IM73D122 [INFINEON]
Ultra-low noise digital XENSIVTM MEMS microphone IM73D122 is designed for applications which require a very high SNR (low self-noise) and a high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level.;
| 型号： | IM73D122 |
| 厂家： | 
Infineon |
| 描述： | Ultra-low noise digital XENSIVTM MEMS microphone IM73D122 is designed for applications which require a very high SNR (low self-noise) and a high sensitivity. The flat frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. |
| 文件： | 总18页 (文件大小：849K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Description
The IM73D122V01 is an ultra-high performance digital PDM MEMS microphone designed for applications which
require a very high SNR (low self-noise) and high sensitivity and which is also IP57 robust to dust and water.
Best-in-class signal-to-noise ratio (SNR) of 73dB(A) enables far field and low volume audio pick-up. The flat
frequency response (20Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of
multi-microphone (array) applications.
The digital microphone ASIC contains an extremely low-noise preamplifier and a high-performance sigma-delta
ADC. Different power modes can be selected in order to suit specific clock frequency and current consumption
requirements.
Each IM73D122V01 microphone is calibrated with an advanced Infineon calibration algorithm, resulting in low
sensitivity tolerances ( 1dB).
Features
•
•
•
•
•
Ultra high signal to noise ratio of 73dB(A) SNR
Component level IP57 water and dust resistant
Dynamic range of 101dB
Acoustic overload point at 122dBSPL
Digital PDM output
•
Flat frequency response with a low frequency roll-
off at 20Hz
Package dimensions: 4mm x 3mm x 1.2mm
Omnidirectional pickup pattern
Power optimized modes determined by PDM
clock frequency
•
•
•
Potential applications
•
High quality audio capturing
•
•
Devices with Voice User Interface (VUI)
-
-
-
Laptops and tablets
Conference systems
Cameras and camcorders
-
-
-
Smart speakers
Home automation
IOT devices
•
•
Active Noise Cancellation (ANC) headphones and
earphones
Smartphones and mobile devices
Industrial or home monitoring with audio pattern
detection
Ordering information
Table 1
Ordering information
Product name
Package
Marking
Ordering code
IM73D122V01
PG-LLGA-5-3
I73D19
SP005675385
Datasheet
www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Product validation
Product validation
Technology qualified for industrial applications.
Ready for validation in industrial applications according to the relevant tests of IEC 60747 and 60749 or
alternatively JEDEC47/20/22.
Block diagram
Figure 1
Block diagram
Environmental robustness
Infineon’s latest Sealed Dual Membrane MEMS technology delivers high ingress protection (IP57) at a
microphone level. The sealed MEMS design prevents water or dust from entering between membrane
and backplate, preventing mechanical blockage or electric leakage issues commonly observed in MEMS
microphones. Microphones built with the Sealed Dual Membrane technology can be used to create IP68
devices, requiring only minimal mesh protection.
Table 2
Environmental robustness
Test Standard
Test Condition
IP5x dust resistance1)
Arizona dust A4 coarse, vertical orientation , sound hole upwards, 10
cycles (15 minutes sedimentation, 6 sec blowing)
IPx7 water immersion2)
Temporary immersion of 1 meters for 30 minutes. Microphone tested
2 hours afer removal
1
The number "5" stands for the dust ingress rating or the capacity to withstand the effects of fine, abrasive dust particles.
The "7" specifies the higher water immersion rating.
2
Datasheet
2
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Table of contents
Table of contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Potential applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Product validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Environmental robustness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
2
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Acoustic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical characteristics and parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Audio DC offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Stereo PDM configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1
3.2
3.3
3.4
3.5
4
5
6
7
8
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Footprint and stencil recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering and board assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reliability specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Datasheet
3
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Typical performance characteristics
1
Typical performance characteristics
Test conditions: VDD = 1.8V, fCLK = 3.072MHz, unless otherwise specified.
30
12
25
20
15
10
5
9
6
3
0
-3
-6
-9
-12
0
-5
-10
10
100
1000
10000
0
20
40
60
80
Frequency [Hz]
Frequency [kHz]
Figure 2
Typical amplitude response
Figure 3
Typical free field ultrasonic
response
90
75
60
45
30
15
0
10000
1000
100
10
-15
-30
1
10
100
1000
10000
10
100
1000
10000
Frequency [Hz]
Frequency [Hz]
Figure 4
Typical phase response
Figure 5
Typical group delay
10.00
1.00
0.10
0.01
122dB SPL
10
1
120dB SPL
110dB SPL
0.1
90
95
100
105
110
115
120
125
100
1000
10000
Input Sound Pressure Level [dB]
Frequency [Hz]
Figure 6
Typical THD vs SPL
Figure 7
Typical THD vs frequency
Datasheet
4
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Typical performance characteristics
1200
1000
800
600
400
200
0
-80
-90
f
clock = 3.072MHz
-100
-110
-120
-130
-140
-150
-160
fclock = 4.800MHz
f
clock = 2.400MHz
clock = 1.536MHz
f
fclock = 768kHz
1.60
2.10
2.60
3.10
3.60
10
100
1000
10000
V
DD [V]
Frequency [Hz]
Figure 8
Typical IDD vs VDD
Figure 9
Typical noise floor
(unweighted)
Datasheet
5
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Acoustic characteristics
2
Acoustic characteristics
Test conditions (unless otherwise specified in the table): VDD = 1.8V, fCLK = 3.072MHz, TA = 25°C, 55% R.H., audio
bandwidth 20Hz to 20kHz, select pin grounded, no load on DATA, Tedge = 9ns
Table 3
acoustic specifications
Symbol
Parameter
Values
Typ.
Unit Note or Test Condition
Min.
Max.
Sensitivity
S
1kHz, 94dBSPL, all
dBFS
-27
-26
-25
operating modes
Low Frequency Roll-off
LFRO
20
19
37
Hz -3dB relative to 1kHz
kHz +3dB relative to 1kHz
kHz
High Frequency Flatness3)
Resonance Frequency Peak3)
Signal to Noise fclock = 768kHz
Ratio
SNR
20Hz to 8kHz bandwidth,
A-Weighted
69
fclock = 1.536MHz
fclock = 2.4MHz
71
72
73
72
0.5
20Hz to 20kHz bandwidth,
dB(A)
A-Weighted
fclock = 3.072MHz
fclock = 4.8MHz3)
Total
Harmonic
Distortion
94dBSPL
THD
AOP
Measuring 2nd to 5th
harmonics; 1kHz. all
operating modes
%
120dBSPL
1.0
Acoustic
Overload Point
10% THD
Measuring 2nd to 5th
dBSPL harmonics; 1kHz. all
operating modes
122
Group Delay
250Hz
600Hz
1kHz
4kHz
75Hz
1kHz
4kHz
60
12
7
µs
°
3.5
20
0.5
-2
Phase
Response
Directivity
Polarity
Omnidirectional
Positive pressure increases density of 1's,
negative pressure decreases density of 1's in
data output
3
Parameter not subject to productive test. Verified by laboratory characterization / design.
Datasheet
6
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Electrical characteristics and parameters
3
Electrical characteristics and parameters
3.1
Absolute maximum ratings
Stresses at or above the listed maximum ratings may affect device reliability or cause permanent device
damage. Functional device operation at these conditions is not guaranteed.
Table 4
Absolute maximum ratings
Parameter
Symbol
Min.
Values
Unit
Note / Test Condition
Max.
3.6
Voltage on any Pin
Vmax
V
Storage Temperature
Ambient Temperature
TS
TA
-40
-40
125
85
°C
°C
3.2
Electrical parameters
Table 5
Electrical parameters and digital interface input
Parameter
Symbol
Values
Typ.
1.8
Unit Note / Test Condition
Min.
Max.
3.6
4)
Supply Voltage
VDD
1.62
V
5)
Clock
Frequency
Range
Standby Mode
fclock
350
850
kHz
Low Power
Mode
450
768
kHz
Normal Mode
1.2
2.0
2.9
1.536
2.4
1.65
2.6
MHz
MHz
MHz
High
Performance
Mode
3.072
3.3
Ultrasonic
Mode
4.56
4.8
5.04
MHz
VDD Ramp-up Time
Input Logic Low Level
Input Logic High Level
Clock Rise/Fall Time
Clock Duty Cycle
50
0.35xVDD
VDD+0.3
13
ms
V
Time until VDD ≥ VDD_min
VIL
-0.3
VIH
0.65xVDD
V
ns
%
%
pF
10% to 90%
fclock≤ 3MHz
fclock> 3MHz
40
48
60
52
Output Load Capacitance on
DATA
Cload
200
4
A 1μF bypass capacitor shall be placed close to the microphone VDD pad to ensure best SNR performance.
5
Data pad is high impedance in standby mode.
Datasheet
7
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Electrical characteristics and parameters
3.3
Electrical characteristics
Test conditions (unless otherwise specified in the table): VDD = 1.8V, TA = 25°C, 55% R.H.
Table 6
General electrical characteristics
Parameter
Symbol
Min.
Values
Typ.
Unit Note / Test Condition
Max.
1
Current
Consumption
Clock Off Mode
Iclock_off
Istandby
IDD
μA
CLOCK pulled low
No load on DATA
<5pF load on DATA
Standby Mode
fclock = 768kHz
fclock = 1.536MHz
fclock = 2.4MHz
fclock = 3.072MHz
fclock = 4.8MHz
25
50
280
690
750
980
900
310
770
945
1120
1000
20
Short Circuit Current
1
mA
Grounded DATA pin
Power Supply Rejection
PSR1k_NM
-80
-86
dBFS 100mVpp sine wave on
VDD swept from 200Hz to
20kHz.
PSR217_NM
dBFS(A) 100mVrms, 217Hz square
wave on VDD. A-weighted.
Startup Time 0.5dB
sensitivity
20
50
20
50
ms
Time to start up in any
operating modes afer
VDD_min and CLOCK have
been applied.6)
accuracy
0.2dB
sensitivity
accuracy
Mode Switch
Time
0.5dB
sensitivity
accuracy
ms
Time to switch between
operating modes. VDD
remains on during the
mode switch.6)
0.2dB
sensitivity
accuracy
Output Logic Low Level
Output Logic High Level
Delay Time for DATA Driven
VOL
VOH
tDD
0.3xVDD
80
V
0.7xVDD
40
ns
Delay time from CLOCK
edge (0.5xVDD) to DATA
driven.
Delay Time for DATA High-Z7)
tHZ
5
30
ns
Delay time from CLOCK
edge (0.5xVDD) to DATA
high impedance state
(table continues...)
6
Verified at typical PDM clock frequencies for each power mode.
thold is dependent on Cload
7
Datasheet
8
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Electrical characteristics and parameters
Table 6
(continued) General electrical characteristics
Parameter
Symbol
Values
Typ.
Unit Note / Test Condition
Min.
Max.
Delay Time for DATA Valid8)
Power-on behaviour
tDV
100
ns
Delay time from CLOCK
edge (0.5xVDD) to DATA
valid (<0.3xVDD or
>0.7xVDD
)
Idle tone is output over PDM within 3ms of applying VDD and fclock, remains
until a valid microphone signal is available. Idle tone consists of alternating
1s and 0s, representing a zero input signal.
Figure 10
Timing diagram
3.4
Audio DC offset
The DC output level encoded in the DC bit stream is determined by the L/R state on startup. In each case the DC
output level is stable over time and does not vary with input signal level.
Table 7
DC output level using L/R pin
LR state
DC output level (typical)
Unit
dBFS
dBFS
LR = GND
LR = VDD
-80
-40
8
Load on data: Cload=100pF, Rload=100kΩ
Datasheet
9
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Electrical characteristics and parameters
3.5
Stereo PDM configuration
The IM73D122V01 is designed to function in circuits with one or two microphones on the PDM bus. When
two microphones are connected, data is transmitted alternately according to the L/R pin status of each
microphone. When two microphones are connected to a shared PDM bus, the power modes of both
microphones will be the same as both are controlled by the same PDM clock. The performance is unchanged
relative to a single microphone per bus configuration.
Table 8
PDM channel configuration using L/R pin.
Channel
DATA1
Data driven
Data high-Z
L/R connection
Falling clock edge
Rising clock edge
Rising clock edge
Falling clock edge
GND
VDD
DATA2
Figure 11
Typical stereo mode configuration
Note:
For best performance it is strongly recommended to place a 100nF (CVDD_typical) capacitor between VDD
and ground. The capacitor should be placed as close to VDD as possible. A termination resistor (RTERM
of about 100Ω may be added to reduce the ringing and overshoot on the output signal.
)
Datasheet
10
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Package information
4
Package information
Figure 12
Table 9
IM73D122V01 package drawing
IM73D122V01 pin configuration
Pin Number
Name
DATA
VDD
Description
1
2
3
4
5
PDM data output
Power supply
CLOCK
LR
PDM clock input
PDM lefꢀriꢁgt select
Ground
GND
Datasheet
11
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Footprint and stencil recommendation
5
Footprint and stencil recommendation
The acoustic port hole diameter in the PCB should be larger than the acoustic port hole diameter of the MEMS
microphone to ensure optimal performance. A PCB sound port size of radius 0.4 mm (diameter 0.8mm) is
recommended.
The board pad and stencil aperture recommendations shown in Figure 13 are based on Solder Mask Defined
(SMD) pads. The specific design rules of the board manufacturer should be considered for individual design
optimizations or adaptations.
Figure 13
IM73D122V01 footprint and stencil recommendation
Note:
Dimensions are in millimeters unless otherwise specified
Datasheet
12
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Packing information
6
Packing information
For shipping and assembly the Infineon microphones are packed in product specific tape-and-reel carriers. A
detailed drawing of the carrier can be seen in Figure 14.
Figure 14
IM73D122V01 tape and reel packing information
Datasheet
13
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Reflow soldering and board assembly
7
Reflow soldering and board assembly
Infineon MEMS microphones are qualified in accordance with the IPC/JEDEC J-STD-020D-01. The moisture
sensitivity level of MEMS microphones is rated as MSL1. For PCB assembly of the MEMS microphone the widely
used reflow soldering using a forced convection oven is recommended.
The soldering profile should be in accordance with the recommendations of the solder paste manufacturer
to reach an optimal solder joint quality. The reflow profile shown in Figure 15 is recommended for board
manufacturing with Infineon MEMS microphones.
Figure 15
Table 10
Recommended reflow profile
Reflow profile limits
Profile feature
Temperature Min (Tsmin
Pb-Free assembly
150 °C
Sn-Pb Eutectic assembly
100 °C
)
Temperature Max (Tsmax
Time (Tsmin to Tsmax) (ts)
Ramp-up rate (TL to TP)
)
200 °C
150 °C
60-120 seconds
3 °C/second max.
217 °C
60-120 seconds
3 °C/second max.
183 °C
Liquidous temperature (TL)
Time (tL) maintained above TL
Peak Temperature (Tp)
60-150 seconds
260°C +0°C/-5°C
60-150 seconds
235°C +0°C/-5°C
Time within 5°C of actual peak
temperature (tp) 9)
20-40 seconds
10-30 seconds
Ramp-down rate
6 °C/second max.
8 minutes max.
6 °C/second max.
6 minutes max.
Time 25°C to peak temperature
Note:
For further information please consult the 'General recommendation for assembly of Infineon
packages' document which is available on the Infineon Technologies web page
9
Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum
14
Datasheet
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Reflow soldering and board assembly
The MEMS microphones can be handled using industry standard pick and place equipment. Care should be
taken to avoid damage to the microphone structure as follows:
•
•
•
•
•
Do not pick the microphone with vacuum tools which make contact with the microphone acoustic port
hole.
The microphone acoustic port hole should not be exposed to vacuum, this can destroy or damage the
MEMS.
Do not blow air into the microphone acoustic port hole. If an air blow cleaning process is used, the port
hole must be sealed to prevent particle contamination.
It is recommended to perform the PCB assembly in a clean room environment in order to avoid
microphone contamination.
Air blow and ultrasonic cleaning procedures shall not be applied to MEMS Microphones. A no-clean paste
is recommended for the assembly to avoid subsequent cleaning steps. The microphone MEMS can be
severely damaged by cleaning substances.
•
•
To prevent the blocking or partial blocking of the sound port during PCB assembly, it is recommended to
cover the sound port with protective tape during PCB sawing or system assembly.
Do not use excessive force to place the microphone on the PCB. The use of industry standard pick and
place tools is recommended in order to limit the mechanical force exerted on the package.
Datasheet
15
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Reliability specifications
8
Reliability specifications
The microphone sensitivity afer stress must deviate by no more than 3dB from the initial value.
Table 11
Test
Reliability specification
Abbreviation Test Condition
Standard
Ta=-40°C, VDD=3.6V, 1000 hours JESD22-A108
Ta=-40°C, 1000 hours JESD22-A119
Low Temperature Operating Life
Low Temperature Storage Life
High Temperature Operation Life
High Temperature Storage Life
LTOL
LTSL
HTOL
HTSL
Ta=+125°C, VDD=3.6V, 1000 hours JESD22-A108
JESD22-A103
Ta=+125°C, 1000 hours
Temperature Cycling
Temperature Humidity Bias
Vibration Test
PC + TC
PC + THB
VVF
Pre conditioning MSL-1
JESD22-A113
1000 cycles, -40°C to +125°C, 30 JESD22-A104
minutes per cycle
Pre conditioning MSL-1
JESD22-A113
Ta=+85°C, R.H = 85%, VDD=3.6V, JESD22-A101
1000 hours
20Hz to 2000Hz with a peak
acceleration of 20g in X, Y, and
Z for 4 minutes each, total 4
-cycles
IEC 60068-2-6
Mechanical Shock
Reflow Solder10)
MS
10000g/0.1msec direction x,y,z, IEC 60068-2-27
5 shocks in each direction, 5
shocks in total
RS
3 reflow cycles, peak
temperature = +260°C
IPC-JEDEC J-
STD-020D-01
Electrostatic Discharge -System
Level Test
ESD - SLT
3 discharges of 8kV direct
contact to lid while Vdd is
IEC-61000-4-2
supplied according to the
operational modes; (Vdd ground
is separated from earth ground)
Electrostatic Discharge - Human
Body Model
ESD - HBM 1 pulse of 2kV between all I/O
pin combinations
JEDEC-JS001
JEDEC JS-002
Electrostatic Discharge - Charged
Device Model
ESD - CDM 3 discharges of 500V direct
contact to I/O pins.
10
The microphone sensitivity must deviate by no more than 1dB from the initial value afer 3 reflow cycles.
16
Datasheet
1.00
2022-08-12
IM73D122V01
Ultra-low noise high sensitivity digital XENSIVTM MEMS microphone
Revision history
Revision history
Document
Date of
Description of changes
version
release
v1.00
2022-08-12
Initial release
Glossary
Datasheet
17
1.00
2022-08-12
Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2022-08-12
Published by
Infineon Technologies AG
81726 Munich, Germany
Important notice
Warnings
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics (“Bescgaffengeitsꢁarantie”).
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer’s compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or
any consequences of the use thereof can reasonably
be expected to result in personal injury.
©
2022 Infineon Technologies AG
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
Document reference
IFX-otw1628687092342
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer’s technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to such
application.
相关型号：
©2020 ICPDF网 联系我们和版权申明