IRGS30B60KTRR [INFINEON]

Insulated Gate Bipolar Transistor, 75A I(C), 600V V(BR)CES, N-Channel, PLASTIC, D2PAK-3;
IRGS30B60KTRR
型号: IRGS30B60KTRR
厂家: Infineon    Infineon
描述:

Insulated Gate Bipolar Transistor, 75A I(C), 600V V(BR)CES, N-Channel, PLASTIC, D2PAK-3

电动机控制 栅 晶体管
文件: 总14页 (文件大小:380K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97003  
IRGB30B60KPbF  
IRGS30B60KPbF  
IRGSL30B60KPbF  
VCES = 600V  
INSULATED GATE BIPOLAR TRANSISTOR  
C
Features  
IC = 50A, TC=100°C  
at TJ=175°C  
• Low VCE (on) Non Punch Through IGBT Technology  
• 10µs Short Circuit Capability  
G
• Square RBSOA  
tsc > 10µs, TJ=150°C  
VCE(on) typ. = 1.95V  
• Positive VCE (on) Temperature Coefficient  
• Maximum Junction Temperature rated at 175°C  
• Lead-Free  
E
n-channel  
Benefits  
• Benchmark Efficiency for Motor Control  
• Rugged Transient Performance  
• Low EMI  
• Excellent Current Sharing in Parallel Operation  
D2Pak  
IRGS30B60KPbF IRGSL30B60KPbF  
TO-262  
TO-220AB  
IRGB30B60KPbF  
Absolute Maximum Ratings  
Parameter  
Max.  
600  
Units  
V
Collector-to-Emitter Voltage  
VCES  
78  
Continuous Collector Current  
Continuous Collector Current  
Pulse Collector Current (Ref.Fig.C.T.5)  
Clamped Inductive Load current  
IC @ TC = 25°C  
50  
A
IC @ TC = 100°C  
120  
ICM  
120  
ILM  
RMS Isolation Voltage, Terminal to Case, t=1 min.  
Gate-to-Emitter Voltage  
2500  
±20  
V
VISOL  
VGE  
Maximum Power Dissipation  
370  
W
PD @ TC = 25°C  
Maximum Power Dissipation  
180  
PD @ TC = 100°C  
Operating Junction and  
-55 to +175  
TJ  
Storage Temperature Range  
°C  
TSTG  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw  
300 (0.063 in. (1.6mm) from case)  
10 lbf·in (1.1 N·m)  
Thermal / Mechanical Characteristics  
Parameter  
Min.  
–––  
–––  
–––  
–––  
–––  
Typ.  
–––  
Max.  
0.41*  
–––  
62  
Units  
°C/W  
Rθ  
Rθ  
Rθ  
Rθ  
Junction-to-Case- IGBT  
JC  
CS  
JA  
JA  
Case-to-Sink, flat, greased surface  
0.50  
–––  
Junction-to-Ambient, typical socket mount  
Junction-to-Ambient (PCB Mount, Steady State)  
–––  
40  
Weight  
1.44  
–––  
g
Wt  
* RθJC (end of life) = 0.65°C/W. This is the maximum measured value after 1000 temperature cycles from -55 to 150°C  
and is accounted for by the physical wearout of the die attach medium.  
www.irf.com  
1
05/17/05  
IRGB/S/SL30B60KPbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Collector-to-Emitter Breakdown Voltage  
Min. Typ. Max. Units  
Conditions  
GE = 0V, IC = 500µA  
Ref.Fig.  
V(BR)CES  
V
V
600  
3.5  
V
V(BR)CES/TJ  
GE = 0V, IC = 1mA (25°C-150°C)  
Temperature Coeff. of Breakdown Voltage  
0.40  
V/°C  
IC = 30A, VGE = 15V, TJ = 25°C  
C = 30A, VGE = 15V, TJ = 150°C  
IC = 30A, VGE = 15V, TJ = 175°C  
1.95 2.35  
2.40 2.75  
5,6,7  
VCE(on)  
I
Collector-to-Emitter Voltage  
V
8,9,10  
2.6  
4.5  
-10  
18  
2.95  
5.5  
VGE(th)  
V
V
V
CE = VGE, IC = 250µA  
Gate Threshold Voltage  
V
mV/°C  
S
8,9,10  
11  
VGE(th)/TJ  
gfe  
CE = VGE, IC = 1.0mA (25°C-150°C)  
CE = 50V, IC = 50A, PW = 80µs  
Threshold Voltage temp. coefficient  
Forward Transconductance  
VGE = 0V, VCE = 600V  
GE = 0V, VCE = 600V, TJ = 150°C  
VGE = 0V, VCE = 600V, TJ = 175°C  
GE = ±20V, VCE = 0V  
5.0  
250  
ICES  
IGES  
V
Zero Gate Voltage Collector Current  
Gate-to-Emitter Leakage Current  
1000 2000 µA  
1830 3000  
V
±100 nA  
Switching Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Total Gate Charge (turn-on)  
Gate-to-Emitter Charge (turn-on)  
Gate-to-Collector Charge (turn-on)  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
Min. Typ. Max. Units  
Conditions  
Ref.Fig.  
Qg  
IC = 30A  
102  
153  
17  
Qge  
Qgc  
Eon  
Eoff  
Etot  
td(on)  
tr  
VCC = 400V  
14  
21  
nC  
µJ  
ns  
CT1  
VGE = 15V  
44  
66  
IC = 30A, VCC = 400V  
350  
825  
620  
955  
CT4  
V
GE = 15V, RG = 10 , L = 200µH  
TJ = 25°C  
C = 30A, VCC = 400V  
1175 1575  
I
46  
28  
60  
39  
VGE = 15V, RG = 10, L = 200µH  
Rise time  
CT4  
td(off)  
tf  
TJ = 25°C  
Turn-Off delay time  
185  
31  
200  
40  
Fall time  
Eon  
Eoff  
Etot  
td(on)  
tr  
IC = 30A, VCC = 400V  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On delay time  
635 1085  
1150 1350  
1785 2435  
CT4  
12,14  
WF1,WF2  
13,15  
CT4  
VGE = 15V, RG = 10, L = 200µH  
TJ = 150°C  
µJ  
ns  
IC = 30A, VCC = 400V  
46  
28  
60  
39  
V
GE = 15V, RG = 10 , L = 200µH  
Rise time  
td(off)  
tf  
TJ = 150°C  
Turn-Off delay time  
205  
32  
235  
42  
WF1  
Fall time  
WF2  
LE  
Internal Emitter Inductance  
Input Capacitance  
7.5  
nH Measured 5mm from package  
GE = 0V  
Cies  
Coes  
Cres  
RBSOA  
V
1750 2500  
VCC = 30V  
Output Capacitance  
Reverse Transfer Capacitance  
Reverse Bias Safe Operating Area  
160  
60  
255  
90  
pF  
16  
f = 1.0MHz  
TJ = 150°C, IC = 120A, Vp = 600V  
VCC=500V,VGE = +15V to 0V,RG =10  
TJ = 150°C, Vp = 600V, RG = 10Ω  
VCC=360V,VGE = +15V to 0V  
FULL SQUARE  
4
CT2  
CT3  
WF3  
WF3  
SCSOA  
Short Circuit Safe Operating Area  
Peak Short Circuit Collector Current  
10  
µs  
A
ISC (Peak)  
200  
Note  to  
are on page 13  
2
www.irf.com  
IRGB/S/SL30B60KPbF  
80  
70  
60  
50  
40  
30  
20  
10  
0
400  
350  
300  
250  
200  
150  
100  
50  
0
0
20 40 60 80 100 120 140 160 180  
(°C)  
0
20 40 60 80 100 120 140 160 180  
(°C)  
T
T
C
C
Fig. 1 - Maximum DC Collector Current vs.  
Fig. 2 - Power Dissipation vs. Case  
Case Temperature  
Temperature  
1000  
100  
10  
1000  
100  
10  
1
10 µs  
100 µs  
1ms  
DC  
0.1  
1
1
10  
100  
(V)  
1000  
10000  
10  
100  
(V)  
1000  
V
CE  
V
CE  
Fig. 4 - Reverse Bias SOA  
Fig. 3 - Forward SOA  
TC = 25°C; TJ 150°C  
TJ = 150°C; VGE =15V  
www.irf.com  
3
IRGB/S/SL30B60KPbF  
60  
50  
40  
30  
20  
10  
0
60  
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
V
V
V
V
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
GE  
50  
40  
30  
20  
10  
0
0
1
2
3
4
5
0
1
2
3
4
5
V
(V)  
V
(V)  
CE  
CE  
Fig. 5 - Typ. IGBT Output Characteristics  
Fig. 6 - Typ. IGBT Output Characteristics  
TJ = -40°C; tp = 80µs  
TJ = 25°C; tp = 80µs  
60  
V
= 18V  
= 15V  
= 12V  
= 10V  
= 8.0V  
GE  
V
50  
40  
30  
20  
10  
0
GE  
V
GE  
V
GE  
V
GE  
0
1
2
3
4
5
V
(V)  
CE  
Fig. 7 - Typ. IGBT Output Characteristics  
TJ = 150°C; tp = 80µs  
4
www.irf.com  
IRGB/S/SL30B60KPbF  
20  
18  
16  
14  
12  
10  
8
20  
18  
16  
14  
12  
I
I
I
= 15A  
= 30A  
= 60A  
I
I
I
= 15A  
= 30A  
= 60A  
CE  
CE  
CE  
CE  
CE  
CE  
10  
8
6
6
4
4
2
2
0
0
5
10  
15  
20  
5
10  
15  
20  
V
(V)  
V
(V)  
GE  
GE  
Fig. 9 - Typical VCE vs. VGE  
Fig. 8 - Typical VCE vs. VGE  
TJ = 25°C  
TJ = -40°C  
250  
200  
150  
100  
50  
20  
18  
16  
14  
12  
10  
8
T
T
= 25°C  
J
J
= 150°C  
I
I
I
= 15A  
= 30A  
= 60A  
CE  
CE  
CE  
6
T
= 150°C  
J
4
T
= 25°C  
15  
2
J
0
0
0
5
10  
20  
5
10  
15  
20  
V
(V)  
V
(V)  
GE  
GE  
Fig. 10 - Typical VCE vs. VGE  
Fig. 11 - Typ. Transfer Characteristics  
TJ = 150°C  
VCE = 50V; tp = 10µs  
www.irf.com  
5
IRGB/S/SL30B60KPbF  
3000  
2500  
2000  
1000  
100  
10  
td  
OFF  
E
OFF  
1500  
E
ON  
td  
ON  
1000  
500  
0
t
F
t
R
0
20  
40  
(A)  
60  
80  
0
20  
40  
60  
80  
I
C
I
(A)  
C
Fig. 12 - Typ. Energy Loss vs. IC  
TJ = 150°C; L=200µH; VCE= 400V,  
RG= 10; VGE= 15V  
Fig. 13 - Typ. Switching Time vs. IC  
TJ = 150°C; L=200µH; VCE= 400V  
RG= 10; VGE= 15V  
10000  
1000  
100  
3000  
2500  
2000  
1500  
1000  
500  
E
OFF  
td  
OFF  
E
ON  
td  
ON  
t
F
t
R
10  
0
0
25  
50  
75  
100  
125  
0
25  
50  
75  
100  
125  
R
( )  
R
( )  
G
G
Fig. 14 - Typ. Energy Loss vs. RG  
TJ = 150°C; L=200µH; VCE= 400V  
ICE= 30A; VGE= 15V  
Fig. 15 - Typ. Switching Time vs. RG  
TJ = 150°C; L=200µH; VCE= 400V  
ICE= 30A; VGE= 15V  
6
www.irf.com  
IRGB/S/SL30B60KPbF  
16  
10000  
1000  
100  
14  
200V  
Cies  
12  
400V  
10  
8
6
Coes  
Cres  
4
2
0
10  
0
25  
Q
50  
75  
100  
125  
0
20  
40  
60  
80  
100  
, Total Gate Charge (nC)  
G
V
(V)  
CE  
Fig. 16- Typ. Capacitance vs. VCE  
Fig. 17 - Typical Gate Charge vs. VGE  
VGE= 0V; f = 1MHz  
ICE = 30A; L = 600µH  
10  
1
D = 0.50  
0.20  
0.1  
R1  
R1  
R2  
R2  
0.10  
Ri (°C/W) τi (sec)  
τ
J τJ  
τ
0.200  
0.000428  
τ
Cτ  
0.05  
1 τ1  
Ci= τi/Ri  
τ
0.01  
0.001  
0.0001  
2τ2  
0.02  
0.01  
0.209  
0.013031  
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
SINGLE PULSE  
( THERMAL RESPONSE )  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
1
t
, Rectangular Pulse Duration (sec)  
1
Fig 18. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)  
www.irf.com  
7
IRGB/S/SL30B60KPbF  
L
L
VCC  
80 V  
+
-
DUT  
DUT  
480V  
0
Rg  
1K  
Fig.C.T.1 - Gate Charge Circuit (turn-off)  
Fig.C.T.2 - RBSOA Circuit  
diode clamp /  
DUT  
L
Driver  
- 5V  
DC  
360V  
DUT /  
DRIVER  
VCC  
DUT  
Rg  
Fig.C.T.3 - S.C.SOA Circuit  
Fig.C.T.4 - Switching Loss Circuit  
V
CC  
R =  
ICM  
DUT  
VCC  
Rg  
Fig.C.T.5 - Resistive Load Circuit  
8
www.irf.com  
IRGB/S/SL30B60KPbF  
700  
600  
500  
400  
300  
200  
100  
0
70  
60  
50  
40  
30  
20  
10  
0
700  
600  
500  
400  
300  
200  
100  
0
35  
30  
25  
20  
15  
10  
5
90% ICE  
tf  
TEST CURRENT  
90% test current  
5% VCE  
tr  
10% test current  
5% VCE  
5% ICE  
0
Eon Loss  
Eoff Loss  
-100  
-5  
-100  
-10  
-0.20 0.00 0.20 0.40 0.60 0.80  
15.90 16.00  
16.10 16.20  
Time (µs)  
16.30  
Time(µs)  
Fig. WF1- Typ. Turn-off Loss Waveform  
@ TJ = 150°C using Fig. CT.4  
Fig. WF2- Typ. Turn-on Loss Waveform  
@ TJ = 150°C using Fig. CT.4  
600  
500  
400  
300  
200  
100  
0
300  
250  
200  
150  
100  
50  
ICE  
VCE  
0
-5.00  
0.00  
5.00  
time (µS)  
10.00 15.00  
Fig. WF3- Typ. S.C Waveform  
@ TC = 150°C using Fig. CT.3  
www.irf.com  
9
IRGB/S/SL30B60KPbF  
TO-220AB Package Outline  
Dimensions are shown in millimeters (inches)  
TO-220AB Part Marking Information  
Note: "P" in assembly line  
position indicates "Lead-Free"  
10  
www.irf.com  
IRGB/S/SL30B60KPbF  
D2Pak Package Outline  
Dimensions are shown in millimeters (inches)  
D2Pak Part Marking Information  
www.irf.com  
11  
IRGB/S/SL30B60KPbF  
TO-262 Package Outline  
Dimensions are shown in millimeters (inches)  
IGBT  
1- GATE  
TO-262 Part Marking Information  
12  
www.irf.com  
IRGB/S/SL30B60KPbF  
D2Pak Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TRR  
1.60 (.063)  
1.50 (.059)  
1.60 (.063)  
1.50 (.059)  
4.10 (.161)  
3.90 (.153)  
0.368 (.0145)  
0.342 (.0135)  
FEED DIRECTION  
TRL  
11.60 (.457)  
11.40 (.449)  
1.85 (.073)  
1.65 (.065)  
24.30 (.957)  
15.42 (.609)  
23.90 (.941)  
15.22 (.601)  
1.75 (.069)  
10.90 (.429)  
10.70 (.421)  
1.25 (.049)  
4.72 (.136)  
4.52 (.178)  
16.10 (.634)  
15.90 (.626)  
FEED DIRECTION  
13.50 (.532)  
12.80 (.504)  
27.40 (1.079)  
23.90 (.941)  
4
330.00  
(14.173)  
MAX.  
60.00 (2.362)  
MIN.  
30.40 (1.197)  
MAX.  
NOTES :  
1. COMFORMS TO EIA-418.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION MEASURED @ HUB.  
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.  
26.40 (1.039)  
24.40 (.961)  
4
3
Notes:  
 VCC = 80% (VCES), VGE = 20V, L = 28µH, RG = 22Ω.  
‚ This is only applied to TO-220AB package.  
ƒ This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ).  
For recommended footprint and soldering techniques refer to application note #AN-994.  
„ Energy losses include "tail" and diode reverse recovery.  
Calculated continuous current based on maximum allowable junction temperature. Package limitation current is 75A.  
TO-220AB package is not recommended for Surface Mount Application.  
Data and specifications subject to change without notice.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7903  
Visit us at www.irf.com for sales contact information. 05/05  
www.irf.com  
13  
Note: For the most current drawings please refer to the IR website at:  
http://www.irf.com/package/  

相关型号:

IRGS30B60KTRRPBF

Insulated Gate Bipolar Transistor, 75A I(C), 600V V(BR)CES, N-Channel, LEAD FREE, PLASTIC, D2PAK-3
INFINEON

IRGS4045DPbF

INSULATED GATE BIPOLAR TRANSISTOR WITH UL TRAFAST SOFT RECOVERY DIODE
INFINEON

IRGS4045DPDF

INSULATED GATE BIPOLAR TRANSISTOR WITH UL TRAFAST SOFT RECOVERY DIODE
INFINEON

IRGS4045DTRLPbF

INSULATED GATE BIPOLAR TRANSISTOR WITH UL TRAFAST SOFT RECOVERY DIODE
INFINEON

IRGS4045DTRRPbF

INSULATED GATE BIPOLAR TRANSISTOR WITH UL TRAFAST SOFT RECOVERY DIODE
INFINEON

IRGS4055PBF

PDP TRENCH 1GBT
INFINEON

IRGS4056DPBF

INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
INFINEON

IRGS4062DPBF

INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
INFINEON

IRGS4062DTRLPBF

Insulated Gate Bipolar Transistor, 48A I(C), 600V V(BR)CES, N-Channel, TO-263AB, LEAD FREE, D2PAK-3
INFINEON

IRGS4062DTRRPBF

Insulated Gate Bipolar Transistor, 48A I(C), 600V V(BR)CES, N-Channel, TO-263AB, LEAD FREE, D2PAK-3
INFINEON

IRGS4064DPBF

Insulated Gate Bipolar Transistor, 20A I(C), 600V V(BR)CES, N-Channel,
INFINEON

IRGS4064DTRLPBF

Insulated Gate Bipolar Transistor,
INFINEON