IRG8P50N120KDPBF_15 [INFINEON]

Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode;
IRG8P50N120KDPBF_15
型号: IRG8P50N120KDPBF_15
厂家: Infineon    Infineon
描述:

Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode

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中文:  中文翻译
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IRG8P50N120KDPbF  
IRG8P50N120KD-EPbF  
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode  
VCES = 1200V  
C
IC = 50A, TC =100°C  
tSC 10µs, TJ(max) = 150°C  
CE(ON) typ. = 1.7V @ IC = 35A  
G
E
V
IRG8P50N120KDPbF  
IRG8P50N120KDEPbF  
TO247AD  
n-channel  
TO247AC  
Applications  
G
Gate  
C
E
• Industrial Motor Drive  
• UPS  
Collector  
Emitter  
• Solar Inverters  
• Welding  
Features  
Benefits  
Benchmark Low VCE(ON)  
High Efficiency in a Motor Drive Applications  
Increases margin for short circuit protection scheme  
Excellent Current Sharing in Parallel Operation  
Rugged Transient Performance  
10μs Short Circuit SOA  
Positive VCE(ON) Temperature Coefficient  
Square RBSOA and high ILM- rating  
Lead-Free, RoHS compliant  
Environmentally friendly  
Standard Pack  
Base part number  
Package Type  
Orderable Part Number  
Form  
Quantity  
IRG8P50N120KDPbF  
TO-247AC  
TO-247AD  
Tube  
Tube  
25  
25  
IRG8P50N120KDPbF  
IRG8P50N120KD-EPbF  
IRG8P50N120KD-EPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
IC @ TC = 25°C  
IC @ TC = 100°C  
ICM  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulse Collector Current (see fig. 2)  
1200  
80  
50  
V
105  
ILM  
Clamped Inductive Load Current (see fig. 3)  
Diode Continuous Forward Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current   
Continuous Gate-to-Emitter Voltage  
Maximum Power Dissipation  
140  
45  
25  
140  
±30  
350  
140  
A
IF @ TC = 25°C  
IF @ TC = 100°C  
IFM  
VGE  
PD @ TC = 25°C  
PD @ TC = 100°C  
V
W
Maximum Power Dissipation  
TJ  
Operating Junction and  
-40 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw  
C
300 (0.063 in. (1.6mm) from case)  
10 lbf·in (1.1 N·m)  
Thermal Resistance  
Parameter  
Min.  
–––  
–––  
–––  
–––  
Typ.  
–––  
–––  
0.24  
40  
Max.  
0.36  
0.83  
–––  
Units  
Thermal Resistance Junction-to-Case-(each IGBT)   
Thermal Resistance Junction-to-Case-(each Diode)   
Thermal Resistance, Case-to-Sink (flat, greased surface)  
Thermal Resistance, Junction-to-Ambient (typical socket mount)  
RJC (IGBT)  
RJC (Diode)  
RCS  
°C/W  
–––  
RJA  
1
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
Typ.  
Max. Units  
Conditions  
V(BR)CES  
V(BR)CES/TJ  
Collector-to-Emitter Breakdown Voltage  
Temperature Coeff. of Breakdown Voltage  
1200  
0.93  
V
VGE = 0V, IC = 250µA   
V/°C VGE = 0V, IC = 2mA (25°C-150°C)  
5.0  
1.7  
2.0  
2.0  
6.5  
V
IC = 35A, VGE = 15V, TJ = 25°C  
IC = 35A, VGE = 15V, TJ = 150°C  
VCE = VGE, IC = 1.4mA  
VCE(on)  
VGE(th)  
Collector-to-Emitter Saturation Voltage  
Gate Threshold Voltage  
V
Threshold Voltage Temperature Coeff.  
Forward Transconductance  
-16  
mV/°C VCE = VGE, IC = 1.4mA (25°C-150°C)  
VGE(th)/TJ  
gfe  
20  
1
1.2  
2.1  
2.4  
35  
±300  
2.7  
S
µA  
V
V
CE = 50V, IC = 35A, PW = 20µs  
GE = 0V, VCE = 1200V  
ICES  
IGES  
VF  
Collector-to-Emitter Leakage Current  
Gate-to-Emitter Leakage Current  
Diode Forward Voltage Drop  
VGE = 0V, VCE = 1200V, TJ = 150°C  
mA  
nA VGE = ±30V  
V
IF = 35A  
IF = 35A, TJ = 150°C  
Switching Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
Typ. MaxUnits  
Conditions  
Qg  
Total Gate Charge (turn-on)  
Gate-to-Emitter Charge (turn-on)  
Gate-to-Collector Charge (turn-on)  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Rise time  
Turn-Off delay time  
Fall time  
Turn-On Switching Loss  
210  
10  
315  
15  
205  
IC = 35A  
VGE = 15V  
Qge  
Qgc  
Eon  
Eoff  
Etotal  
td(on)  
tr  
td(off)  
tf  
Eon  
nC  
mJ  
VCC = 600V  
135  
2.3  
1.9  
4.2  
35  
IC = 35A, VCC = 600V, VGE=15V  
RG = 5, TJ = 25°C  
Energy losses include tail & diode  
reverse recovery   
25  
ns  
190  
105  
3.8  
Eoff  
Etotal  
td(on)  
tr  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Rise time  
3.9  
7.7  
30  
mJ  
IC = 35A, VCC = 600V, VGE=15V  
RG = 5, TJ = 150°C  
Energy losses include tail & diode  
reverse recovery   
25  
ns  
td(off)  
Turn-Off delay time  
270  
tf  
Fall time  
140  
3300  
200  
Cies  
Coes  
Cres  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
VGE = 0V  
pF  
VCC = 30V  
f = 1.0Mhz  
105  
TJ = 150°C, IC = 140A  
VCC = 960V, Vp 1200V  
VGE = +20V to 0V  
RBSOA  
Reverse Bias Safe Operating Area  
FULL SQUARE  
TJ = 150°C,VCC = 600V, Vp 1200V  
VGE = +15V to 0V  
SCSOA  
Short Circuit Safe Operating Area  
10  
µs  
TJ = 150°C  
Erec  
trr  
Reverse Recovery Energy of the Diode  
Diode Reverse Recovery Time  
0.52  
170  
22  
mJ  
ns  
A
VCC = 600V, IF = 35A  
VGE = 15V, Rg = 5  
Irr  
Peak Reverse Recovery Current  
Notes:  
VCC = 80% (VCES), VGE = 20V.  
Ris measured at TJ of approximately 90°C.  
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.  
Maximum limits are based on statistical sample size characterization.  
Pulse width limited by max. junction temperature.  
Values influenced by parasitic L and C in measurement.  
2
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
80  
70  
60  
50  
40  
30  
20  
10  
0
For both:  
Duty cycle : 50%  
Tj = 150°C  
Tcase = 100°C  
Gate drive as specified  
Power Dissipation = 125W  
Square Wave:  
VCC  
I
Diode as specified  
0.1  
1
10  
100  
f , Frequency ( kHz )  
Fig. 1 - Typical Load Current vs. Frequency  
(Load Current = IRMS of fundamental)  
1000  
100  
10  
1000  
10µsec  
100  
10  
1
100µsec  
1
1msec  
DC  
Tc = 25°C  
Tj = 150°C  
Single Pulse  
0.1  
1
10  
100  
1000  
10000  
10  
100  
1000  
10000  
V
(V)  
CE  
V
(V)  
CE  
Fig. 3 - Reverse Bias SOA  
TJ = 150°C; VGE = 20V  
Fig. 2 - Forward SOA  
TC = 25°C; TJ 150°C; VGE = 15V  
1000  
100  
10  
1000  
100  
10  
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
GE  
GE  
GE  
GE  
GE  
Tc = -40°C  
Tc = 25°C  
Tc = 150°C  
1
1.0  
0.1  
0.1  
0
2
4
6
8
0
2
4
6
8
10  
V
(V)  
V
(V)  
CE  
CE  
Fig. 5 - Typ. IGBT Saturation Voltage  
Fig. 4 -Typ. IGBT Output Characteristics  
VGE = 15V; tp = 20µs  
TJ = 25°C; tp = 20µs  
3
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
1000  
100  
10  
16  
14  
12  
10  
8
V
V
= 600V  
= 400V  
CES  
CES  
6
T = -40°C  
J
1
4
T = 25°C  
J
2
T = 150°C  
J
0.1  
0
4
6
8
10  
12  
14  
16  
0
50  
Q
100  
150  
200  
250  
V
(V)  
, Total Gate Charge (nC)  
GE  
G
Fig. 6 - Typ. Transfer Characteristics  
Fig. 7 - Typical Gate Charge vs. VGE  
VCE = 50V; tp = 20µs  
ICE = 35A  
14  
12  
10  
8
1000  
100  
10  
E
E
E
@ Tj = 150°C  
OFF  
td  
OFF  
@ Tj = 150°C  
@ Tj = 150°C  
ON  
RR  
t
F
td  
ON  
E
E
E
@ Tj = 25°C  
OFF  
@ Tj = 25°C  
@ Tj = 25°C  
ON  
RR  
6
t
R
4
2
1
0
0
10  
20  
30  
I
40  
(A)  
50  
60  
70  
0
10  
20  
30  
I
40  
(A)  
50  
60  
70  
C
C
Fig. 9 - Typ. Switching Time vs. IC  
TJ = 150°C; VCE = 600V, RG = 5.0; VGE = 15V  
Fig. 8 - Typ. Energy Loss vs. IC  
VCE = 600V, RG = 5.0; VGE = 15V  
1000  
10  
9
8
7
6
5
4
3
2
1
0
E
E
E
Tj = 150°C  
ON @  
@ Tj = 150°C  
OFF  
@ Tj = 150°C  
td  
OFF  
RR  
EON @ Tj = 25°C  
EOFF @ Tj = 25°C  
ERR @ Tj = 25°C  
t
F
100  
td  
ON  
t
R
10  
3
6
9
12 15 18 21 24 27  
5
7
9
11 13 15 17 19 21 23 25 27  
Rg ( )  
R
( )  
G
Fig. 11 - Typ. Switching Time vs. RG  
TJ = 150°C; VCE = 600V, ICE = 35A; VGE = 15V  
Fig. 10 - Typ. Energy Loss vs. RG  
VCE = 600V, ICE = 35A; VGE = 15V  
4
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
30  
28  
26  
24  
22  
20  
1900  
V
= 600V  
R
= 5.0  
CC  
Tj = 150°C  
G
1700  
1500  
1300  
1100  
900  
R
= 10  
= 22  
= 27  
G
V
= 15V  
GE  
= 35A  
R
G
I
F
R
R
= 5  
G
G
R
= 10  
G
R
=
  
G
700  
R
= 27  
G
500  
200  
600  
1000  
1400  
1800  
2200  
10  
20  
30  
40  
(A)  
50  
60  
70  
di /dt (A/µs)  
I
F
F
Fig. 13 - Typ. Diode ERR vs. IF  
TJ = 150°C  
Fig. 12 - Typ. IRR vs. di/dt  
1000  
-40°C  
25°C  
150°C  
100  
10  
1
0.1  
0.0  
1.0  
2.0  
3.0  
(V)  
4.0  
5.0  
6.0  
V
F
Fig. 14 - Typ. Diode Forward Voltage Drop  
Characteristics  
5
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
1
0.1  
D = 0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
R1  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W)  
0.11421  
0.15533  
0.09137  
i (sec)  
0.000475  
0.003895  
0.018752  
0.01  
J J  
CC  
1 1  
2 2  
33  
Ci= iRi  
Ci= iRi  
0.001  
SINGLE PULSE  
( THERMAL RESPONSE )  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
0.0001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig. 15 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)  
1
D = 0.50  
0.20  
0.1  
0.10  
0.05  
Ri (°C/W)  
0.02298  
0.13483  
0.34628  
0.32636  
i (sec)  
0.000019  
0.000197  
0.003798  
0.051102  
R1  
R1  
R2  
R2  
R3  
R3  
R4  
R4  
J J  
CC  
1 1  
2 2  
3 3  
4 4  
0.02  
0.01  
Ci= iRi  
Ci= iRi  
0.01  
Notes:  
SINGLE PULSE  
1. Duty Factor D = t1/t2  
( THERMAL RESPONSE )  
2. Peak Tj = P dm x Zthjc + Tc  
0.001  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig. 16 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)  
6
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
L
L
80 V  
+
-
VCC  
DUT  
0
DUT  
VCC  
1K  
Rg  
Fig.C.T.1 - Gate Charge Circuit (turn-off)  
Fig.C.T.2 - RBSOA Circuit  
diode clamp /  
DUT  
L
4X  
DC  
DUT  
VCC  
-5V  
DUT /  
VCC  
DRIVER  
Rg  
RSH  
Fig.C.T.3 - S.C. SOA Circuit  
Fig.C.T.4 - Switching Loss Circuit  
(Board Stray Inductance 180nH)  
C force  
100K  
D1 22K  
C sense  
DUT  
G force  
0.0075µF  
E sense  
E force  
Fig.C.T.5 - BVCES Filter Circuit  
7
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
800  
700  
600  
500  
400  
300  
200  
100  
0
320  
280  
VCE  
240  
200  
160  
120  
80  
40  
0
ICE  
-100  
-40  
-10.00  
0.00  
10.00  
20.00  
Time (uS)  
Fig. WF1 - Typ. S.C. Waveform  
@ TJ = 150°C using Fig. CT.3  
8
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
TO-247AC Package Outline  
Dimensions are shown in millimeters (inches)  
TO-247AC Part Marking Information  
Notes: This part marking information applies to devices produced after 02/26/2001  
EXAMPLE: THIS IS AN IRFPE30  
WITH ASSEMBLY  
PART NUMBER  
INTERNATIONAL  
RECTIFIER  
LOGO  
LOT CODE 5657  
IRFPE30  
135H  
57  
ASSEMBLED ON WW 35, 2001  
IN THE ASSEMBLY LINE "H"  
56  
DATE CODE  
YEAR 1 = 2001  
WEEK 35  
ASSEMBLY  
LOT CODE  
Note: "P" in assembly line position  
indicates "Lead-Free"  
LINE H  
TO-247AC package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com © 2014 International Rectifier Submit Datasheet Feedback  
9
October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
TO-247AD Package Outline  
Dimensions are shown in millimeters (inches)  
TO-247AD Part Marking Information  
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D -E  
W IT H A S S E M B L Y  
P A R T N U M B E R  
D A T E C O D E  
IN T E R N A T IO N A L  
R E C T IF IE R  
L O G O  
L O T C O D E 5 6 5 7  
A S S E M B L E D O N W W 3 5 , 2 0 0 0  
IN T H E A S S E M B L Y L IN E "H "  
0 3 5 H  
5 7  
5 6  
Y E A R  
W E E K 3 5  
L IN E  
0
=
2 0 0 0  
A S S E M B L Y  
L O T C O D E  
N o te : "P " in a s s e m b ly lin e p o s itio n  
in d ic a te s "L e a d -F re e "  
H
TO-247AD package is not recommended for Surface Mount Application.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
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October 30, 2014  
IRG8P50N120KDPbF/IRG8P50N120KD-EPbF  
Qualification Information†  
Qualification Level  
Industrial†  
(per JEDEC JESD47F) ††  
TO-247AC  
TO-247AD  
N/A  
Moisture Sensitivity Level  
RoHS Compliant  
N/A  
Yes  
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/  
†† Applicable version of JEDEC standard at the time of product release.  
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visit http://www.irf.com/whoto-call/  
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October 30, 2014  
 

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