IR2131PBF [INFINEON]

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IR2131PBF
型号: IR2131PBF
厂家: Infineon    Infineon
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驱动器 MOSFET驱动器 驱动程序和接口 接口集成电路 光电二极管 信息通信管理
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Data Sheet No. PD-6.032C  
IR2131  
3 HIGH SIDE AND 3 LOW SIDE DRIVER  
Features  
Product Summary  
n Floating channel designed for bootstrap operation  
Fully operational to +600V  
Tolerant to negative transient voltage  
dV/dt immune  
n Gate drive supply range from 10 to 20V  
n Undervoltage lockout for all channels  
n Over-current shutdown turns off all six drivers  
n Independent 3 high side & 3 low side drivers  
n Matched propagation delay for all channels  
n Outputs out of phase with inputs  
V
600V max.  
200 mA / 420 mA  
10 - 20V  
OFFSET  
I +/-  
O
V
OUT  
t
(typ.)  
1.3 & 0.6 µs  
700 ns  
on/off  
Deadtime (typ.)  
Packages  
Description  
The IR2131 is a high voltage, high speed power  
MOSFET and IGBT driver with three independent high  
and low side referenced output channels. Proprietary  
HVIC technology enables ruggedized monolithic  
construction. Logic inputs are compatible with 5V  
CMOS or LSTTL outputs. A current trip function which  
terminates all six outputs can be derived from an  
external current sense resistor. A shutdown input is  
provided for a customized shutdown function. An open  
drain FAULT signal is provided to indicate that any of  
the shutdowns has occurred. The output drivers  
feature a high pulse current buffer stage designed for  
minimum driver cross-conduction. Propagation delays  
are matched to simplify use in high frequency  
applications. The floating channels can be used to  
drive N-channel power MOSFETs or IGBTs in the high  
side configuration which operate up to 600 volts.  
Typical Connection  
CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL  
B-157  
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IR2131  
Absolute Maximum Ratings  
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-  
eters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured  
under board mounted and still air conditions. Additional Information is shown in Figures 7 through 10.  
Parameter  
Definition  
Value  
Symbol  
Min.  
Max.  
Units  
V
V
High Side Floating Supply Voltage  
High Side Floating Offset Voltage  
High Side Floating Output Voltage  
Low Side and Logic Fixed Supply Voltage  
Logic Ground  
-0.3  
525  
B1,2,3  
S1,2,3  
V
- 25  
V
+ 0.3  
B1,2,3  
B1,2,3  
V
V
- 0.3  
V
+ 0.3  
B1,2,3  
HO1,2,3  
S1,2,3  
V
-0.3  
25  
+ 0.3  
CC  
V
V
V
- 25  
V
V
V
V
SS  
CC  
CC  
CC  
CC  
CC  
V
Low Side Output Voltage  
-0.3  
+ 0.3  
+ 0.3  
+ 0.3  
LO1,2,3  
V
Logic Input Voltage (HIN1,2,3 ,LIN1,2,3,FLT -CLR,SD &ITRIP)  
FAULT Output Voltage  
V
V
- 0.3  
- 0.3  
IN  
SS  
SS  
V
FLT  
dV /dt  
Allowable Offset Supply Voltage Transient  
50  
V/ns  
W
S
P
D
Package Power Dissipation @ T +25°C  
(28 Lead DIP)  
(28 Lead SOIC)  
(44 Lead PLCC)  
(28 Lead DIP)  
-55  
1.5  
1.6  
2.0  
83  
A
R
Thermal Resistance, Junction to Ambient  
θJA  
(28 Lead SOIC)  
(44 Lead PLCC)  
78  
°C/W  
°C  
63  
T
J
Junction Temperature  
150  
150  
300  
T
S
Storage Temperature  
T
Lead Temperature (Soldering, 10 seconds)  
L
Recommended Operating Conditions  
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the  
recommended conditions. All voltage parameters are absolute voltages referenced to COM. The V offset rating is  
S
tested with all supplies biased at 15V differential.  
Parameter  
Definition  
High Side Floating Supply Voltage  
High Side Floating Offset Voltage  
High Side Floating Output Voltage  
Low Side and Logic Fixed Supply Voltage  
Logic Ground  
Value  
Symbol  
Min.  
Max.  
Units  
V
V
V
V
+ 10  
V
+ 20  
S1,2,3  
B1,2,3  
S1,2,3  
S1,2,3  
Note 1  
600  
V
V
V
B1,2,3  
HO1,2,3  
S1,2,3  
V
CC  
10  
20  
V
-5  
0
5
SS  
LO1,2,3  
V
Low Side Output Voltage  
V
CC  
HIN1,2,3 LIN1,2,3  
V
Logic Input Voltage (  
,
,FLT -CLR, SD &ITRIP)  
V
V
V
+ 5  
SS  
IN  
SS  
SS  
V
FAULT Output Voltage  
V
CC  
FLT  
T
A
Ambient Temperature  
-40  
125  
°C  
Note 1: Logic operational for V of -5V to +600V. Logic state held for V of -5V to -V  
.
S
S
BS  
B-158 CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL  
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IR2131  
Dynamic Electrical Characteristics  
V
(V , V  
CC BS1,2,3  
) = 15V, V  
= V  
= COM, C = 1000 pF and T = 25°C unless otherwise specified. The  
SS L A  
BIAS  
S1,2,3  
dynamic electrical characteristics are defined in Figures 4 through 5.  
Parameter  
Definition  
Value  
Min. Typ. Max. Units Test Conditions  
Symbol  
t
Turn-On Propagation Delay  
Turn-Off Propagation Delay  
Turn-On Rise Time  
0.6  
0.2  
1.3  
0.6  
80  
2.0  
1.0  
on  
µs  
ns  
t
V
= 0 & 5V  
off  
IN  
t
150  
100  
V
= 0 to 600V  
S1,2,3  
r
t
Turn-Off Fall Time  
40  
f
t
ITRIP to Output Shutdown Propagation Delay  
ITRIP Blanking Time  
400  
700 1000  
400  
700 1000  
310  
V
, V  
IN ITRIP  
= 0 & 5V  
= 1V  
itrip  
t
V
ITRIP  
bl  
t
ITRIP to FAULT Indication Delay  
Input Filter Time (All Six Inputs)  
FLT -CLR to FAULT Clear Time  
SD to Output Shutdown Propagation Delay  
Deadtime  
400  
V , V = 0 & 5V  
IN ITRIP  
flt  
t
V
= 0 & 5V  
flt,in  
IN  
t
400  
400  
400  
700 1000  
700 1000  
700 1200  
V , V , V = 0&5V  
IN IT FC  
fltclr  
t
V , V = 0 & 5V  
IN SD  
sd  
DT  
V
= 0 & 5V  
IN  
Static Electrical Characteristics  
V
(V , V  
BIAS CC BS1,2,3  
) = 15V, V  
= V = COM and T = 25°C unless otherwise specified.The V , V and I  
S1,2,3 SS A IN TH IN  
parameters are referenced to V and are applicable to all six logic input leads: HIN1,2,3 & LIN1,2,3. The V and I  
O
SS  
O
parameters are referenced to COM and V  
and are applicable to the respective output leads: HO1,2,3 or LO1,2,3.  
S1,2,3  
Parameter  
Value  
Symbol  
Definition  
Min. Typ. Max. Units Test Conditions  
V
Logic “0” Input Voltage (OUT = LO)  
Logic “1” Input Voltage (OUT = HI)  
Logic “0” Fault Clear Input Voltage  
Logic “1” Fault Clear Input Voltage  
Shutdown Input Positive Going Threshold  
Shutdown Input Negative Going Threshold  
ITRIP Input Positive Going Threshold  
ITRIP Input Negative Going Threshold  
2.2  
IH  
V
0.8  
IL  
FCLR,IH  
V
2.2  
V
V
0.8  
FCLR,IL  
V
1.2  
0.9  
250  
200  
1.8  
1.5  
485  
400  
2.1  
SD,TH+  
V
1.8  
SD,TH-  
V
600  
550  
100  
100  
50  
IT,TH+  
V
IT,TH-  
mV  
V
OH  
High Level Output Voltage, V  
- VO  
V
V
= 0V, I = 0A  
O
BIAS  
IN  
IN  
V
Low Level Output Voltage, VO  
Offset Supply Leakage Current  
= 5V, I = 0A  
O
OL  
LK  
I
V = V = 600V  
B S  
µA  
I
Quiescent V Supply Current  
30  
3.0  
190  
50  
75  
100  
4.5  
V
= 0V or 5V  
= 0V or 5V  
QBS  
BS  
IN  
IN  
I
Quiescent V Supply Current  
mA  
V
QCC  
CC  
I
Logic “1” Input Bias Current (OUT = HI)  
Logic “0” Input Bias Current (OUT = LO)  
“High” ITRIP Bias Current  
300  
100  
150  
100  
250  
150  
150  
100  
V
= 0V  
= 5V  
IN+  
IN  
IN  
I
IN-  
µA  
nA  
µA  
nA  
V
I
ITRIP = 5V  
ITRIP = 0V  
ITRIP+  
I
“Low” ITRIP Bias Current  
ITRIP-  
I
Logic “1” Fault Clear Bias Current  
Logic “0” Fault Clear Bias Current  
Logic “1” Shutdown Bias Current  
Logic “0” Shutdown Bias Current  
125  
75  
75  
FLT -CLR = 0V  
FLT -CLR = 5V  
SD = 5V  
FCLR+  
I
FCLR-  
I
SD+  
I
SD = 0V  
SD-  
CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL B-159  
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IR2131  
Static Electrical Characteristics -- Continued  
V
(V , V  
BIAS CC BS1,2,3  
) = 15V, V  
= V = COM and T = 25°C unless otherwise specified.The V , V and I  
S1,2,3 SS A IN TH IN  
parameters are referenced to V and are applicable to all six logic input leads: HIN1,2,3 & LIN1,2,3 . The V and I  
SS  
O
O
parameters are referenced to COM and V  
and are applicable to the respective output leads: HO1,2,3 or LO1,2,3.  
S1,2,3  
Parameter  
Value  
Symbol  
Definition  
Min. Typ. Max. Units Test Conditions  
V
V
Supply Undervoltage Positive Going  
BS  
8.2  
7.8  
8.2  
7.8  
8.7  
8.3  
8.7  
8.3  
9.2  
8.8  
9.2  
8.8  
BSUV+  
Threshold  
V Supply Undervoltage Negative Going  
BS  
Threshold  
V Supply Undervoltage Positive Going  
CC  
Threshold  
V Supply Undervoltage Negative Going  
CC  
Threshold  
V
BSUV-  
V
V
CCUV+  
V
R
CCUV-  
FAULT Low On-Resistance  
Output High Short Circuit Pulsed Current  
55  
75  
on,FLT  
I
O+  
200  
250  
V = 0V, V = 0V  
O IN  
PW 10 µs  
mA  
I
O-  
Output Low Short Circuit Pulsed Current  
420  
500  
V
O
= 15V, V = 5V  
IN  
PW 10 µs  
Lead Assignments  
28 Lead DIP  
44 Lead PLCC w/o 12 Leads  
IR2131J  
28 Lead SOIC (Wide Body)  
IR2131  
IR2131S  
Part Number  
B-160 CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL  
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IR2131  
Functional Block Diagram  
Lead Definitions  
Lead  
Symbol Description  
Logic inputs for high side gate driver outputs (HO1,2,3), out of phase  
Logic inputs for low side gate driver output (LO1,2,3), out of phase  
Logic input for fault clear  
HIN1,2,3  
LIN1,2,3  
FLT - CLR  
SD  
Logic input for shutdown  
Indicates over-current or undervoltage lockout (low side) has occurred, negative logic  
Low side and logic fixed supply  
Input for over-current shutdown  
Logic ground  
FAULT  
V
CC  
ITRIP  
V
V
SS  
High side floating supplies  
B1,2,3  
HO1,2,3  
High side gate drive outputs  
V
High side floating supply returns  
Low side gate drive outputs  
S1,2,3  
LO1,2,3  
COM  
Low side return  
CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL B-161  
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IR2131  
Device Information  
Process & Design Rule  
Transistor Count  
Die Size  
HVDCMOS 4.0 µm  
700  
167 X 141 X 26 (mil)  
Die Outline  
Thickness of Gate Oxide  
800Å  
Connections  
First  
Material  
Width  
Poly Silicon  
4 µm  
Layer  
Spacing  
Thickness  
Material  
Width  
Spacing  
Thickness  
6 µm  
5000Å  
Al - Si (Si: 1.0% ±0.1%)  
Second  
Layer  
6 µm  
9 µm  
20,000Å  
8 µm X 8 µm  
PSG (SiO2)  
Contact Hole Dimension  
Insulation Layer  
Material  
Thickness  
Material  
1.5 µm  
PSG (SiO2)  
Passivation  
Thickness  
1.5 µm  
Method of Saw  
Method of Die Bond  
Wire Bond  
Full Cut  
Ablebond 84 - 1  
Thermo Sonic  
Au (1.0 mil / 1.3 mil)  
Cu  
Method  
Material  
Material  
Die Area  
Leadframe  
Ag  
Lead Plating  
Types  
Materials  
Pb : Sn (37 : 63)  
28 Lead PDIP & SOIC / 44 Lead PLCC  
EME6300 / MP150 / MP190  
Package  
Remarks:  
B-162 CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL  
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IR2131  
HIN1,2,3  
LIN1,2,3  
ITRIP  
SD  
FLT - CLR  
FAULT  
LO1,2,3  
HO1,2,3  
Figure 1. Input/Output Timing Diagram  
Figure 2. Floating Supply Voltage Transient Test Circuit  
HIN1,2,3  
LIN1,2,3  
50%  
50%  
t
t
r
t
off  
t
f
on  
FLT-CLR  
SD  
90%  
90%  
C0M  
HO1,2,3  
LO1,2,3  
10%  
10%  
Figure 3. Switching Time Test Circuit  
Figure 4. Switching Time Waveform Definitions  
LIN1,2,3  
50%  
HIN1,2,3  
ITRIP  
50%  
50%  
50%  
SD  
FLT - CLR  
50%  
LIN1,2,3  
FAULT  
50%  
50%  
LO1,2,3  
50%  
DT  
50%  
DT  
50%  
50%  
LO1,2,3  
HO1,2,3  
t
t
t
sd  
flt  
fltclr  
t
itrip  
Figure 5. Deadtime Waveform Definitions  
Figure 6. Shutdown Waveform Definitions  
CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL B-163  
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IR2131  
50  
45  
40  
35  
30  
25  
20  
50  
45  
40  
35  
30  
25  
20  
480V  
320V  
480V  
320V  
160V  
0V  
160V  
0V  
1E+2  
1E+3  
1E+4  
1E+5  
1E+2  
1E+3  
1E+4  
1E+5  
Frequency (Hz)  
Frequency (Hz)  
Figure 7. IR2131 TJ vs. Frequency (IRF820)  
Figure 8. IR2131 TJ vs. Frequency (IRF830)  
RGATE = 33, VCC = 15V  
RGATE = 20, VCC = 15V  
100  
140  
120  
100  
80  
480V  
320V  
80  
60  
40  
20  
160V  
0V  
480V  
320V  
60  
160V  
0V  
40  
20  
1E+2  
1E+3  
1E+4  
1E+5  
1E+2  
1E+3  
1E+4  
1E+5  
Frequency (Hz)  
Frequency (Hz)  
Figure 9. IR2131 TJ vs. Frequency (IRF840)  
Figure 10. IR2131 TJ vs. Frequency (IRF450)  
RGATE = 15, VCC = 15V  
RGATE = 10, VCC = 15V  
B-164 CONTROL INTEGRATED CIRCUIT DESIGNERS’ MANUAL  
To Order  

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