IRF350 [INFINEON]

TRANSISTORS N-CHANNEL(Vdss=400V, Rds(on)=0.300ohm, Id=14A); 晶体管N沟道( VDSS = 400V , RDS(ON) = 0.300ohm ,ID = 14A)
IRF350
型号: IRF350
厂家: Infineon    Infineon
描述:

TRANSISTORS N-CHANNEL(Vdss=400V, Rds(on)=0.300ohm, Id=14A)
晶体管N沟道( VDSS = 400V , RDS(ON) = 0.300ohm ,ID = 14A)

晶体 晶体管
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PD - 90339F  
IRF350  
JANTX2N6768  
JANTXV2N6768  
REPETITIVEAVALANCHEANDdv/dtRATED  
HEXFET TRANSISTORS  
THRU-HOLE (TO-204AA/AE)  
[REF:MIL-PRF-19500/543]  
400V, N-CHANNEL  
Product Summary  
Part Number  
BVDSS  
RDS(on)  
ID  
IRF350  
400V  
0.300Ω  
14A  
The HEXFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transistors.  
The efficient geometry and unique processing of this latest  
“State of the Art” design achieves: very low on-state resis-  
tance combined with high transconductance; superior re-  
verse energy and diode recovery dv/dt capability.  
TO-3  
The HEXFET transistors also feature all of the well estab-  
lished advantages of MOSFETs such as voltage control,  
very fast switching, ease of paralleling and temperature  
stability of the electrical parameters.  
Features:  
n
n
n
n
n
Repetitive Avalanche Ratings  
Dynamic dv/dt Rating  
Hermetically Sealed  
Simple Drive Requirements  
Ease of Paralleling  
They are well suited for applications such as switching  
power supplies, motor controls, inverters, choppers, audio  
amplifiers and high energy pulse circuits.  
Absolute Maximum Ratings  
Parameter  
Units  
I
@ V  
@ V  
= 10V, T = 25°C  
Continuous Drain Current  
14  
9.0  
D
GS  
C
A
I
D
= 10V, T = 100°C Continuous Drain Current  
GS  
C
I
Pulsed Drain Current  
Max. Power Dissipation  
Linear Derating Factor  
56  
DM  
@ T = 25°C  
P
D
150  
W
W/°C  
V
C
1.2  
V
GS  
Gate-to-Source Voltage  
±20  
E
Single Pulse Avalanche Energy ➀  
Avalanche Current ➀  
11.3  
14  
mJ  
AS  
I
A
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt ➀  
Operating Junction  
15  
mJ  
AR  
dv/dt  
4.0  
V/ns  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Lead Temperature  
Weight  
300 (0.063 in. (1.6mm) from case for 10s)  
11.5 (typical)  
For footnotes refer to the last page  
www.irf.com  
1
01/22/01  
IRF350  
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)  
Parameter  
Min Typ Max Units  
Test Conditions  
BV  
DSS  
Drain-to-Source Breakdown Voltage  
400  
V
V
= 0V, I = 1.0mA  
D
GS  
Reference to 25°C, I = 1.0mA  
BV  
/T  
Temperature Coefficient of Breakdown  
Voltage  
0.46  
V/°C  
DSS  
J
D
R
Static Drain-to-Source On-State  
Resistance  
0.300  
0.400  
4.0  
V
= 10V, I =9.0A➀  
GS D  
DS(on)  
V
=10V, I =14A ➀  
GS  
D
V
Gate Threshold Voltage  
Forward Transconductance  
Zero Gate Voltage Drain Current  
2.0  
6.0  
V
V
DS  
= V , I =250µA  
GS(th)  
fs  
GS  
D
g
S (  
)
V
> 15V, I  
=9.0A➀  
DS  
DS  
I
25  
V =320V, V =0V  
DS GS  
DSS  
µA  
250  
V
=320V  
DS  
= 0V, T = 125°C  
V
GS  
J
I
Gate-to-Source Leakage Forward  
Gate-to-Source Leakage Reverse  
Total Gate Charge  
52  
5.0  
25  
6.1  
100  
-100  
110  
18  
V
=20V  
GSS  
GS  
nA  
nC  
I
V
GS  
=-20V  
GSS  
Q
V
=10V, ID 14A  
GS =  
g
Q
Q
Gate-to-Source Charge  
Gate-to-Drain (‘Miller’) Charge  
Turn-On Delay Time  
Rise Time  
V
DS  
=200V  
gs  
65  
gd  
d(on)  
r
t
t
35  
V
DD  
=200V, I =14A,  
D
190  
170  
130  
R
G
=2.35Ω  
n s  
t
Turn-Off Delay Time  
Fall Time  
d(off)  
t
f
L
L
Total Inductance  
nH  
S +  
D
Measured from the center of  
drain pad to center of source  
pad  
C
C
C
Input Capacitance  
2600  
680  
V
= 0V, V =25V  
iss  
GS DS  
Output Capacitance  
pF  
f = 1.0MHz  
oss  
rss  
Reverse Transfer Capacitance  
250  
Source-Drain Diode Ratings and Characteristics  
Parameter  
Min Typ Max Units  
Test Conditions  
I
Continuous Source Current (Body Diode)  
14  
56  
S
A
I
Pulse Source Current (Body Diode) ➀  
SM  
V
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
1.7  
V
T = 25°C, I =14A, V  
= 0V ➀  
j
SD  
S
GS  
t
1200 nS  
250 µc  
T = 25°C, I =14A, di/dt 100A/µs  
j
rr  
F
Q
RR  
V
50V ➀  
DD  
t
Forward Turn-On Time  
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L + L .  
S D  
on  
Thermal Resistance  
Parameter  
Min Typ Max Units  
Test Conditions  
R
R
Junction to Case  
0.83  
30  
thJC  
thJA  
°C/W  
Junction to Ambient  
Typical socket mount  
For footnotes refer to the last page  
2
www.irf.com  
IRF350  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
Fig 3. Typical Transfer Characteristics  
Fig 4. Normalized On-Resistance  
Vs. Temperature  
www.irf.com  
3
IRF350  
13 a& b  
Fig 6. Typical Gate Charge Vs.  
Fig 5. Typical Capacitance Vs.  
Gate-to-Source Voltage  
Drain-to-Source Voltage  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
Forward Voltage  
4
www.irf.com  
IRF350  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
Pulse Width 1µs  
Duty Factor ≤ 0.1 %  
Fig 10a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
Fig 9. Maximum Drain Current Vs.  
d(on)  
d(off)  
Case Temperature  
Fig 10b. Switching Time Waveforms  
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
www.irf.com  
5
IRF350  
15V  
DRIVER  
L
V
D S  
D.U.T  
AS  
R
G
+
-
V
D D  
I
A
10V  
t
0.01  
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR )D SS  
t
p
Fig 12c. Maximum Avalanche Energy  
Vs. Drain Current  
I
AS  
Current Regulator  
Fig 12b. Unclamped Inductive Waveforms  
Same Type as D.U.T.  
50KΩ  
.2µF  
12V  
Q
G
.3µF  
+
10 V  
V
DS  
D.U.T.  
-
Q
Q
GD  
GS  
V
GS  
V
G
3mA  
I
I
D
G
Charge  
Current Sampling Resistors  
Fig 13b. Gate Charge Test Circuit  
Fig 13a. Basic Gate Charge Waveform  
6
www.irf.com  
IRF350  
Foot Notes:  
➀➀ I  
SD  
14A, di/dt 145A/µs,  
400V, T 150°C  
➀➀ Repetitive Rating; Pulse width limited by  
maximum junction temperature.  
V
DD  
J
Suggested RG =2.35 Ω  
V  
=50V, starting T = 25°C,  
DD  
J
Pulse width 300 µs; Duty Cycle 2%  
Peak I = 14A,  
L
Case Outline and Dimensions —TO-204AA (Modified TO-3)  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000  
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111  
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086  
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630  
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936  
Data and specifications subject to change without notice. 01/01  
www.irf.com  
7

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