IPP60R125CP_07 [INFINEON]

CoolMOSTM Power Transistor; CoolMOSTM功率晶体管
IPP60R125CP_07
型号: IPP60R125CP_07
厂家: Infineon    Infineon
描述:

CoolMOSTM Power Transistor
CoolMOSTM功率晶体管

晶体 晶体管
文件: 总10页 (文件大小:323K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IPP60R125CP  
CoolMOSTM Power Transistor  
Features  
Product Summary  
DS @ Tj,max  
R DS(on),max  
Q g,typ  
V
650  
0.125  
53  
V
• Lowest figure-of-merit RONxQg  
• Ultra low gate charge  
nC  
• Extreme dv/dt rated  
• High peak current capability  
• Qualified according to JEDEC1) for target applications  
PG-TO220  
• Pb-free lead plating; RoHS compliant  
CoolMOS CP is specially designed for:  
• Hard switching topologies, for Server and Telecom  
Type  
Package  
Ordering Code  
Marking  
IPP60R125CP  
PG-TO220  
SP000088488  
6R125P  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
T C=25 °C  
T C=100 °C  
T C=25 °C  
25  
16  
Continuous drain current  
A
Pulsed drain current2)  
82  
I D,pulse  
E AS  
I D=11 A, V DD=50 V  
I D=11 A, V DD=50 V  
Avalanche energy, single pulse  
Avalanche energy, repetitive t AR  
708  
1.2  
mJ  
2),3)  
2),3)  
E AR  
I AR  
11  
A
Avalanche current, repetitive t AR  
MOSFET dv /dt ruggedness  
Gate source voltage  
V
DS=0...480 V  
50  
dv /dt  
V GS  
V/ns  
V
±20  
±30  
208  
-55 ... 150  
60  
static  
AC (f >1 Hz)  
T C=25 °C  
P tot  
Power dissipation  
W
T j, T stg  
Operating and storage temperature  
Mounting torque  
°C  
M3 and M3.5 screws  
page 1  
Ncm  
Rev. 2.2  
2007-08-28  
IPP60R125CP  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
16  
Parameter  
Symbol Conditions  
Unit  
I S  
Continuous diode forward current  
Diode pulse current2)  
A
T C=25 °C  
I S,pulse  
82  
Reverse diode dv /dt 4)  
dv /dt  
15  
V/ns  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Thermal characteristics  
R thJC  
Thermal resistance, junction - case  
-
-
-
-
0.6  
62  
K/W  
Thermal resistance, junction -  
ambient  
R thJA  
leaded  
Soldering temperature,  
wavesoldering only allowed at leads  
1.6 mm (0.063 in.)  
from case for 10 s  
T sold  
-
-
260 °C  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS  
V GS(th)  
V
V
GS=0 V, I D=250 µA  
DS=V GS, I D=1.1 mA  
Drain-source breakdown voltage  
Gate threshold voltage  
600  
2.5  
-
-
V
3
3.5  
V
DS=600 V, V GS=0 V,  
I DSS  
Zero gate voltage drain current  
-
-
2
-
µA  
T j=25 °C  
V
DS=600 V, V GS=0 V,  
-
-
-
20  
-
T j=150 °C  
I GSS  
V
V
GS=20 V, V DS=0 V  
GS=10 V, I D=16 A,  
Gate-source leakage current  
100 nA  
R DS(on)  
Drain-source on-state resistance  
0.11  
0.125  
T j=25 °C  
V
GS=10 V, I D=16 A,  
-
-
0.30  
2.1  
-
T j=150 °C  
R G  
Gate resistance  
f =1 MHz, open drain  
-
Rev. 2.2  
page 2  
2007-08-28  
IPP60R125CP  
Values  
typ.  
Parameter  
Symbol Conditions  
Unit  
min.  
max.  
Dynamic characteristics  
C iss  
Input capacitance  
-
-
2500  
120  
-
-
pF  
ns  
V
GS=0 V, V DS=100 V,  
f =1 MHz  
C oss  
Output capacitance  
Effective output capacitance, energy  
C o(er)  
-
-
110  
300  
-
-
related5)  
V
GS=0 V, V DS=0 V  
Effective output capacitance, time  
to 480 V  
C o(tr)  
related6)  
t d(on)  
t r  
t d(off)  
t f  
Turn-on delay time  
-
-
-
-
15  
5
-
-
-
-
V
V
DD=400 V,  
GS=10 V, I D=16 A,  
Rise time  
Turn-off delay time  
Fall time  
50  
5
R G=3.3  
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
12  
18  
53  
5.0  
-
-
nC  
Q gd  
V
V
DD=400 V, I D=16 A,  
GS=0 to 10 V  
Q g  
70  
-
V plateau  
Gate plateau voltage  
V
V
Reverse Diode  
V
GS=0 V, I F=16 A,  
V SD  
Diode forward voltage  
-
0.9  
1.2  
T j=25 °C  
t rr  
Reverse recovery time  
-
-
-
430  
9
-
-
-
ns  
µC  
A
V R=400 V, I F=I S,  
di F/dt =100 A/µs  
Q rr  
I rrm  
Reverse recovery charge  
Peak reverse recovery current  
42  
1) J-STD20 and JESD22  
2) Pulse width t p limited by T j,max  
3) Repetitive avalanche causes additional power losses that can be calculated asP AV=E AR*f.  
4)  
I
SD  
=ID, di/dt<=200A/µs, VDClink=400V, Vpeak<V(BR)DSS, Tj<Tjmax, identical low side and high side switch.  
5) C o(er) is a fixed capacitance that gives the same stored energy asC oss while V DS is rising from 0 to 80% V DSS.  
6) C o(tr) is a fixed capacitance that gives the same charging time asC oss while V DS is rising from 0 to 80% V DSS.  
Rev. 2.2  
page 3  
2007-08-28  
IPP60R125CP  
1 Power dissipation  
2 Safe operating area  
I D=f(V DS); T C=25 °C; D =0  
parameter: t p  
P
tot=f(T C)  
102  
250  
limited by on-state  
resistance  
1 µs  
10 µs  
200  
150  
100  
50  
100 µs  
1 ms  
10 ms  
101  
DC  
100  
10-1  
0
0
100  
101  
102  
103  
40  
80  
120  
160  
T
C [°C]  
V DS [V]  
3 Max. transient thermal impedance  
thJC=f(t P)  
4 Typ. output characteristics  
I D=f(V DS); T j=25 °C  
Z
parameter: D=t p/T  
parameter: V GS  
100  
120  
105  
90  
75  
60  
45  
30  
15  
0
8 V  
10 V  
20 V  
0.5  
0.2  
7 V  
10-1  
0.1  
6 V  
0.05  
0.02  
5.5 V  
0.01  
5 V  
4.5 V  
single pulse  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
0
5
10  
DS [V]  
15  
20  
t
p [s]  
V
Rev. 2.2  
page 4  
2007-08-28  
IPP60R125CP  
5 Typ. output characteristics  
I D=f(V DS); T j=150 °C  
parameter: V GS  
6 Typ. drain-source on-state resistance  
DS(on)=f(I D); T j=150 °C  
R
parameter: V GS  
50  
40  
30  
20  
10  
0
0.5  
6 V  
7 V  
6.5 V  
5 V  
5.5 V  
8 V  
6 V  
7 V  
10 V  
20 V  
0.4  
0.3  
0.2  
0.1  
20 V  
5.5 V  
5 V  
4.5 V  
0
0
0
5
10  
DS [V]  
15  
20  
10  
20  
30  
40  
50  
I
D [A]  
V
7 Drain-source on-state resistance  
8 Typ. transfer characteristics  
I D=f(V GS); |V DS|>2|I D|R DS(on)max  
parameter: T j  
R
DS(on)=f(T j); I D=16 A; V GS=10 V  
0.4  
120  
80  
40  
0
C °25  
0.3  
0.2  
C °150  
98 %  
typ  
0.1  
0
-60  
-20  
20  
60  
100  
140  
180  
0
2
4
6
8
10  
T j [°C]  
V GS [V]  
Rev. 2.2  
page 5  
2007-08-28  
IPP60R125CP  
9 Typ. gate charge  
GS=f(Q gate); I D=16 A pulsed  
10 Forward characteristics of reverse diode  
I F=f(V SD  
V
)
parameter: V DD  
parameter: T j  
102  
10  
9
8
7
6
5
4
3
2
1
0
25 °C, 98%  
150 °C, 98%  
120 V  
25 °C  
400 V  
150 °C  
101  
100  
10-1  
0
0.5  
1
1.5  
2
0
10  
20  
30  
gate [nC]  
40  
50  
60  
Q
V
SD [V]  
11 Avalanche energy  
12 Drain-source breakdown voltage  
E
AS=f(T j); I D=11 A; V DD=50 V  
V
BR(DSS)=f(T j); I D=0.25 mA  
800  
700  
600  
400  
200  
0
660  
620  
580  
540  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
T j [°C]  
T j [°C]  
Rev. 2.2  
page 6  
2007-08-28  
IPP60R125CP  
13 Typ. capacitances  
14 Typ. Coss stored energy  
C =f(V DS); V GS=0 V; f =1 MHz  
E oss= f(V DS)  
105  
20  
104  
16  
12  
8
Ciss  
103  
102  
Coss  
101  
4
Crss  
100  
0
0
0
100  
200  
300  
DS [V]  
400  
500  
100  
200  
300  
400  
500  
600  
V
DS [V]  
V
Rev. 2.2  
page 7  
2007-08-28  
IPP60R125CP  
Definition of diode switching characteristics  
Rev. 2.2  
page 8  
2007-08-28  
IPP60R125CP  
PG-TO220-3-1/TO-220-3-21: Outlines  
Dimensions in mm/inches:  
Rev. 2.2  
page 9  
2007-08-28  
IPP60R125CP  
Published by  
Infineon Technologies AG  
81726 München, Germany  
© Infineon Technologies AG 2006.  
All Rights Reserved.  
Attention please!  
The information given in this data sheet shall in no event be regarded as a guarantee of conditions o  
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typica  
values stated herein and/or any information regarding the application of the device, Infineon Technologies  
hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties o  
non-infringement of intellectual property rights of any third party  
Information  
For further information on technology, delivery terms and conditions and prices please contact your neares  
Infineon Technologies Office (www.infineon.com ).  
Warnings  
Due to technical requirements components may contain dangerous substances. For information on the types  
in question please contact your nearest Infineon Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or systems with the express  
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to  
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or  
system. Life support devices or systems are intended to be implanted in the human body, or to support and/or  
maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the  
user or other persons may be endangered.  
Rev. 2.2  
page 10  
2007-08-28  

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