IPB80N06S2L06ATMA2 [INFINEON]

Power Field-Effect Transistor, 80A I(D), 55V, 0.0084ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, GREEN, PLASTIC, TO-263, 3 PIN;
IPB80N06S2L06ATMA2
型号: IPB80N06S2L06ATMA2
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 80A I(D), 55V, 0.0084ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, GREEN, PLASTIC, TO-263, 3 PIN

ATM 异步传输模式 PC 脉冲 晶体管
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IPB80N06S2L-06  
IPP80N06S2L-06  
OptiMOS® Power-Transistor  
Product Summary  
Features  
VDS  
55  
6.3  
80  
V
• N-channel Logic Level - Enhancement mode  
R
DS(on),max (SMD version)  
m  
A
• Automotive AEC Q101 qualified  
• MSL1 up to 260°C peak reflow  
• 175°C operating temperature  
Green package (lead free)  
• Ultra low Rds(on)  
I D  
PG-TO263-3-2  
PG-TO220-3-1  
• 100% Avalanche tested  
Type  
Package  
Ordering Code Marking  
IPB80N06S2L-06  
IPP80N06S2L-06  
PG-TO263-3-2  
PG-TO220-3-1  
SP0002-18163  
SP0002-18824  
2N06L06  
2N06L06  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol  
Conditions  
Unit  
Continuous drain current1)  
I D  
T C=25 °C, VGS=10 V  
T C=100 °C,  
80  
80  
A
V
GS=10 V2)  
Pulsed drain current2)  
Avalanche energy, single pulse2)  
Gate source voltage4)  
I D,pulse  
EAS  
T C=25 °C  
I D= 80 A  
320  
530  
mJ  
V
VGS  
±20  
Ptot  
T C=25 °C  
Power dissipation  
250  
W
°C  
T j, T stg  
Operating and storage temperature  
-55 ... +175  
Rev. 1.0  
page 1  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
Values  
Parameter  
Symbol  
Conditions  
Unit  
min.  
typ.  
max.  
Thermal characteristics2)  
R thJC  
R thJA  
R thJA  
Thermal resistance, junction - case  
-
-
-
-
0.6  
62  
K/W  
Thermal resistance, junction -  
ambient, leaded  
SMD version, device on PCB  
minimal footprint  
-
-
-
-
62  
40  
6 cm2 cooling area5)  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V(BR)DSS  
VGS(th)  
V
V
GS=0 V, I D= 1 mA  
Drain-source breakdown voltage  
Gate threshold voltage  
55  
-
-
V
DS=VGS, I D=180 µA  
1.2  
1.6  
2.0  
V
DS=55 V, VGS=0 V,  
I DSS  
Zero gate voltage drain current  
-
-
0.01  
1
1
µA  
T j=25 °C  
V
DS=55 V, VGS=0 V,  
100  
T j=125 °C2)  
I GSS  
V
V
GS=20 V, VDS=0 V  
GS=4.5 V, I D=69 A  
Gate-source leakage current  
-
-
1
100 nA  
R DS(on)  
Drain-source on-state resistance  
6.1  
8.4  
8.1  
6.3  
6
mΩ  
V
GS=4.5 V, I D=69 A,  
-
-
-
5.8  
6.1  
4.8  
SMD version  
RDS(on)  
V
GS=10 V, I D=69 A,  
Drain-source on-state resistance  
m  
V
GS=10 V, I D=69 A,  
SMD version  
Rev. 1.0  
page 2  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
Values  
Parameter  
Symbol  
Conditions  
Unit  
min.  
typ.  
max.  
Dynamic characteristics2)  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
C oss  
Crss  
t d(on)  
t r  
-
-
-
-
-
-
-
3800  
890  
240  
11  
-
-
-
-
-
-
-
pF  
ns  
V
GS=0 V, VDS=25 V,  
f =1 MHz  
21  
V
DD=30 V, VGS=10 V,  
I D=80 A, R G=1.6 Ω  
t d(off)  
t f  
Turn-off delay time  
Fall time  
60  
20  
Gate Charge Characteristics2)  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
13  
38  
17  
60  
150  
-
nC  
Q gd  
V
V
DD=44 V, I D=80 A,  
GS=0 to 10 V  
Q g  
114  
3.5  
Vplateau  
Gate plateau voltage  
V
A
Reverse Diode  
Diode continous forward current2)  
Diode pulse current2)  
I S  
-
-
-
-
80  
T C=25 °C  
I S,pulse  
320  
V
GS=0 V, I F=80 A,  
VSD  
Diode forward voltage  
Reverse recovery time2)  
Reverse recovery charge2)  
-
-
-
0.9  
60  
92  
1.3  
76  
V
T j=25 °C  
VR=30 V, I F=I S,  
diF/dt =100 A/µs  
t rr  
ns  
Q rr  
115 nC  
1) Current is limited by bondwire; with an R thJC = 0.6 K/W the chip is able to carry 138 A at 25°C. For detailed  
information see Application Note ANPS071E at www.infineon.com/optimos  
2) Defined by design. Not subject to production test.  
3) See diagram 13  
4) Qualified at -20V and +20V.  
5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain  
connection. PCB is vertical in still air.  
Rev. 1.0  
page 3  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
1 Power dissipation  
2 Drain current  
P
tot = f(T C); VGS 4 V  
I D = f(T C); VGS 10 V  
300  
250  
200  
150  
100  
50  
100  
80  
60  
40  
20  
0
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
T
C [°C]  
T
C [°C]  
3 Safe operating area  
4 Max. transient thermal impedance  
thJC = f(t p)  
I D = f(VDS); T C = 25 °C; D = 0  
parameter: t p  
Z
parameter: D =t p/T  
100  
1000  
100  
10  
0.5  
1 µs  
10 µs  
100 µs  
10-1  
0.1  
1 ms  
0.05  
10-2  
0.01  
single pulse  
10-3  
1
10-7  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
0.1  
1
10  
100  
t p [s]  
V
DS [V]  
Rev. 1.0  
page 4  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
5 Typ. output characteristics  
I D = f(VDS); T j = 25 °C  
parameter: VGS  
6 Typ. drain-source on-state resistance  
DS(on) = (I D); T j = 25 °C  
R
parameter: VGS  
300  
16  
10 V  
3 V  
3.5 V  
14  
12  
10  
8
250  
200  
150  
100  
50  
4 V  
4 V  
3.5 V  
4.5 V  
6
10 V  
3 V  
4
2.5 V  
0
2
0
2
4
6
8
10  
0
20  
40  
60  
80  
100  
120  
I
D [A]  
V
DS [V]  
7 Typ. transfer characteristics  
I D = f(VGS); VDS = 6V  
parameter: T j  
8 Typ. Forward transconductance  
g fs = f(I D); T j = 25°C  
parameter: g fs  
200  
180  
160  
140  
120  
100  
80  
250  
200  
150  
100  
50  
60  
40  
175 °C  
20  
25 °C  
-55 °C  
0
0
1
2
3
4
0
50  
100  
150  
200  
I
D [A]  
V
GS [V]  
Rev. 1.0  
page 5  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
9 Typ. Drain-source on-state resistance  
DS(ON) = f(T j)  
10 Typ. gate threshold voltage  
GS(th) = f(T j); VGS = VDS  
R
V
parameter: I D = 80 A; VGS = 10 V  
parameter: I D  
12  
2.5  
10  
8
2
1.5  
1
900 µA  
180 µA  
6
4
0.5  
2
0
-60  
-20  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
T j [°C]  
100  
140  
180  
T j [°C]  
11 Typ. capacitances  
12 Typical forward diode characteristicis  
C = f(VDS); VGS = 0 V; f = 1 MHz  
IF = f(VSD)  
parameter: T j  
104  
103  
Ciss  
102  
Coss  
103  
25 °C  
175 °C  
101  
Crss  
102  
100  
0
5
10  
15  
20  
25  
30  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
V
DS [V]  
V
SD [V]  
Rev. 1.0  
page 6  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
13 Typical avalanche energy  
AS = f(T j)  
14 Typ. gate charge  
E
V
GS = f(Q gate); I D = 80 A pulsed  
parameter: I D  
900  
12  
10  
8
50 A  
800  
44 V  
11 V  
700  
60 A  
600  
80 A  
500  
6
400  
300  
200  
100  
4
2
0
0
0
50  
100  
150  
200  
0
20  
40  
60  
80  
100  
120  
140  
T j [°C]  
Q gate [nC]  
15 Typ. drain-source breakdown voltage  
16 Gate charge waveforms  
V
BR(DSS) = f(T j); I D = 1 mA  
66  
64  
62  
60  
58  
56  
54  
52  
50  
48  
46  
VGS  
Qg  
Qgate  
Qgd  
Qgs  
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
Rev. 1.0  
page 7  
2006-03-13  
IPB80N06S2L-06  
IPP80N06S2L-06  
Published by  
Infineon Technologies AG  
St.-Martin-Straße 53  
D-81541 München  
© Infineon Technologies AG 2004  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be considered as  
a guarantee of characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,  
regarding circuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices, please contact your  
nearest Infineon Technologies Office (www.infineon.com)  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact your nearest Infineon Technologies Office.  
effectiveness of that device or system. Life support devices or systems are intended to be implanted  
in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons may be endangered.  
Rev. 1.0  
page 8  
2006-03-13  

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