra low stand-by current
consumption of 20 µA (typ.) the IFX24401 is ideal for use in battery powered applications. The regulator can be
shut down via an Enable input which further reduces the current consumption to 5 µA (typ.). An integrated output
sink current circuitry keeps the voltage at the Output pin Q below 5.5 V even when reverse currents are applied.
Thus connected devices are protected from overvoltage damage.
Type
IFX24401TEV50
IFX24401ELV50
Package
PG-TO252-5
PG-SSOP-14
Marking
2440150
24401V50
Data Sheet
2
Rev. 1.02, 2009-12-10
IFX24401
Block Diagram
2
Block Diagram
IFX24401
I
Q
Overtemperature
Shutdown
Bandgap
1
Reference
EN
Enable
Charge
Pump
GND
Figure 1
Block Diagram
Data Sheet
3
Rev. 1.02, 2009-12-10
IFX24401
Pin Configuration
3
Pin Configuration
I NC EN Q
Figure 2
Pin Configuration PG-TO252-5 (top view)
3.1
Pin Definitions and Functions (PG-TO252-5 )
Pin
Symbol
Function
1
I
Input
Connect ceramic capcitor between I and GND
2
3
4
5
N.C.
GND
EN
No Connect
May be open or connected to GND
Ground
Internally connected to heat slug
Enable Input
Low signal level disables the regulator. Pull-down resistor is integrated.
Q
Output
Place capacitor between Q pin and GND. Capacitor placement should be close to pin.
Refer to capacitance and ESR requirements in “Functional Range” on Page 6
Heat Slug --
Heat Slug
Connect to board GND and heatsink
Data Sheet
4
Rev. 1.02, 2009-12-10
IFX24401
Pin Configuration
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢁꢄ
ꢁꢃ
ꢁꢂ
ꢁꢁ
ꢁꢉ
ꢈ
1ꢀ&ꢀ
1ꢀ&ꢀ
1ꢀ&ꢀ
,
1ꢀ&ꢀ
1ꢀ&ꢀ
1ꢀ&ꢀ
*1'
1ꢀ&ꢀ
(1
1ꢀ&ꢀ
4
1ꢀ&ꢀ
ꢊ
1ꢀ&ꢀ
3,1&21),*B6623ꢋꢁꢄꢀ69*
Figure 3
Pin Configuration PG-SSOP-14 (top view)
3.2
Pin Definitions and Functions (PG-SSOP-14 )
Pin
Symbol
Function
1,2,3,5,7 N.C.
No Connect
May be open or connected to GND
4
6
GND
EN
Ground
Enable Input
Low signal level disables the regulator. Pull-down resistor is integrated.
8,10,11,1 N.C.
2,14
No Connect
May be open or connected to GND
9
Q
Output
Place capacitor between Q pin and GND. Capacitor placement should be close to pin.
Refer to capacitance and ESR requirements in “Functional Range” on Page 6
13
I
Input
Connect ceramic capcitor between I and GND
Pad
Exposed Pad
Connect to board GND and heatsink
Data Sheet
5
Rev. 1.02, 2009-12-10
IFX24401
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Absolute Maximum Ratings1)
Tj = -40 °C to 150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter
Symbol
Limit Values
Unit
Test Condition
Min.
Max.
Input I
Voltage
Current
Enable EN
Voltage
VI
II
-0.3
-1
45
–
V
mA
–
–
VEN
IEN
-0.3
-1
45
1
V
Observe current limit
IEN,max
–
2)
Current
mA
Output Q
Voltage
Voltage
Current
VQ
VQ
IQ
-0.3
-0.3
-1
5.5
6.2
–
V
V
mA
–
t < 10 s3)
–
Temperature
Junction temperature
Storage temperature
Tj
Tstg
-40
-50
150
150
°C
°C
–
–
1) Not subject to production test, specified by design.
2) External resistor required to keep current below absolute maximum rating when voltages ≥ 5.5 V are applied.
3) Exposure to these absolute maximum ratings for extended periods (t > 10 s) may affect device reliability.
Note:Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note:Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2
Functional Range
Parameter
Symbol
Limit Values
Unit Remarks
Min.
Max.
42
125
–
Input voltage
VI
5.5
-40
470
–
V
–
Junction temperature
Output Capacitor
Tj
CQ
ESR (CQ)
°C
nF
Ω
–
1)
10
f = 10 kHz
1) The minimum output capacitance requirement is applicable for a worst case capacitor tolerance of 30%
Note:In the operating range, the functions given in the circuit description are fulfilled.
Data Sheet
6
Rev. 1.02, 2009-12-10
IFX24401
General Product Characteristics
4.3
Thermal Resistance
Pos.
Parameter
Symbol
Limit Value
Unit
Conditions
Min. Typ. Max.
IFX24401TEV50 (PG-TO252-5, )
4.3.1
4.3.2
4.3.3
Junction to Case1)
RthJC
RthJA
–
–
–
4
115
57
–
–
–
K/W
K/W
K/W
measured to pin 5
Footprint only2)
Junction to Ambient1)
300mm2 heatsink area on
PCB2)
4.3.4
–
42
–
K/W
600mm2 heatsink area on
PCB2)
IFX24401ELV50 (PG-SSOP-14)
4.3.5
4.3.6
4.3.7
Junction to Case1)
RthJC
RthJA
–
–
–
7
120
59
–
–
–
K/W
K/W
K/W
measured to pin 5
Footprint only2)
Junction to Ambient1)
300mm2 heatsink area on
PCB2)
4.3.8
–
49
–
K/W
600mm2 heatsink area on
PCB2)
1) not subject to production test, specified by design
2) EIA/JESD 52_2, FR4, 80 × 80 × 1.5 mm; 35µ Cu, 5µ Sn
Data Sheet
7
Rev. 1.02, 2009-12-10
IFX24401
General Product Characteristics
Table 1
Electrical Characteristics
VI = 13.5 V; VEN = 5 V; -40 °C < Tj < 125 °C (unless otherwise specified)
Parameter
Symbol
Limit Values
Unit
Measuring Condition
Min. Typ. Max.
Output Q
Output voltage
VQ
VQ
4.9
4.9
5.0
5.0
5.1
5.1
V
V
0.1 mA < IQ < 300 mA;
6 V < VI < 16 V
Output voltage
0.1 mA < IQ < 100 mA;
6 V < VI < 40 V
1)
Output current limit
Output current limit
Current consumption;
Iq = II - IQ
IQ,LIM
IQ,LIM
Iq
320
–
–
–
–
20
–
800
30
mA
mA
µA
VQ = 0V
IQ = 0.1 mA;
Tj = 25 °C
Current consumption;
Iq
–
–
–
–
40
9
µA
µA
mV
IQ = 0.1 mA;
Tj ≤ 80 °C
Iq = II - IQ
Quiescent current;
Disabled
Drop voltage
Iq
5
VEN = 0 V;
Tj < 80 °C
Vdr
250
500
IQ = 200 mA;
1)
Vdr = VI - VQ
Load regulation
Line regulation
∆VQ, lo
∆VQ, li
-40
-20
15
5
40
20
mV
mV
IQ = 5 mA to 250 mA
Vl = 10V to 32 V;
IQ = 5 mA
Power supply ripple rejection
–
–
60
–
–
dB
fr = 100 Hz;
Vr = 0.5 Vpp
–
PSRR
Temperature output voltage drift
Enable Input EN
Turn-on Voltage
Turn-off Voltage
H-input current
dVQ/dT
0.5
mV/K
VEN ON
VEN OFF
IEN ON
3.1
–
–
–
–
3
0.5
–
0.8
4
V
V
µA
µA
VQ ≥ 4.9 V
VQ ≤ 0.3 V
V
V
EN = 5 V
EN = 0 V;
L-input current
IEN OFF
–
1
Tj < 80 °C
1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.
Data Sheet
8
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
5
Typical Performance Characteristics
Current Consumption Iq versus
Junction Temperature TJ
Current Consumption Iq versus
Input Voltage VQ
1_Iq -Tj .vsd
3_IQ -VI.VSD
Iq [µA]
TJ = 25°C
Iq [µA]
VI = 13.5V
100
10
40
30
20
10
IQ = 100 µA
IQ = 50mA
IQ = 10mA
1
IQ = 0.2mA
0.01
-40 -20
0
20 40 60 80 100 120 140
0
10
20
30
40
TJ [°C]
VI [V]
Current Consumption Iq versus
Output Current IQ
Output Voltage VQ versus
Junction Temperature TJ
5A_VQ-TJ.VSD
2_IQ-IQ.VSD
30
VI = 13.5 V
Iq [µA]
VQ [V]
VI = 13.5 V
Tj = 25 °C
Tj = -40 °C
5.05
5.00
20
15
10
5
IQ =100µA...100mA
4.95
4.90
-40 -20
0
20 40 60 80 100 120 140
0
20
40
60
100
IQ [mA]
Tj [°C]
Data Sheet
9
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Dropout Voltage Vdr versus
Output Current IQ
Maximum Output Current IQ versus
Junction Temperature Tj
6_VDR-IQ .VSD
8_IQMAX-TJ.VSD
600
620
VI= 13.5 V
Vdr [mV]
IQ [mA]
TJ = 150 °C
400
300
200
100
580
560
540
520
500
T
Jj = 25 °C
TJ = -40 °C
0
100
200
300
-40 -20
0
20 40 60 80 100 120 140
IQ [mA]
TJ [°C]
Dropout Voltage Vdr versus
Maximum Output Current IQ versus
Input Voltage VI
Junction Temperature
9_SOA.VSD
7_ V D R -TJ . V S D
600
600
IQ,LIM
T
T
j = 125 °C
j = 25 °C
[mA]
Vdr [mV]
IQ = 250 mA
400
300
200
100
400
300
200
100
IQ = 150mA
IQ = 10 mA
0
10
20
30
40
VI [V]
-40 -20
0
20 40 60 80 100 120 140
TJ [°C]
Data Sheet
10
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Region of Stability
Output Voltage VQ Start-up behavior
14_VI-
12_ESR-IQ.VSD
time _startup.vsd
100
CQ = 10nF ...10 µF
Tj = 25 °C
VQ [V]
ESRCQ
[Ω]
EN = HIGH
10
5.05
5.00
4.90
4.80
I
Q = 5mA
1
Stable
Region
0.1
0.01
0
50
100
150
200
IQ [mA]
1
2
3
4
5
t
[ms]
Power Supply Ripple Rejection PSRR versus
Frequency f
Load Regulation ∆VQ versus
Output Current Change ∆IQ
13_PSRR.VSD
18a_dVQ-dIQ _Vi6V.vsd
80
0
IQ = 0.1 mA
Q = 30 mA
PSRR
VI = 6V
∆VQ
[dB ]
[mV]
I
IQ = 100 mA
60
-10
-15
-20
-25
-30
T
j = -40 °C
j = 25 °C
50
40
30
T
V
RIPPLE = 0.5 VPP
VI = 13.5 V
Q = 10 µF Tantalum
T
j = 150 °C
C
TJ = 25 °C
10
100
1k
10k
100k
[Hz]
0
50
100
150
250
IQ [mA]
f
Data Sheet
11
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Load Regulation ∆VQ versus
Output Current Change dIQ
Line Regulation ∆V versus
Input Voltage ChangQ ed VI
18b_dVQ-dIQ_Vi135V.vsd
19_dVQ-dVI__150C.vsd
0
0
TJ = 150 °C
V
I = 13.5V
∆VQ
∆VQ
[mV]
[mV]
IQ = 1mA
IQ = 10mA
IQ = 100mA
-10
-15
-20
-25
-30
-2
-3
-4
-5
-6
T
J = -40 °C
T
J = 25 °C
IQ = 200mA
TJ = 150 °C
0
50
100
150
250
0
5
10 15 20 25 30 35 40 45
I [V]
IQ [mA]
V
Load Regulation ∆VQ versus
Output Current Change ∆IQ
Line Regulation ∆VQ versus
Input Voltage Changed VI
19_dVQ-dVI_25C.vsd
18c_dVQ-dIQ_Vi28V.vsd
0
0
TJ = 25 °C
VI = 28
∆VQ
∆
VQ
[mV]
[mV]
IQ = 1mA
IQ = 10mA
-2
-3
-4
-5
-6
-10
-15
-20
-25
-30
TJ = -40 °C
I
Q = 100mA
IQ = 200mA
TJ = 25 °C
TJ = 150 °C
0
5
10 15 20 25 30 35 40 45
I [V]
0
50
100
150
250
V
IQ [mA]
Data Sheet
12
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Line Regulation ∆VQ versus
Input Voltage Change VI
Load Transient Response Peak Voltage ∆VQ
19_dVQ-dVI_-40C.vsd
20_Load Trancientvs time 125.vsd
0
T
J =40 °C
IQ
IQ=100mA
T
J = 125 °C
I = 13.5 V
∆VQ
[mV]
V
∆
IQ = 1mA
IQ = 10mA
-2
-3
-4
-5
-6
IQ = 100mA
I
Q = 200mA
VQ
VQ = 100 mV/DIV
t = 40 µs/DIV
0
5
10 15 20 25 30 35 40 45
I [V]
V
Load Transient Response Peak Voltage ∆VQ
Line Transient Response Peak Voltage ∆VQ
20_Load Trancientvs time 25.vsd
21_Line Trancientvs time 25.vsd
IQ
TJ = 25 °C
VI = 13.5 V
TJ = 25 °C
VI = 13.5 V
∆IQ = 100mA
VI
∆VI = 2V
VQ
VQ = 50 mV/DIV
VQ
VQ = 100 mV/DIV
t = 40 µs/DIV
t = 400 µs/DIV
Data Sheet
13
Rev. 1.02, 2009-12-10
IFX24401
Typical Performance Characteristics
Line Transient Response Peak Voltage ∆VQ
I
Enabled Input Current IEN versus
Input Voltage VI , EN=Off
25_IINH vs VIN INH _off.vsd
21_Line Trancientvs time 125.vsd
TJ = 125 °C
VI = 13.5 V
IEN
EN = L
[µA ]
VI
(i.e. IC OFF)
∆VI = 2 V
1.0
0.8
0.6
0.4
0.2
T
J = 150°C
TJ = 25°C
TJ = -40°C
VQ
VQ = 50 mV/DIV
t = 400 µs/DIV
10
20
30
40
V
I [V]
Enabled Input Current IEN versus
Enabled Input Voltage VEN
Thermal Resistance Junction-Ambient RTHJA
versus Power Dissipation PV
24_IINH vs VINH.vsd
32_RTH VS PV TO252.VSD
75
RTH-JA
A = 300mm2
IEN
Cooling Area single sided PCB
[µA ]
T
J = 150°C
[K /W]
50
40
30
20
10
T
T
J = 25°C
65
60
J = -40°C
TO252-5
55
50
10
20
30
40
3
6
9
12
V
EN [V]
PV [W]
Data Sheet
14
Rev. 1.02, 2009-12-10
IFX24401
Application Information
6
Application Information
IFX24401
VBat
100
VCC
1
Q 5
I
470
nF
+
4.7
µF
nF
Overtemperature
Shutdown
Bandgap
1
Reference
e. g.
Ignition
2
EN
Enable
Charge
Pump
GND
3, Tab
Figure 4
Application Diagram
Input, Output
An input capacitor is necessary for damping line influences. A resistor of approx. 1 Ω in series with CI, can damp
the LC of the input inductivity and the input capacitor.
The IFX24401 requires a ceramic output capacitor of at least 470 nF. In order to damp influences resulting from
load current surges it is recommended to add an additional electrolytic capacitor of 4.7 µF to 47 µF at the output
as shown in Figure 4.
Additionally a buffer capacitor CB of > 10µF should be used for the output to suppress influences from load surges
to the voltage levels. This one can either be an aluminum electrolytic capacitor or a tantalum capacitor following
the application requirements.
A general recommendation is to keep the drop over the equivalent serial resistor (ESR) together with the discharge
of the blocking capacitor below the allowed Headroom of the Application to be supplied (e.g. typ. dVQ = 350mV).
Since the regulator output current roughly rises linearly with time the discharge of the capacitor can be calculated
as follows:
dVCB = dIQ*dt/CB
The drop across the ESR calculates as:
dVESR = dI*ESR
To prevent a reset the following relationship must be fullfilled:
dVC + dVESR < VRH = 350mV
Example: Assuming a load current change of dIQ = 100mA, a blocking capacitor of CB = 22µF and a typical
regulator reaction time under normal operating conditions of dt ~ 25µs and for special dynamic load conditions,
such as load step from very low base load, a reaction time of dt ~ 75µs.
dVC = dIQ*dt/CB = 100mA * 25µs/22µF = 113mV
So for the ESR we can allow
dVESR = VRH2 - dVC = 350mV - 113mV = 236mV
The permissible ESR becomes:
ESR = dVESR / dIQ = 236mV/100mA = 2.36Ohm
Data Sheet
15
Rev. 1.02, 2009-12-10
IFX24401
Package Outlines
7
Package Outlines
+0.15
-0.05
6.5
A
+0.05
-0.10
5.7 MAX.1)
2.3
+0.08
-0.04
B
(5)
0.5
+0.20
-0.01
0.9
0...0.15
0.15 MAX.
per side
+0.08
±0.1
5 x 0.6
1.14
0.5
-0.04
0.1 B
4.56
M
0.25
A B
GPT09527
1) Includes mold flashes on each side.
All metal surfaces tin plated, except area of cut.
Figure 5
PG-TO252-5
0.35 x 45˚
1)
0.1 C D
±0.1
3.9
+0.06
0.19
0.08
C
C
0.64±0.25
0.2
0.65
2)
±0.05
±0.2
6
0.25
M
M
D 8x
0.15
C A-B D 14x
D
Bottom View
±0.2
3
A
1
7
14
8
1
7
14
8
Exposed
Diepad
B
0.1 C A-B 2x
1)
±0.1
4.9
GPT09113
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion
PG-SSOP-14-1,-2,-3-PO V02
Figure 6
PG-SSOP-14
Data Sheet
16
Rev. 1.02, 2009-12-10
IFX24401
Revision History
8
Revision History
Revision
1.02
Date
2009-12-10
Changes
Corrections to pin assignment
1.01
2009-10-19
Coverpage changed
Overview page: Inserted reference statement to TLE/TLF series.
Initial Release
1.0
2009-04-28
Data Sheet
17
Rev. 1.02, 2009-12-10
Edition 2009-12-10
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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