IRF9389PBF [INFINEON]
High and Low Side Switches for Inverter; 高和低边开关的逆变器型号: | IRF9389PBF |
厂家: | Infineon |
描述: | High and Low Side Switches for Inverter |
文件: | 总14页 (文件大小:249K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IRF9389PbF
HEXFET® Power MOSFET
N-CH P-CH
N-CHANNEL MOSFET
1
8
D1
D1
S1
G1
VDS
30
27
-30
64
V
2
7
RDS(on) max
Qg (typical)
m
nC
3
4
6
5
S2
D2
D2
6.8
8.1
G2
P-CHANNEL MOSFET
ID
Top View
SO-8
6.8
-4.6
A
(@TA = 25°C)
Applications
l
HighandLowSideSwitchesforInverter
l
High and Low Side Switches for Generic Half-Bridge
Features
Benefits
High and low-side MOSFETs in a single package
High-side P-Channel MOSFET
Increased power density
Easier drive circuitry
Industry-standard pinout
results in Multi-vendor compatibility
Compatible with existing surface mount techniques
RoHS compliant containing no Lead, no Bromide and no Halogen
MSL1, Consumer qualification
Easier manufacturing
Environmentally friendlier
Increased reliability
Base Part Number Package Type
Standard Pack
Orderable part number
Form
Tube/Bulk
Quantity
95
IRF9389PbF
IRF9389TRPbF
IRF9389PbF
SO-8
Tape and Reel
4000
Absolute Maximum Ratings
Max.
Parameter
Units
N-Channel
P-Channel
±20
V
VGS
Gate-to-Source Voltage
±20
6.8
5.4
34
ID @ TA = 25°C
ID @ TA = 70°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
-4.6
A
-3.7
-23
2.0
1.3
PD @TA = 25°C
PD @TA = 70°C
Power Dissipation
W
W/°C
°C
Power Dissipation
Linear Derating Factor
Operating Junction and
0.016
-55 to + 150
TJ
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
Junction-to-Drain Lead
Junction-to-Ambient
Typ.
–––
–––
Max
20
62.5
Units
R
R
JL
JA
°C/W
www.irf.com © 2012 International Rectifier
January 14, 2013
1
IRF9389PbF
Static @ TJ = 25°C (unless otherwise specified)
Conditions
Parameter
Min.
Typ.
–––
–––
0.03
0.02
22
Max. Units
BVDSS
Drain-to-Source Breakdown Voltage
N-Ch
P-Ch
30
–––
–––
–––
–––
27
V
VGS = 0V, ID = 250μA
GS = 0V, ID = -250μA
-30
–––
–––
–––
–––
–––
–––
1.3
V
VDSS/TJ Breakdown Voltage Temp. Coefficient N-Ch
V/°C Reference to 25°C, ID = 1mA
Reference to 25°C, ID = -1mA
P-Ch
N-Ch
m
V
GS = 10V, ID = 6.8A
RDS(on)
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
33
40
VGS = 4.5V, ID = 5.4A
m
P-Ch
51
64
V
GS = -10V, ID = -4.6A
GS = -4.5V, ID = -3.7A
82
103
2.3
V
VGS(th)
N-Ch
1.8
V
VDS = VGS, ID = 10μA
VDS = VGS, ID = -10μA
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
-1.3
–––
–––
–––
–––
–––
–––
–––
–––
8.2
-1.8
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
6.8
8.1
1.4
1.3
0.98
2.1
2.2
9.4
5.1
8.0
4.8
14
-2.3
1.0
μA VDS = 24V, VGS = 0V
IDSS
Drain-to-Source Leakage Current
-1.0
150
-150
100
-100
-100
100
–––
–––
14
V
V
V
DS = -24V, VGS = 0V
DS = 24V, VGS = 0V, TJ = 125°C
DS = -24V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
nA VGS = 20V
VGS = -20V
V
GS = -20V
VGS = 20V
VDS = 15V, ID = 5.4A
gfs
Qg
S
4.1
VDS = -15V, ID = -3.7A
N-Channel
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
nC
16
VGS = 10V, VDS = 15V, ID = 6.8A
Qgs
Qgd
RG
td(on)
tr
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Gate Resistance
–––
–––
–––
–––
4.4
P-Channel
V
GS = -10V, VDS = -15V, ID = -4.6A
19
N-Channel
Turn-On Delay Time
Rise Time
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
ns
VDD = 15V, VGS = 4.5V
ID = 1.0A, RG = 6.2
P-Channel
td(off)
tf
Turn-Off Delay Time
Fall Time
4.9
17
VDD = -15V, VGS = -4.5V
3.9
15
ID = -1.0A, RG = 6.8
N-Channel
Ciss
Coss
Crss
Input Capacitance
398
383
82
pF
VGS = 0V, VDS = 15V, ƒ = 1.0MHz
Output Capacitance
P-Channel
104
36
Reverse Transfer Capacitance
VGS = 0V, VDS = -15V, ƒ = 1.0KHz
64
Diode Characteristics
Conditions
Parameter
Min.
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
–––
–––
–––
–––
8.4
Max. Units
IS
Continuous Source Current (Body DiodeN-Ch
P-Ch
2.0
-2.0
34
A
ISM
VSD
trr
Pulsed Source Current (Body Diode)
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
-23
1.2
-1.2
13
Diode Forward Voltage
V
T = 25°C, I = 2.0A, V = 0V
J
S
GS
T = 25°C, I = -2.0A, V = 0V
J
S
GS
Reverse Recovery Time
ns N-Channel: T = 25°C, I = 2.0A,
J F
11
17
VDD = 15V, di/dt = 102/μs
nC P-Channel: T = 25°C, I = -2.0A,
Qrr
Reverse Recovery Charge
2.3
3.5
7.2
J
F
4.8
VDD = -15V, di/dt = 102/μs
Notes:
Surface mounted on 1 in square Cu board
R is measured at TJ approximately 90°C
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 16)
Pulse width 400μs; duty cycle 2%.
www.irf.com © 2012 International Rectifier
January 14, 2013
2
IRF9389PbF
N-Channel
100
10
1
100
10
1
VGS
7.5V
6.5V
5.5V
4.5V
4.0V
3.5V
3.0V
2.75V
VGS
TOP
TOP
7.5V
6.5V
5.5V
4.5V
4.0V
3.5V
3.0V
2.75V
BOTTOM
BOTTOM
2.75V
2.75V
60μs PULSE WIDTH
60μs PULSE WIDTH
Tj = 150°C
Tj = 25°C
0.1
1
10
100
0.1
1
10
100
V
, Drain-to-Source Voltage (V)
V
, Drain-to-Source Voltage (V)
DS
DS
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
10
2.0
I
= 5.4A
D
V
= 4.5V
GS
1.5
1.0
0.5
T
= 150°C
J
T
= 25°C
J
1
V
= 15V
DS
60μs PULSE WIDTH
0.1
1
2
3
4
5
6
-60 -40 -20
0
20 40 60 80 100 120140 160
T
J
, Junction Temperature (°C)
V
, Gate-to-Source Voltage (V)
GS
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
vs.Temperature
3
www.irf.com © 2012 International Rectifier
January 14, 2013
IRF9389PbF
N-Channel
10000
1000
100
14.0
12.0
10.0
8.0
V
= 0V,
= C
f = 1 MHZ
GS
I = 6.8A
D
C
C
C
+ C , C
SHORTED
iss
gs
gd
ds
V
V
V
= 24V
= 15V
= 6.0V
= C
DS
DS
DS
rss
oss
gd
= C + C
ds
gd
C
iss
6.0
C
oss
4.0
C
rss
2.0
10
0.0
1
10
, Drain-to-Source Voltage (V)
100
0
1
2
3
4
5
6
7
8
9
V
DS
Q , Total Gate Charge (nC)
G
Fig 5. Typical Capacitance vs.
Fig 6. Typical Gate Charge vs.
Drain-to-SourceVoltage
Gate-to-SourceVoltage
100
100
10
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
100μsec
1msec
T
= 150°C
J
10
1
1
10msec
T = 25°C
J
DC
0.1
0.01
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0V
GS
0.1
0.2
0.4
V
0.6
0.8
1.0
1.2
1.4
0.1
1
10
100
, Source-to-Drain Voltage (V)
V
, Drain-to-Source Voltage (V)
SD
DS
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
Forward Voltage
www.irf.com © 2012 International Rectifier
January 14, 2013
4
IRF9389PbF
N-Channel
RD
VDS
7
6
5
4
3
2
1
0
VGS
D.U.T.
RG
+
-
VDD
VGS
Pulse Width µs
Duty Factor
Fig 10a. Switching Time Test Circuit
V
DS
25
50
75
100
125
150
90%
T
, Ambient Temperature (°C)
A
10%
V
GS
Fig 9. Maximum Drain Current vs.
t
t
r
t
t
f
d(on)
d(off)
AmbientTemperature
Fig 10b. Switching Time Waveforms
100
120
110
100
90
I
= 6.8A
D
80
60
40
20
80
70
60
Vgs = 4.5V
Vgs = 10V
50
40
30
20
2
4
6
8
10 12 14 16 18 20
0
5
10 15 20 25 30 35 40 45
I , Drain Current (A)
D
V
Gate -to -Source Voltage (V)
GS,
Fig 11. Typical On-Resistance vs. Gate
Fig 12. Typical On-Resistance vs. Drain
Voltage
Current
5
www.irf.com © 2012 International Rectifier
January 14, 2013
IRF9389PbF
N-Channel
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
20000
16000
12000
8000
4000
0
I
= 10μA
D
-75 -50 -25
0
25 50 75 100 125 150
1E-8 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2
T , Temperature ( °C )
J
Time (sec)
Fig 14. Typical Power vs. Time
Fig 13. Threshold Voltage vs. Temperature
Current Regulator
Same Type as D.U.T.
50K
Q
Q
G
.2F
12V
.3F
VGS
+
Q
V
DS
GS
GD
D.U.T.
-
V
GS
V
G
3mA
I
I
D
G
Charge
Current Sampling Resistors
Fig 15a. Basic Gate Charge Waveform
Fig 15b. Gate Charge Test Circuit
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January 14, 2013
6
IRF9389PbF
N and P-Channel
100
10
D = 0.50
0.20
0.10
0.05
0.02
0.01
1
0.1
SINGLE PULSE
( THERMAL RESPONSE )
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + T
A
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t
, Rectangular Pulse Duration (sec)
1
Fig 16. Typical Effective Transient Thermal Impedance, Junction-to-Ambient
7
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January 14, 2013
IRF9389PbF
P-Channel
100
10
1
100
10
1
VGS
VGS
TOP
-8.0V
-7.0V
-6.0V
-5.0V
-4.5V
-3.5V
-3.0V
-2.75V
TOP
-8.0V
-7.0V
-6.0V
-5.0V
-4.5V
-3.5V
-3.0V
-2.75V
BOTTOM
BOTTOM
-2.75V
-2.75V
60μs PULSE WIDTH
Tj = 150°C
60μs PULSE WIDTH
Tj = 25°C
0.1
0.1
0.1
1
10
100
0.1
1
10
100
-V , Drain-to-Source Voltage (V)
DS
-V , Drain-to-Source Voltage (V)
DS
Fig 17. Typical Output Characteristics
Fig 18. Typical Output Characteristics
100
10
1.6
I
= -3.7A
D
V
= -4.5V
GS
1.4
1.2
1.0
0.8
0.6
T
= 150°C
J
T = 25°C
J
1
V
= -15V
DS
60μs PULSE WIDTH
0.1
1
2
3
4
5
6
7
-60 -40 -20
0
20 40 60 80 100 120140 160
T
J
, Junction Temperature (°C)
-V , Gate-to-Source Voltage (V)
GS
Fig 19. Typical Transfer Characteristics
Fig 20. Normalized On-Resistance
vs.Temperature
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January 14, 2013
8
IRF9389PbF
P-Channel
14.0
12.0
10.0
8.0
10000
1000
100
V
= 0V,
= C
f = 1 MHZ
GS
I = -4.6A
D
C
C
C
+ C , C
SHORTED
iss
gs
gd
ds
= C
rss
oss
gd
= C + C
V
= -24V
= -15V
= -6.0V
DS
ds
gd
V
V
DS
DS
C
iss
C
C
oss
6.0
rss
4.0
2.0
0.0
10
0
2
4
6
8
10
12
1
10
-V , Drain-to-Source Voltage (V)
100
Q
Total Gate Charge (nC)
G
DS
Fig 22. Typical Gate Charge vs.
Fig 21. Typical Capacitance vs.
Gate-to-SourceVoltage
Drain-to-SourceVoltage
100.00
100
10
OPERATION IN THIS AREA
LIMITED BY R (on)
DS
100μsec
1msec
10msec
10.00
1.00
0.10
T
= 150°C
J
1
T = 25°C
J
DC
0.1
0.01
Tc = 25°C
Tj = 150°C
Single Pulse
V
= 0V
GS
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.1
1
10
100
-V , Source-to-Drain Voltage (V)
-V , Drain-to-Source Voltage (V)
SD
DS
Fig 23. Typical Source-Drain Diode
Fig 24. Maximum Safe Operating Area
Forward Voltage
9
www.irf.com © 2012 International Rectifier
January 14, 2013
IRF9389PbF
P-Channel
RD
VDS
5.0
4.0
3.0
2.0
1.0
0.0
VGS
D.U.T.
RG
-
VDD
+
VGS
Pulse Width µs
Duty Factor
Fig 26a. Switching Time Test Circuit
t
t
r
t
t
f
d(on)
d(off)
V
GS
25
50
75
100
125
150
10%
T
, Ambient Temperature (°C)
A
90%
V
Fig 25. Maximum Drain Current vs.
DS
AmbientTemperature
Fig 26b. Switching Time Waveforms
600
500
200
I
= -4.6A
D
160
120
80
Vgs = -4.5V
400
300
200
Vgs = -10V
100
0
40
2
4
6
8
10 12 14 16 18 20
0
5
10
15
20
25
30
-I , Drain Current (A)
D
-V
Gate -to -Source Voltage (V)
GS,
Fig 28. Typical On-Resistance vs. Drain
Current
Fig 27. Typical On-Resistance vs. Gate
Voltage
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January 14, 2013
10
IRF9389PbF
P-Channel
20000
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
16000
12000
8000
4000
0
I
= -10μA
D
1E-8 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2
-75 -50 -25
0
25 50 75 100 125 150
Time (sec)
T
, Temperature ( °C )
J
Fig 29. Threshold Voltage vs. Temperature
Fig 30. Typical Power vs. Time
Current Regulator
Same Type as D.U.T.
50K
.2F
12V
Q
G
.3F
-
V
+
DS
D.U.T.
Q
Q
GD
GS
V
GS
V
G
-3mA
I
I
D
G
Current Sampling Resistors
Charge
Fig 31a. Basic Gate Charge Waveform
Fig 31b. Gate Charge Test Circuit
11
www.irf.com © 2012 International Rectifier
January 14, 2013
IRF9389PbF
SO-8 Package Details
SO-8 Part Marking
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
www.irf.com © 2012 International Rectifier
January 14, 2013
12
IRF9389PbF
Tape and Reel
TERMINAL NUMBER 1
12.3 ( .484 )
11.7 ( .461 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIRECTION
NOTES:
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
330.00
(12.992)
MAX.
14.40 ( .566 )
12.40 ( .488 )
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.
13
www.irf.com © 2012 International Rectifier
January 14, 2013
IRF9389PbF
Qualification information†
Cons umer
Qualification level
(per JE DEC JES D47F †† guidelines)
MS L1
Moisture Sensitivity Level
RoHS compliant
SO-8
(per JE DEC J-S TD-020D††
Yes
)
Qualification standards can be found at International Rectifiers web site:
http://www.irf.com/product-info/reliability/
Applicable version of JEDEC standard at the time of product release.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
www.irf.com © 2012 International Rectifier
January 14, 2013
14
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