IRG4RC10SD [INFINEON]
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, Vce(on)typ.=1.10V, @Vge=15V, Ic=2.0A); 超快软恢复二极管绝缘栅双极晶体管（ VCES = 600V ，的VCE（on ）典型值= 1.10V ， @ VGE = 15V ， IC = 2.0A ）
| 型号： | IRG4RC10SD |
| 厂家： | 
Infineon |
| 描述： | INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, Vce(on)typ.=1.10V, @Vge=15V, Ic=2.0A) |
| 文件： | 总10页 (文件大小：190K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PD 91678A
IRG4RC10SD
Standard Speed CoPack
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
IGBT
C
• Extremely low voltage drop 1.1V(typ) @ 2A
• S-Series: Minimizes power dissipation at up to 3
KHz PWM frequency in inverter drives, up to 4
VCES = 600V
V
CE(on) typ. = 1.10V
KHz in brushless DC drives.
G
• Tight parameter distribution
• IGBT co-packaged with HEXFREDTM ultrafast,
ultra-soft-recovery anti-parallel diodes for use
@VGE = 15V, IC = 2.0A
E
n-channel
in bridge configurations
• Industry standard TO-252AA package
Benefits
• Generation 4 IGBT's offer highest efficiencies
available
• IGBT's optimized for specific application conditions
• HEXFRED diodes optimized for performance with
IGBT's . Minimized recovery characteristics require
less/no snubbing
D-PAK
• Lower losses than MOSFET's conduction and
Diode losses
TO-252AA
Absolute Maximum Ratings
Parameter
Max.
Units
VCES
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
600
V
IC @ TC = 25°C
14
IC @ TC = 100°C
8.0
ICM
18
A
ILM
18
IF @ TC = 100°C
4.0
IFM
16
± 20
VGE
V
PD @ TC = 25°C
Maximum Power Dissipation
38
W
PD @ TC = 100°C Maximum Power Dissipation
15
TJ
Operating Junction and
-55 to +150
TSTG
Storage Temperature Range
°C
Thermal Resistance
Parameter
Typ.
–––
Max.
Units
RθJC
RθJC
RθJA
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
Junction-to-Ambient (PCB mount)*
Weight
3.3
7.0
50
–––
°C/W
–––
0.3 (0.01)
–––
g (oz)
* When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994
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1
12/30/00
IRG4RC10SD
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)CES
∆V(BR)CES/∆TJ Temperature Coeff. of Breakdown Voltage
Collector-to-Emitter Breakdown Voltage 600
—
—
—
V
VGE = 0V, IC = 250µA
—
—
—
—
3.0
—
0.64
V/°C VGE = 0V, IC = 1.0mA
VCE(on)
Collector-to-Emitter Saturation Voltage
1.58 1.7
IC = 8.0A
VGE = 15V
2.05
1.68
—
—
—
V
IC = 14.0A
See Fig. 2, 5
IC = 8.0A, TJ = 150°C
VCE = VGE, IC = 250µA
VGE(th)
Gate Threshold Voltage
6.0
—
∆VGE(th)/∆TJ Temperature Coeff. of Threshold Voltage
-9.5
mV/°C VCE = VGE, IC = 250µA
gfe
Forward Transconductance
3.65 5.48
—
S
VCE = 100V, IC =8.0A
VGE = 0V, VCE = 600V
ICES
Zero Gate Voltage Collector Current
—
—
—
—
—
—
—
250
1000
µA
V
GE = 0V, VCE = 600V, TJ = 150°C
VFM
Diode Forward Voltage Drop
1.5 1.8
1.4 1.7
V
IC =4.0A
See Fig. 13
IC =4.0A, TJ = 150°C
VGE = ±20V
IGES
Gate-to-Emitter Leakage Current
—
±100 nA
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
IC = 8.0A
CC = 400V See Fig. 8
Qg
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
15 22
Qge
Qgc
td(on)
tr
2.42 3.6
6.53 9.8
nC
ns
V
VGE = 15V
76
32
—
—
TJ = 25°C
IC = 8.0A, VCC = 480V
td(off)
tf
Turn-Off Delay Time
Fall Time
815 1200
720 1080
VGE = 15V, RG = 100Ω
Energy losses include "tail" and
diode reverse recovery.
Eon
Eoff
Ets
Ets
td(on)
tr
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
0.31
3.28
—
—
mJ See Fig. 9, 10, 18
3.60 10.9
1.46 2.6
mJ IC = 5.0A
70
36
—
—
—
—
—
—
—
—
—
42
57
TJ = 150°C, See Fig. 10,11, 18
IC = 8.0A, VCC = 480V
ns
td(off)
tf
Turn-Off Delay Time
Fall Time
890
890
3.83
7.5
280
30
VGE = 15V, RG = 100Ω
Energy losses include "tail" and
Ets
LE
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
mJ diode reverse recovery.
nH Measured 5mm from package
VGE = 0V
Cies
Coes
Cres
trr
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
pF
ns
A
VCC = 30V
See Fig. 7
4.0
28
ƒ = 1.0MHz
TJ = 25°C See Fig.
38
TJ = 125°C
TJ = 25°C See Fig.
TJ = 125°C 15
nC TJ = 25°C See Fig.
TJ = 125°C 16
A/µs TJ = 25°C See Fig.
TJ = 125°C 17
14
IF =4.0A
Irr
Diode Peak Reverse Recovery Current
Diode Reverse Recovery Charge
2.9 5.2
3.7 6.7
VR = 200V
Qrr
40
60
70 105
di/dt = 200A/µs
di(rec)M/dt
Diode Peak Rate of Fall of Recovery
During tb
280
235
—
—
Details of note through are on the last page
2
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IRG4RC10SD
2.50
2.00
1.50
1.00
0.50
0.00
F or b oth:
D u ty c yc le : 50 %
T
= 1 2 5° C
J
P
CB Mount, Ta = 55°C
sink
G a te d riv e a s s pe cifie d
P o w er D iss ipa tion
=
W
1.4
S q u a re w a v e :
60% of rate d
volta ge
I
Ideal diodes
0.1
1
10
100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
100
10
1
100
°
T = 25 C
J
°
°
T = 150 C
T = 150 C
J
J
10
°
T = 25 C
J
V
= 15V
V
= 50V
GE
CC
80µs PULSE WIDTH
5µsPULSEWIDTH
1
0.5
1.0
1.5
2.0 2.5 3.0
6
8
10 12
V
, Collector-to-Emitter Voltage (V)
V
, Gate-to-Emitter Voltage (V)
GE
CE
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
IRG4RC10SD
3.00
2.50
2.00
1.50
1.00
16
V
= 15V
GE
80 us PULSE WIDTH
I
= 16A
C
12
8
I
I
=
=
8A
4A
C
C
4
0
-60 -40 -20
0
20 40 60 80 100 120 140 160
25
50
T
75
100
125
150
°
, Junction Temperature ( C)
T
°
, Case Temperature ( C)
J
C
Fig. 4 - Maximum Collector Current vs. Case
Fig. 5 - Typical Collector-to-Emitter Voltage
Temperature
vs. Junction Temperature
10
D = 0.50
1
0.20
0.10
0.05
0.02
P
DM
SINGLE PULSE
(THERMAL RESPONSE)
0.01
0.1
t
1
t
2
Notes:
1. Duty factor D =
t / t
1 2
2. Peak T =P
DM
x Z
+ T
C
J
thJC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
t , Rectangular Pulse Duration (sec)
1
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4RC10SD
20
15
10
5
500
400
300
200
100
0
V
I
= 400V
= 8A
CC
C
V
C
= 0V,
f = 1MHz
C
GE
= C + C
SHORTED
ce
ies
ge
gc ,
gc
C
= C
gc
res
C
= C + C
ce
oes
C
ies
C
C
oes
res
0
1
10
100
0
5
10
15
20
V
, Collector-to-Emitter Voltage (V)
Q
G
, Total Gate Charge (nC)
CE
Fig. 8 - Typical Gate Charge vs.
Fig. 7 - Typical Capacitance vs.
Gate-to-Emitter Voltage
Collector-to-Emitter Voltage
3.60
3.55
3.50
3.45
3.40
3.35
3.30
100
10
1
100Ω
= 15V
= 480V
V
= 480V
R
V
V
CC
= O
CC
GE
G
GE
V
T
= 15V
= 25
= 8A
°
C
J
C
I
I
=
16A
C
I
I
=
=
A
A
8
4
C
C
0.1
0
20
40
60
80
100
-60 -40 -20
0
20 40 60 80 100 120 140 160
°
T , Junction Temperature ( C )
RG , Gate Resistance (Ω)
J
Fig. 9 - Typical Switching Losses vs. Gate
Fig. 10 - Typical Switching Losses vs.
Resistance
Junction Temperature
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5
IRG4RC10SD
100
10
1
15
V
T
= 20V
R
T
= 100
100 Ω
GE
J
G
J
= 125 oC
°
= 150 C
V
V
= 480V
= 15V
GE
CC
12
9
6
3
SAFE OPERATING AREA
10
0
0
4
8
12
16
20
1
100
1000
I
, Collector Current (A)
V
, Collector-to-Emitter Voltage (V)
C
CE
Fig. 11 - Typical Switching Losses vs.
Fig. 12 - Turn-Off SOA
Collector Current
100
T
= 150°C
= 125°C
10
J
T
J
T
=
25°C
J
1
0.1
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Forward Voltage Drop - VFM ( )
V
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4RC10SD
50
45
40
35
30
25
20
14
12
10
8
VR = 200V
TJ = 125°C
TJ = 25°C
I
= 8.0A
= 4.0A
F
F
I
I
I
= 8.0A
F
F
= 4.0A
6
4
2
VR = 200V
TJ = 125°C
TJ = 25°C
0
100
100
1000
1000
di /dt - (A/µs)
f
di /dt - (A/µs)
f
Fig. 15 - Typical Recovery Current vs. dif/dt
Fig. 14 - Typical Reverse Recovery vs. dif/dt
200
1000
VR = 200V
TJ = 125°C
TJ = 25°C
VR = 200V
TJ = 125°C
TJ = 25°C
160
I
I
= 8.0A
= 4.0A
I
I
= 8.0A
= 4.0A
F
F
F
F
120
80
40
0
A
100
100
100
1000
1000
di /dt - (A/µs)
f
di /dt - (A/µs)
f
Fig. 16 - Typical Stored Charge vs. dif/dt
Fig. 17 - Typical di(rec)M/dt vs. dif/dt,
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7
IRG4RC10SD
Same type
device as
D.U.T.
430µF
80%
90%
of Vce
D.U.T.
10%
V
ge
V
C
90%
t
d(off)
10%
5%
I
C
Fig. 18a - Test Circuit for Measurement of
tf
t
r
I
LM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t
d(on)
t=5µs
E
E
off
on
E
= (E +E )
on off
ts
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
trr
trr
G ATE VO LTA G E D .U .T.
Q rr =
Ic dt
Ic
∫
tx
10% +Vg
+Vg
tx
10% Irr
10% Vcc
Vcc
D UT VO LTAG E
AN D CU RRE NT
Vce
V pk
Irr
10% Ic
Vcc
Ipk
90% Ic
Ic
DIO DE RE CO V ERY
W AVEFO RMS
5% Vce
tr
td(on)
t2
V
E on = Vce Ic dt
t4
∫
Erec =
t1
Vd Ic dt
∫
t3
DIO DE REVE RSE
REC O VERY ENER G Y
t1
t2
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
Defining Eon, td(on), tr
8
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IRG4RC10SD
Vg
GATE SIG NAL
DEVICE UNDER TEST
CURRENT D.U.T.
VOLTAGE IN D.U.T.
CURRENT IN D1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
480V
4 X IC @25°C
L
D.U.T.
RL=
1000V
V *
c
0 - 480V
50V
6000µF
100 V
Figure 20. Pulsed Collector Current
Test Circuit
Figure 19. Clamped Inductive Load Test Circuit
Package Outline
TO-252AA Outline
Dimensions are shown in millimeters (inches)
2.38 (.094)
2.19 (.086)
6.73 (.265)
6.35 (.250)
1.14 (.045)
0.89 (.035)
-
A
4
-
1.27 (.050)
0.88 (.035)
5.46 (.215)
5.21 (.205)
0.58 (.023)
0.46 (.018)
6.45 (.245)
5.68 (.224)
6.22 (.245)
5.97 (.235)
10.42 (.410)
9.40 (.370)
1.02 (.040)
1.64 (.025)
1
2
3
0.51 (.020)
MIN.
LEAD ASSIGNMENTS
- B
-
1 - GATE
1.52 (.060)
1.15 (.045)
0.89 (.035)
0.64 (.025)
2 - COLLECTOR
3 - EMITTER
4 - COLLECTOR
3X
0.58 (.023)
0.46 (.018)
1.14 (.045)
0.76 (.030)
2X
0.25 (.010)
M
A M B
N OTES:
2.28 (.090)
1
2
3
4
DIMEN SIONING & TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIM ENSION : INCH.
4.57 (.180)
CONFORMS TO JEDEC OUTLINE TO-252AA.
DIM EN SIONS SHOW N ARE BEFORE SOLDER DIP,
SOLDER DIP M AX. +0.16 (.006).
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9
IRG4RC10SD
Notes:
Repetitive rating: VGE=20V; pulse width limited by maximum junction temperature (figure 20)
VCC=80%(VCES), VGE=20V, L=10µH, RG = 100W (figure 19)
Pulse width ≤ 80µs; duty factor ≤ 0.1%.
Pulse width 5.0µs, single shot.
Tape & Reel Information
TO-252AA
TR
TR L
TR R
16.3 ( .641 )
15.7 ( .619 )
16.3 ( .64 1 )
15.7 ( .61 9 )
12.1 ( .47 6 )
11.9 ( .46 9 )
8.1 ( .318 )
7.9 ( .312 )
FEED DIR ECTIO N
FEED D IREC TIO N
N O TES
:
1 . C O NT RO LLIN G DIM EN SIO N : M ILLIM ETER.
2 . ALL D IM EN SIO N S ARE SHO W N IN M ILLIMETERS ( IN CH ES ).
3 . O U TLINE C O N FO R M S TO EIA-481 & EIA-541.
13 INC H
16 mm
N O TES :
1. O U TLINE CO N FO R M S TO EIA-481.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 12/00
10
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