IGC189T120T6RLX1SA1 [INFINEON]

Insulated Gate Bipolar Transistor, 1200V V(BR)CES, N-Channel, 13.62 X 13.87 MM, DIE-3;
IGC189T120T6RLX1SA1
型号: IGC189T120T6RLX1SA1
厂家: Infineon    Infineon
描述:

Insulated Gate Bipolar Transistor, 1200V V(BR)CES, N-Channel, 13.62 X 13.87 MM, DIE-3

栅 功率控制 晶体管
文件: 总5页 (文件大小:81K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGC189T120T6RL  
IGBT4 Low Power Chip  
Features:  
·
·
·
·
1200V Trench + Field Stop technology  
low switching losses  
positive temperature coefficient  
easy paralleling  
This chip is used for:  
low / medium power modules  
C
E
·
Applications:  
low / medium power drives  
G
·
Chip Type  
VCE  
ICn  
Die Size  
Package  
IGC189T120T6RL 1200V 200A 13.62 x 13.87 mm2  
sawn on foil  
MECHANICAL PARAMETER  
Raster size  
13.62 x 13.87  
12.1 x 12.35  
1.31 x 0.81  
188.9 / 150.6  
115  
Emitter pad size (incl. gate pad)  
Gate pad size  
mm2  
Area total / active  
Thickness  
µm  
mm  
grd  
Wafer size  
150  
Flat position  
90  
Max.possible chips per wafer  
Passivation frontside  
Pad metal  
69  
Photoimide  
3200 nm AlSiCu  
Ni Ag –system  
Backside metal  
Die bond  
suitable for epoxy and soft solder die bonding  
Electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject ink dot size  
Æ 0.65mm ; max 1.2mm  
Store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended storage environment  
Edited by INFINEON Technologies , AIM PMD D CID CLS , L7703C, Edition 0.9, 22.11.2007  
IGC189T120T6RL  
MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
Collector-Emitter voltage , T =25 °C  
VC E  
1200  
V
A
A
j
1)  
DC collector current, limited by T  
IC  
jmax  
Pulsed collector current, t limited by T  
Icpuls  
600  
p
jmax  
Gate-Emitter voltage  
VGE  
Tj  
±20  
V
Operating junction temperature  
-40 ... +17 5  
°C  
Short circuit data2 ) V GE = 15V, VCC = 800V, Tvj = 150°C  
Reverse bias safe operating area 2 ) (RBSOA)  
10  
µs  
tp  
IC max = 400A, VCE max = 1200V, Tvj max= 150°C  
1)  
depending on thermal properties of assembly  
2)  
not subject to production test - verified by design/characterization  
STATIC CHARACTERISTICS (tested on wafer ), T =25 °C  
j
Value  
typ.  
Parameter  
Symbol  
Conditions  
Unit  
min.  
max.  
Collector-Emitter breakdown voltage  
Collector-Emitter saturation voltage  
V(BR)CES  
VCE(sat)  
VGE=0V , IC= 5.7 mA 1200  
VGE=15V, IC=200A  
IC=7.4mA , VGE=VCE  
VCE=1200V , VGE=0V  
VCE=0V , VGE=20V  
1.55  
5.0  
1.8  
5.8  
2.05  
6.5  
V
Gate-Emitter threshold voltage  
Zero gate voltage collector current  
Gate-Emitter leakage current  
Integrated gate resistor  
VGE(th)  
ICES  
13  
µA  
nA  
W
IGES  
600  
RGint  
3.5  
ELECTRICAL CHARACTERISTICS (not subject to production test - verified by design/characterization)  
Value  
Parameter  
Symbol  
Unit  
Conditions  
min.  
typ.  
max.  
Input capacitance  
Output capacitance  
Ciss  
VCE=25V,  
VGE =0V,  
f=1MHz  
12500  
770  
pF  
Coss  
Reverse transfer capacitance  
Crss  
680  
Edited by INFINEON Technologies , AIM PMD D CID CLS , L7703C, Edition 0.9, 22.11.2007  
IGC189T120T6RL  
SWITCHING CHARACTERISTICS inductive load (not subject to production test - verified by design  
/characterization)  
Value  
Conditions 1)  
Parameter  
Symbol  
Unit  
min.  
typ.  
tbd  
max.  
Turn-on delay time  
Rise time  
td(on)  
tr  
td(off)  
tf  
Tj =125°C  
VC C=600V,  
IC=20 0A,  
tbd  
tbd  
tbd  
ns  
Turn-off delay time  
Fall time  
VGE =-15/15V,  
R G= ---W  
1) values also influenced by parasitic L- and C- in measurement and pac kage.  
Edited by INFINEON Technologies , AIM PMD D CID CLS , L7703C, Edition 0.9, 22.11.2007  
IGC189T120T6RL  
CHIP DRAWING  
Edited by INFINEON Technologies , AIM PMD D CID CLS , L7703C, Edition 0.9, 22.11.2007  
IGC189T120T6RL  
FURTHER ELECTRICAL CHARACTERISTICS  
This chip data sheet refers to the  
device data sheet  
tbd  
DESCRIPTION  
AQL 0,65 for visual inspection according to failure catalogue  
Electrostatic Discharge Sensitive Device according to MIL-STD 883  
Test-Normen Villach/Prüffeld  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
© Infineon Technologies AG 2007  
All Rights Reserved  
Attention please!  
The information herein is given to describe certain components and shall not be considered as warranted  
characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Infineon Technologies is an approved CECC manufacturer.  
Information  
For further information on technology, delivery terms and conditions and prices please contact your nearest  
Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see  
address list).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types  
in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies components may only be used in life -support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life -support device or system, or to affect th e safety or effectiveness of that device or  
system. Life support devices or systems are intended to be implanted in the human body, or to support  
and / or maintain and sustain and / or protect human life. If they fail, it is reasonable to assume that the  
health of the user or other persons may be endangered.  
Edited by INFINEON Technologies , AIM PMD D CID CLS , L7703C, Edition 0.9, 22.11.2007  

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