IRF300P227 [INFINEON]

300V Single N-Channel StrongIRFET™ in a TO-247AC package;
IRF300P227
型号: IRF300P227
厂家: Infineon    Infineon
描述:

300V Single N-Channel StrongIRFET™ in a TO-247AC package

文件: 总17页 (文件大小:1065K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IRF300P227  
MOSFET  
StrongIRFET™  
VDSS  
300V  
RDS(on) typ.  
33m  
40m  
50A  
max  
Applications  
ID  
UPS and Inverter applications  
Half-bridge and full-bridge topologies  
Resonant mode power supplies  
DC/DC and AC/DC converters  
OR-ing and redundant power switches  
Brushed and BLDC Motor drive applications  
Battery powered circuits  
Benefits  
G
Gate  
D
Drain  
S
Improved Gate, Avalanche and Dynamic dv/dt Ruggedness  
Source  
Fully Characterized Capacitance and Avalanche SOA  
Enhanced body diode dv/dt and di/dt Capability  
Pb-Free ; RoHS Compliant ; Halogen-Free  
Standard Pack  
Base part number  
Package Type  
Orderable Part Number  
Form  
Quantity  
IRF300P227  
TO-247AC  
Tube  
25  
IRF300P227  
60  
45  
30  
15  
125  
105  
85  
I
= 30A  
D
T
= 125°C  
J
65  
45  
T
= 25°C  
J
25  
5
2
0
4
6
8
10 12 14 16 18 20  
25  
50  
T
75  
100  
125  
150  
175  
, Case Temperature (°C)  
V
Gate -to -Source Voltage (V)  
C
GS,  
Figure 1 Typical On-Resistance vs. Gate Voltage  
Figure 2 Maximum Drain Current vs. Case Temperature  
Final Datasheet  
www.infineon.com  
Please read the important Notice and Warnings at the end of this document  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Table of Contents  
Table of Contents  
Applications  
Benefits  
…..………………………………………………………………………...……………..……………1  
…..………………………………………………………………………...……………..…………….1  
Ordering Table ….……………………………………………………………………………………………………1  
Table of Contents ….………………………………………………………………………………………………...2  
1
2
3
4
Parameters ………………………………………………………………………………………………3  
Maximum ratings, Thermal, and Avalanche characteristics ………………………………………4  
Electrical characteristics ………………………………………………………………………………5  
Electrical characteristic diagrams ……………………………………………………………………6  
Package Information ………………………………………………………………………………………………14  
Qualification Information ……………………………………………………………………………………………15  
Revision History …………………………………………………………………………………………..…………16  
2
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Parameters  
1
Parameters  
Table1  
Key performance parameters  
Values  
Parameter  
Units  
VDS  
300  
40  
V
RDS(on) max   
m  
ID  
50  
A
3
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Maximum ratings and thermal characteristics  
2
Maximum ratings and thermal characteristics  
Table 2  
Maximum ratings (at TJ=25°C, unless otherwise specified)  
Parameter  
Symbol  
Conditions  
Values  
Unit  
Continuous Drain Current  
Continuous Drain Current  
Pulsed Drain Current   
Maximum Power Dissipation  
ID  
ID  
IDM  
PD  
TC = 25°C, VGS @ 10V  
TC = 100°C, VGS @ 10V  
TC = 25°C  
50  
35  
189  
313  
A
TC = 25°C  
W
Linear Derating Factor  
Peak Diode Recovery   
Gate-to-Source Voltage  
TC = 25°C  
2.1  
W/°C  
TJ = 175°C, IS = 20A,  
dv/dt  
VGS  
6.0  
V/ns  
V
VDS = 150V  
-
± 20  
Operating Junction and  
TJ  
-
-55 to + 175  
Storage Temperature Range  
TSTG  
°C  
-
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
Mounting Torque, 6-32 or M3 Screw  
-
-
-
-
300  
10 lbf·in (1.1 N·m)  
Table 3  
Thermal characteristics  
Parameter  
Junction-to-Case   
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
Symbol  
Conditions  
TJ approximately 90°C  
Min.  
Typ.  
Max.  
0.48  
-
Unit  
-
-
-
-
0.24  
-
R  
JC  
-
-
°C/W  
R  
CS  
40  
R  
JA  
Table 4  
Avalanche characteristics  
Parameter  
Symbol  
Values  
455  
Unit  
EAS (Thermally limited)  
Single Pulse Avalanche Energy   
mJ  
EAS (tested)  
IAR  
451  
Single Pulse Avalanche Energy Tested Value   
Avalanche Current   
A
See Fig 16, 17, 23a, 23b  
EAR  
mJ  
Repetitive Avalanche Energy   
Notes:  
Repetitive rating; pulse width limited by max. junction temperature.  
Limited by TJmax, starting TJ = 25°C, L = 1mH, RG = 50, IAS = 30A, VGS =10V.  
ISD 20A, di/dt 1000A/µs, VDD V(BR)DSS, TJ 175°C.  
Pulse width 400µs; duty cycle 2%.  
Coss e. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS  
.
Coss e. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS  
Ris measured at TJ approximately 90°C.  
.
This value determined from sample failure population, starting TJ = 25°C, L= 1mH, RG = 50, IAS = 30A, VGS =10V.  
4
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Electrical characteristics  
3
Electrical characteristics  
Table 5  
Static characteristics  
Values  
Min. Typ. Max.  
Parameter  
Symbol  
Conditions  
Unit  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coeicient  
Static Drain-to-Source On-Resistance  
V(BR)DSS  
V(BR)DSS/TJ  
RDS(on)  
VGS = 0V, ID = 1mA  
Reference to 25°C, ID = 1.0mA   
VGS = 10V, ID = 30A  
300  
-
-
-
-
-
40  
V
V/°C  
0.12  
33  
m  
Gate Threshold Voltage  
VGS(th)  
VDS = VGS, ID = 270µA  
VDS = 240V, VGS =0V  
2.0  
-
-
-
-
-
4.0  
10  
V
Drain-to-Source Leakage Current  
IDSS  
µA  
V
DS = 240V,VGS = 0V,TJ =125°C  
300  
Gate-to-Source Forward Leakage  
Gate Resistance  
IGSS  
RG  
VGS = 20V  
-
-
-
100  
-
nA   
2.7  
  
Table 6  
Dynamic characteristics  
Values  
Min. Typ. Max.  
Parameter  
Symbol  
Conditions  
Unit  
Forward Trans conductance  
Total Gate Charge  
Gate-to-Source Charge  
Gate-to-Drain Charge  
Total Gate Charge Sync. (Qg– Qgd)  
Turn-On Delay Time  
Rise Time  
Turn-ODelay Time  
Fall Time  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
gfs  
Qg  
Qgs  
Qgd  
Qsync  
td(on)  
tr  
td(o)  
tf  
Ciss  
Coss  
Crss  
V
DS = 50V, ID =30A  
62  
-
-
-
71  
28  
-
107  
-
-
-
-
-
-
-
-
-
-
S
ID = 30A  
VDS = 150V  
VGS = 10V  
nC  
ns  
-
-
-
-
-
-
-
-
-
13  
58  
16  
43  
51  
28  
4893  
425  
6.6  
VDD = 150V  
ID = 30A  
RG = 2.7  
VGS = 10V  
VGS = 0V  
VDS = 50V  
ƒ = 1.0MHz, See Fig.7  
pF  
Eective Output Capacitance  
Coss e.(ER)  
Coss e.(TR)  
-
-
282  
485  
-
-
VGS = 0V, VDS = 0V to 240V   
VGS = 0V, VDS = 0V to 240V   
(Energy Related)  
Output Capacitance (Time Related)  
Table 7  
Reverse Diode  
Values  
Parameter  
Symbol  
Conditions  
Unit  
Min. Typ. Max.  
D
Continuous Source Current  
(Body Diode)  
Pulsed Source Current  
(Body Diode)   
MOSFET symbol  
IS  
-
-
50  
showing the  
G
A
integral reverse  
p-n junction diode.  
TJ = 25°C, IS = 30A,VGS = 0V   
TJ = 25°C  
S
ISM  
VSD  
trr  
-
-
-
-
189  
1.2  
Diode Forward Voltage  
V
-
-
-
-
-
-
140  
199  
313  
811  
3.1  
-
-
-
-
-
-
Reverse Recovery Time  
ns  
TJ = 125°C  
VDD = 150V  
TJ = 25°C  
IF = 30A,  
Reverse Recovery Charge  
Reverse Recovery Current  
Qrr  
nC  
A
TJ = 125°C  
TJ = 25°C  
TJ = 125°C  
di/dt = 100A/µs   
IRRM  
5.5  
5
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
4
Electrical characteristic diagrams  
1000  
100  
10  
1000  
100  
10  
VGS  
15V  
10V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
4.0V  
VGS  
15V  
10V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
4.0V  
TOP  
TOP  
BOTTOM  
BOTTOM  
4.0V  
4.0V  
60µs PULSE WIDTH  
Tj = 175°C  
60µs PULSE WIDTH  
Tj = 25°C  
1
1
0.1  
1
10  
100  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
DS  
V
, Drain-to-Source Voltage (V)  
DS  
Figure 4 Typical Output Characteristics  
Figure 3 Typical Output Characteristics  
1000  
100  
3.2  
I
= 30A  
D
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
V
= 10V  
GS  
T = 175°C  
J
10  
T = 25°C  
J
1.0  
V
= 50V  
DS  
60µs PULSE WIDTH  
0.10  
2
3
4
5
6
7
8
-60  
-20  
20  
60  
100  
140  
180  
V
, Gate-to-Source Voltage (V)  
GS  
T , Junction Temperature (°C)  
J
Figure 5 Typical Transfer Characteristics  
Figure 6 Normalized On-Resistance vs. Temperature  
6
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
1000000  
V
= 0V, f = 1 MHZ  
GS  
iss  
rss  
oss  
14  
12  
10  
8
C
C
C
= C + C , C SHORTED  
gs  
gd  
= C + C  
ds  
gd ds  
I = 30A  
D
= C  
100000  
10000  
1000  
100  
gd  
V
V
= 240V  
= 150V  
DS  
C
DS  
iss  
VDS= 60V  
C
oss  
6
C
rss  
4
10  
2
1
1
10  
100  
1000  
0
0
10 20 30 40 50 60 70 80 90  
V
, Drain-to-Source Voltage (V)  
DS  
Q , Total Gate Charge (nC)  
G
Figure 8 Typical Gate Charge vs. Gate-to-Source  
Voltage  
Figure 7 Typical Capacitance vs. Drain-to-Source  
Voltage  
1000  
100  
T = 175°C  
J
10  
1
T = 25°C  
J
V
= 0V  
GS  
0.1  
0.0  
0.4  
V
0.8  
1.2  
1.6  
2.0  
, Source-to-Drain Voltage (V)  
SD  
Figure 9 Typical Source-Drain Diode Forward  
Voltage  
7
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
1000  
100  
10  
100µsec  
1msec  
OPERATION IN THIS AREA  
LIMITED BY R (on)  
10msec  
DS  
1
0.1  
DC  
Tc = 25°C  
Tj = 175°C  
Single Pulse  
0.01  
0.1  
1
10  
100  
V
, Drain-to-Source Voltage (V)  
DS  
Figure 10 Maximum Safe Operating Area  
12  
10  
8
360  
Id = 1.0mA  
350  
340  
330  
320  
310  
300  
6
4
2
0
0
50  
100 150 200 250 300 350  
Drain-to-Source Voltage (V)  
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
T , Temperature ( °C )  
J
V
DS,  
Figure 11 Drain-to-Source Breakdown Voltage  
Figure 12 Typical Coss Stored Energy  
8
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
140  
VGS = 6.0V  
120  
VGS = 7.0V  
VGS = 8.0V  
VGS = 10V  
100  
80  
60  
40  
20  
I
= 270µA  
D
ID = 1.0mA  
= 1.0A  
I
D
-75 -50 -25  
0
25 50 75 100 125 150 175  
0
25  
50  
75 100 125 150 175 200  
T , Temperature ( °C )  
I , Drain Current (A)  
D
J
Figure 13 Typical On-Resistance vs. Drain  
Current  
Figure 14 Threshold Voltage vs. Temperature  
1
D = 0.50  
0.20  
0.1  
0.01  
0.10  
0.05  
0.02  
0.01  
0.001  
Notes:  
SINGLE PULSE  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
( THERMAL RESPONSE )  
0.0001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t , Rectangular Pulse Duration (sec)  
1
Figure 15 Maximum Eective Transient Thermal Impedance, Junction-to-Case  
9
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
100  
10  
1
Allowed avalanche Current vs avalanche  
pulsewidth, tav, assuming Tj = 150°C and  
Tstart =25°C (Single Pulse)  
Allowed avalanche Current vs  
avalanche pulsewidth, tav, assuming  
Tj = 25°C and Tstart = 150°C.  
0.1  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Figure 16 Avalanche Current vs. Pulse Width  
Notes on Repetitive Avalanche Curves , Figures 16, 17:  
(For further info, see AN-1005 at www.infineon.com)  
1.Avalanche failures assumption:  
500  
TOP  
BOTTOM 1.0% Duty Cycle  
= 30A  
Single Pulse  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for every  
part type.  
I
400  
300  
200  
100  
0
D
2. Safe operation in Avalanche is allowed as long asTjmax is not  
exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 23a, 23b.  
4. PD (ave) = Average power dissipation per single avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage  
increase during avalanche).  
6. Iav = Allowable avalanche current.  
7. DT = Allowable rise in junction temperature, not to exceed Tjmax  
(assumed as 25°C in Figure 15, 16).  
t
av = Average time in avalanche.  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see Figures 14)  
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC  
Iav = 2T/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
Figure 17 Maximum Avalanche Energy vs.  
Temperature  
10  
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
50  
60  
50  
40  
30  
20  
10  
0
I
= 20A  
I
= 30A  
F
F
V
= 150V  
V
= 150V  
R
R
40  
30  
20  
10  
0
T = 25°C  
T = 25°C  
J
J
T = 125°C  
J
T = 125°C  
J
100 200 300 400 500 600 700 800 900 1000  
100 200 300 400 500 600 700 800 900 1000  
di /dt (A/µs)  
F
di /dt (A/µs)  
F
Figure 19 Typical Recovery Current vs. dif/dt  
Figure 18 Typical Recovery Current vs. dif/dt  
2500  
3000  
I
= 20A  
I
= 30A  
F
F
V
= 150V  
V
= 150V  
R
2500  
2000  
1500  
1000  
500  
R
2000  
1500  
1000  
500  
0
T = 25°C  
T = 25°C  
J
J
T = 125°C  
J
T = 125°C  
J
0
100 200 300 400 500 600 700 800 900 1000  
100 200 300 400 500 600 700 800 900 1000  
di /dt (A/µs)  
F
di /dt (A/µs)  
F
Figure 21 Typical Stored Charge vs. dif/dt  
Figure 20 Typical Stored Charge vs. dif/dt  
11  
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
Figure 22 Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET™ Power MOSFETs  
Figure 23b Unclamped Inductive Waveforms  
Figure 23a Unclamped Inductive Test Circuit  
12  
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Electrical characteristic diagrams  
Figure 24b Switching Time Waveforms  
Figure 24a Switching Time Test Circuit  
Figure 25b Gate Charge Waveform  
Figure 25a Gate Charge Test Circuit  
13  
Final Datasheet  
V2.1  
2020-01-07  
StrongIRFET™  
IRF300P227  
Package Information  
5
Package Information  
TO-247AC Package Outline (Dimensions are shown in millimeters (inches))  
TO-247AC Part Marking Information  
EXAMPLE: THIS IS AN IRFPE30  
WITH ASSEMBLY  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
LOT CODE 5657  
IRFPE30  
135H  
57  
ASSEMBLED ON WW 35, 2001  
IN THE ASSEMBLY LINE "H"  
56  
DATE CODE  
YEAR 1 = 2001  
WEEK 35  
ASSEMBLY  
LOT CODE  
Note: "P" in assembly line position  
indicates "Lead-Free"  
LINE H  
TO-247AC package is not recommended for Surface Mount Application.  
14  
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Qualification Information  
6
Qualification Information  
Qualification Information  
Qualification Level  
Industrial  
(per JEDEC JESD47F) †  
Moisture Sensitivity Level  
RoHS Compliant  
TO-247AC  
N/A  
Yes  
Applicable version of JEDEC standard at the time of product release.  
15  
Final Datasheet  
V2.1  
2020-01-07  
 
StrongIRFET™  
IRF300P227  
Revision History  
Revision History  
Major changes since the last revision  
Page or Reference Revision  
Date  
Description of changes  
All pages  
All pages  
1.0  
1.1  
2017-02-27  
  
  
  
  
  
First release data sheet.  
Updated @ 25c =20A on Avalanche Current vs. Pulse Width fig 16 on  
page10  
Added DV/DT = 6V/ns, Di/Dt = 1000A/us, Tjmax = 175C, VDS = 150V,  
Id = 20A on page 4  
2017-07-20  
Added IRRM = 5.5A @ 125c on page 5.  
All pages  
All pages  
2.0  
2.1  
2017-11-14  
2020-01-07  
First release final datasheet.  
  
  
Update from “IR MOSFT/StrongIRFET™” to “StrongIRFET™” -all pages  
Update Package picture –page1  
16  
Final Datasheet  
V2.1  
2020-01-07  
Trademarks of Infineon Technologies AG  
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HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™,  
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SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™  
Trademarks updated November 2015  
Other Trademarks  
All referenced product or service names and trademarks are the property of their respective owners.  
IMPORTANT NOTICE  
For further information on the product, technology,  
Edition 2015-05-06  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
The information given in this document shall in no  
event be regarded as a guarantee of conditions or  
characteristics (“Beschaenheitsgarantie”) .  
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